Direct-Rambus-Clock-Generator - Rambus, Inc.

Document DL-0056 Version 1.1 Preliminary Information Page 1

RAMBUS Direct Rambus® Clock Generator

Overview

The Direct Rambus® Clock Generator (DRCG)

provides the necessary clock signals to support a Direct

Rambus memory subsystem. It includes s ignals to

synchronize the Direct Rambus Channel clock to an

external system clock. Contained in a 24-pin SSOP

package, the DRCG provides an off-the-shelf solution

for a broad range of Direct Rambus memory applica-

tions, such as PC and workstation main memory,

graphics frame buffers, and communications buffer

memory.

Features

■High Speed Clock Support

267-400 MHz clock source for Direct Rambus

memory syste ms supports up to a 1.6 GB /se c data

transfer rate

■Single differential output driver with less than

50ps short term jitt er

■Synchronization Flexibility

Includes signals to synchronize clock domains of

the Rambus Channel with an external system or

processor clock

■Supports frequency multipliers: 8, 6, 4, 8/3

■Power Management Support

Two power management modes, Clk Stop and

Powerdown minimizes power for mobile and

other power-sensitive applications

■In Clk Stop mode, the DRCG remains activated

while the output buffer is disabled, allowing

fast transitions between the clock-off and

clock-on states. This mode can be used in

conjunction with the Nap mode of the

RDRAMs and R ambus ASIC Cell (RAC).

■In Powerdown mode, the DRCG is completely

powered down for minimum power d i ssipa-

tion. This mode is used in conjunction with the

power down modes of the RD RAMs and RAC.

■Supports Independent Channel Clocking

Supports syst ems not requiring s ynchronization of

the Rambus clock to another system clock

■Active power < 350mW; Vdd = 3.3V ± 5%

■Supports Spread Spectrum Clocking (SSC) for EMI

suppression and minimization

Figure 1: Direct Rambus Clock Generator Package

Related Documentation

Data sheets for the Rambus memory system compo-

nents, includin g the Rambus DRAMs , RIMM Module,

RIMM connector are available on the Rambus web site

at http://www.ram bus.com.

The DRCG is packa ged in a 24-pin 150 mil SSOP.

Figure 2 shows the pin assignments. Table 1 describes

the function and connection of each pin.

Figure 2: DRCG Pin-outs

VDDIPD

SYNCLKN

STOPB

GNDC

REFCLK

VDDIR

PCLKM

VDDP

GNDP

PWRDNB

GNDI

VDDC

CLK

CLKB

VDDO

GNDO

GND

MULT0

MULT1

VDDO

GNDO

N/C

Page 2 Preliminary Information Document DL-0056 Version 1.1

Direct Rambus Clock Generator Data Sheet

Table 1. DRCG Pin-Out

Pin# Signal Type Function Notes

1VDDIR RefV Reference fo r REFCLK Conne ct to C l o c k S ou rce S u pply

2REFCLK IReference cloc k Connect to Clock Sou rce

3VDDPPVDD for PLL 3.3V Supply voltage

4GNDP GGro und f or P LL Grou nd reference

5GNDI GGround for control inputs Ground reference

6PCLKM IPhase Detector input Connect to Controlle r

7SYNCLKN IPhase Detector input Connect to Cont rolle r

8GNDC GGround for Phase Aligner Ground reference

9VDDCPVDD for Ph ase A ligner 3.3V Su p ply voltage

10 VDDIPD RefV Reference for Phase Detector

input s & S TO PB Connect to Controller Supply

11 STOPB IActive Low clock output disable Connect to Controller

12 PWRDNB IActive Low power down input 3.3V CMOS input signal

13 GND IGr o un d Connect to Ground

14 MULT1 IPLL multiplier select 3.3V CMOS input signal

15 MULT0 IPLL multiplier select 3.3V CMOS input signal

16 VDDOPVDD for clock outpu t 3.3V S up p ly volta g e

17 GNDO GGround for clock output Ground reference

18 CLKB OOutput Clock (complem ent) Connect to Rambus Channel

19 N/C N/C Not used Not connected (floating pin)

20 CLK OOutput Clock Connect to Rambus Channel

21 GNDO GGround for clock output Ground reference

22 VDDOPVDD for clock outpu t 3.3V S up p ly volta g e

23 S1 IMode Control 3.3V CMOS input signal

24 S0 IMode Control 3.3V CMOS input signal

Document DL-0056 Version 1.1 Preliminary Information Page 3

Direct Rambus Clock Generator Data Sheet

Figure 3: Direct Rambus Clock Generator Block Diagram

General Description

Figu re 3 shows the bl o c k diagra m of th e DRC G. The

major blocks of the DRCG include a Phase Lock Loop,

a Phase Aligner, a Phase Detector, and a Differential

Output Buffer.

The DRCG’s input clock signal, REFCLK is fed to pres-

caler B of the PLL. Divider A is used in the PLL’s feed-

back path, generating an intermediate output clock,

PLLClk = REFCLK * A/B. The MULT0 and MULT1

pins control the multiply ratio for the PLL. The

multiply ratio values for A and B are shown in Table 8

and described in the PLL Multiplier section.

The Phase Aligner is used to delay the PLL output by

an arbi trary amoun t of phase , without modifying the

output frequency. The Phase Aligner is controlled by

the Phase Detector (φD). The Phase Aligner delays the

output of the PLL by the amount of phase required to

align PCLKM and SYNCLKN at the inputs of the

Phase Detector. The Phase Aligner output clock is

labeled PAClk, and is the clock that no rmally drives

the DRCG output buffer.

Under No rmal operat ion mo de the Dif fer ential Output

Buffer receives the input clock signal from the Phase

Aligner, it buffers the signal an d dri v es a differential

clock output. The Differential Output Buffer is imped-

ance matched to the Rambus Channel transmission

line.

The S0 and S1 input pins control the Bypass and Test

mode selection. The Bypass mode selects the output of

the PLL (PLLClk), bypassing the Phase Aligner, and

can be used in applications that do not require Gear

Ratio Logic in the controller (or phase alig nment of

external clocks). The Test mode routes the input clock,

REFCLK, bypassing both the PLL and the Phase

Aligner circuits to the differential output buffer.

