TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
1
TOSHIBA LED Lamps
TLRE1008A(T04), TLSE1008A(T04),
TLOE1008A(T04), TLYE1008A(T04), TLPYE1008A(T04),
TLGE1008A(T04), TLFGE1008A(T04), TLPGE1008A(T04)
Panel Circuit Indicators
• Surface-mount devices
• 1.6 (L) mm × 0.8 (W) mm × 0.6 (H) mm
• InGaAℓP LEDs
• Replacing standard-intensity LEDs with high-intensity ones
helps increase the brightness or reduce the power consumption
of end products.
• Colors: red, orange, yellow, pure yellow, green, pure green
• Applications:
Backlighting for battery-powered equipment
Pilot lamps for mobile handsets
Low-power electronic equipment, etc.
• Standard embossed tape packing: T04 (4000/reel)
4-mm tape reel
Color and Material
Unit: mm
JEDEC ―
JEITA ―
TOSHIBA 4-1C1
Weight: 0.0013 g (typ.)
Part Number Color Material
TLRE1008A Red
TLSE1008A Red
TLOE1008A Orange
TLYE1008A Yellow
TLPYE1008A Pure Yellow
TLGE1008A Green
TLFGE1008A Green
TLPGE1008A Pure Green
InGaAℓP
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
2
Absolute Maximum Ratings (Ta = 25°C)
Part Number
Forward Current
IF (mA)
Please see Note 1
Reverse Voltage
VR (V)
Power Dissipation
PD (mW)
Operation
Temperature
Topr (°C)
Storage
Temperature
Tstg (°C)
TLRE1008A
TLSE1008A
TLOE1008A
TLYE1008A
TLPYE1008A
TLGE1008A
TLFGE1008A
TLPGE1008A
25 4 60 −40 to 85 −40 to 100
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
Electrical Characteristics (Ta = 25°C)
Forward Voltage VF Reverse Current
IR
Part Number
Min Typ. Min IF Max VR
TLRE1008A 1.6 1.9 2.4
TLSE1008A 1.6 1.9 2.4
TLOE1008A 1.6 2.0 2.4
TLYE1008A 1.6 2.0 2.4
TLPYE1008A 1.6 2.0 2.4
TLGE1008A 1.6 2.0 2.4
TLFGE1008A 1.6 2.0 2.4
TLPGE1008A 1.6 2.1 2.4
20 50 4
Unit V mA μA V
0
40
30
0 80 6020 100
20
10
40
Ambient temperature Ta (°C)
IF – Ta
Allowable forward current IF (mA)
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
3
Optical Characteristics–1 (Ta = 25°C)
Luminous Intensity IV
Part Number
Min Typ. Max IF
Available IV rank
Please see Note 2
TLRE1008A 27.2 70 ⎯ 20 L / M / N / P
TLSE1008A 47.6 135 ⎯ 20 M / N / P / Q
TLOE1008A 47.6 150 ⎯ 20 M / N / P / Q
TLYE1008A 27.2 105 ⎯ 20 L / M / N / P
TLPYE1008A 27.2 100 ⎯ 20 L / M / N / P
TLGE1008A 27.2 70 ⎯ 20 L / M / N / P
TLFGE1008A 15.3 40 ⎯ 20 K / L / M / N
TLPGE1008A 4.76 18 ⎯ 20 H / J / K / L
Unit mcd mcd mcd mA ⎯
Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Luminous Intensity IV
Rank
Min Max
H 4.76 12.9
J 8.5 23
K 15.3 41.4
L 27.2 73.6
M 47.6 129
N 85 230
P 153 414
Q 272 736
Unit mcd mcd
Optical Characteristics–2 (Ta = 25°C)
Emission Spectrum
Peak Emission
Wavelength λp Δλ Dominant Wavelength λd
Part Number
Min Typ. Max Typ. Min Typ. Max
IF
TLRE1008A ⎯ 644 ⎯ 18 624 630 638
TLSE1008A ⎯ 623 ⎯ 15 607 613 621
TLOE1008A ⎯ 612 ⎯ 15 599 605 613
TLYE1008A ⎯ 590 ⎯ 13 581 587 595
TLPYE1008A ⎯ 583 ⎯ 13 574 580 586
TLGE1008A ⎯ 574 ⎯ 11 565 571 576
TLFGE1008A ⎯ 568 ⎯ 11 559 565 571
TLPGE1008A ⎯ 562 ⎯ 11 ⎯ 558 564
20
Unit nm nm nm mA
The cautions
• This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by the IR light.
• This product is designed as a general display light source usage, and it has applied the measurement standard
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional
application (ex. Light source for sensor, optical communication and etc) except general display light source.
