KZ400EH050-BGA480 - Kawasaki Microelectronics, Inc.

HI G H - D E N S I T Y

HI G H- PE R F O R M A N C E

KZ4 0 0 G H

KZ4 0 0

CMOS GATE ARRAYS

OVERVIEW

KEY FEATURES

•0.35 µm drawn channel length (0.29 µm effective)

•Double/triple/quadruple layer metal CMOS technologies

•High-density and high-performance cell architecture

comparable to standard cell solutions

•Gate array architecture with 20 masterslices for fastest

time-to-market designs

•Embedded arrays offered for high-speed complex designs

•Customized array options available for high

volume designs

• Wide selection of I/O buffers: LVTTL, GTL+, HSTL,

SSTL, LVDS, PCI, USB, PECL, OSC

•3.3V or 2.5V operation voltage

• I/O drive: 2~24 mA

•Low power dissipation: 0.63 µW/MHz/gate at 3.3V

With the KZ400GH/KZ400EH CMOS Series, Kawasaki LSI offers

an advanced generation of 0.35 micron gate arrays and embedded

arrays. The Series provides cost-effective solutions for high-speed,

highly integrated, yet low voltage applications in today’s networking,

computer and multimedia markets. Appropriate product applications

include high-speed data routers/switches, 3D graphics and video

encoders/decoders.

To satisfy these requirements, the KZ400GH/KZ400EH Series

uses Kawasaki LSl’s 0.35 µm DLM, TLM or QLM process

technologies and an advanced cell architecture. This achieves high

density, high speed and low power dissipation—comparable to

standard cell products—while maintaining the quick turnaround of gate

arrays. The KZ400GH/KZ400EH Series supports complex designs of

up to 2 million gates and a system clock frequency as high as

200MHz. A variety of I/O buffers are available, including LVTTL,

GTL+, HSTL, SSTL, LVDS, PCI, USB, Pseudo-ECL and OSC.

The KZ400GH/KZ400EH Series offers a wide selection of

compilable memories such as metal-programmable RAMs and

all-layer RAMs/ROMs. This helps you optimize designs, because the

best compilable memory for a specific application may be chosen.

Also, ASIC-DRAM is under development for graphics, image

processing and networking applications which require the large capacity

of memory buffers. For high-performance and fast time-to-market

designs, the KZ400GH/KZ400EH Series offers various

high-performance cores such as CPU (and its peripherals), JPEG,

CAM (Content Addressable Memory), and analog functions

(PLL, A/D Converter, D/A Converter).

You can also maximize the chip-level and system-level

performance for complex designs by using Kawasaki LSl’s design

methodology. It includes rich libraries of accurately characterized cells,

timing-driven synthesis, clock distribution schemes, test insertion, and a

floor planner with interaction to synthesis on industry-standard tools.

•Propagation delay of 130 ps (2NAND power gate,

F.O.= 2)

•Clock skew management: PLL and clock

distribution methodologies

•Six types of metal-programmable SRAM

• High-density (22K bits/mm2) all-layer SRAM

up to 256K bits

• Testability tools such as SCANTEST, IDDQ and JTAG

•Design system with open I/F to various front-end platforms

•ISO9001 certified on manufacturing and design

quality since 1994

CORE LIBRARY

The KZ400GH/KZ400EH Series library offers more than 300

robust macrocells, providing a variety of high-performance synthesis

options. The macrocells are composed of different sized transistors,

enabling you to optimize the design for speed, power and density.

The macrocells have input slew-rate-dependent loading and offset

delay, and non-linear output load-dependent delay parameters to

produce accurately characterized timing. This results in the maximum

performance achievable from the process technology. The core

library is supplied for many industry-standard tools and HDL’s, including

Verilog HDL, VHDL, Synopsys, Mentor, ViewLogic and others.

I/O LIBRARY The I/Os in the KZ400GH/KZ400EH Series are powered by 3.3

or 2.5V supplies. Kawasaki LSI also provides 5V-tolerant I/Os,

which can receive signals from a 5V-powered device, yet output 3.3

or 2.5V. Slew-rate controlled buffers, input with pull-up, pull-down

resistors and open drain outputs are also available. The KZ400GH/

KZ400EH Series also supports high-speed and low-voltage swing

I/Os such as LVTTL, GTL+, Pseudo-ECL (PECL), High-Speed

Transceiver Logic (HSTL), Stub Series Terminated Logic (SSTL) and

Low-Voltage Differential Signal (LVDS). For computer and peripheral

applications, Kawasaki LSI support industry-standard buses with its PCI

Bus I/O buffers and USB I/O buffers.