Phase

Aligner CLKB

STOPB

PLL

REFCLK

φD

CLK

SYNCLKN

PCLKM

PLLClk

PAClk

MULT0

MULT1 2

PWRDNB

BypClk

Test MUX Bypass MUX

Differential

Output Buffer

Page 4 Preliminary Information Document DL-0056 Version 1.1

Direct Rambus Clock Generator Data Sheet

Figure 4: System Clock Architecture

Example System Clock Configuration

Figure 4 shows the clocking configuration for an

example Direct Rambus DRAM subsystem. The

configura tion shows the interconnect ion of the sy stem

clock source, the Direct Rambus Clock Generator

(DRCG), and the clock signals of a memory controller

ASIC. The ASIC contains the Rambus Access Cell

(RAC), the Rambus Memory Controller (RMC), and

logic to support synchronizing the Channel Bus Clock

with the controller clock. (The diagram represents the

differential clock outputs as a single Bus Clock wire.)

This configuration achieves frequency-lock between

the controller and Rambus Ch annel clocks (PCl k and

SynClk). These clock signals are matched and phase-

aligned at the RMC/RAC boundary in order to allow

data transfers to occur across this boundary with out

additional latency.

The main clock source drives the system clock (PClk)

to the ASIC, and also drives the reference clock

(RefClk) to the DRCG. PClk and RefClk must have a

rational freq uency rela tionship, even if the fr equen cies

are not equal; but, there is no phase relationship

requirement whatsoever. A PLL inside the DRCG

multiplies the DR CG’s REFCLK input to generate the

desired frequency for Bus Clock. Bus Clock is driven

on the Rambus Channel through a terminated trans-

mission line. At the mid-point of the Channel, the RAC

senses Bus Clock using its own DLL for clo c k align-

ment, followed by a fixed divide-by-4 circuit that

generates SynClk.

PClk is the clock used by the RMC in the ASIC. SynClk

is the clock used at the ASIC interface of the RAC. The

DRCG together with the Gear Ratio Logic in the A S IC

enables the controller to exchange data directly from

the PClk domain to the SynClk domain without incur-

ring additional latency for synchronization. In general,

PClk and SynC lk can run at different frequencies, so

the Gear Ratio Logic must select the appropriate M

and N dividers such that the frequencies of PClk/M

and SynClk/N are equal. For example, if

PClk =13 3MH z and Bus Clock= 40 0MH z,

SynClk=100MHz, and M=4 while N=3, giving PClk/M

= SynClk/N = 33MHz.

Figure 5 shows an example of the clock waveforms

generated with the Gear Ratio Logic.

The ASIC drives the output clocks, PClk/M and

SynClk/N from the Gear Ratio Lo gic to the DRCG

Phase Detector inputs. The routing of the PClk/M and

SynClk/N signal traces must be matched both in

impedance and propagation delay on the ASIC as well

as on the board. These signals are not part of the

Rambus Channel and their routing must be matche d

by board designers.

System

Clock

Source Bus Clock

Direct Rambus

Clock Generator

(DRCG)

RefClk

Gear Ratio

Logic

PClk/M

SynClk/N

Controller

...

RDRAMs

DLL

SynClk

RAC

RMC

PClk

Document DL-0056 Version 1.1 Preliminary Information Page 5

Direct Rambus Clock Generator Data Sheet

Figure 5: Gear Ratio Timing Diagram

After comparing the phases of PClk/M and

SynClk/N, the DRCG Phase Detector drives a phase

aligner that adjusts the phase of the DRCG output

clock, Bus Clock. Since the other elements in the

distributed loop have a fixed delay, adjusting Bus

Clock adjusts the phase of SynClk and thus the phase

of SynClk/N. In this manner, the distributed loop

adjusts the average ph as e of Syn Clk/N to match the

average phase of PClk/M, eliminating the average

phase error at the input of the DRCG Phase Dectector.

When the clocks are aligned, data can be exchanged

directly from the PClk domain to the SynClk domain.

If the ASIC stops the SynClk/N clock (for example, in

a power saving mode), the DRCG phase aligner freezes

and holds it state. The phase aligner resumes normal

operation when SynClk/N resumes.

The Gear Ratio Logic supports four clock ratios (2.0,

1.5, 1.3 3, and 1.0), wher e the ratio is defined as the ratio

of PClk/SynClk. Since Bus Clock = 4*SynClk, this ratio

also is equa l to 4*PClk/Bus Clo c k. Other ratios could

be used, depending on particular system implementa-

tions. Table 2 shows several supported gear ratios,

together with the corresponding M and N dividers in

the gear ratio logic, and the corresponding A and B

dividers required and designed into the DRCG PLL.

The Ratio column gives the Gear Ratio as defined by

PClk/SynClk (same as M/N). The f@PD column lists

the divided down frequency (in MHz) at the Phase

Detector input, where f@PD = PClk/M = SynClk/N.

System Architecture without

Gear Ratio Logic

Figure 6 shows how a DRCG can be used in a system

that does not use Gear Ratio Logic. The DRCG is used

to generate Bus Clock, as before, but the Phase Aligner

part of the DRCG is not used. In this configuration, the

Phase Aligner inputs (PCLKM and SYNCLKN) must

be tied to ground and not left floating. Since the

resulting SynClk and PClk signals are not aligned, the

data must be retimed (for example, using FIFOs) at the

PClk/SynClk boundary.

Figure 6: DRCG In System without Gear Ratio Logic

PClk

SynClk

PClk/M =

SynClk/N

Table 2. Fr eq uencies , Di viders, and Ge ar Rat ios

Bus

Clock P

Clk Syn

Clk A B M N Ratio f@

267 67 67 8 1 2 2 1.0 33

300 100 75 6 1 8 6 1.33 12.5

400 100 100 8 1 4 4 1.0 25

267 133 67 4 1 4 2 2.0 33

400 133 100 6 1 8 6 1.33 16.7

System

Clock Bus Clock

RefClk

DLL

PClk SynClk

RAC

RMC

Controller

...