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
4
TLRE1008A
IF = 20 mA
Ta = 25°C
0
640
0.4
1.0
0.8
580 680 660 620
600 700
0.6
0.2
0.1
40
0.3
0.5
3
1
−20 80 60 20
0 100
1
1.6 2.0
3
5
50
10
1.7 2.2
30
1.8 2.1 1.9
Ta = 25°C
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength λ (nm)
Wavelength characteristic
Ta = 25°C
1
100
150
50
30
10
3
5
3 5 10 30 100
(
t
yp
.
)
(
t
yp
.
)
(
t
yp
.
)
(
t
yp
.
)
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
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TLSE1008A
IF = 20 mA
Ta = 25°C
0
640
0.4
1.0
0.8
580 680 660 620
600 700
0.6
0.2
Ta = 25°C
1
100
30
1.6 2.1 2.0 1.7 2.2
10
3
1.8
50
5
1.9
0.1
3
−20 80 60
0 100
0.5
20
0.3
40
1
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength λ (nm)
Wavelength characteristic
(
t
yp
.
)
(
t
yp
.
)
100
150
50
30
10
3
5
3 5 10 100
300
Ta = 25°C
30
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
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TLOE1008A
0.1
10
3
80 60 100
1
0.3
20
5
0.5
−20 0 40
IF = 20 mA
Ta = 25°C
0
600
0.4
1.0
0.8
540 640 620 580
560 660
0.6
0.2
Ta = 25°C
1
100
30
1.7 2.2 2.1 1.8 2.3
10
3
1.9
50
5
2.0
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength λ (nm)
Wavelength characteristic
100
150
50
30
10
3
5
3 5 10 30 100
300
Ta = 25°C
(
t
yp
.
)
(
t
yp
.
)
(
t
yp
.
)
(
t
yp
.
)
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
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TLYE1008A
100
150
50
30
10
3
5
3 5 10 30 100
300
Ta = 25°C
IF = 20 mA
Ta = 25°C
0
600
0.4
1.0
0.8
540 640 620 580
560 660
0.6
0.2
0.1
10
3
80 60 100
1
0.3
20
5
0.5
−20 0 40
Ta = 25°C
1
100
30
1.7 2.2 2.1 1.8 2.3
10
3
1.9
50
5
2.0
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength λ (nm)
Wavelength characteristic
(
t
yp
.
)
(
t
yp
.
)
(
t
yp
.
)
(
t
yp
.
)
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
8
TLPYE1008A
100
150
50
30
10
3
5
3 5 10 30 100
300
Ta = 25°C
IF = 20 mA
Ta = 25°C
0
600
0.4
1.0
0.8
540 640 620 580
560 660
0.6
0.2
0.1
10
3
80 60 100
1
0.3
20
5
0.5
−20 0 40
Ta = 25°C
1
100
30
1.7 2.2 2.1 1.8 2.3
10
3
1.9
50
5
2.0
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength λ (nm)
Wavelength characteristic
(
t
yp
.
)
(
t
yp
.
)
(
t
yp
.
)
(
t
yp
.
)
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
9
TLGE1008A
0.1
10
3
80 60 100
1
0.3
20
5
0.5
−20 0 40
IF = 20 mA
Ta = 25°C
0
0.4
1.0
0.8
540
0.6
0.2
620600 580 560
Ta = 25°C
1
100
30
1.7 2.2 2.1 1.8 2.3
10
3
1.9
50
5
2.0
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength λ (nm)
Wavelength characteristic
(
t
yp
.
)
(
t
yp
.
)
(
t
yp
.
)
(
t
yp
.
)
100
150
50
30
10
3
5
3 5 10 30 100
300
Ta = 25°C
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
10
TLFGE1008A
0.1
10
3
80 60 100
1
0.3
20
5
0.5
−20 0 40
IF = 20 mA
Ta = 25°C
0
0.4
1.0
0.8
520
0.6
0.2
600580 560 540
Ta = 25°C
1
100
30
1.7 2.2 2.1 1.8 2.3
10
3
1.9
50
5
2.0
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength λ (nm)
Wavelength characteristic
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
(
t
yp
.
)
(
t
yp
.
)
(
t
yp
.
)
(
t
yp
.
)
100
150
50
30
10
3
5
3 5 10 30 100
300
Ta = 25°C
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
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TLPGE1008A
IF = 20 mA
Ta = 25°C
0
0.4
1.0
0.8
520
0.6
0.2
600580 560 540
0.1
10
3
80 60 100
1
0.3
20
5
0.5
−20 0 40
Relative luminous intensity
Forward current IF (mA)
IV – IF
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength λ (nm)
Wavelength characteristic
Luminous intensity IV (mcd)
1
100
30
1.7 2.2 2.1 1.8 2.3
10
3
1.9
50
5
2.0
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Ta = 25°C
(
t
yp
.
)
(
t
yp
.
)
10
150
5
3
1
0.3
0.5
3 5 10 30 100
30
Ta = 25°C
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
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Radiation Pattern
Horizontal to polarity Ta=25℃
Vertical to polarity
(
t
yp
.