MEMORIES Metal-Programmable Memory

The KZ400GH/KZ400EH Series has two types of compiled

metal-programmable memory: High-Density (HD) RAM and

Low-Power (LP) RAM. HD RAMs feature high performance and

high density up to 7.13K bits/mm 2. HD RAMs are suitable for

applications that need high-performance, high-density memories.

The total capacity of an HD RAM is up to 36K bits per block.

All-Layer Memory

In the KZ400EH Series, higher density embedded memories are

generated by all-layer memory compilers. All-layer memories feature

extremely high-density, large-capacity, and high-performance, while

offering low-power dissipation. The largest memory capacity is

256K bits for SRAM, and 1M bit for ROM. The bit density of

22K bits/mm2for the single-port SRAM is extremely high for an

ASIC memory.

These Kawasaki LSI all-layer memories are tuned for high-

performance, memory-intensive applications such as image process-

ing, ATM switches, etc. If lower power is required, an Address

Transition Detection (ATD) circuit can be optionally added.

LP RAMs feature high-performance and very low-power.

The total capacity of an LP RAM is 16K bits. As an application

example, LP RAMs are suitable for register files. Table 1 shows the

performance and specifications of HD and LP RAMs.

ATDdetects the address transition, then starts accessing the memory.

After a certain period of time, it turns off the entire memory operation

to cut off the DC current and prepare for the next address transition

automatically. This option is very effective for power reduction when

the operating frequency is less than 100MHz in SRAMs, and less

than 50MHz in ROM.

Kawasaki LSI is now developing ASIC-DRAM as one of the

all-layer memories offered; the size of a 256K bit block is targeted to

be 60% of that of the all-layer single-port RAM, with a density of

about 35K bits/mm2. A 100MHz high-speed page mode operation

can be achieved. Table 2 shows the performance specifications

of all-layer memories.

Table 1 KZ400GH/KZ400EH Metal-Programmable Memories

Table 2 KZ400EH All-Layer Memories

OTAL

ITS

ORD

ENSITY

CCESS

IME

IGH

-D

ENSITY

RAM 1-p Async. 64~36K 64~4K 1~36 ~7,125 bits/mm22.6ns*

2-p Async. 32~36K 32~4K 1~36 ~3,454 bits/mm23.1ns*

1-p Sync 64~36K 64~4K 1~36 ~6,890 bits/mm22.9ns*

2-p Sync. 32~36K 32~4K 1~36 ~3,402 bits/mm23.2ns*

-P

OWER

RAM 1-p Async. 1~16K 1~128 1~128 ~3,369 bits/mm22.4ns**

2-p Async. 1~16K 1~128 1~128 ~3,369 bits/mm22.4ns**

*Access time is for 512-word x 8-bit configuration in typical condition.

**Access time is for 32-word x 8-bit configuration in typical condition.

OTAL

ITS

ORD

ENSITY

CCESS

IME

SRAM 1-p Async. 16~256K 16~16K 1~64 ~22,000 bits/mm23.4ns*

1-p Sync. 16~256K 16~16K 1~64 ~22,000 bits/mm22.4ns*

2-p Sync. 16~64K 16~4K 1~64 ~8,500 bits/mm23.8ns*

ROM 1-p Sync. 64~1M 64~128K 1~128 ~100,000 bits/mm24.1ns*

DRAM*** 1-p Sync. 2K~256K 1K~64K 1~64 35,000 bits/mm2

*The numbers are for 512-word x 8-bit configuration in typical condition.

**The numbers are row access time/column access time under worst case conditions.

***Under development

KZ400GH/KZ400EH CMOS SERIES

20ns (RAS)/4ns(CAS)**

ARRAY FAMILY Table 3 shows the 20 base arrays in the KZ400GH/KZ400EH

Series. Array utilization depends on design, and typically varies from

33 to 46% in DLM (Double Layer Metal) technology, from 50 to

69% in TLM (Triple Layer Metal) technology, and from 66 to 90%

in QLM (Quadruple Layer Metal). A compute cell or a drive cell

is counted as a gate. Kawasaki LSI offers an option to compile and

fabricate a custom sized array for high-volume designs.