RDRAMs

Direct Rambus

Clock Generator

Data

Retiming

Ground

Page 6 Preliminary Information Document DL-0056 Version 1.1

Direct Rambus Clock Generator Data Sheet

Logical Specification

The DRCG clock source has three fundamental oper-

ating states. Figure 7 show s the state di agram with

each transition labeled A through N. Note that the

clock source output need NOT be glitch-free during

state tran sitions.

Figure 7: DRCG State Diagram

Upon powering up the DRCG, the device can enter

any state, depending on the settings of the control

signals PWRDNB and STOPB.

In Powerdown mode (PWRDNB = 0), the DRCG clock

source is powered down with the control signal,

PWRDNB. The reference inputs, VDDIR and VDDIPD,

may remain ON or may be grounded w hile in Power-

down mode. The PWRDNB signal dominates all other

DRCG control sign als. If PWRDNB is enabled

(PWRDNB = 0), the device should enter the Power-

down mode no matter what other signals are driving

or controlling the DRCG. The device should not exit

the Powerdown mode until PWRDNB is disa bled

(PWRDNB = 1). Transition tim ing is shown in Table 5.

The contro l signals S0 and S1 may be changed to take

the DRCG from Test mode to Normal mode or Normal

mode to Test mode, as shown in Figure 10.

The MULT0 and MULT1 control signals can be used in

two ways. If they are changed during Powerdown

mode, then the Powerdown transition timings deter-

mine the settling time of the DRCG.

However, the MULT0 and MULT1 control signals can

also be changed during Normal mode. When the

MULT con t rol sig nals are “hot swapped” in this

manner, the MULT transition timings determine the

settling time of the DRCG. The MULT0 and MULT1

control signals must be stable d uring Test mode.

In Clk Stop mode (STOPB = 0, PWRDNB = 1), the clock

source is ON, but the clock output is disabled. The

reference i nputs VDDIR and VDDIPD must remain ON

during the Clk Stop mode.

In Normal mode (ST OPB = 1, PWRDNB = 1), the clock

source is ON, and the Differential Output Buffer is

enabled.

The SYNCLKN input, controls the update of the phase

aligner logic. If the S YNCLKN input stops toggling,

whether in Normal mode or Clk Stop mode, the phase

aligner will stop advancing and will hold its state. The

maximu m time that S YNCLKN can be frozen is the

same as the maximum assertion time for STOPB,

shown as a paramet er tSTOP i n Table 4. When the

SYNCLKN input resumes toggling, the phase aligner

logic should continue being updat ed a ccording to the

phase difference at the phase detector inputs, PCLKM

and SYNCLKN.

VDD turn-on

Powerdown

VDD

Clk Stop

Normal

turn-on VDD

turn-on

Test

VDD turn - o n

Table 3. Control Signals for Clock Source States

STATE PWRDNB STOPB Clock

Source Output

Buffer

Powerdown 0 X OFF Ground

Clk Stop 1 0 ON Disabled

Normal 1 1 ON Enabled

Document DL-0056 Version 1.1 Preliminary Information Page 7

Direct Rambus Clock Generator Data Sheet

Transition Timings

The following figures show the timing diagrams for

the variou s transitions between stat e s ..

Figure 8: PWRDNB Transition Timings

Figure 9: MULT Transition Timings

Figure 10: S0 and S1 Transition Timings

PWRDNB

CLK/CLKB

tPOWERUP tPOWERDN

MULT0, MULT1

CLK/CLKB

tMULT

S0 and/or S1

CLK/CLKB

tCTL

Page 8 Preliminary Information Document DL-0056 Version 1.1

Direct Rambus Clock Generator Data Sheet

Figure 11: StopB Transition Timings

Figure 11 shows that the Clk Stop to Normal transition

goes through three phases. During tCLKON, the clock

output is not speci fi ed a nd can have glitches. For the

time period tCLKON < t < tCLKSETL, the clock output

is enabled and is glitch-free. For the time period t >

tCLKSETL, the clock output phase settles to within 50

ps of the phase before the clock output was disabled.

At this time, the clock output must also meet the

voltage and timing specifications listed in the Device

Parameters. The outputs are in a high impedance state

during the Clk Stop mode. The above specifications

apply when the output has been held in the Clk Stop

state for less than tSTOP listed in Ta ble 4.

Table 5 specifies the latencies of each state transition.

Note that these transitions need not be glitch free. Also

the transition latencies assume the following:

■RefClk input has settled and meets DC and AC

operating conditions shown in Table 14 and

Table 16.

■S0 and S1 control signals are stable, except for the

timing tC TL.

■MULT0 and MULT1 are stable, except for the

timing fo r tMULT.

tSTOP

tON

STOPB

CLK/CLKB

tCLKOFF

tCLKSETL

tCLKON

output clock

not spec’d

glitches ok

clock enabled

and glitch free clock output settled within

50ps of the phase before

disabled

Table 4. STOPB Control Timing

Symbol Min Max Unit Description

tSTOP 100 µs Max time in Clk Stop

(STOPB=0) befor e r e -

enteri ng Normal

mode (STOPB=1).

tON 100 ns Min t ime in Norm al

mode (STOPB=1)

before re-entering Clk

Stop (STOPB=0).

Document DL-0056 Version 1.1 Preliminary Information Page 9

Direct Rambus Clock Generator Data Sheet

Power Saving Modes

Table 6 shows th e logic for enabling the clock outp uts,

using the STOPB input si gnal. When STOPB is high,

the DRCG is in its Normal mode, and CLK and CLKB

are complementary outputs following the Phase

Aligner output (PAClk in Figure 3). When STOPB is

low, the DRCG is in Clk Stop m ode, the output driver

transistors are both disabled and the CLK and CLKB

outputs are set by internal resistor dividers to voltage

VX,STOP

Table 5. State Transition Latency Specifications

Transition From To Transition Latency Description

Symbol Max

APower-

down Normal tPOWERUP 3 ms Time from PWRDNB ↑ to CL K/ C LKB out pu t s ett le d

(excluding tDISTLOCK).

