Document Number: 321330, Revision: -003
Intel® 5520 and Intel® 5500
Chipsets
Thermal/Mechanical Design Guidelines
November 2009
2Thermal/Mechanical Design Guidelines
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVI DED IN INTEL’S
TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LI ABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,
COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel may make changes to specifications, product descriptions, and plans at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibilit y whatsoever for conflicts or i ncompatibilit ies aris ing from future
changes to them.
The Intel® 5520 and Intel® 5500 Chipsets IOH may contain design defects or errors known as errata, which may cause the
product to deviate from published specifications. Current characterized errata are available upon request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or othe r Intel literature, may be obtained
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Copyright © 2009, Intel Corporation. All rights reserved.
* Other brands and names may be claimed as the property of others.
Thermal/Mechanical Design Guidelines 3
Contents
1Introduction..............................................................................................................7
1.1 Design Flow........................................................................................................8
1.2 Definition of Terms..............................................................................................8
1.3 Reference Documents.......... ............... .. ............... .. .. ............... .. .. ............... .. ........9
2 Packaging Technology.............................................................................................11
2.1 Non-Critical to Function Solder Joints................................................................... 14
2.2 Package Mechanical Require me n ts................ ... ................ ................................ .... 15
3 Thermal Specifications ............................................................................................17
3.1 Thermal Design Power (TDP) ..............................................................................17
3.2 Case Temperature......... .. .. ............... .. .. ............... .. .. .. ............... .. .. ............... .. .. ..17
4 Thermal Simulation ................................................................................................. 19
5 Thermal Metrology .................................................................................................. 21
5.1 Die Temperature Measureme n ts............. .. .. ................................ .........................21
5.1.1 Zero Degree Ang l e Attach Me thod olog y....... .. ................. ................. ..........21
5.2 Power Simulation Software................................................................................. 23
6 Reference Thermal Solution..................................................................................... 25
6.1 Operating Environme nt............... .......................................................................25
6.2 Heatsink Performance........................................................................................25
6.3 Mechanical Design Envelope ............................................................................... 26
6.4 Board-Level Components Kee p out Di me nsions ............ .. .. .. ................. .. ... ..............27
6.5 Tall Torsional Clip Heatsink Thermal Solution Assembly ..........................................27
6.5.1 Heatsink Orientation............................................................................... 30
6.5.2 Extruded Heatsink Profiles. ......................................................................30
6.5.3 Mechanical Interface Material...................................................................30
6.5.4 Thermal Interface Material.......................................................................30
6.5.5 Heatsink Clip .........................................................................................31
6.5.6 Clip Retention Anchors............................................................................32
6.6 Alternative Tall Heatsink Clip ............... .. .. ................. ................. ................. .. ......32
6.7 Reliability Guidelines..........................................................................................35
7 Reference Thermal Solution 2..................................................................................37
7.1 Operating Environme nt............... .......................................................................37
7.2 Heatsink Performance........................................................................................37
7.3 Mechanical Design Envelope ............................................................................... 38
7.4 Board-Level Components Kee p out Di me nsions ............ .. .. .. ................. .. ... ..............39
7.5 Short Torsional Clip Heatsink Thermal Solution Assembly........................................39
7.5.1 Heatsink Orientation............................................................................... 41
7.5.2 Extruded Heatsink Profiles. ......................................................................41
7.5.3 Heatsink Surface Treatment.....................................................................42
7.5.4 Thermal Interface Material.......................................................................42
7.5.5 Heatsink Clip .........................................................................................43
7.5.6 Clip Retention Anchors............................................................................43
7.6 Reliability Guidelines..........................................................................................43
8 Design Recommendations for Solder Joint Reliability ..............................................45
8.1 Solder Pad Recommendation...............................................................................45
8.2 Shock Strain Guidance.......................................................................................46
A Thermal Solution Component Suppliers ................................................................... 49
A.1 Tall Torsional Clip Heatsink Thermal Solution ........................................................49
A.2 Short Torsional Clip Heatsink Thermal Solution......................................................50
4Thermal/Mechanical Design Guidelines
B Mechanical Drawings ...............................................................................................53
Figures
1-1 Thermal Design Process............ ... .. ...................................................................... 8
2-1 IOH Package Dimensions (Top View)....................................................................11
2-2 IOH Package Dimensions (Side View) ...................................................................11
2-3 IOH Package D imensions (Bottom View) ...............................................................12
2-4 IOH Package Drawing.........................................................................................13
2-5 Non-Critical to Function Solder Joints ...................................................................14
5-1 Thermal Solution Decision Flow Chart...................................................................22
5-2 Zero Degree Angle Attach Heatsink Modifications ...................................................22
5-3 Zero Degree Angle Attach Methodology (Top View) ................................................23
6-1 Tall Torsional Clip Heatsink Measured Thermal Performance versus
Approach Velocity..............................................................................................26
6-2 Tall Torsional Clip Heatsink Volumetric Envelope for the IOH......... .. .. .......................27
6-3 Tall Torsional Clip Heatsink Board Component Keepout ...........................................28
6-4 Retention Mechanism Component Keepout Zone....................................................29
6-5 Tall Torsional Heatsink Assembly .........................................................................30
6-6 Tall Torsional Clip Heatsink Extrusion Profile..........................................................31
6-7 Tall Heatsink with Alternative Clip Board Component Keepout..................................33
6-8 Retention Mechanism Component Keepout Zone for Alternative Clip ......................... 34
6-9 Tall Heatsink and Alternative Clip Assembly...........................................................35
7-1 Short Torsional Clip Heatsink Measured Thermal Performance versus
Approach Velocity..............................................................................................38
7-2 Short Torsional Clip Heatsink Volumetric Envelope for the IOH........... ........... ...........39
7-3 Short Torsional Clip Heatsink Board Component Keepout ........................................40
7-4 Retention Mechanism Component Keepout Zones...................................................40
7-5 Short Torsional Clip Heatsink Assembly .................................................................41
7-6 Short Torsional Clip Heatsink Extrusion Profile .......................................................42
8-1 Example of Thick Traces used in a Desktop BGA.....................................................46
B-1 Tall Torsional Clip Heatsink Assembly Drawing.......................................................54
B-2 Tall Torsional Heatsink Drawing 1 (1 of 2).............................................................55
B-3 Tall Torsional Heatsink Drawing 2 (2 of 2).............................................................56
B-4 Tall/Short Torsional Clip Heatsink Clip Drawing......................................................57
B-5 Short Torsional Clip Heatsink Assembly Drawing ....................................................58
B-6 Short Torsional Heatsink Drawing ........................................................................59
B-7 Alternative Clip for Tall Torsional Heatsink.............................................................60
Tables
3-1 Intel® 5520 and Intel® 550 0 Chipsets Thermal Design Power.................................17
3-2 Intel® 5520 and Intel® 5500 Chipse ts Ther mal Specification .................. .. ..............18
6-1 Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure....................31
6-2 Reliability Guidelines ..........................................................................................36
7-1 Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure....................43
7-2 Reliability Guidelines ..........................................................................................43
8-1 Shock Strain Guidance .......................................................................................47
B-1 Mechanical Drawing List......................................................................................53
Thermal/Mechanical Design Guidelines 5
Revision History
§
Document
Number Revision
Number Description Date
321330 001 • Public release March 2009
321330 002 • Updated Table 3-1, post Si idle power from 8W to 10W
• Updated supplier part number information in Appendix A April 2009
321330 003 • Updated Table 3-1, post Si idle power from 10W to 13W November 2009
6Thermal/Mechanical Design Guidelines
Thermal/Mechanical Design Guidelines 7
Introduction
1Introduction
As the complexity of computer systems increases, so do the power dissipation
requirements. Care must be taken to ensure that the additional power is properly
dissipated. Typical me thods to improve heat dissipation include selective use of
ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the
Intel® 5520 and Intel® 5500 Chipsets.
• Describe reference thermal solutions that meet the specifications of the Intel®
5520 and Intel® 5500 Chipsets.
Properly designed thermal solutions provide adequate cooling to maintain the Intel
5520 and Intel 5500 chipsets case temperatures at or below thermal specifications.
This is accomplished by providing a low local-ambient temper ature, ensuring adequate
local airflow, and minimizing the case to local-ambient thermal resistance. By
maintaining Intel 5520 and Intel 5500 chipsets’ case temperature at or below the
specified limits, a system designer can ensure the proper functionality, performance,
and reliability of the IOH. Operation outside the functional limits can cause data
corruption or permanent damage to the component.