Cluster

Compute Section Drive Section

Table 3 KZ400GH/KZ400EH Masterslice Selection

Figure 1 CMOS-CBA Array Core Architecture

OUNT

(

ITCH

) U

SABLE

ATES

RRAY

NDEX

TANDARD

INE

ATES

DLM TLM QLM

006 108 112 61,500 28,100 42,200 55,300

009 128 136 87,600 38,200 57,400 76,500

013 152 160 126,700 52,600 78,900 105,200

016 168 180 156,800 63,100 94,700 126,300

019 184 196 190,100 74,400 111,600 148,900

027 216 232 266,300 99,000 148,500 198,100

031 232 252 309,100 112,300 168,400 224,600

036 248 268 355,200 126,100 189,200 252,300

040 264 284 404,500 140,600 210,900 281,200

046 280 304 462,400 157,100 235,700 314.200

050 292 316 501,300 167,900 251,900 335,900

058 312 340 577,600 190,600 288,800 381,200

064 328 356 640,000 211,200 320,000 422,400

069 340 372 685,600 226,200 342,700 452,400

077 360 392 774,400 255,500 387,200 511,100

108 424 464 1,081,600 356,000 540,800 713,800

144 488 536 1,440,000 475,200 720,000 950,400

207 584 640 2,073,600 684,200 1,036,800 1,368,500

262 656 720 2,624,400 866,000 1,312,200 1,732,100

307 708 780 3,069,500 1,012,900 1,534,700 2,025,800

Typical design both for DLM and TLM

A compute cell or a drive cell is counted as a gate.

ARRAY

ARCHITECTURE

gate array, on the other hand, the size of the core cell is uniformly large

to provide sufficient drive for the large fanout. Yet this results in the

low gate density, as most nets have a small number of fanouts and do

not require high drive.

With CBA, the smaller gate load and smaller wire load

significantly improves performance, power and density compared to

conventional gate arrays. These features are comparable to the

same generation standard cell architecture. With this optimized cell

architecture, KZ400GH/KZ400EH arrays achieve a gate density of

up to 9,500 usable gates/mm2.

The core cell cluster of the KZ400GH/KZ400EH Series as shown in

Figure 1, is based on the CMOS-CBA®architecture licensed by

Synopsys, Inc. It consists of two different unit cells: a compute cell

and a drive cell. A compute cell contains four small PMOS and four

small NMOS that are optimized for building logic and memory. A

drive cell contains two large PMOS and two large NMOS that pro-

vide sufficient drive for global nets or large fanout. Statistical analysis

has determined that a cluster of three compute cells and one drive cell

provides optimal density for many design styles. In the conventional

MEGAFUNCTIONS

AND ANALOG

FUNCTIONS

Kawasaki LSI supports a number of megafunctions other than the

compiled memories in the KZ400GH/KZ400EH Series. These

megafunctions minimize design time and maximize performance of

complex system chips. The KC80 is a very high-performance CPU

core that is binary-compatible with the Zilog Z80®. A JPEG core is

also available for imaging and data compression applications. Kawasaki

LSI also offers an Address Processor Core or Content Addressable

Memory (CAM) for high-performance broadband network and

internetworking applications.

There are a number of analog functions under

development for video signal processing applications, system

clock management and frequency synthesis. These functions

include 8 and 10-bit A/D converters, 8-bit D/A converters,

operational amplifiers, comparators, Phase Locked Loops (PLL)

and Voltage Controlled Oscillators (VCO).

CLOCK

DISTRIBUTION

For maximum system performance, it is important to minimize not only

board-level system clock skew, but also chip-level clock skew on a

die. Kawasaki LSI provides several clocking methodologies to

minimize on-chip clock skew.

Clock Buffer

This method is the most popular and has been well utilized in older

technologies. It is simple and effective in cases where the number

of clocked elements are less than a few hundred, or the clock skew

requirement is not stringent. In the KZ400GH/KZ400EH Series,

up to 200 flip-flops (depending on frequency) can be driven in a

single stage, with special buffers for clocking.

