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FEATURES
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN−
1IN+
VCC
2IN+
2IN−
2OUT
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
D, N, OR PW PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
−
+
IN−
IN+
OUT
LP324, LP2902ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS
SLOS460A – MARCH 2005 – REVISED MAY 2005
•Low Supply Current . . . 85 µA Typ•Low Offset Voltage . . . 2 mV Typ•Low Input Bias Current . . . 2 nA Typ•Input Common Mode to GND•Wide Supply Voltage . . . 3 V < V
CC
< 32 V•Pin Compatible With LM324•Applications
– LCD Displays
– Portable Instrumentation
– Sensor/Metering Equipment– Consumer Electronics (MP3 Players, Toys,Etc.)
– Power Supplies
The LP324 and LP2902 are quadruple low-power operational amplifiers especially suited for battery-operatedapplications. Good input specifications and wide supply-voltage range still are achieved, despite the ultra-lowsupply current. Single-supply operation is achieved with an input common-mode range that includes GND.
The LP324 and LP2902 are ideal in applications where wide supply voltage and low power are more importantthan speed and bandwidth. These applications include portable instrumentation, LCD displays, consumerelectronics (MP3 players, toys, etc.), and power supplies.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
PDIP – N Tube of 25 LP324N LP324NTube of 50 LP324DSOIC – D LP3240°C to 70 °C Reel of 2500 LP324DRTube of 90 LP324PWTSSOP – PW LP324Reel of 2000 LP324PWRPDIP – N Tube of 25 LP2902N LP2902NTube of 50 LP2902DSOIC – D LP2902–40 °C to 85 °C Reel of 2500 LP2902DRTube of 50 LP2902PWTSSOP – PW LP2902Reel of 2500 LP2902PWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
SYMBOL (EACH AMPLIFIER)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
VCC
OUT
IN−
IN+
Absolute Maximum Ratings
(1)
ESD Protection
LP324, LP2902ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS
SLOS460A – MARCH 2005 – REVISED MAY 2005
SCHEMATIC (EACH AMPLIFIER)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range
(2)
±16 or 32 VV
ID
Differential input voltage
(3)
±32 VV
I
Input voltage (either input) –0.3 32 VDuration of output short circuit (one amplifier) to ground at (or below) T
A
= 25 °C, V
CC
≤15 V
(4)
UnlimitedD package 86θ
JA
Package thermal impedance
(5) (6)
N package 80 °C/WPW package 113T
J
Operating virtual junction temperature 150 °CT
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values (except differential voltages and V
CC
specified for the measurement of I
OS
) are with respect to the network GND.(3) Differential voltages are at IN+, with respect to IN–.(4) Short circuits from outputs to V
CC
can cause excessive heating and eventual destruction.(5) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 °C can affect reliability.(6) The package thermal impedance is calculated in accordance with JESD 51-7.
TEST CONDITIONS TYP UNIT
Human-Body Model ±2 kV
2
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Electrical Characteristics
Operating Conditions
LP324, LP2902ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS
SLOS460A – MARCH 2005 – REVISED MAY 2005
T
A
= 25 °C, V
CC
= 5 V, V
IC
= V
CC
/2, R
L
= 100 k Ωto GND (unless otherwise noted)
LP324 LP2902PARAMETER TEST CONDITIONS
(1)
T
A
(2)
UNITMIN TYP
(3)
MAX MIN TYP
(3)
MAX
25 °C 2 4 2 4V
IO
Input offset voltage mVFull range 9 1025 °C 2 10 2 20I
IB
Input bias current nAFull range 20 4025 °C 0.2 2 0.5 4I
IO
Input offset current nAFull range 4 825 °C 50 100 40 70Large-signal R
L
= 10 k Ωto GND,A
V
V/mVvoltage gain V
CC
= 30 V
Full range 40 3025 °C 80 90 80 90Common-mode V
CC
= 30 V,CMRR dBrejection ratio V
IC
= 0 V to V
CC
– 1.5 V
Full range 75 7525 °C 80 90 80 90Power-supply
k
VSR
V
CC
= 5 V to 30 V Vrejection ratio
Full range 75 7525 °C 85 150 85 150I
CC
Supply current R
L
=∞ µ AFull range 250 27525 °C 3.4 3.6 3.4 3.6Output voltage I
L
= 0.35 mA to GND,V
OH
Vswing (high) V
IC
= 0 V
Full range V
CC
– 1.9 V
CC
– 1.925 °C 0.82 0.7 0.82 0.7Output voltage I
L
= 0.35 mA from V
CC
,V
OL
Vswing (low) V
IC
= 0 V
Full range 1 125 °C 7 10 7 10Output sourceI
O
V
O
= 3 V, V
ID
= 1 V mAcurrent
Full range 4 425 °C 4 5 4 5V
O
= 1.5 V, V
ID
= –1 V
Full range 3 3I
O
Output sink current mA25 °C 2 4 2 4V
O
= 1.5 V, V
ID
= –1 V,V
IC
= 0 V
Full range 1 125 °C 20 35 20 35I
OS,GND
Output short to GND V
ID
= 1 V mAFull range 40 4025 °C 15 30 15 30I
OS,VCC
Output short to V
CC
V
ID
= –1 V mAFull range 45 45Input offset∝V
IO
25 °C 10 10 µV/ °Cvoltage driftInput offset∝I
IO
25 °C 10 10 pA/ °Ccurrent drift
(1) For full-range temperature limits: V
CC
= 3 V to 32 V, V
ICR
= 0 V to V
CC
– 1.5 V (unless otherwise noted)(2) Full range is 0 °C to 70 °C for LP324 and –40 °C to 85 °C for LP2902.(3) All typical values are at T
A
= 25 °C.
V
CC
=±15 V, T
A
= 25 °C
PARAMETER TYP UNIT
GBW Gain bandwidth product 100 kHzSR Slew rate 50 V/ms
3
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
LP2902D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2902DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2902DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2902DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2902DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2902DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2902N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LP2902NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LP2902PW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2902PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2902PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2902PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2902PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2902PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP324D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP324DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP324DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP324DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP324DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP324DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP324N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LP324NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LP324PW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP324PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP324PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 24-May-2007
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
LP324PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP324PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP324PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 24-May-2007
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LP2902DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LP2902PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LP324DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LP324PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP2902DR SOIC D 14 2500 333.2 345.9 28.6
LP2902PWR TSSOP PW 14 2000 367.0 367.0 35.0
LP324DR SOIC D 14 2500 333.2 345.9 28.6
LP324PWR TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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