CPower-

down Clk Stop tPOWERUP 3 ms Time from PWRDNB ↑ until the intern al PLL and cl ock

has turned ON and settled.

KPower-

down Test tPOWERUP 3 ms Time from PWRDNB ↑ to CL K/ C L K B output s ettled

(excluding tDISTLOCK).

DD ON Normal tPOWERUP 3 ms Time from when VDD is applied and settled until

CLK/CLKB output is settled (excluding tDISTLOCK).

DD ON Clk Stop tPOWERUP 3 ms Time from when VDD is applied and settled u ntil th e i nter-

nal PLL and clock has turned ON and settled.

DD ON Test tPOWERUP 3 ms Time from when VDD is applied and settled until the out-

put cloc k has turned ON and settled.

J Normal Normal tMULT 1 ms Time from when MULT0 or MULT1is changed until

CLK/CLKB output has re-settled (excluding tDISTLOCK).

E Clk Stop Normal tCLKON 10 ns Time from STOPB ↑ until CLK/CLKB provides glitch-free

clock edges.

E Clk Stop Normal tCLKSETL 20

cycles Time from STOPB ↑ to CLK/CLKB output settled to

within 50ps o f the phase before CLK/CL KB was disabled.

F Normal Clk Stop tCLKOFF 5 ns Time from STOPB ↓ to CLK/CLKB output disabled.

L Test Normal tCTL 3 ms Time from when S0 or S1 is changed until CLK/CLKB out-

put has re-settled (excluding tDISTLOCK).

N Normal Test tCTL 3 ms Time from when S0 or S1 is changed until CLK/CLKB out-

put has re-settled (excluding tDISTLOCK).

B,D Normal

Clk Stop

Power-

down tPOWERDN 1 ms Time fr om PWRDNB ↓ to th e dev ic e in Po werdow n Mo de.

Table 6. Clk Stop Mode Selection

Mode STOPB PWRDNB CLK CLKB

Normal 1 1 PAClk PAClkB

Clk Stop 0 1 VX,STOP VX,STOP

Page 10 Preliminary Information Document DL-0056 Version 1.1

Direct Rambus Clock Generator Data Sheet

Table 7 shows the logic for selecting the Powerdown

mode, using the PWRDNB input signal. PWRDNB is

active low (enabled when = 0). When PWRDNB is

disabled, the DRCG is in its Normal mode. When

PWRDNB is enabled (PWRDNB = 0), the DRCG is put

into a powered-off state, and the CLK and CLKB

outputs are both low (ground). The internal resistor

dividers ar e disconnected during Power down mode in

order to save power. This is true both for the resistor

dividers used to set VX,STOP during Clk Stop mode,

and for the resistor dividers used to set the trip points

for the input clocks.

PLL Multiplier

Table 8 shows the logic for selecting the PL L prescaler

and feedback dividers to determine the multiply ratio

for the PLL from the REFCLK input. Divider A sets the

feedback and Divider B sets the prescaler, so the PLL

output clock (PLLClk in Figure 3) is set by: PLLClk =

REF CLK * A/ B.

Distributed Loop Lock Time

After the DRCG PLL has settled, the distribu ted loop

containing the Phase Aligner must also settle. This

settling time depends o n com p onents in the distrib-

uted loop which are outside of the clock source. There-

fore, this system settling tim e is not a compo nen t

specification.

The maximum lock time for the distributed loop is

specified in Table 9. Note that the total time for the

output clock to settle from the Powerdown state to the

Normal state is the sum of tPOWERUP plus tDIS-

TLOCK. Simila rly, if MU LT0 and MULT1 control

signals are changed whil e the DRCG is in the Normal

state, the total time for the o utput clock to re-settle is

the sum of tMULT plu s tDISTLOCK.

The above specification is the maximum possible lock

time for the distributed loop. The actual lock time

depends on the cycle time of the phase detector input

clocks (tCYCLE,PD), the amount of initial phase error at

the phase detector inputs (tERR,INIT), and the phase

detector step size per update (tSTEP) shown in Table 17.

The lock time is given by:

tDISTLOCK = tCYCLE,PD * tERR,INIT / tSTEP.

Using the values given in Table 1 6 and Table 17, this

reduces to:

tDISTLOCK = 0.5 * (tCYCLE,PD)2 / 2ps.

The resulting lock time, theref ore, str ongly depends on

the phase detector input cycle time. For the maxim um

cycl e time of 10 0ns (10MH z), this gives 2.5m s as shown

in Table 9. For a cycle time of 80ns (12.5MHz), the lock

time drops to 1.6ms. And for a faster cycle time of 40ns

(25MHz), the lock time drops to 0.4ms.

Test Modes

Table 10 shows the logic for selecti ng the Bypass and

Test modes. The select bits, S0 and S1, control the selec-

tion of these modes. The Bypass mode selects and

outputs the full speed PLL output clock (PLLClk) to

the CLK/CLKB outputs bypassin g the Phase Aligner.

The Test mode selects the REFCLK input and outputs

it to the CLK/CLKB outpu ts bypassing both the PLL

and the Phase Aligner.

In the Output Test mode (OE), both the CLK and CLKB

outputs are put into a high-im p edance state (Hi-Z).

This mode can be used for component testing and for

board-level testing. The internal resistor dividers used

Table 7. Powerdown Mode Selec tion

Mode PWRDNB STOPB CLK CLKB

Normal 1 1 PAClk PAClkB

Power-

down 0XGndGnd

Table 8. PLL Divider Selection

MULT0 MULT1 A B

0041

0161

1181

1083

Table 9. Distributed Loo p Lock Time Specific ation

Symbol Min Max Unit Description

tDISTLOCK 2.5 ms Time from when

CLK/CLK B out-

put is settled to

when the phase

error between

SYNCLK N an d

PCLKM falls

withi n the tERR-PD

spec in Table 17.

Document DL-0056 Version 1.1 Preliminary Information Page 11

Direct Rambus Clock Generator Data Sheet

to set VX,STOP during Clk Stop mode are disconnected

during Output Test mode.