The simplest and most cost-effective method to improve the inherent system cooling
characteristics is through careful chassis design and placement of fans, vents, and
ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel 5520 and
Intel 5500 chipsets component only. For thermal design information on other chipset
components, refer to the respective component TMDG. For the ICH9, refer to the
Intel® I/O Controller Hub 9 (ICH9) Family Thermal and Mechanical Design Guidelines.
Note: Unless otherwise specified, the term “IOH” refers to the Intel® 5520 and Intel® 5500
Chipsets.
Introduction
8Thermal/Mechanical Design Guidelines
1.1 Design Flow
To develop a reliable, cost-effective thermal solution, several tools have been provided
to the system designer. Figure 1-1 illustrates the design process implicit to this
document and the tools appropriate for each step.
1.2 Definition of Terms
FC-BGA Flip Chip Ball Grid Array . A package type defined by a plastic substrate where
a die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
attach style. The primary electrical interface is an array of solder balls
attached to the substrate opposite the die. Note that the device arrives at
the customer with solder balls attached.
BLT Bond Line Thickness. Final settled thickness of the thermal interface
material after installation of heatsink.
Intel® QuickPath Interconnect
The Physical layer of Intel® QuickPath Interconnect is a link based
interconnect specification for Intel processors, chipset and I/O bridge
components.
IOH Input Output Hub. The IO Controller Hub component that contains the
Intel® QuickPath technology to the processor, and PCI Express* interface. It
communicates with the ICH9 over a proprietary interconnect called the
Enterprise South Bridge Interface (ESI).
ICH9 I/O Controller Hub 9.
Tcase_max Die temperature allowed. This temperature is measured at the geometric
center of the top of the die.
TDP Thermal design power. Thermal solutions should be designed to dissipate
this target power level. TDP is not the maximum power that the IOH can
dissipate.
Figure 1-1. Thermal Design Process
Therm al M odel
Therm al M odel U ser's G uide
Step 1: T herm al
Simulation
Therm al R eference
M echanical R eference
Step 2: H eatsink S election
Therm al T esting S oftware
So ftware U ser's G uide
S tep 3: Therm al V alidation
Thermal/Mechanical Design Guidelines 9
Introduction
1.3 Reference Documents
The reader of this specification should also be familiar with material and concepts
presented in the following documents:
Note: Unless otherwise specified, these documents are available through your Intel field sales
representative. Some documents may not be available at this time.
§
Title Document # Location
Intel® 5520 and Intel® 5500 Chipsets Datasheet 321328 www.intel.com
Intel® 5520 and Intel® 5500 Chipset Specification Update 321329 www.intel.com
Various system thermal design suggestions
(http://www.formfactors.org)
Introduction
10 Thermal/Mechanical Design Guidelines
Thermal/Mechanical Guidelines 11
Packaging Technology
2Packaging Technology
The Intel 5520 and Intel 5500 chipsets component uses a 37.5 mm, 8-layer flip chip
ball grid array (FC-BGA) package (see Figure 2-1, Figure 2-2, and Figure 2-3). For
information on the ICH9 package, refer to the Intel® I/O Controller Hub 9 (ICH9)
Family Thermal and Mechanical Design Guidelines.
Figure 2-1. IOH Package Dimensions (Top View)
Figure 2-2. IOH Package Dimensions (Side View)
Die
37.5 mm.
37.5 mm.
13.8 mm.
10.6 mm
Handling
Exclusion
Area
-C -
See Note 3
Seating Plane
Se e N ote 1
Die
NOTES:
1. Primary datum-C and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to AN SI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5 ± 0.1 mm . Top of die above the motherboard after reflow is about 2.36 ± 0.24 mm .
0.20
0.5 ± 0.1 m m
2.48 ±
0.24 mm
1.98 ±
0.14 mm
Substrate
0.82 ±
0.045 mm
Packaging Technology
12 Thermal/Mechanical Guidelines
Notes:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
Figure 2-3. IOH Package Dimensions (Bottom View)
37.5 + 0.05
2822 26242018161412108642 36343230
A
AJ
AE
AC
AA
U
R
N
L
J
G
E
C
W
AG
AL
AN
AR
AH
AF
AD
AB
Y
V
T
P
M
K
H
F
D
AK
AM
AP
AT
B
A
B
37.5 + 0.05
CA
0.2
35x 1.016
35.56
35.56
35X 1.016
11 25232119171513975312729333531
C
0.2
Thermal/Mechanical Guidelines 13
Packaging Technology
Figure 2-4. IOH Package Drawing
Packaging Technology
14 Thermal/Mechanical Guidelines
2.1 Non-Critical to Function Solder Joints
Intel has defined selected solder joints of the IOH as non-critical to function (NCTF)
when evaluating package solder joints post environmental testing. The IOH signals at
NCTF locations are typically redundant ground or non-critical reserved, so the loss of
the solder joint continuity at end of life conditions will not affect the overall product
functionality. Figure 2-5 identifies the NCTF solder joints of the IOH package.
Figure 2-5. Non-Critical to Function Solder Joints
1 3 5 7 9 11 13 15 17 19 21 2 3 25 27 29 31 33 35
2 4 6 8 10 12 1 4 16 18 20 22 2 4 26 28 30 32 34 36
AT AR
AP AN
AM AL
AK AJ
AH AG
AF AE
AD AC
AB AA
YW
VU
TR
PN
ML
KJ
HG
FE
DC
BA
Thermal/Mechanical Guidelines 15
Packaging Technology
2.2 Package Mechanical Requirements
The Intel 5520 and Intel 5500 chipsets package has a bare die that is capable of
sustaining a maximum static no rmal load of 15 lbf (67N). These mechanical load lim its
must not be exceeded during heatsink installation, mechanical stress testing, standard
shipping conditions, and/or any other use condition.
Note: The heatsink attach solutions must not induce continuous stress to the IOH package
with the exception of a uniform load to maintain the heatsink-to-package thermal
interface.
Note: These specifications apply to uniform compressive loading in a direction perpendicular
to the die top surface.
Note: These specifications are based on limited testing for design characterization. Loading
limits are for the package only.
§
Packaging Technology
16 Thermal/Mechanical Guidelines
Thermal/Mechanical Guidelines 17
Thermal Specifications
3Thermal Specifications
3.1 Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the IOH component to
consume maximum power dissipation for sustained time periods. Therefore, in order to
arrive at a more realistic power level for thermal design purposes, Intel characterizes
power consumption based on known platform benchmark applications. The resulting
power consumption is referred to as the Thermal Design P ower (TDP). TDP is the target
power level to which the thermal solutions should be designed. TDP is not the
maximum power that the IOH can dissipate.
For TDP specifications, see Table 3-1 for the Intel 5520 and Intel 5500 chipsets.
FC-BGA packages have poor heat transfer capability into the board and have minimal
thermal capability without thermal solution. Intel recommends that system designers
plan for a heatsink with Intel 5520 and Intel 5500 chipsets.
3.2 Case Temperature
To ensure proper operation and reliability of Intel 5520 and Intel 5500 chipsets, the
case temperature must comply with the thermal profile as specified in Table 3-2.
System and/or component level thermal solutions are required to maintain these
temperature specifications. Refer to Chapter 5 for guidelines on accurately measuring
package case temperatures.
,
Notes:
1. These specifications are based on post-silicon measurement and subject to change.
2. TDP assumes the following configuration: 36 PCIe* Gen 2.0 and ESI link with ICH9 and the Intel®
QuickPath Interconnect operating at 6.4 GT/s.
3. The Idle Power for the IOH is 13 W, please refer to the Intel® 5520 and Intel® 5500 Chipsets NDA
Specification Update (Erratum 62) for more details.
4. The idle power assumes the case temperature is at or below 95°C.
Table 3-1. Intel® 5520 and Intel® 5500 Chipsets Thermal Design Power
Product TDP Idle Notes
Intel® 5520 and Intel® 5500 Chipsets 27.1W 13W 1, 2, 3, 4
Thermal Specifications
18 Thermal/Mechanical Guidelines
Notes:
1. Refer to the Intel® 5520 and Intel® 5500 Chipsets Datasheet for thermal management mechanism and
Tcontrol usage.
