PD - 95810 AUTOMOTIVE MOSFET IRFP1405 HEXFET(R) Power MOSFET Features Advanced Process Technology Ultra Low On-Resistance 175C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax D VDSS = 55V RDS(on) = 5.3m G ID = 95A S Description Specifically designed for Automotive applications, this HEXFET(R) Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175C junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications. S D G TO-247AC Absolute Maximum Ratings ID @ TC = 25C ID @ TC = 100C ID @ TC = 25C IDM PD @TC = 25C Parameter Max. Continuous Drain Current, VGS @ 10V (Silicon Limited) Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V (Package Limited) Pulsed Drain Current 160 110 95 640 310 c Power Dissipation VGS EAS (Thermally limited) EAS (Tested ) IAR EAR Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Single Pulse Avalanche Energy Tested Value Avalanche Current Repetitive Avalanche Energy TJ TSTG Operating Junction and Storage Temperature Range d c h g A W 2.0 20 530 1060 See Fig.12a, 12b, 15, 16 W/C V mJ A mJ -55 to + 175 C Soldering Temperature, for 10 seconds Mounting Torque, 6-32 or M3 screw 300 (1.6mm from case ) 10 lbf in (1.1N m) y Thermal Resistance Parameter RJC Rcs RJA Units Junction-to-Case * Case-to-Sink, Flat, Greased Surface Junction-to-Ambient * y Typ. Max. Units --- 0.24 --- 0.49 --- 40 C/W HEXFET(R) is a registered trademark of International Rectifier. * R is measured at TJ approximately 90C www.irf.com 1 12/22/03 http://store.iiic.cc/ IRFP1405 Electrical Characteristics @ TJ = 25C (unless otherwise specified) Parameter Min. Typ. Max. Units V(BR)DSS Drain-to-Source Breakdown Voltage 55 --- --- V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient --- 0.058 --- RDS(on) Static Drain-to-Source On-Resistance --- 4.2 5.3 VGS(th) Gate Threshold Voltage 2.0 --- 4.0 gfs IDSS Forward Transconductance V Conditions VGS = 0V, ID = 250A V/C Reference to 25C, ID = 1mA m VGS = 10V, ID = 95A e V VDS = VGS, ID = 250A VDS = 25V, ID = 95A 77 --- --- S --- --- 20 A --- --- 250 Gate-to-Source Forward Leakage --- --- 200 Gate-to-Source Reverse Leakage --- --- -200 Qg Total Gate Charge --- 120 180 Qgs Gate-to-Source Charge --- 30 --- Qgd Gate-to-Drain ("Miller") Charge --- 53 --- VGS = 10V td(on) Turn-On Delay Time --- 12 --- VDD = 28V tr Rise Time --- 160 --- td(off) Turn-Off Delay Time --- 140 --- tf Fall Time --- 150 --- VGS = 10V LD Internal Drain Inductance --- 5.0 --- Between lead, LS Internal Source Inductance --- 13 --- 6mm (0.25in.) from package and center of die contact VGS = 0V IGSS Drain-to-Source Leakage Current VDS = 55V, VGS = 0V VDS = 55V, VGS = 0V, TJ = 125C nA VGS = 20V VGS = -20V ID = 95A nC VDS = 44V e ID = 95A ns nH RG = 2.6 e D G S Ciss Input Capacitance --- 5600 --- Coss Output Capacitance --- 1310 --- Crss Reverse Transfer Capacitance --- 350 --- Coss Output Capacitance --- 6550 --- VGS = 0V, VDS = 1.0V, = 1.0MHz Coss Output Capacitance --- 920 --- VGS = 0V, VDS = 44V, = 1.0MHz Coss eff. Effective Output Capacitance --- 1750 --- VGS = 0V, VDS = 0V to 44V VDS = 25V pF = 1.0MHz f Source-Drain Ratings and Characteristics Parameter Min. Typ. Max. Units IS Continuous Source Current --- --- 95 ISM (Body Diode) Pulsed Source Current --- --- 640 VSD (Body Diode) Diode Forward Voltage --- --- 1.3 V trr Reverse Recovery Time --- 70 110 ns Qrr Reverse Recovery Charge --- 170 260 nC ton Forward Turn-On Time c Conditions MOSFET symbol A showing the integral reverse p-n junction diode. TJ = 25C, IS = 95A, VGS = 0V e TJ = 25C, IF = 95A, VDD = 28V di/dt = 100A/s e Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) Notes: Coss eff. is a fixed capacitance that gives the same charging time max. junction temperature. (See fig. 11). as Coss while VDS is rising from 0 to 80% VDSS . Limited by TJmax, starting TJ = 25C, L = 0.12mH Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical repetitive R G = 25, IAS = 95A, VGS =10V. Part not avalanche performance. recommended for use above this value. This value determined from sample failure population. 