)
(
t
yp
.
)
30°
40°
0 0.2 0.4 0.6 0.8
0° 10°
20°
30°
40°
50°
60°
70°
80°
90°
10°
20°
50°
60°
70°
80°
90°
1.0
0 0.2 0.4 0.6 0.8
0° 10°
20°
30°
40°
50°
60°
70°
80°
90°
10°
20°
30°
40°
50°
60°
70°
80°
90°
1.0
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
13
Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C to 30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of
5°C to 30°C/70% RH or below.
When performing lead(Pb)-free soldering, the devices should be assembled within 72 hours in an environment
of 5°C to 30°C/70% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the air tightness would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
• Reflow soldering (example)
• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
• Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 70% RH (max)
• Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: 25 W
Temperature: 300°C or less
Time: within 3 s
• Do not perform wave soldering.
60 to 120 s max
140 to 160°C
10 s max
240°C max
4°C/s max
4°C/s max
Time (s)
Package surface
temperature (°C)
(*)
(*)
(*) (*)
(*)
(*)
Temperature profile for Pb soldering (example)
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
14
• Reflow soldering (example)
• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 72 h of
opening the package.
• Second reflow soldering
In case of second reflow soldering should be performed within 72 h of the first reflow under the above conditions.
Storage conditions before the second reflow soldering: 30°C, 70% RH (max)
• Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: 25 W
Temperature: 300°C or less
Time: within 3 s
• Do not perform wave soldering.
Recommended Soldering Pattern
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES: (made by ASAHI GLASS)
KAO CLEAN THROUGH 750H: (made by KAO)
PINE ALPHA ST-100S: (made by ARAKAWA CHEMICAL)
Precaution When Mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic, do not apply friction using a hard material.
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
0.8 0.7 0.8
(0.8)
Unit: mm
Temperature profile for Pb-free soldering (example)
Time (s)
150 to 180°C max
4°C/s max
5 s max
260°C max
4°C/s max
30 to 50 s max
230°C
60 to 120 s
(*)
(*)
(*)
(*)
(*)
(*)
(*)
Package surface
temperature (°C)
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
15
Tape Specifications
1. Product Number Format
The type of package used for shipment is denoted by a symbol suffix after the product number. The
method of classification is as below. (However, this method does not apply to products whose
electrical/optical characteristics differ from standard Toshiba specifications)
(1) Tape Type: T04 (4-mm pitch)
(2) Example
2. Handling Precautions
Tape material protected against static electricity. However, static electricity may occur depending on
quantity of charged static electricity and a device may attach to a tape, or a device may be unstable when
peeling a tape cover.
(a) Since tape materials may accumulate an electrostatic charge, use an ionizer to neutralize the ambient
air.
(b) For transport and temporary storage of devices, use containers (boxes and bags) and jigs that are
made of anti-static materials or of materials which dissipate electrostatic charge.
3. Tape Dimensions
Unit: mm
Symbol Value Tolerance Symbol Value Tolerance
D 1.50 +0.1/−0 P2 2.00 ±0.05
E 1.75 ±0.1 W 8.00 ±0.1
P0 4.00 ±0.1 P 4.00 ±0.1
t 0.20 ±0.05 A0 0.90 ±0.1
F 3.50 ±0.05 B0 1.75 ±0.1
D1 0.60 ±0.05 K0 0.75 ±0.1
A0
P D1
F
E
W
Polarity
t
K0
B0
D
P2
P0
TLRE1008A (T04)
Tape type
Toshiba product No.
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
16
4. Reel Dimensions
Unit: mm
5. Leader and Trailer Section of Tape
Note 1: Empty trailer section
Note 2: Empty leader section
2 ± 0.5
φ13 ± 0.5
φ21 ± 0.8
11.4 ± 1
9 +1/-0
φ60
φ180 +0
−4
(Note 1)
Leading part 190 mm (min)
40 mm or more
(Note 2)
40 mm or more
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
17
6. Packing Display
(1) Packing quantity
Reel 4,000 pcs
Carton 20,000 pcs
(2) Package form: Each reel is sealed in an aluminum pack with silica gel.
7. Label Format
(1) Example: TLRE1008A (T04)
P/N: TOSHIBA
TYPE TLRE1008A
ADDC (T04) Q’TY 4,000 pcs
Lot Number Key code for TSB 32C 4000
(RANK SYMBOL)
Use under 5-30degC/70%RH within 72h
SEALED
[[G]]/RoHS COMPATIBLE DIFFUSED IN *****
*Y380xxxxxxxxxxxxxxxxxx* ASSEMBLED IN *****
(2) Label location
Tape reel direction
Label position
Label position
• Reel
•
Carton
• The aluminum package in which the reel is supplied also has a copy of the label
attached to center of one side.
TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04)
2008-08-04
18
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA A SSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATI ON, OR NONINF RINGEMEN T.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