Clock Tree Synthesis (CTS)

Clock Tree Synthesis is an automatic way to build a clock tree by

balancing the far end delay with local buffers at the most appropriate

physical location. The clock tree is synthesized with low driving

inverters or buffers. Clock Tree Synthesis (CTS) is efficient when

the number of clocked instances is very large or the clock skew

requirement is stringent.

Clock Trunk with CTS

The clock trunk is a wide metal line which is connected to a special

clock driver. It provides lower skew and a shorter delay than a clock

buffer or CTS. In the KZ400GH/KZ400EH Series, a strong clock

driver can be built with multiple special buffers for clocking, or can

be configured with an I/O clock driver, which typically uses 2 to 3

I/O pads.

KZ400GH/KZ400EH CMOS SERIES

PACKAGES Kawasaki LSI has internal ceramic packaging capabilities, enabling

accelerated prototype deliveries. Subcontractors are used for most of

the cost-effective plastic packages that are popular in high volume

designs. Kawasaki LSI also maintains close development relationships

TEST

METHODOLOGY

To ensure a high-quality device, it is important to implement a test

strategy with high fault coverage. Kawasaki LSI’s test methodology for

the KZ400GH/KZ400EH Series includes the following test solutions.

Internal Full Scan Testing

Internal Full Scan Testing is one of the most powerful test methodolo-

gies for automatic development of test vectors, achieving more than

95% stuck-at fault coverage for large synchronous designs. The

Synopsys Test Compiler, which automatically performs testability

rule checking, scan chain insertion and ATPG (Automatic Test

Pattern Generation).

IDDQ Testing

IDDQ Testing is an effective methodology which detects various

types of silicon defects without area or performance overhead.

This methodology is supported by measuring the device’s quiescent

power-supply current on functional vectors selected by CM-iTest®

from CrossCheck, a part of Duet Technologies, Inc. This test provides

an easy way to improve the fault coverage of an ad-hoc test strategy.

JTAG (IEEE 1149.1

Boundary Scan Testing)

JTAG is supported by inserting boundary scan circuits into the

system logic and providing test vectors and BSDL for the boundary

scan logic. The TAP controller and associated logic is transparently

inserted into the customer’s netlist.

Process Monitoring

Process monitoring is performed by adding an AC measurement circuit

into the device and measuring the AC delay. This AC measurement

verifies that the device can operate at a required frequency.

Fault Simulation

Fault simulation is supported using the Cadence Verifault-XL simulator,

which allows you to rapidly obtain fault coverage information for the

applied test vectors.

with key vendors, ensuring that the next generation of industry

standard Ball Grid Arrays (BGA) will be offered to customers whose

designs exceed 300 pins. Package offerings are shown in Table 4.

Table 4 KZ400GH/KZ400EH Package Selection

ACKAGE

OUNT

Skinny DIP 42 64

PQFP 44 64 80 100 120*128 144*160*176 208*240*304*

LQFP (1.4 mm thick body) 64 80 100 128 144 160 176 208

PBGA 256 304 352 416 480 576

TBGA 256 304 352 416 480 576 672

PGA 144 180 208 256 280

*Drop-in heat spreader available for high power dissipation

DESIGN SYSTEM Kawasaki LSI’s integrated top-down design flow is shown in Fig. 2.

It allows you to start either with VHDL or Verilog-HDL, or from the

gate-level, and choose from a wide assortment of schematic capture

programs. Kawasaki LSI supports popular EDA tools, from companies

such as Synopsys, Cadence, Mentor Graphics and ViewLogic.

Kawasaki LSI’s Design Rule Checker and Delay Calculator

can read EDIF netlists. Thus you have a choice of either VSS, Verilog,

QuickSim II, ViewSim, V-System or IKOS Voyager, to read the

delay files generated by the Delay Calculator for gate-level simulation.

An accurate delay calculation method is provided, accounting for not

only output-load-dependent delay, but also input-slew-rate-dependent

offset delay, input-slew-rate-dependent loading delay and interconnect

delay caused by wire resistance. This advanced calculation methodology,

coupled with control of the physical layout, results in the implementation

of the highest performance and most accurate designs.

