The Green Series
Version: IS-1.1 BT-L-1210007 Page 1 of 10
1L2531G11A0DE201
◆Outline (L*W* H): 2.05*5.0*7.1 mm
◆Good thermal dissipation & optical uniformity
Table of Contents
Product Code Method-----------------------------------------2
Maximum Rating-----------------------------------------------2
Typical Product Characteristics------------------------------3
Directive Characteristics--------------------------------------3
Electronic-Optical Characteristics---------------------------4
Dimensions -----------------------------------------------------5
Packing-----------------------------------------------------------6
Precautions -----------------------------------------------------7
Test Items and Results of Reliability-----------------------10
Features
Forward current: ≦30mA
Typical viewing angle 50% Iv: 120°
Lens color: green diffused
RoHS and REACH-compliant
ESD level ≥ 2kV(HBM)
Applications
Indoor decorating
Outdoor lighting for amusement
Consumer electronics
Other applications
The Green Series
Version: IS-1.1 BT-L-1210007 Page 2 of 10
Product Code Method
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1 - L - 25 - 31 - G11A - 0 - D - E - 2 - 01
① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩
①
②
③
④
Process Type
Product Type
Specification
Lead Frame
Code
1 : normal process
L: lamp LED
25:
square2.05*5.0mm
31:frame
⑥
⑦
⑧
⑨
Polarity Code
Resin Color
Code
Article Mode
Code
Special Process
Requirements
0: tinned and polarity
D: green diffused
E article mode
2: tinned
Maximum Rating(Ta=25℃)
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Characteristics
Symbol
Typical
Unit
DC Forward Current
IF
30
mA
Pulse Forward Current*3
IPF
100
mA
Reverse Voltage
VR
8
V
Power Dissipation
PD
80
mW
Junction Temperature
TJ
110
oC
Operating Temperature Range
TOP
-40~85
oC
Storage Temperature Range
TSTG
-40~100
oC
Soldering Temperature*4
TSD
260
oC
Notes 1: There is no maximum or typical voltage parameter
2: For other ambient, limited setting of current will be depended on de-rating curves.
3: Duty 1/10, pulse width 0.1ms
4: The maximum of soldering time is 5 seconds in TSD
The Green Series
Version: IS-1.1 BT-L-1210007 Page 3 of 10
Typical Product Characteristics(Ta=25℃)
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Characteristics
Symbol
Min
Typical
Max
Unit
Test condition
Forward Voltage
VF
1.5
1.8
2.5
V
IF=10mA
Leakage Current
IR
-
-
10
μA
VR= 8V
Luminous Intensity
Iv
1
6
-
mcd
IF=10mA
Dominant Wavelength
λd
564.5
-
576.5
nm
IF=10mA
Viewing Angle
2θ1/2
-
120
-
deg
IF=10mA
Notes: 1. Measurement Errors:
Forward Voltage: ±0.1V, Luminous Intensity: ±10%Iv, Dominant Wavelength: ±1.0nm
2. Electrical-Optical Characteristics (Ta=25℃)
Directive Characteristics(Ta=25℃)
------------------------------------------------------------------------------------------------------------------------------------
Φ -Angular Displacement
Relative Radiant Intensity vs .Angular Displacement
20°30°40°
50°
60°
70°
80°
90°
10°
0°
Ie rel-Relative Radiant Intensity
The Green Series
Version: IS-1.1 BT-L-1210007 Page 4 of 10
Electronic-Optical Characteristics
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1). Forward Current IF-VF
2). Relative Luminous Intensity-IF
Forward Voltage VF(V) Ta=25°
Forward Current IF(mA)
0 5 10 15 20 25 30
Forward Current (mA)
Relative Lumious Flux(%)
150
125
100
75
50
25
0 40
3). Relative Luminous Intensity-Ta
4). Forward Current IF-Ta
120%
100%
60%
40%
20% 0 20 40 80 100
-20 Junction Temperature(°)
Relative Luminous Flux(%)
140%
40
30
20
10
0
0 20 40 60 80 100
Ambient Temperature(°C)
Maximum Current (mA)
5). Forward Voltage-Ta
6). Wavelength Characteristics (Ta=25OC)
Relative Forward Voltage(%)
Ambient Temperature(°)
Wavelength (nm) Ta=25°
Relative Luminous Intensity
The Green Series
Version: IS-1.1 BT-L-1210007 Page 5 of 10
Dimensions
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4.95
5
7.1
2
2.05
0.6
0.5
0.5
24.0min
2.54
1.0min
Notes: 1. All measurements are ±0.3 mm unless otherwise indicated.
2. The appearance of encapsulation tolerance is ±0.25 mm
3. The maximum dimensions of protruded resin flange (NOTE) is 1.0mm
The Green Series
Version: IS-1.1 BT-L-1210007 Page 6 of 10
Packing
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1. Package bag: vinyl bag(1,000pcs per bag)
2. Label: label as below(label on the left)
3. Package
3.1. ESD bag: 12bags per carton (12,000pcs per carton)
3.2. Carton size: 330*135*330mm
4. Falling
The falling off of the device: we have to ensure the max loss number of LAMP is 2pcs.
5. Different rank
The product of different rank will be separate in the same box
The Green Series
Version: IS-1.1 BT-L-1210007 Page 7 of 10
Precautions
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A. Storage
It can be stored for 3 months under conditions of Temperature 23+/-5 and humidity 40-70%。During
storage, there must not be any damage to the sealed bag, and if opened once, do not store again. After the
package is opened, the products should be used within one week under the same temperature and humidity.