2. TSFSC = TSTHRHI - IOH Thermal sensor readi ng
3. Tcontrol = TSTHRHI - Threshold TSFSC
4. TSFSC: The “head-room” between the di e temperature and the maximum allowable die temperature is
reported in de grees Centigrade throug h TSFSC. When TSFSC goes to zero, it throttles.
5. TSTHRHI is used to determine throttling point as the temperature incr eases, and the threshold TSFSC is an
offset between the throttling point and the fan speed contro l point.
6. Threshold TSFSC value is 3.
7. The Tcontrol of 92 is a conceptual threshold value to be compared against the thermal sensor readin g.
8. When TSFSC > 3, which means IOH thermal sensor reading is less than Tcontrol of 92, system can run
under acoustic condition.
9. When TSFSC <=3, which means IOH th ermal sensor reading is larger th an Tcontrol, The fans must incr ease
as necessary to try to maintain the TSFSC reading >=3. In the cases where maximum fan speed is reached
and TSFSC cannot be maintained at >=3, the Tcase must still be maintained to be less than or equal to
Tcase_max.
10. Target Psi_ca for tall HS is assuming a Tla of 53 °C, target Psi_ca for short HS is assuming a Tla of 43°C.
Please identify your specific Psi_ca based on your system’s high fan speed Boundary Condition.
11. The reference Tall Heatsink is described in Chapter 6, “Reference Thermal Solution” and the reference
Short Heatsink is described in Chapter 7, “Reference Th ermal Solution 2”.
§
Table 3-2. Intel® 5520 and Intel® 5500 Chipsets Thermal Specification
Parameter Value
Tcase_max 95.1°C
Tcase_min 5°C
Tcontrol 92
Target Psi_ca 1.41°C/W Tla=53°C Tall HS
1.92°C/W Tla=43°C Short HS
Thermal/Mechanical Guidelines 19
Thermal Simulation
4Thermal Simulation
Intel provides thermal simulation models of Intel 5520 and Intel 5500 chipsets and
associated users’ guides to aid system designers in simulating, analyzing, and
optimizing their thermal solutions in an integrated, system-level environment. The
models are for use with the commercially available Computational Fluid Dynamics
(CFD)-based thermal analysis tool FLOTHERM* (version 5.1 or higher) by Flomerics,
Inc. Contact your Intel field sales representative to order the thermal models and
users’ guides.
§
Thermal Simulation
20 Thermal/Mechanical Guidelines
Thermal/Mechanical Guidelines 21
Thermal Metrology
5Thermal Metrology
The system designer must make temperature measurements to accurately determine
the thermal performance of the system. Intel has established guidelines for proper
techniques to measure the IOH die temperatures. Section 5.1 provides guidelines on
how to accurately measure the IOH die temperatures. Section 5.2 contains information
on running an application program that will emulate anticipated maximum thermal
design power. The flowchart in Figure 5-1 offers useful guidelines for thermal
performance and evaluation.
5.1 Die Temperature Measurements
To ensure functionality and reliability, the Tcase of the IOH must be maintained at or
between the maximum/minimum operating range of the temperature specification as
noted in Table 3-1. The surface temperature at the geometric center of the die
corresponds to Tcase. Measuring Tcase requires special care to ensure an accurate
temperature measurement.
Temperature differences between the temperature of a surface and the surrounding
local ambient air can introduce errors in the measurements. The measurement errors
could be due to a poor thermal contact between the thermocouple junction and the
surface of the package, heat loss by radiation and/or convection, conduction through
thermocouple leads, and/or contact between the thermocouple cement and the
heatsink base (if a heatsink is used). For maximum measurement accuracy, only the 0°
thermocouple attach approach is recommended.
5.1.1 Zero Degree Angle Attach Methodology
1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the
bottom of the heatsink base.
2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered
hole to one edge of the heatsink. The slot should be parallel to the heatsink fins
(see Figure 5-2).
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The
cutouts should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to
the center of the top surface of the die using a high thermal conductivity cement.
During this step, ensure no contact is present between the thermocouple cement
and the heatsink base because any contact will affect the thermocouple reading.
It is critical that the thermocouple bead makes contact with the die (see
Figure 5-3).
6. Attach heatsink assembly to the IOH and ro ute thermocouple wires out through the
milled slot.
Thermal Metrology
22 Thermal/Mechanical Guidelines
NOTE: Not to scale.
Figure 5-1. Thermal Solution Decision Flow Chart
Attach
thermocouples
using recommended
metrolo gy. S e tup
the system in the
desired
configuration.
Tdie >
Specification? No
Yes
Heatsink
Required
Select
Heatsink
End
Start
Run the Power
program and
monitor the
device die
temperature.
Attach device
to board
using no rma l
reflow
process.
Figure 5-2. Zero Degree Angle Attach Heatsink Modifications
Thermal/Mechanical Guidelines 23
Thermal Metrology
NOTE: Not to scale.
5.2 Power Simula tion Software
The power simulation software is a utility designed to dissipate the thermal design
power on Intel 5520 and Intel 5500 chipsets when used in conjunction with the Intel®
X eon® processor 5500 series. The combination of the above mentioned processor(s)
and the higher bandwidth capability of Intel 5520 and Intel 5500 chipsets enable higher
levels of system performance. To assess the thermal pe rformance of the chipset
thermal solution under “worst case realistic application” conditions, Intel is developing
a software utility that operate the chipset at near worst-case thermal power dissipation.
The power simulation software being developed should only be used to test thermal
solutions at or near the thermal design power. Figure 5-1 shows a decision flowchart for
determining thermal solution needs. Real world applications may exceed the thermal
design power limit for transient time periods. For power supply current requirements
under these transient conditions, please refer to each component’s datasheet for the
ICC (max power supply current) specification. Contact your Intel field sales
representative to order the software and the user’s guide.
Note: To dissipate Intel 5520 and Intel 5500 chipsets at or near TDP, some PCIe test card
with high I/O traffic might be needed. Contact your Intel field sales representative for
more detail information.
§
Figure 5-3. Zero Degree Angle Attach Methodology (Top View)
Cem ent +
Therm ocouple B ead
Die
Thermocouple
Wire
Substrate
Thermal Metrology
24 Thermal/Mechanical Guidelines
Thermal/Mechanical Guidelines 25
Reference Thermal Solution
6Reference Thermal Solution
Intel has developed reference thermal solutions to meet the cooling needs of the Intel
5520 and Intel 5500 chipsets under operating environments and specifications defined
in this document. This section describes the overall requirements for the tall torsional
clip heatsink reference thermal solution including critical-to-function dimensions,
operating en viro nment, and validation criteria. Other chipset components may or may
not need attached thermal solutions depending on your specific system local-ambient
operating conditions. For information on the ICH9, refer to thermal specification in the
Intel® I/O Controller Hub 9 (ICH9) Family Thermal and Mechanical Design Guidelines.
6.1 Operating Environment
The reference thermal solution was designed assuming: under the high fan speed
condition, a maximum local-ambient temperature of 53°C and the minimum
recommended airflow velocity through the cross-section of the heatsink fins is 3 m/S;
under the acoustic fan speed condition, a maximum local-ambient temper ature of 57°C
and the minimum recommended airflow velocity through the cross-section of the
heatsink fins is 1.5 m/S.
The approaching airflow temperature is assumed to be equal to the local-ambient
temperature. The thermal designer must carefully select the location to measure
airflow to obtain an accurate estimate. These local-ambient conditions are based on a
35°C external-ambient temperature at 1500 m altitude. (External-ambient refers to
the environment external to the system.)
6.2 Heatsink Performance
Figure 6-1 depicts the simulated thermal performance of the reference thermal solution
versus approach air velocity. Since this data was modeled at sea level, a correction
factor would be required to estimate thermal performance at other altitudes.
The following equation can be used to correct any altitude:
α, β and γ can be obtained from Figure 6-1.
Q - “velocity through heaksink fin area (m/s)”. Velocity is the value on X axis of
Figure 6-1.
ρalt - Air density at given altitude.
ρ0 - Air density at sea level.
θca αβQalt ϒ–
×+ρalt
ρo
------
ϒ–
=
Reference Thermal Solution
26 Thermal/Mechanical Guidelines
Note: 8.6% power through board at high fan speed and 10.5% power through board at
acoustic fan speed are assumed.
6.3 Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constr aints typically placed
on the Intel 5520 and Intel 5500 chipsets thermal solution are shown in Figure 6-2.