Device Pa rameters

This chapter specifies the numerical values of the

physical parameters described earlier in this data

sheet.

The DRCG clock source meets the device characteris-

tics listed in Table 15 and Table 17 when characterized

under the operating condition s listed in Table 14 and

Table 16, and when using the componen ts show n in

Figure 13, and the corresponding component values

given in Table 18.

Only the DC specifica tions of Table 15 apply while in

Test mode. The AC specifications of Table 17 (see

Logical Specification Section for mode descriptions) do

not apply while in Test mode unless specified.

Absolute Maximums

Table 11 represents stress ratings only, and fu nctional

operation at the ma ximum settin gs is not guaranteed.

Supply Current Characteristics

The current drawn thr ough the VDD pi ns is spe cified in

Table 12. This includes the total current through all

VDDC, VDDP, and VDDO pins .

The current drawn through the VDDIR and the

VDDIPD reference pins is specified in Table 13. These

specs are for each pin individually, and not for their

sum. The maximum total current for the refer ence pins

wo uld be tw o tim es the n umbers below. The ma ximum

total current would be 2mA for the REFCLK reference

input (VDDIR) plus 2mA more for the complete voltage

refere nce circuit ( on p in VDDIPD) used for both Phase

Detector input pins.

Ta ble 10: Bypass and Test Mode Selection

Mode S0 S1 CLK CLKB

Normal 0 0 PAClk PAClkB

Bypass 1 0 PLLClk PLLClkB

Test 1 1 RefClk RefClkB

Output Test (OE) 0 1 Hi-Z Hi-Z

Table 11 . Absolute Maximum Ratings

Symbol Parameter Min Max Unit

VDD,ABS Max voltage on VDD

with respect to

ground

-0.5 4.0 V

VI,ABS Max voltage on any

pin with r espec t to

ground

-0.5 VDD+

0.5 V

Table 12. Supply Current Characteristics

Symbol Parameter Min Max Unit

IPOWER-

DOWN

Current in Power-

dow n sta t e

(PWRDNB = 0)

200 µA

ICLKSTOP Current in Clk Stop

stat e (STOPB = 0) 50 mA

INORMAL Current in Normal

stat e (STOPB = 1) 100 mA

Table 13. Reference Current Characteristics

Symbol Parameter Min Max Unit

IREF,PWDN Reference Current

in Po werdown

state (PWRDNB =

50 µA

IREF,NORM Reference Current

in Normal or Clk

Stop sta te

(PWRDNB=1)

2mA

Page 12 Preliminary Information Document DL-0056 Version 1.1

Direct Rambus Clock Generator Data Sheet

DC Operating Conditions

This section specifies input conditions for operating

the device. When operated outside these limits, device

characteristics are undefined.

Table 14 gives the DC operating cha r acteristics.

a. For VDDx ≥ input ≥=0 , where VDDx is the relevant supply (VDDIR for REFCLK, VDDIPD for the Phase Detector in pu t s, an d ot h e r CM OS

inputs)

DC Characteristics

a. VCOS = VOH - VOL.

b. rOUT = DVO/DIO. This is defined at the output pins.

Table 14. DC Operating Conditions

Symbol Parameter Min Max Unit

VDD Supply voltage 3.135 3.465 V

TAAmbient operating temperature 0 70 °C

VIL Input (scalable CMOS) signal low voltage - 0.3 VDD

VIH Input (scalable CMOS) signal high voltage 0.7 - VDD

VIL,RREFCLK input low voltage - 0.3 VDDIR

VIH,RREFCLK input high voltage 0.7 - VDDIR

VIL,PD Input sig nal lo w voltage for PD inputs and S TOPB - 0.3 VDDIPD

VIH,PD Input signal high voltage for PD inputs and STOPB 0.7 - VDDIPD

VDDIR Input supply reference for REFCLK 1.235 3.465 V

VDDIPD Input supply reference for PD inputs 1.235 2.625 V

IIN Input leakage current spec for REFCLK input, Phase Detector

inputs, and all scalable CMOS inputsa-50 50 uA

Table 15. DC Device Characteristics

Symbol Parameter Min Max Unit

VX,STOP Output v oltag e during Clk S top (STOPB=0) 1.1 2.0 V

VXDifferential output crossing-point voltage 1.3 1.8 V

VCOS Out put volt a ge swing (p-p single-end ed)a0.4 1.0 V

VOH Outp u t hig h volt age - 2.35 V

VOL Output low voltage 1.0 - V

rOUT Output dynamic resistance (at pins)b12 50 Ω

IOZ Output current during Hi-Z (S0=0, S1=1) - 50 µA

IOZ,STOP Output cu rrent during Clk Stop ( S TOPB=0) - 500 µA

Document DL-0056 Version 1.1 Preliminary Information Page 13

Direct Rambus Clock Generator Data Sheet

AC Operating Conditions

This section specifies input AC conditi ons for oper-

ating the device. When operated outside these limits,

device characteristics are undefined.

a. Maximum REFCLK Input cycle time specification does not apply when the DRCG is in Test Mode.

b. RefClk jitter measured at VDDI,R(nom)/2 and is the absolute value of th e worst case +/- deviation, not the peak-to-

peak jitter.

c. If inpu t mod ulation is u se d; input mod ulation is allowe d bu t not required

d. The amount of allowed spreading for any non-triangular modulation is determined by the induced downstream track-

ing skew, which cannot exceed the skew gener a ted by the spec ifi e d 0.6 % tr iangular mod ulation. Typically, the amount of

allowe d n o n -t riangula r modulation is about 0. 5%

e. The input jitter for the Phase Detector inputs is defined from cycle-to-cycle on one input signal (not between the two

Phase Dete ctor input s), and is meas ured at VDDI,PD(nom) /2. Be cause the allo wable inpu t jit t er is large , a non-propor-

tional (bang-bang) phase detec to r design is used to limit the effect on output clock jit ter.