100% Pulse width 1.0ms; duty cycle 2%. tested to this value in production. Repetitive rating; pulse width limited by 2 www.irf.com http://store.iiic.cc/ IRFP1405 1000 1000 100 BOTTOM TOP 4.5V 10 60s PULSE WIDTH Tj = 25C ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A) TOP VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V 4.5V BOTTOM 100 4.5V 1 60s PULSE WIDTH Tj = 175C 10 0.1 1 10 100 0.1 0 VDS, Drain-to-Source Voltage (V) 11 10 10 100 100 VDS, Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 140 1000 T J = 25C Gfs, Forward Transconductance (S) ID, Drain-to-Source Current () VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V 4.5V T J = 175C 100 VDS = 25V 60s PULSE WIDTH T J = 25C 120 100 80 T J = 175C 60 40 20 VDS = 10V 380s PULSE WIDTH 10 4.0 5.0 6.0 7.0 8.0 9.0 0 10.0 0 VGS, Gate-to-Source Voltage (V) 20 40 60 80 100 ID, Drain-to-Source Current (A) Fig 3. Typical Transfer Characteristics Fig 4. Typical Forward Transconductance Vs. Drain Current www.irf.com 3 http://store.iiic.cc/ IRFP1405 10000 ID= 95A VGS, Gate-to-Source Voltage (V) 8000 C, Capacitance (pF) 20 VGS = 0V, f = 1 MHZ C iss = C gs + C gd, C ds SHORTED C rss = C gd C oss = C ds + C gd Ciss 6000 4000 Coss 2000 VDS= 44V VDS= 28V 16 12 8 4 FOR TEST CIRCUIT SEE FIGURE 13 Crss 0 0 1 10 0 100 40 80 120 160 200 QG Total Gate Charge (nC) VDS, Drain-to-Source Voltage (V) Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 10000 1000.0 ID, Drain-to-Source Current (A) ISD, Reverse Drain Current (A) OPERATION IN THIS AREA LIMITED BY R DS(on) T J = 175C 100.0 10.0 T J = 25C 1.0 1000 100 100sec 10 1 Tc = 25C Tj = 175C Single Pulse VGS = 0V 1msec 10msec DC 0.1 0.1 0.2 0.6 1.0 1.4 1.8 1 2.2 100 1000 VDS , Drain-toSource Voltage (V) VSD, Source-toDrain Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage 10 Fig 8. Maximum Safe Operating Area 4 www.irf.com http://store.iiic.cc/ IRFP1405 200 RDS(on) , Drain-to-Source On Resistance (Normalized) 2.5 ID , Drain Current (A) LIMITED BY PACKAGE 150 100 50 0 25 50 75 100 125 150 ID = 95A VGS = 10V 2.0 1.5 1.0 0.5 175 -60 -40 -20 T C , Case Temperature (C) 0 20 40 60 80 100 120 140 160 180 T J , Junction Temperature (C) Fig 10. Normalized On-Resistance Vs. Temperature Fig 9. Maximum Drain Current Vs. Case Temperature 1 Thermal Response ( Z thJC ) D = 0.50 0.1 0.20 0.10 0.05 0.02 0.01 0.01 J R1 R1 J 1 R2 R2 C 2 1 2 Ri (C/W) i (sec) 0.2529 0.00080 0.2368 0.014283 Ci= i/Ri Ci i/Ri 0.001 SINGLE PULSE ( THERMAL RESPONSE ) Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc 0.0001 1E-006 1E-005 0.0001 0.001 0.01 0.1 t1 , Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com 5 http://store.iiic.cc/ IRFP1405 DRIVER L VDS D.U.T RG + V - DD IAS 20V VGS tp A 0.01 Fig 12a. Unclamped Inductive Test Circuit V(BR)DSS tp EAS, Single Pulse Avalanche Energy (mJ) 2000 15V ID 16A 20A BOTTOM 95A TOP 1500 1000 500 0 25 50 75 100 125 150 175 Starting T J, Junction Temperature (C) I AS Fig 12c. Maximum Avalanche Energy Vs. Drain Current Fig 12b. Unclamped Inductive Waveforms QG 10 V QGD 4.0 VG Charge Fig 13a. Basic Gate Charge Waveform L VCC VGS(th) Gate threshold