When using heatsinks that extend beyond the IOH reference heatsink envelope shown
in Figure 6-2, any motherboard components placed between the heatsink and
motherboard cannot exceed 1.60 mm (0.063 in.) in height.
Figure 6-1. Tall Tors ional Clip Heatsink Measured Th ermal Performance versus
Approach Velocity
Tall HS performan ce on Intel® 5520 and Intel® 5500 Chipsets
0.8
1.0
1.2
1.4
1.6
1.8
0.4 0.9 1.4 1.9 2.4 2.9
Velocity through HS fin area (m/s)
Theta_ca (mean+2.55sigma) (C/W)
Unif orm heating,curve fit ting resu l t:
Alpha=0.6937,Beta=0.5144, Gamma=1.0136
Thermal/Mechanical Guidelines 27
Reference Thermal Solution
6.4 Board-Level Components Keepout Dimensions
The location of hole patterns and keepout zones for the reference thermal solution are
shown in Figure 6-3 and Figure 6-4.
6.5 Tall Torsional Clip Heatsink Thermal Solution
Assembly
The reference thermal solution for the IOH is a passive extruded heatsink with thermal
interface. It is attached using a clip with each end hooked through an anchor soldered
to the board. Figure 6-6 shows the reference thermal solution assembly and associated
components.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are
provided in Appendix B. Appendix A contains vendor information for each thermal
solution component.
Figure 6-2. Tall Torsional Clip Heatsink Volumetric Envelope for the IOH
TNB
Heatsink
50.00 mm.
50.00 mm.
IOH
Tall
Heatsink
Die
FCBGA + Solder Balls
32.39
Motherboard
IOH
Tall
Heatsink
2.36 mm.
TIM
Reference Thermal Solution
28 Thermal/Mechanical Guidelines
Figure 6-3. Tall Torsional Clip Heatsi n k Board Component Keepout
Thermal/Mechanical Guidelines 29
Reference Thermal Solution
Figure 6-4. Retention Mechanism Component Keepout Zone
Reference Thermal Solution
30 Thermal/Mechanical Guidelines
6.5.1 Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be
aligned with the direction of the heatsink fins.
6.5.2 Extruded Heatsink Profiles
The reference thermal solution uses an extruded heatsink for cooling the IOH.
Figure 6-6 shows the heatsink profile. Appendix A lists a supplier for this extruded
heatsink. Other heatsinks with similar dimensions and increased thermal performance
may be available. Full mechanical drawing of this heatsink is provided in Appendix B.
6.5.3 Mechanical Interface Material
No mechanical interface material is associated with this reference solution.
6.5.4 Thermal Interface Material
A thermal interface material (TIM) provides improved conductivity between the IHS
and heatsink. The reference thermal solution uses Honeywell PCM4 5 F*, 0.25 mm
(0.010 in.) thick, 20 mm x 20 mm (1.0 in. x 1.0 in.) square.
Note: Unflowed or “dry” Honeywell PCM45 F has a material thickness of 0.010 inch. The
flowed or “wet” Honeywell PCM45F has a material thickness of ~0.003 inch after it
reaches its phase change temperature.
Figure 6-5. Tall Torsional Heatsink Assembly
A ssem bly : E12030-008
D79046-004 D82345-001
Thermal/Mechanical Guidelines 31
Reference Thermal Solution
6.5.4.1 Effect of Pressure on TIM Performance
As mechanical pressure increases on the TIM, the thermal resistance of the TIM
decreases. This phenomenon is due to the decrease of the bond line thickness (BLT).
BLT is the final settled thickness of the thermal interface material after installation of
heatsink. The effect of pressure on the thermal resistance of the Honeywell PCM45 F
TIM is shown in Table 6-1.
Intel provides both End of Line and End of Life TIM thermal resistance values of
Honeywell PCM45F. End of Line and End of Life TIM thermal resistance values are
obtained through measurement on a Test Vehicle similar to Intel 5520 and Intel 5500
chipsets’ physical attributes using an extruded aluminum heatsink. The End of Line
value represents the TIM performance post heatsink assembly while the End of Life
value is the predicted TIM performance when the product and TIM reaches the end of
its life. The heatsink clip provides enough pressure for the TIM to achieve End of Line
thermal resistance of 0.19C x cm2/W and End of Life thermal resistance of
0.39C x cm2/W.
6.5.5 Heatsink Clip
The reference solution uses a wire clip with hooked ends. The hooks attach to wire
anchors to fasten the clip to the board. See Appendix B for a mechanical drawing of the
clip.
Table 6-1. Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure
Pressure on Thermal Solution
and Package Interface (PSI)
Thermal Resistance (C* × cm2)/W
End of Line End of Life
40 0.19 0.39
Figure 6-6. Tall Torsional Clip Heatsink Extrusion Profile
Reference Thermal Solution
32 Thermal/Mechanical Guidelines
6.5.6 Clip Retention Anchors
A clip retention anchor has been developed to minimize the impact of clip retention on
the board for Intel 5520 and Intel 5500 chipset-based platforms that have limited
board space. It is based on a standard three-pin jumper and is soldered to the board
like any common through-hole header. A new anchor design is available with 45° bent
leads to increase the anchor attach reliability over time. See Appendix A for the part
number and supplier information.
6.6 Alternative Tall Heatsink Clip
Intel has developed an alternative tall heatsink clip that will result in a smaller keep-out
zone area. Both the thermal boundary condition requirements and mechanical
boundary condition will not change with the use of this alternative tall heatsink clip.
Figure 6-7 and Figure 6-8 shows the board level keep-zone requirement with
alternative reference tall heatsink clip while Figure 6-9 shows the tall heatsink and the
alternative clip assembly. Full mechanical drawings of this alternative heatsink clip are
provided in Appendix B.
Thermal/Mechanical Guidelines 33
Reference Thermal Solution
Figure 6-7. Tall Heatsink with Alternative Clip Board Component Keepout
Reference Thermal Solution
34 Thermal/Mechanical Guidelines
Figure 6-8. Retention Mechanism Component Keepout Zone for Alternative Clip
Thermal/Mechanical Guidelines 35
Reference Thermal Solution
6.7 Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading
to the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume.
The test profiles for the Intel 5520 and Intel 5500 chipsets reference solution are
unpackaged system level limits. The reference solution is to be mounted to a fully
configured system. The environmental reliability requirements for the reference
thermal solution are shown in Table 6-2. These could be considered as general
guidelines.
Figure 6-9. Tall Heatsink and Alternative Clip Assembly
Assem bly : E12030-007
D79046-004
E12029-001
TIM
Reference Thermal Solution
36 Thermal/Mechanical Guidelines
Notes:
1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies from
three lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.
§
Table 6-2. Reliability Guidelines
Test (1) Requirement Pass/Fail Criteria (2)
Mechanical Shock System level unpackaged profile: 25G
2 drops in all 6 orientations Visual Check and Electrical
Functional Test
Random Vibration System level unpackaged
Duration: 10 min/axis, 3axes
Power Spectral Density Profile: 2.20g RMS
Visual Check and Electrical
Functional Test
Thermal Cycling –40°C to +85°C, in conformance to JEDEC Visual Check and Electrical
Functional Test
Thermal/Mechanical Guidelines 37
Reference Thermal Solution 2
7Reference Thermal Solution 2
Intel has developed two different reference thermal solutions to meet the cooling n eeds
of Intel 5520 and Intel 5500 chipsets under operating environments and specifi cations
defined in this document. This section describes the overall requirements for the short
torsional clip heatsink reference thermal solution including critical-to-function
dimensions, operating environment, and validation criteria. Other chipset components
may or may not need attached thermal solutions depending on your specific system
local-ambient operating conditions. For information on the ICH9, refer to thermal
specification in the Intel® I/O Controller Hub 9 (ICH9) Family Thermal and Mechanical
Design Guidelines.
7.1 Operating Environment
The reference thermal solution was designed assuming: under the high fan speed
condition, a maximum local-ambient temperature of 43°C and the minimum
recommended airflow velocity through the cross-section of the heatsink fins is 0.8 m/s;
under the acoustic fan speed condition, a maximum local-ambient temper ature of 40°C
and the minimum recommended airflow velocity through the cross-section of the
heatsink fins is 0.53 m/s.