B. Cleaning
Do not use any unidentified chemical to clean LEDS, it could damage or crack the LED epoxy surface.
If necessary, soak LED in alcohol for a time not exceeding one minute in normal temperature.
C. Lead Frames Shaping & Trimming
1. The shaping should be done underneath the wedge point. No pressure should be exerted to the epoxy
shell of the LED during shaping.
2. Shaping of the leads should be done before soldering.
3. Lead trimming should only be done at normal temperature.
D. Soldering
1. When soldering, the soldering iron needs to be at least 1.6mm away from the epoxy edge. Do not
apply any pressure to the epoxy encapsulation or the lead frame during the soldering process.
2. When reflow soldering or wave soldering, please solder once for less than 5 seconds at a maximum
temperature of 265°C. During the soldering process, if the temperature or timing is not controlled within
limits, it would cause the epoxy to deform or cause the die or wires within the LED to be damaged.
3. When using soldering iron, please solder once for less than 5 seconds at a maximum temperature of
350°C+10°C. When soldering a row of LED on a PCB, please do not solder both leads of a LED in sequence.
(Solder the positive lead at first, then the negative leads)
4. Do not dip the epoxy encapsulation part of LED into any soldering paste liquid.
5. After soldering, do not adjust the location of the LED anymore.
WAVE SOLDERING PROFILE FOR LEAD FREE PROCESS:
The Green Series
Version: IS-1.1 BT-L-1210007 Page 8 of 10
Precautions
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6. When attaching electronic parts to a PCB with LEDS, the curing time for the whole PCB should be less
than 120 seconds, at less than a temperature of 120°C.
7. LED view
1) Bottom view:
2) Side view:
E. Installation
1. During the installation process, do not apply any pressure to the leads.
2. Please make sure the installation holes on the PCB matches the leads of the LED.
F. ESD (Electrostatic Discharge)
1. LED is very sensitive to ESD; please make sure during the whole usage and installation process, that no
ESD exist to affect the LED. Excessive ESD could damage the LED chip and result in performance
degradation.
2. LED can also be damaged by electrical surge, please make sure any driving electrical circuits are equipped
with surge protection.
3. During the installation process, please make sure all the equipment and personnel are grounded properly.
Make use ESD protection equipment such as anti-static gloves, anti-static wrist bands, anti-static mats,
anti-static clothes, anti-static shoes, and anti-static containers.
4. When LED come into contact with low electrical resistance metallic surfaces, the ESD could damage the
LED due to sudden discharge of ESD. Please make sure all surfaces that will be in contact with LED are
covered with anti-static mats (Surface electrical resistance of 106~108Ω/sq). LED should be placed in anti-static
containers and anti-static bags.
The Green Series
Version: IS-1.1 BT-L-1210007 Page 9 of 10
Precautions
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G. Recommended Usage Guidelines
1. Please only use 20mA (Lamp LED) and 30mA (High Flux LED) of forward current to drive LEDS whether
one LED or multiple LEDS are being used.
2. Circuit connections
i. Serial connection
ii. Parallel connection
3. Sudden surge could damage the LED interior connections. Please design circuit with care so no sudden
voltage surge or current surge will show when turning the circuit on or off.
4. When color or brightness uniformity is required while using multiple LEDS, the LED driver condition is
critical. Our company guarantees the uniformity of the LEDS from the same bin when the driver current is
20mA (Lamp LED) and 30mA (High Flux LED)
H. Safety
1. Please comply with government electrical safety code while using the LEDS.
2. Do not look directly into a lit LED; it could damage the eyes after only a few seconds.
3. Do not look directly into powered UV LEDS; it could damage the eyes after only a few seconds.
(UV LEDS are mainly used in currency validating machines)
I. Direction
1. We are sending you our specification and drawings for your approval. Please return to us one copy
“For Approval” with your approved signatures.
2. Comply with HSF request of customers
The Green Series
Version: IS-1.1 BT-L-1210007 Page 10 of 10
Test Items and Results of Reliability
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[Note] USL*1: Upper Specification Level
LSL*2: Lower Specification Level
Test Item
Test Conditions
Duration/
Cycle
Ac/Re
Number of
Damage
Reference
Normal Temperature Life
Ta＝23℃(±5℃)
IF=20mA
1008 hrs
0/1
0/22
JESD22 A-108
High Temperature Life
Ta＝85℃(±5℃)
IF=20mA
1008 hrs
0/1
0/22
JESD22 A-108
High Humidity Heat Life
Ta＝85℃(±5℃)
RH=85%
IF=20mA
1008 hrs
0/1
0/22
JESD22 A-108
Thermal shock
-45℃/30min~105℃
/30min
(±5℃)
1008 hrs
0/1
0/22
JESD22 A-104
Electrostatic Discharge (ESD)
Test
According to the
SPEC
3 cycles
0/1
0/22
AEC Q101-001
Low Temperature Storage
Ta=-40℃
1008 hrs
0/1
0/22
JESD22-A103D
High Temperature Storage
Ta=125℃
1008 hrs
0/1
0/22
JESD22-A103D
*Criteria for Judging
Item
Symbol
Condition
Criteria for Judgment of Pass
Min
Max
Forward Voltage
VF
IF=10mA
-
USL*1×1.1
Reverse Current
IR
VR= 8V
-
10μA
Luminous Intensity
Iv
IF=10mA
LSL*2×0.7
-