f. Capacitance m easured at Frequency = 1MHz, DC bias = 0. 9V, an d VAC < 100m V

Table 16. AC Operating Conditions

Symbol Parameter Min Max Unit

tCYCLE ,IN REFCLK Input cycle time 10 40ans

tJ,IN Input Cycle-t o -cycle jitte rb- 250 ps

DCIN Input duty cycle over 10, 000 cycles 40% 60% tCYCLE

fM,INcInput frequency of modulation 30 33 kHz

PM,INcModulation index for triangular modulation - 0.6 %

Modulation index for non-triangular modulation - 0.5d%

tCYCLE,PD Phase Detector input cycle time at PCLK M & S YNC L KN 30 100 ns

tJPD Phase Detector input Cycle-to-cycle jittere3.5 ns

tERR,INIT Initial Phase error at Phase Detector inputs

(Required range of Phase Aligner) -0.5 0.5 tCYCLE,PD

DCIN,PD Phase Detector input duty cycle over 10,000 cycles 25% 75% tCYCLE,PD

tI,SR Input slew rate (measured at 20% - 80% of input voltage)

for PCLKM, SYNCLKN, and REFCLK 14V/ns

CIN,PD Input capacitance at PCLKM, SYNCLKN, and REFCLKf-7pF

∆CIN,PD Input capaci tance matching at PCLKM and SYNCLKNf-0.5pF

CIN,CMOS Input capacitance at scalable CMOS pins (excluding

PCLKM, SYNCLK N , and REFCLK)f-10pF

Page 14 Preliminary Information Document DL-0056 Version 1.1

Direct Rambus Clock Generator Data Sheet

AC Characteristics

Table 17 gives the AC characteristics for device opera-

tion.

a. Output short term jitter specification is the absolute value of the worst case measured ± deviation over 10,000 con-

secutive cycles and is defined in the Jitter section and illustrated in Figure 18.

b. Phase Detector phase error is a component specification that tests the internal DRCG phase detector alignment cir-

cuitry and no t a n ext ern al di s tri buted lo op in a system. This specif ic a tion a ppli es to the a verage phas e er ror and do es

not incl ude jitt er of the input clocks .

c. Spe cification ap p lies during Test Mode on ly.

Table 17. AC Device Characteristics

Symbol Parameter Min Max Unit

tCYCLE Clock cycle time 2.5 3.83 ns

tJJitter over 1-6 clock cycles at 400MHza-50ps

Jitter over 1-6 clock cycles at 300MHza-70ps

Jitter over 1-6 clock cycles at 267MHza-80ps

tSTEP Phase Aligner phase step size (at CLK/CLKB) 2 - ps

tERR,PD Internal Phase Detector phase error between

PCLKM and SYNCLKN (rising edges)b- 10 0 100 ps

tERR,SSC PLL output Phase error when tracki ng SSC - 100 100 ps

DC Output duty cycle over 10, 00 0 cy cles 40% 60% tCYCLE

tDC,ERR Cycle-to-cycle duty cycle error at 400MHz - 50 ps

Cycle-to-cycle duty cycle error at 300MHz - 70 ps

Cycle-to-cycle duty cycle error at 267MHz - 80 ps

tCR, tCF Output rise and fall times (measured at

20% - 80% of output vo ltage) 160 400 ps

tCR,CF Difference between output rise and fall times

on the same pin of a single device (20% - 80%) -100 ps

tJT Cycle-to-cycle jitter during Test modec-500ps

DCTAverage Output duty cycle over 10,000 cycles

during Test mod ec40% 60% tCYCLE

tCRT, tCFT Output rise and fall times (measured at

20% - 80% of output voltage) during Test

modec

250 900 ps

Document DL-0056 Version 1.1 Preliminary Information Page 15

Direct Rambus Clock Generator Data Sheet

Physical Specificatio n

Input Signals

The DRCG receives a reference clock input (RefClk)

and two clock inputs (PCLKM and SYNCLKN) that

drive the phase detector. These clock inputs come from

circuits that are power ed by diff ere nt supplies than the

DRCG, and thus cannot be referenced to the DRCG’s

3.3V supply voltage. Reference voltage inputs VDDIR

and VDDIPD are provided to enable the DRCG to

determine the proper trip-point of the clock inputs.

The Phase Detector signals come from the contr oller, so

the controller output voltage supply is connected to

the pin VDDIPD of the DRCG, and is used as the refer-

ence for the two phase detector input signals, PCLKM

and SYNCLKN. VDDIPD is also used as the reference

for the output enable/disable signal, STOPB.

Similarly, the reference cl o ck comes from the m ain

clock source chip, so the main clock source output

voltage supply is connected to the pin VDDIR of the

DRCG, and is used as the reference for the REFCLK

input signal.

The input clock signals must be con v erted from small

swing signals (e.g. 0 to VDDIR or 0 to VDDIPD) to full

swing signals (0 to VDD). Therefore, the DRCG

contains input translator circuits in order to detect the

inputs levels accurately. Figure 12 shows an example

connection of a clock source (with its VDDI) to the

DRCG. The figure also shows a resistor d ivider that

conceptu ally show s how a VDDI/2 reference could b e

developed.

Figure 12: Input Level Translator

Select Inputs

There are several select inputs. The MULT0 and

MULT1 inputs are used for selecting the PLL multi-

plier ratio. The S0 and S1 inputs are used for selecting

various modes of operation. And the PWRDNB input

is used for controlling powerdow n.

All of the select inputs (MULT0, MULT 1, S0, S1, and

PWRDNB) are normal, 3. 3V LCMOS, scalable CMOS

inputs signa ls. No external reference inputs or level

translators (such as those used with the cloc k inputs)

are r eq uir ed.

All inputs are active high, except PWRDNB, which is

active low. No internal pull-up or pull-down resistors

exist inside the DRCG .

The only param e ters listed in Table 16 that relate

specifically to the select inputs are the input levels (VIL

and VIH) and the input capacitance (CIN,CMOS).

VDDI (1.3v - 3.3v)

Input

VDDI

SOURCE

DRCG

Page 16 Preliminary Information Document DL-0056 Version 1.1

Direct Rambus Clock Generator Data Sheet

Clock Output Driv er

Figure 13: Example System Clock Driver Equiv al ent Circuit

Figure 13 show s the clock driver equivalent circuit.