The approaching airflow temperature is assumed to be equal to the local-ambient
temperature. The thermal designer must carefully select the location to measure
airflow to obtain an accurate estimate. These local-ambient conditions are based on a
35°C external-ambient temper ature at 1500m altitude. (External-ambient refers to the
environment external to the system.)
7.2 Heatsink Performance
Figure 7-1 depicts the simulated thermal performance of the reference thermal solution
versus approach air velocity. Since this data was measured at sea level, a correction
factor would be required to estimate thermal performance at other altitudes.
Reference Thermal Solution 2
38 Thermal/Mechanical Guidelines
Note: 20.5% power through board at high fan speed and 25.7% power through board at
acoustic fan speed are assumed.
7.3 Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constr aints typically placed
on Intel 5520 and Intel 5500 chipset thermal solutions are shown in Figure 7-2.
When using heatsinks that extend beyond the IOH reference heatsink envelope shown
in Figure 7-2, any motherboard components placed between the heatsink and
motherboard cannot exceed 1.60 mm (0.063 in.) in height.
Figure 7-1. Short Tors ional Clip Heatsi n k Measured The rmal Performanc e versus
Approach Velocity
Short HS perfor mance on Intel ® 5520 and Intel® 5500 Chipsets
1.1
1.4
1.7
2.0
2.3
2.6
2.9
0.4 0.9 1.4 1.9 2.4 2.9
Velocity through HS fin area(m/s)
Theta_ca (mean+2.55sigma ) (C/W)
Un ifor m heat ing,cur ve f itting res ult :
A l pha= 0.8571,Beta = 1.03 63, Gamm a = 0.91 07
Thermal/Mechanical Guidelines 39
Reference Thermal Solution 2
7.4 Board-Level Components Keepout Dimensions
The location of hole patterns and keepout zones for the reference thermal solution are
shown in Figure 7-3 and Figure 7-4.
7.5 Short Torsional Clip Heatsink Thermal Solution
Assembly
The reference thermal solution for the IOH is a passive extruded heatsink with thermal
interface. It is attached using a clip with each end hooked through an anchor soldered
to the board. Figure 7-5 shows the reference thermal solution assembly and associated
components.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are
provided in Appendix B. Appendix A contains vendor information for each thermal
solution component.
Figure 7-2. Short Torsional Clip Heatsink Volumetric Envelope for the IOH
TNB
Heatsink
65.00 mm.
65.00 mm
IOH
Short
Heatsink
Die
FCBGA + Solder Balls
14.89 mm.
Motherboard
IOH
Short
Heatsink
2.36 mm.
TIM
Reference Thermal Solution 2
40 Thermal/Mechanical Guidelines
Figure 7-3. Short Torsional Clip Heatsink Board Component Keepout
Figure 7-4. Retention Mechanism Component Keepout Zones
Thermal/Mechanical Guidelines 41
Reference Thermal Solution 2
7.5.1 Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be
aligned with the direction of the heatsink fins.
7.5.2 Extruded Heatsink Profiles
The reference thermal solution uses an extruded heatsink for cooling the IOH.
Figure 7-6 shows the heatsink profile. Appendix A lists a supplier for this extruded
heatsink. Other heatsinks with similar dimensions and increased thermal performance
may be available. Full mechanical dra wings of this heatsink are provided in Appendix B.
Figure 7-5. Short Torsional Clip Heatsink Assembly
Asse mbl y: D8 2348 -004
Punched
Punched
D82345-001
D82347-004
Reference Thermal Solution 2
42 Thermal/Mechanical Guidelines
7.5.3 Heatsink Surface Treatment
The short torsional heatsink is adopted due to volumetrical constraint. In addition, the
heatsink is anodized for electrical insulation considerations in case there is any
accidental contact with other components nearby.
7.5.4 Thermal Interface Material
A thermal interface material (TIM) provides improved conductivity between the IHS
and heat sink. The reference thermal solution uses Honeywell PCM45 F*, 0.25 mm
(0.010 in.) thick, 20 mm x 20 mm (0.79 in. x 0.79 in.) square.
Note: Unflowed or “dry” Honeywell PCM45 F has a material thickness of 0.010 inch. The
flowed or “wet” Honeywell PCM45F has a material thickness of ~0.003 inch after it
reaches its phase change temperature.
7.5.4.1 Eff ect of Pressure on TIM Performance
As mechanical pressure increases on the TIM, the thermal resistance of the TIM
decreases. This phenomenon is due to the decrease of the bond line thickness (BLT).
BLT is the final settled thickness of the thermal interface material after installation of
heatsink. The effect of pressure on the thermal resistance of the Honeywell PCM45 F
TIM is shown in Table 7-1.
Intel provides both End of Li ne and End of Life TIM thermal resistance values of
Honeywell PCM45F. End of Line and End of Life TIM thermal resistance values are
obtained through measurement on a Test Vehicle similar to Intel 5520 and Intel 5500
chipsets’ physical attributes using an extruded aluminum heatsink. The End of Line
value represents the TIM performance post heatsink assembly while the End of Life
value is the predicted TIM performance when the product and TIM reaches the end of
its life. The heatsink clip provides enough pressure for the TIM to achieve End of Line
thermal resistance of 0.19 x cm2/W and End of Life thermal resistance of
0.39 x cm2/W.
Figure 7-6. Short Tors ional Clip Heatsi n k Extrusion Prof ile
Thermal/Mechanical Guidelines 43
Reference Thermal Solution 2
7.5.5 Heatsink Clip
The reference solution uses a wire clip with hooked ends. The hooks attach to wire
anchors to fasten the clip to the board. See Appendix B for a mechanical drawing of the
clip.
7.5.6 Clip Retention Anchors
A clip retention anchor has been developed to minimize the impact of clip retention on
the board for Intel 5520 and Intel 5500 chipset-based platforms that have limited
board space. It is based on a standard three-pin jumper and is soldered to the board
like any common through-hole header. A new anchor design is available with 45° bent
leads to increase the anchor attach reliability over time. See Appendix A for the part
number and supplier information.
7.6 Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume.
The test profiles for Intel 5520 and Intel 5500 chipsets reference solutions are
unpackaged system level limits. The reference solution is to be mounted to a fully
configured system. The environmental reliability requirements for the reference
thermal solution are shown in Table 7-2. These could be considered as general
guidelines.
Notes:
1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies from
three lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.
§
Table 7-1. Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure
Pressure on Thermal Solution
and Package Interface (PSI)
Thermal Resistance (°C × in2)/W
End of Line End of Life
40 0.19 0.39
Table 7-2. Reliability Guidelines
Test (1) Requirement Pass/Fail Criteria (2)
Mechanical Shock System level unpackaged profile: 25G
2 drops in all 6 orientations Visual Check and Electrical
Functional Test
Random Vibration System level unpackaged
Duration: 10 min/axis, 3axes
Power Spectral Density Profile: 2.20g RMS
Visual Check and Electrical
Functional Test
Thermal Cycling –40°C to +85°C, in conformance to JEDEC Visual Check and Electrical
Functional Test
Reference Thermal Solution 2
44 Thermal/Mechanical Guidelines
Thermal/Mechanical Guidelines 45
Design Recommendations for Solder Joint Reliability
8Design Recommendations for
Solder Joint Reliability
Solder Joint Reliability (SJR) remains a major topic of concern in designing systems
especially for surface mounted components. Solder ball cracking and fracture is a
failure mode associated with overstressing the surface mounted component on the
motherboard. The over-stressing typically occurs when the motherboard is subjected to
bending deflection. The deflection of the motherboard applies loads to these surface
mounted components that attempt to peel the component from the board. These loads
stress the solder balls of the component and either initiate cracks, which grow through
the solder during thermal and power cycling, or cause fracture, which results in an
electrical open.
Loading conditions such as shock typically stress the motherboard and generate
stresses at the solder joints that leads to either crack initiation or complete fracture of
the balls. This section will discuss guidance specific to the Intel 5520 and Intel 5500
chipsets. Please refer to the System Mechanical Design Guidance for Dynamic Events -
Application Notes / Briefs for more information on system design guidance, and best
practices.
Section 2.1 describes the function of the Non-Critical to Function (NCTF) Solder Balls.
