PA-MLF16B-P-Z-01(W) Drawing Rev: CStatus: Released
File: PA-MLF16B-P-Z-01 Dwg
Scale: 3:1
Drawing: BM Fedde Date: 2/25/03
Description: Prototyping adaptor
16 position, MLF GHz socket (-Z version) to type PGA base pins (0.100" centers).
Add "W" to end of part number for inclusion of optional wire wrap sub base.
Pins: Material- Brass Alloy 360 1/2 hard; finish-
10µ" Au over 50µ" Ni (min.).
Substrate: 0.125"±0.007" FR4/G10 or equivalent
high temp material. 1/2 oz. Cu clad. SnPb plating
Stand-off: material- Teflon; 0.090" Dia; 0.060"
thick.
All tolerances: ±0.005" (unless stated otherwise).
Materials and specifications are subject to change
without notice.
Top View
Front ViewSide View1
2
3
1
2
3
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.comModified: 2/07/08
17.78mm
[0.700"]
12.88mm
[0.507"]
-01W version (3 level,
0.64mm [0.025"] Sqr.
WW pin)
0.88mm [0.035"]
2.14mm [0.084"]
17mm [0.669"]
0.89mm
[0.035"]
4.94mm
[0.194"]
0.65mm
22.1mm
[0.870"]
2.54mm [0.100"]
4.38mm [0.172"]
2.09mm x 2.09mm thermal /GND pad
6.35mm
[0.250"]
3.94mm
[0.155"]
15.24mm [0.600"]
Ø 0.46mm [0.018"]
6.35mm
[0.250"]
15.63mm
[0.615"]
2.54mm typ. [0.100"]
GHz socket
Recommended Torque
0.5in-lbs.
±0.020"
SMT Pad Detail 0.37mm
0.92mm