The differential output clock driver of the DRCG has a

low output impedance in the range of about 20 ohms.

The driver pr oduces the specified voltage swing on the

channel, and also mat ches the chan nel im pedance. The

nominal value of the channel impedance, ZCH, is

expected to be 28 ohms for a Rambus memory

subsystem. External series resistors RS and parallel

resistors RP are used to set the voltage swi ng on the

channel. The driver output characteristics are defined

together with the external components, and the output

clock is specified at the mea surement point indicated

in Figure 13. The complete set of external components

for the output driver circuit, including edge-rate filter

capacitors is also shown in the figure and example

values for the external components are shown in

Table 18.

The clock driver is specified as a black-box at the

package pins. The output characteristics are measured

after the series resistance, RS. The outputs are termi-

nated differentially at the end of the transmission line,

with no appl ied termination voltage.

The clock driver’s output impedance, rOUT, is in series

with RS, and the combination is in parallel with RP

. The

resulting effective impedance must mat ch the channel

impedance in or der to minimize secondary reflections.

To accomplish this, each of the four CMOS output

devices is designed to have an rOUT of abou t 20 ohms

when fully turned on. rOUT is the dynamic output resis-

tance. Since rOUT is in series with RS, and that co mbina -

tion is in parallel with RP, the effective output

impedance is given by:

RP (RS + rOUT) / (RP + RS + rOUT)

This calculation results in an effective output imped-

ance of about 27 ohms for the example values listed in

Table 18. Since the to tal impedance is do minated by

the externa l resistors, a large variatio n in the on-c hip

value of rOUT is allowed. When the output is transi-

tioning, the im ped an ce of the CM OS devices increases

dramatically. The purpose of RP is to limit th e

maximu m output impedance during output tran si-

tions.

In order to control signal attenuation and EMI, clock

signal rise/fall times are tightly controlled. External

filter capacitors CF could be used to control the output

slew rate. In addition, the capacitor CMID is used to

provide AC ground at the mid-point of the RP and the

RT resistors.

Table 18 gives the nominal values of the external

components and their maximum acceptable tolera nce,

assuming ZCH = 28 ohms for the example Rambus

memory subsystem. These values apply only to the

DRCG Testboard. For motherboard values, see the

System Physica l Design Guide..

Measurement Point

RPZCH

ZCH

CMID

Measurement Point

CMID

Differential Driver

Table 18. Ex am pl e Externa l Com pon ent Values

Symbol Parameter Value Tolerance Unit

RTTermination

resistor 27 ± 1% Ω

RSSeries resistor 68 ± 5% Ω

RPParallel resistor 39 ± 5% Ω

CFEdge-Rate

Filter Capacitor 3± 10%pF

CMID AC Ground

Capacitor 100 ± 20% pF

Document DL-0056 Version 1.1 Preliminary Information Page 17

Direct Rambus Clock Generator Data Sheet

Output Driver Characteristics

Table 19 gives e xample V/I cha racteristics for the clock

output drivers at the pins of the DRCG. The sign on all

current parameters (direction of current flow) is refer-

enced to a ground inside the component; i.e. positive

currents flow into the component. These example V/I

characteristics can be used for generating simul ati on

models of the DRCG (such as IBIS models). Table 19 is

given as an example and do es not repr esen t additional

specifications.

Table 19. Output Buffer V/I Characteristics

Voltage

(V)

Pull-Down Pull-Up

I (mA) I (mA) I (mA) I (mA) I (mA) I (mA)

Min Typ Max Min Typ Max

0000-35-55-91

0.2 8.3 11.9 17.6 -34 -55 -90

0.4 15.8 22.8 33.6 -34 -54 -89

0.6 22.5 32.5 47.9 -33 -53 -87

0.8 28.3 41.0 60.3 -33 -52 -86

1.0 33 48 71 -32 -51 -84

1.2 37 54 79 -31 -50 -82

1.4 41 59 85 -30 -48 -79

1.6 43 62 90 -28 -46 -77

1.8 44 64 92 -27 -43 -73

2.0 45 65 93 -24 -40 -68

2.2 45 66 94 -21 -36 -62

2.4 46 66 95 -17.7 -31.1 -55.0

2.6 46 67 95 -13.6 -25.4 -46.7

2.8 46 67 95 -8.9 -19.0 -37.6

3.0 46 67 96 -3.7 -11.9 -27.4

3.135 46 67 96 0 -6.7 -19.9

3.3 67 96 0 -10.3

3.465 96 0

Page 18 Preliminary Information Document DL-0056 Version 1.1

Direct Rambus Clock Generator Data Sheet

Signal Wavef orms

A physical signal which appears at the pins of a device

is deemed valid or invalid depending on its voltage

and timing relations with other signals. In put and

output voltage waveforms are defined as shown in

Figure 14. Both rise and fall times are defined between

the 20% and 80% points of the voltage swing, wi th the

swing defined as VH - VL. For example, the output

voltage swin g VCOS = VOH - VOL

Figure 14: Input and Output Voltage Waveforms

Figure 15 shows the definition of output crossing

point. The nominal crossing point between the comple-

mentary outputs is defined to be at the 50% point of

the DC voltage levels. There are two crossing points

defined, Vx+ at the rising edge of CLK and Vx- at the

falling edge of CLK. For some clock waveforms , both

Vx+ and Vx- might be below Vx,nom (for example, if

tCR is larger than tCF).

Figure 15: Crossing-point Voltage

Figure 16 shows the definition of long-term duty cycle,

which is sim p ly the waveform high-time divided by

the cycle time (defined at the crossing point). Long-

term duty cycle is the average over many (>10,000)

cycles. Short-term duty cycle is defined in the next

section.