These balls are located in the corners of the ball grid array, where they are most
susceptible to stressing from motherboard flexure, and under the die shadow. These
NCTF balls mitigate degradation to component performance once damage has occurred
at the solder balls. Monitoring of these NCTF balls during shock testing is described in
the Platform Design Guide. General design guidance is available in the System
Mechanical Design Guidance for Dynamic Events - Application Notes / Briefs . The NCTF
solder balls provide for load shedding during solder ball loading events.
8.1 Solder Pad Recommendation
Additional protection from pad cratering on the motherboard has been demonstrated
through the usage of thick traces at the corner NCTF ball locations. The NCTF trace
thicknesses from 60-80% of the pad diameter were tested in board level shock tests
with metal define pads and reduced the occurrence of pad cratering failures. Pad
cratering is the failure mode in which solder pads in the motherboard separate from the
PCB.
The thick traces shown in Figure 8-1 are an example of how thick traces may be used
at NCTF pads. Note the NCTF locations shown in Figure 8-1 are not the NCTF locations
of the name of product package and is shown to illustrate the application of thick
traces. Designers are encouraged to use thick traces in designs where pad cratering
has occurred along the corners of the package. The thick traces effectively increase the
strength of the pad to motherboard interface and may cause a crack to initiate in a
different failure mode in the NCTF solder ball while increasing the shock margin.
Design Recommendations for Solder Joint Reliability
46 Thermal/Mechanical Guidelines
8.2 Shock Strain Guidance
A useful metric to compare the impact of design modifications to SJR and assess SJR
risk during shock events is strain measurement. This strain measurement, also referred
to as shock strain, utiliz es strain gages to measure the surface strain of a motherboard.
Please note that Intel also publishes strain guidance specifically for manufacturing. This
manufacturing guidance is part of the Board Flexure Initiative (BFI) and those strain
limits are commonly referred to as BFI strain. More information is available in the BFI
Manufacturing Advantage Service (MAS). DO NOT use BFI strain values for shock
strain testing and DO NOT use shock strain guidance for BFI. These two strain
metrics are significantly different and are not interchangeable. Using the BFI strain
values for a design metric will likely result in a poor system design.
Given parameters unique to the board of interest, such as board thickness, the board
surface strain directly correlates to the amount of board curvature. The amount of
motherboard curvature in the critical locations directly beneath the solder balls is
indicative of the reliability of the component solder joints. This measurement is
typically made at the corners of the BGA components. The shock strain results are
sensitive to the application of the strain gages. Guidance for strain gage application is
available in the Shock Strain Monitoring Customer Reference Document (CRD) and the
local Intel Corporate Quality Engineer is also available for help with strain gage attach.
This Shock Strain Monitoring CRD outlines the proper selection, application, and usage
of the strain gages and strain instrumentation to attain repeatable and valid results.
The Shock Strain Monitoring CRD also discusses proper reduction of the data in order to
use the data to compare to the Intel strain guidance.
The strain guidelines will be developed from empirical testing under differing boundary
conditions and published in a subsequent release of this document. Three strain ranges
are determined to quantify associated SJR risk for the Critical to Function solder joints.
The Non-Critical to Function solder balls may have some cracking and fractures when
the strain measurements are within this guidance. Table 8-1 lists the three ranges for
the Intel 5520 and Intel 5500 chipsets.
Figure 8-1. Example of Thick Traces used in a Desktop BGA
Package Edge
Thick Traces
attached to NCTF
solder pads
NCTF pads are
shown in blue
Thermal/Mechanical Guidelines 47
Design Recommendations for Solder Joint Reliability
Notes:
1. Emin is the minimum principal strain as defined in the Shock Strain Monitoring Customer Reference
Document.
2. These values are for 0.062 inch nominal board thickness.
3. The strain v alue limits will be different for different board thicknesses. Please contact y our Intel Field Sales
representative if your design uses a different board thickness.
The associated risk levels correspond to the likelihood of solder jo int failure. A Low level
of risk is unlikely to result in critical to function solder joint failures. When strain
measurements are made from a small sample of boards or systems and fall within the
Medium risk range, there is insufficient information to assess the risk. It is suggested
that additional systems or boards are tested and failure analysis, such as dy e and peel,
is conducted to assess the risk. A High risk is likely to result in a significant quantity of
solder joint failures of critical solder balls. A change to the design is strongly
recommended to reduce the bending of the motherboard under shock. Incorporating
the Intel Reference Design Heatsink described in Section 6 and Section 7 into the
design or adopting the design practices outlined in the System Mechanical Design
Guidance for Dynamic Events - Application Notes / Briefs will improve the strain
response and therefore reduce SJR risk.
§
Table 8-1. Shock Strain Guidance
Shock Strain
(micro strain, µe) Associated Risk Recommendation / Comments
Emin < 2000 Low Solder joint failure is unlikely
2000 < Emin < 2400 Medium Larger sample size and failure analysis is
suggested for design validation
2400 < Emin High Solder joint failure is likely, consider design
changes to improve reliability
Design Recommendations for Solder Joint Reliability
48 Thermal/Mechanical Guidelines
Thermal/Mechanical Guidelines 49
Thermal Solution Component Suppliers
A Thermal Solution Component
Suppliers
A.1 Tall Torsional Clip Heatsink Thermal Solution
Part Intel Part Number Supplier
(Part Number) Contact Information
Heatsink Assembly includes:
• Unidirectional Fin
Heatsink
• Thermal Interface
Material
• Torsional Clip
E12030-007 (with
Alternative Clip)
E12030-008
AVC
P/N: S908B00001
(with Alternative
Clip)
P/N: S908B00002
Rac hel Hsu (Taiwan)
886-2-2299-6930 x 7630
raichel_hsi@avc.com.tw
David Chao (Taiwan)
886-2-2299-6930 x 7619
david_chao@avc.com.tw
CCI
P/N: 00C95740103
(with Alternative
Clip)
P/N: 00C95740203
Monica Chih (Taiwan)
866-2-29952666, x1131
monica_chih@ccic.com.tw
Harry Lin (U.S.A)
714-739-5797
Ackinc@aol.com
Unidirectional Fin Heatsink D79046-004 AVC
P/N: M0908B0024 Rac hel Hsu (Taiwan)
886-2-2299-6930 x 7630
raichel_hsi@avc.com.tw
David Chao (Taiwan)
886-2-2299-6930 x 7619
david_chao@avc.com.tw
CCI
P/N: 335C95740103 Monica Chih (Taiwan)
866-2-29952666, x1131
monica_chih@ccic.com.tw
Harry Lin (U.S.A)
714-739-5797
Ackinc@aol.com
Thermal Interface
(PCM45F) C65858-001 Honeywell
PCM45 F* Scott Miller
509-252-2206
scott.miller4@honeywell.com
Heatsink Attach Clip D82345-001 AVC
P/N: A208000331 Rac hel Hsu (Taiwan)
886-2-2299-6930 x 7630
raichel_hsi@avc.com.tw
David Chao (Taiwan)
886-2-2299-6930 x 7619
david_chao@avc.com.tw
CCI
P/N: 334C91590101 Monica Chih (Taiwan)
866-2-29952666, x1131
monica_chih@ccic.com.tw
Harry Lin (U.S.A)
714-739-5797
Ackinc@aol.com
Thermal Solution Component Suppliers
50 Thermal/Mechanical Guidelines
Notes:
1. Contact the supplier directly to verify time of component availability.
2. Anchor is independent of heatsink asse mbly. Proper Anchor selection will protect the ch ipset he atsink from
shock and vibration.