The interfaces to these tools are industry-standard formats

such as Verilog-HDL, VHDL, EDIF, SDF, PDEF and WGL, making

it very easy for designers to migrate their designs to Kawasaki LSI’s

technologies. The design sign-off golden simulator is Verilog.

Verilog HDL,VHDL

Functional

Simulation

Gate-Level

Simulation

EDIF

▼

Memory

Megafunction JTAG

Design Rule

Checker

Delay

Calculator

Floorplanner

Fault

Simulation

Placement and Clock

Tree Synthesis

Routing

Verification

Fabrication

Test Vector

Test Program

Tester

▼

▼▼

▼

Schematic

Capture

Logic Synthesis

Test Synthesis

▼

Vector RTL

▼▲

Figure 2 Kawasaki LSI’s Design Flow

Timing Analysis

KZ400GH/KZ400EH CMOS SERIES

ELECTRICAL

CHARACTERISTICS

Table 6 Absolute Maximum Ratings

Table 5 Recommended Operating Conditions

Table 7 DC Characteristics

Silicon Valley Office

Kawasaki LSI U.S.A., Inc.

4655 Old Ironsides Drive, Suite 265

Santa Clara, CA 95054

Tel: (408) 654-0180

Fax: (408) 654-0198

Eastern Area Office

Kawasaki LSI U.S.A., Inc.

501 Edgewater Drive, Suite 510

Wakefield, MA 01880

Tel: (617) 224-4201

Fax: (617) 224-2503

Tables 5 through 7 show the electrical characteristics of the

KZ400GH/KZ400EH Series.

ARAMETER

YMBOL

ATING

NITS

Power Supply Voltage VDD 3.0~3.6 V

2.3~2.7 V

Ambient Temperature Ta -40~+85 °C

ARAMETER

YMBOL

ATING

NITS

Power Supply Voltage VDD -0.3~+3.6 V

Input Voltage VIN -0.3~VDD+0.3 V

0.3~+6.3

Output Current IOUT +30 mA

Storage Temperature TSTG -55~+125 °C

YMBOL

ARAMETER

ONDITIONS

IMITS

NITS

. T

. M

LVTTL 2.0 – – V

Vih High-Input Voltage 5V-tolerant LVTTL 2.0 – – V

3.3V PCI 0.5 x VDD – – V

LVTTL – – 0.8 V

Vil Low-Input Voltage 5V-tolerant LVTTL – – 0.8 V

3.3V PCI – – 0.3 x VDD V

V+ High-Input Voltage LVTTL-Schmitt – 1.8 2.3 V

V- Low-Input Voltage LVTTL-Schmitt 0.5 0.9 – V

Vh Hysteresis Voltage LVTTL-Schmitt 0.4 – – V

lih High-Input Current VIN=VDD -10 – +10 µA

lil Low-Input Current VIN=VSS -10 – +10 µA

Voh High-Output Voltage loh=-2~-24mA 2.4 – – V

Vol Low-Output Voltage lol=2~24mA – – 0.4 V

loz 3-State Lead Current Voh=VSS -10 – +10 µA

Vol=VDD -10 – +10 µA

lpu Active Pull-Up Current VIN=VSS -25 -66 -160 µA

lpd Active Pull-Down Current VIN=VDD 25 66 160 µA

ldds Static Stand-By Current – – – 450* µA

*The number is design-dependent.

ESDProtection:=2000V using MIL STD-883D 3015.6 and EIAJ:ED4701 C-111 B standards

Lock-up immunity:300mA injection current (room temp) using JEDEC No. 17 standard

Kawasaki LSI’s logo design is a registered trademark of Kawasaki LSI USA, Inc. All other brand, product names, and company names are trademarks or registered trademarks of their respective companies. Kawasaki LSI reserves the right to make changes to anyproducts and services herein at any time without notice. Kawasaki LSI does not assume any responsibility or liability arising

out of the application or use of any product or service described herein; nor does the purchase, lease or use of a product or service from Kawasaki LSI convey a license under any patent rights, copyrights, trademark rights, or any other of the intellectual property rights of Kawasaki LSI or of third parties. © 1997 Kawasaki LSI. All rights reserved. Printed in U.S.A. 1/97.