Figure 16: Duty Cycle

80%

V(t) 20%

CLK

CLKB

Vx,nom

Vx+

Vx-

CLK

CLKB

tPW+

tCYCLE

DC = (tPW+ / tCYCLE)

tPW-

Document DL-0056 Version 1.1 Preliminary Information Page 19

Direct Rambus Clock Generator Data Sheet

Jitter

This section de fines the specificatio ns that relate to

timing uncertainty (or jitter) of the input and output

waveforms. Figure 17 shows the definition of cycle-to-

cycle jitter with respect to the falling edge of the CLK

signal. Cycle-to-cycle j itter ( als o called 1-cycle short

term jitter) is the difference between cycle times of

adjacent cycles. Equal requirements apply for rising

edges of the CLK signal.

Figure 17: Cycle-to-cycle Jitter

Figure 18 shows the definition of 4-cycle shor t-term

jitter. Short-term jitter is defined with respect to the

falling edge of the CLK signal. 4-cycle short-term jitter

is the differ ence between the cumulative cycle times of

adjacent 4-cycles. Equal requirements apply for rising

edges of the CLK signal. Equal requirements also

apply for 2-cycle, 3-cycle, 5-cycle, and 6-cycle short-

term jitter.

Figure 18: Short-term Jitter

The purpose of this definition of short-term jitter is to

define errors in the measured time (for example,

t4CYCLE, i) vs. the expected time. The purpose for

measuring the adjacent time t4CYC LE, i+1 is only to help

determine the expected time for t4CYCLE , i. Alternate

methods of determini ng tJ are possible. However,

measuring long-term average jitter instead of short-

term jitter would normally give more pessimis tic

results.

Figure 19 show s the definition of cycle-to-cycle duty

cycle error. Cycle-to-cycle duty cycle err or is defined as

the difference between tPW+ (high-times) of adjacent

differential clock cycles. Equa l requirements apply to

tPW- , low-times of the differential clock cycles.

Figure 19: Cycle-to-cycle Duty Cycle Error

CLK

CLKB tCYCLE,i

tJ = tCYCLE,i - tCYCLE, i+1 over 10,000 consecutive cycles

tCYCLE,i+1

CLK

CLKB t4CYCLE, i

tJ = t4CYCLE, i - t4CYCLE, i+1 over 10,000 consecutive cycles

t4CYCLE, i+1

CLK

CLKB

Cycle (i) Cycle (i+1 )

tPW+ (i)

tCYCLE (i)

tPW+ (i+1)

tCYCLE (i+1)

tDC,ERR = tPW+(i) - tPW+(i+1) and tPW-(i) - tPW-(i+1)

tPW- (i) tPW- (i+1)

Page 20 Preliminary Information Document DL-0056 Version 1.1

Direct Rambus Clock Generator Data Sheet

Spread Spectrum Clocking

Spre ad Spectrum Clocking ( SSC) can be used to r educe

the spectral peaks and help reduce system-level EMI.

The DRCG does not contain any functionality to

generate SSC. If SSC is used, and the SSC clock input

meets operating conditions listed in Table 16, the input

clock will be modulated, and the DRCG will track the

input modulation. The use of SSC is optional, and the

input clocks ma y or may not be modulated.

The minimum clock period cannot be violated. The

preferred method is to adjust the spreading to not

allow for modulation above the nominal frequency.

This technique is often referred to as

“downspreading.” An example frequency modulation

is shown in Figure 20. The frequency is spread from

fNOM down to (1-PM, IN)*fNOM, where fNOM is the

inverse of the nominal input cycle time, tCYCLE,IN.

The example in Figure 20 shows triangular frequency

modulation. Oth er types of non-li near modulation are

commonly used. The amount of allowed modulation

index depends on the type of modulation used. Gener-

ally, the amount of non-linear modulation allowed is

less than the a mount of linear (triangular) modulation

allowed. The amount of allowed s preading for any

non-triangular modulation is determined by the

induced downstream PLL tracking skew, which cannot

exceed the amount of skew generated by a triangular

modu lation of the specified amount.

Figure 20: Input Frequency Modulation

fNOM

(1-PM,IN)*fNOM

0.5/fM,IN 1/fM,IN

Document DL-0056 Version 1.1 Preliminary Information Page 21

Direct Rambus Clock Generator Data Sheet

Package Drawing .

Fig ure 21: 24 -Pin 150mil SSOP Package Drawing

Table 20. Package Dimensions

Symbol Parameter Min Max Unit

e Pin Pitch 0.025 0.025 inch

b Pin width 0.008 0.012 inch

A Package total len gth 0.228 0.244 inch

A1 Package body length 0.150 0.157 inch

D Package total wid th 0.337 0.344 inch

D1 Package overhang 0.033 0.033 inch

E Package total thickness 0.05 3 0.069 inch

E1 Space under package 0.004 0.010 inch

Page 22 Preliminary Information Document DL-0056 Version 1.1

Direct Rambus Clock Generator Data Sheet

Table Of Contents

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

DRCG Pin-out Diagram . . . . . . . . . . . . . . . . . . . . . . . . . 1

DRCG Pin-out Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Example System Clock Configuration . . . . . . . . . . . . . 4

Logical Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Transition Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-9

Power Saving Modes . . . . . . . . . . . . . . . . . . . . . . . . . 9-10

PLL Multipliers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-11

Absolute Maximums . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . 12

AC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . 13

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Physical Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Clock Output Driver . . . . . . . . . . . . . . . . . . . . . . . . 16-17

Signal Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Spread Spectrum Clocking . . . . . . . . . . . . . . . . . . . . . . 20

Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Dir ect Rambus , Dire ct RDRAM, SO- RIMM, and RIMM

are trademarks of Rambus Inc. Rambus, RDRAM and

the Rambus Logo are register ed trademarks of Rambus

Inc. All other trademarks referenced are property of

their respective owners.

This document contains information that is subject to

change by Rambus Inc. without notice. Rambus Inc.

assumes no responsibility or liability for any use of the

information contained herein.

This Rambus d ocument is for design evaluation

purposes only. Rambus devices and modules are

manufactured and sold by Rambus partners . Rambus

partners provide data sheets specific to their products.

For a list of companies who are providing Rambus

products, visit the internet address listed below.

Document DL-0056, Version 1.0

Rambus Inc.

2465 Latham Street

Mountain View, California USA

94040

Telephone: 650-944-8000

Fax: 650-944-8080

Internet: http://ww w.rambus.com