A.2 Short Torsional Clip Heatsink Thermal Solution
Alternative Clip E12029-001 AVC
P/N: A208000345 Rachel Hsu (Taiwan)
886-2-2299-6930 x 7630
raichel_hsi@avc.com.tw
David Chao (Taiwan)
886-2-2299-6930 x 7619
david_chao@avc.com.tw
CCI
P/N: 334C95740102 Monica Chih (Taiwan)
866-2-29952666, x1131
monica_chih@ccic.com.tw
Harry Lin (U.S.A)
714-739-5797
Ackinc@aol.com
Solder-Down Anchor A13494-007 Foxconn
(HB96030-DW)* Julia Jiang (USA)
408-919-6178
juliaj@foxconn.com
Part Intel Part Number Supplier
(Part Number) Contact Information
Part Intel Part Number Supplier
(Part Number) Contact Information
Heatsink Assembly includes:
• Unidirectional Fin
Heatsink
• Thermal Interface
Material
• Torsional Clip
D82348-004 AVC
P/N: SL06400001 Rachel Hsu (Taiwan)
886-2-2299-6930 x 7630
raichel_hsi@avc.com.tw
David Chao (Taiwan)
886-2-2299-6930 x 7619
david_chao@avc.com.tw
CCI
P/N: 00C91590104 Monica Chih (Taiwan)
866-2-29952666, x1131
monica_chih@ccic.com.tw
Harry Lin (U.S.A)
714-739-5797
Ackinc@aol.com
Unidirectional Fin Heatsink D82347-004 AVC
P/N: M0L0640000 Rachel Hsu (Taiwan)
886-2-2299-6930 x 7630
raichel_hsi@avc.com.tw
David Chao (Taiwan)
886-2-2299-6930 x 7619
david_chao@avc.com.tw
CCI
P/N: 335C91590104 Monica Chih (Taiwan)
866-2-29952666, x1131
monica_chih@ccic.com.tw
Harry Lin (U.S.A)
714-739-5797
Ackinc@aol.com
Thermal Interface
(PCM45F) C65858-001 Honeywell
PCM45 F* Scott Miller
509-252-2206
scott.miller4@honeywell.com
Thermal/Mechanical Guidelines 51
Thermal Solution Component Suppliers
Notes:
1. Contact the supplier directly to verify the component availability.
2. Anchor is independent of heatsink assembly. Proper Anchor selection will protect the chipset heatsink from
shock and vibration.
3. CCI doesn’t have P/N for thermal solution components’ piece parts, please check with CCI on the thermal
solution assembly P/N for further information.
§
Heatsink Attach Clip D82345-001 AVC
P/N: A208000331 Rac hel Hsu (Taiwan)
886-2-2299-6930 x 7630
raichel_hsi@avc.com.tw
David Chao (Taiwan)
886-2-2299-6930 x 7619
david_chao@avc.com.tw
CCI
P/N: 334C91590101 Monica Chih (Taiwan)
866-2-29952666, x1131
monica_chih@ccic.com.tw
Harry Lin (U.S.A)
714-739-5797
Ackinc@aol.com
Solder-Down Anchor A13494-007 Foxconn
(HB96030-DW)* Julia Jiang (USA)
408-919-6178
juliaj@foxconn.com
Part Intel Part Number Supplier
(Part Number) Contact Information
Thermal Solution Component Suppliers
52 Thermal/Mechanical Guidelines
Thermal/Mechanical Guidelines 53
Mechanical Drawings
B Mechanical Drawings
Table B-1 lists the mechanical drawings included in this appendix.
Table B-1. Mechanical Drawing List
Drawing Description Figure Number
Tall Torsional Clip Heatsink Assembly Drawing Figure B-1
Tall Torsional Heatsink Drawing 1 (1 of 2) Figure B-2
Tall Torsional Heatsink Drawing 2 (2 of 2) Figure B-3
Tall/Short Torsional Clip Heatsink Clip Drawing Figure B-4
Short Torsional Clip Heatsink Assembly Drawing Figure B-5
Short Torsional Heatsink Drawing Figure B-6
Alternative Clip for Tall Torsional Heatsink Figure B-7
Mechanical Drawings
54 Thermal/Mechanical Guidelines
Figure B- 1. Tall Torsional Clip Heatsink Assembly Drawing
A
4
B
3
C
D
43
21
A
2
C
1
D
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
Tylersburg TIM
13.32± 0.5
5.9± 0.5
15± 0.8
15± 0.8
15± 0.8
15± 0.8
E12030 1 03
DWG. NO SHT. REV
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
- A INITIAL RELEASE MAY 30'07 -
B ADD DIMENSION FOR CLIP ASSEMBLY / ADD NOTE FOR IPN July 12'07
C
UPDATE TO USE HEATSINK D79046-001 VerC ( MODIFY THE RIB DIM
ON HEATSINK BASE TO AVOID INTERFERENCE WITH COMPONENTS
ON MB);TIM SIZE 20mmx20mm
Feb 14'08
D UPDATE TO USE TALL HEATSINK D79046-001 VerD Feb 22'08
01 ROLL IPN FROM -001 TO -003; -002 TO -004;
RELEASE TO TOOLING FEB 27 '08
02 UPDATE TO USE DRAWING D79046-003
ROLL IPN FROM -003 to -005; -004 to -006 MAY 28'08
03
UPDATE TO USE DRAWING D79046-004
ROLL UP IPN FROM -005 TO -007; -006 TO -008
JAN 14'09
SHEET 1 OF 1DO NOT SCALE DRAWINGSCALE: 1
03E12030C
REVDRAWING NUMBERSIZE
Boxboro/Tylersburg Tall HeatSink Assembly
TITLE
EASD
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL
DATEAPPROVED BY
--
DATECHECKED BY
May 28' 08JUNSONG
DATEDRAWN BY
May 30'07 JUNSONG
DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MM
TOLERANCES:
THIRD ANGLE PROJECTION
PARTS LIST
PART NUMBER PART NUMBER
DESCRIPTIONITEM NOQTY
E12030-008E12030-007Tylersburg/Boxboro Tall HS AssemblyTOP
TYLERSBURG_TIMTYLERSBURG_TIM11
D79046-004D79046-004TYLERSBURG/BOXBORO Tall Heatsink21
D82345-001E12029-001Wireclip31
D79046-004
D82345-001
E12029-001
D79046-004
Tylersburg TIM; 10MIL THICKNESS
E12030-007
E12030-008
NOTE:
1 . MARK PART WITH INTEL P/N APPROX
WHERE SHOWN PER INTEL MARKING STANDARD 164997
INTEL P/N USE E12030-00x,(007 OR 008)
WHICH IS HEATSINK ASSEMBLY
2. AFTER PUNCH,CLIP WILL BE HOLD BUT CAN STILL ROTATE
ALONG THE CENTRE AXIS.
1
1
APPROXI PUNCH POSITION
APPROXI PUNCH POSITION
PCM45F, 20mmx20mm
SCALE 1.5
SCALE 1.2
SCALE 1.5
SCALE 1.5
SCALE 1.2
SCALE 1.2
Thermal/Mechanical Guidelines 55
Mechanical Drawings
Figure B-2. Tall Torsional Heatsink Drawing 1 (1 of 2)
A
4
B
3
C
D
43
21
A
2
C
1
D
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
30± 0.3
4.03± 0.2
0.7±0.15 [22 Equal Fins]
2.25±0.15 [10 Equal pitch]
2.25±0.15 [10 Equal Pitch]
4.1± 0.2
0.89±0.15 [20 Equal Fins]
50± 0.3
50± 0.3
2x16
2x17.75
0.66±0.1
9±0.2
9 ± 0.2
9±0.2
9±0.2
D79046 1 03
DWG. NO SHT. REV
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
- A Initial Release Oct 24'06 -
B Modify Dimension's Tolerance based on manu Review July 23'07
C Modify Rib Dim to avoid interference on MB Nov 24'07
D Modify the method of dimensioning the rib on the base Feb 22'08
01 Roll IPN to -002; Release to Tooling Feb 27 '08
02
Modify the rib height from 0.72+/-0.15 to 0.72+/-0.1. Add it as CTF.
Roll IPN to -003
May 28'08
03
Modify the rib height from 0.72+/-0.1 to 0.66+/-0.1
Add anodizing in Note4. Roll up IPN to -004
Jan 14'09
SHEET 1 OF 2DO NOT SCALE DRAWINGSCALE: 1
03D79046C
REVDRAWING NUMBERSIZE
TYLERSBURG/BOXBORO TALL HEATSINK
TITLE
PPA
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL
DATEAPPROVED BY
--
DATECHECKED BY
Jan 14'09Junsong
DATEDRAWN BY
MGBERKTOLD
DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MM
TOLERANCES:
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTIONPART NUMBERITEM NOQTY
TYLERSBURG/BOXBORO Tall HeatsinkD79046-004TOP
NOTES:
1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D
DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE
APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS
INDICATED OTHERWISE.
2. TOLERANCES ON DIMENSIONED AND UNDIMENSIONED
FEATURES UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MILLIMETERS.
TOLERANCES:
LINEAR ± 0.25mm
ANGULAR ± 1 °
3. MATERIAL: BASE:ALUMINUM 6063 T5 K=216 W/M-K MIN.
FINS: ALUMINUM 6063 T5, K=216W/M-K MIN.
4. FINISH: BLACK ANODIZED (ANODIZED PER MIL STD 8625,
TYPEII, CLASSII)
5 CRITICAL TO FUNCTION DIMENSION
6. EDGES SHOWN AS SHARP R 0.1 MAX.
7. TOOLING REQUIRED TO MAKE THIS PART SHALL BE THE
PROPERTY OF INTEL, AND SHALL BE PERMANENTLY MARKED
WITH INTEL'S NAME AND APPROPRIATE PART NUMBER.
8. ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY.
9. ALL DIMENSIONS SHOWN SHALL BE MEASURED FOR FAI
10. REMOVE ALL BURRS OR SHARP EDGES AROUND PERIMETER
OF PART. SHARPNESS OF EDGES SUBJECT TO HANDLING ARE
REQUIRED TO MEET UL1439 TEST.
5
SCALE 1.5
SCALE 2.5
SEE DETAIL A
Full Round
Full Round
5
At the centre area
SEE DETAIL A
0.1 31 31
Mechanical Drawings
56 Thermal/Mechanical Guidelines
Figure B-3. Tall Torsional Heatsink Dra w ing 2 (2 of 2)
A
4
B
3
C
D
43
21
A
2
C
1
D
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
2±0.15
(3.22 )
(1.8 )
()40°
(2.137 )
(0.5 )
(R )0.1
4.33± 0.15
(R )0.2
(R )0.2
D79046 2
C
DWG. NO SHT. REV
SHEET 2 OF 2DO NOT SCALE DRAWINGSCALE: 1
PPA
C
D79046C
REVDRAWING NUMBERSIZEDEPARTMENT
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
DETAIL A
SCALE 15
Thermal/Mechanical Guidelines 57
Mechanical Drawings
Figure B-4. Tall/Short Torsional Clip Heatsink Clip Drawing
Mechanical Drawings
58 Thermal/Mechanical Guidelines
Figure B-5. Short Torsional Clip Heatsink Assembl y Drawing
A
4
B
3
C
D
43
21
A
2
C
1
D
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
5.82± 0.5
22.5± 0.8
22.5± 0.8
D82348 1
03
DWG. NO SHT. REV
X
FINISH:
-
MATERIAL:
mm/dd/yyX
DATEAPPROVED BY
mm/dd/yyX
DATECHECKED BY
May 28/08JUNSONG
DATEDRAWN BY
12/15/06JUNSONG
DATEDESIGNED BY
SHEET 1 OF 1DO NOT SCALE DRAWINGSCALE:1:1
03D82348XC
REVDRAWING NUMBERCAGE CODESIZE
Tylersburg,Short HS,ASS
TITLE
-
DEPARTMENT
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MM
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
A INITIAL REALEASE 11/11/06 X
B UPDATED WITH d82347-001 FROM 28FINS TO 30FINS 23/07/07
C ADD INSULATOR 06/08/07
D REMOVE INSULATOR, ADD ANODIZING ONTO HEATSINK 06/11/07
E UPDATE TO USE HEATSINK D82347-001(VerG) 22/02/08
01 ROLL IPN TO -002; RELEASE TO TOOLING 27/02/08
02 UPDATE TO USE HEATSINK D82347-003 28/05/08
03 UPDATE TO USE HEATSINK D82347-004 14/01/09
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
NOTES:
1. MARK PART WITH INTEL P/N APPROX WHERE
SHOWN PER INTEL MARKING STANDARD 164997
2. CLIP SHOULD BE ABLE TO ROTATE 360 DEGREES
AFTER CRIMPING PROCESS.
MARK WITH INTRL IPN "D82348-004"
1
2
3
SCALE ~2:1
SCALE 2:1
QTY PER ASSEY ITEM NO. PART NUMBER DESCRIPTION
TOP D82348-004 TYLERSBURG SHORT HS ASSMBLY
1 1 TIM PCM45F, 20MMX20MM; 10mil THICK
1 2 D82347-004 TYLERSBURG SHORT HEATSINK
1 3 D82345-001 WIRE CLIP, SHORT HEATSINK
Thermal/Mechanical Guidelines 59
Mechanical Drawings
Figure B-6. Short Torsional Heatsink Drawing
A
4
B
3
C
D
43
21
A
2
C
1
D
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
65±0.35
28X0.4± 0.15
26X( R )0.79
Base 2
(1.9 )
45
(0.94 )
()1.9
1.7
2x16
65±0.35
12.5
28x0.59 ± 0.15
2.16±0.2
2X0.81± 0.15
SIDE FIN
0.99±0.15SIDE FIN
2x17.75
0.66±0.1
16.5±0.2
16.5±0.2
16.5±0.2
16.5±0.2
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
A INITIAL RELEASE 11/11/06
B MODIFY THE FIN NUMBER FROM 26FINS TO 28FINS 19/06/07
C MODIFY THE FIN NUMBER FROM 28FINS TO 30FINS 23/07/07
D MODIFY THE DIM OF 2 SIDE FINS 31/07/07
E ADD FIN HEIGHT BY 0.5MM; ADD ANODIZING 06/11/07
F MODIFY RIB DIM TO AVOID INTERFERENCE ON MB 26/11/07
G MODIFY THE METHOD OF DIMENSIONING THE RIB 22/02/08
01 ROLL IPN TO -002; RELEASE TO TOOLING 27/02/08
02
MODIFY 0.72+/-0.15 TO 0.72+/-0.1, ADD IT AS CTF
ROLL IPN to -003
28/05/08
03
MODIFY THE RIB FROM 0.72+/-0.1 to 0.66+/-0.1 CTF.
ROLL IPN to -004
01/14/09
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
--- --
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
--- --
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
--- --
D82347 1
03
DWG. NO SHT. REV
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
--- --
SHEET 1 OF 1DO NOT SCALE DRAWINGSCALE: 1:1
03D82347C
REVDRAWING NUMBERSIZE
TYLERSBURG SHORT HS
TITLE
-
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL
DATEAPPROVED BY
--
DATECHECKED BY
JAN 14'09
JUNSONG
DATEDRAWN BY
10/23/06JUNSONG
DATEDESIGNED BY
TOLERANCES ON DIMENSIONED AND UNDIMENSIONED
FEATURES UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MILLIMETERS.
TOLERANCES:
LINEAR ± 0.25
ANGULAR ± 1 °
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTIONPART NUMBERITEM NOQTY
30FINS
Tylersburg Short HS
TOP
NOTES:
1. THIS DRAWING TO BE USED IN CONJUNCTION WITH
SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND
TOLERANCES ON THIS DRAWING TAKE PRECEDENCE
OVER SUPPLIED FILE AND ARE APPLICABLE AT PART
FREE, UNCONSTRAINED STATE UNLESS INDICATED
OTHERWISE.
2. TOLERANCES ON DIMENSIONED AND UNDIMENSIONED
FEATURES UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MILLIMETERS.
TOLERANCES:
LINEAR ± 0.25
ANGULAR ± 1 °
3. MATERIAL: BASE:ALUMINUM 6063 T5 K=216 W/M-K MIN.
FINS: ALUMINUM 6063 T5, K=216W/M-K MIN.
4. FINISH: BLACK ANODIZED (ANODIZED PER MIL STD 8625,
TYPEII, CLASSII)
5 CRITICAL TO FUNCTION DIMENSION
6. EDGES SHOWN AS SHARP R 0.1 MAX.
7. TOOLING REQUIRED TO MAKE THIS PART SHALL BE THE
PROPERTY OF INTEL, AND SHALL BE PERMANENTLY MARKED
WITH INTEL'S NAME AND APPROPRIATE PART NUMBER.
8. ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY.
9. ALL DIMENSIONS SHOWN SHALL BE MEASURED FOR FAI
10. REMOVE ALL BURRS OR SHARP EDGES AROUND PERIMETER
OF PART. SHARPNESS OF EDGES SUBJECT TO HANDLING ARE
REQUIRED TO MEET UL1439 TEST.
AT THE HEATSINK BASE CENTER AREA 5
5
28 EQUAL PITCH
SCALE 2:1
SEE DETAIL A
30 FULL ROUND
SCALE ~2:1
DETAIL A
SCALE 10:1
SCALE 2:1
0.1 20 20
Mechanical Drawings
60 Thermal/Mechanical Guidelines
§
Figure B-7. Alternative Clip for Tall Torsional Heatsink