Voltage (V) QGS 3.5 3.0 ID = 250A 2.5 2.0 DUT 0 1.5 1K -75 -50 -25 0 25 50 75 100 125 150 175 T J , Temperature ( C ) Fig 13b. Gate Charge Test Circuit Fig 14. Threshold Voltage Vs. Temperature 6 www.irf.com http://store.iiic.cc/ IRFP1405 Avalanche Current (A) 10000 Duty Cycle = Single Pulse 1000 Allowed avalanche Current vs avalanche pulsewidth, tav assuming Tj = 25C due to avalanche losses. Note: In no case should Tj be allowed to exceed Tjmax 0.01 100 0.05 0.10 10 1 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 tav (sec) Fig 15. Typical Avalanche Current Vs.Pulsewidth EAR , Avalanche Energy (mJ) 600 TOP Single Pulse BOTTOM 1% Duty Cycle ID = 95A 500 400 300 200 100 0 25 50 75 100 125 150 Starting T J , Junction Temperature (C) Notes on Repetitive Avalanche Curves , Figures 15, 16: (For further info, see AN-1005 at www.irf.com) 1. Avalanche failures assumption: Purely a thermal phenomenon and failure occurs at a temperature far in excess of T jmax. This is validated for every part type. 2. Safe operation in Avalanche is allowed as long asTjmax is not exceeded. 3. Equation below based on circuit and waveforms shown in Figures 12a, 12b. 4. PD (ave) = Average power dissipation per single avalanche pulse. 5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 6. I av = Allowable avalanche current. 7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as 25C in Figure 15, 16). tav = Average time in avalanche. 175 D = Duty cycle in avalanche = tav *f ZthJC(D, tav ) = Transient thermal resistance, see figure 11) Fig 16. Maximum Avalanche Energy Vs. Temperature www.irf.com PD (ave) = 1/2 ( 1.3*BV*Iav) = DT/ ZthJC Iav = 2DT/ [1.3*BV*Zth] EAS (AR) = PD (ave)*tav 7 http://store.iiic.cc/ IRFP1405 D.U.T Driver Gate Drive + + * * * * D.U.T. ISD Waveform Reverse Recovery Current + dv/dt controlled by RG Driver same type as D.U.T. I SD controlled by Duty Factor "D" D.U.T. - Device Under Test P.W. Period * RG D= VGS=10V Circuit Layout Considerations * Low Stray Inductance * Ground Plane * Low Leakage Inductance Current Transformer - - Period P.W. VDD + Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt Re-Applied Voltage - Body Diode VDD Forward Drop Inductor Curent Ripple 5% ISD * VGS = 5V for Logic Level Devices Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET(R) Power MOSFETs V DS VGS RG RD D.U.T. + -VDD 10V Pulse Width 1 s Duty Factor 0.1 % Fig 18a. Switching Time Test Circuit VDS 90% 10% VGS td(on) tr t d(off) tf Fig 18b. Switching Time Waveforms 8 www.irf.com http://store.iiic.cc/ IRFP1405 TO-247AC Package Outline Dimensions are shown in millimeters '5* 1 TO-247AC Part Marking Information Notes: T his part marking information applies to devices produced before 02/26/2001 or for parts manufactured in GB. EXAMPLE: THIS IS AN IRFPE30 WITH ASS EMBLY LOT CODE 3A1Q INTERNAT IONAL RECTIFIER LOGO PART NUMBER IRF PE30 3A1Q 9302 DATE CODE (YYWW) YY = YEAR WW = WEEK AS S EMBLY LOT CODE Notes : T his part marking information applies to devices produced after 02/26/2001 EXAMPLE: THIS IS AN IRFPE30 WITH ASS EMBLY LOT CODE 5657 AS SEMBLED ON WW 35, 2000 IN T HE AS S EMBLY LINE "H" INTERNATIONAL RECTIFIER LOGO PART NUMBER IRFPE 30 56 035H 57 AS SEMB LY LOT CODE DATE CODE YEAR 0 = 2000 WEEK 35 LINE H TO-247AC packages are not recommended for Surface Mount Application. Data and specifications subject to change without notice. This product has been designed and qualified for Automotive [Q101] market. Qualification Standards can be found on IR's Web site. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.12/03 www.irf.com 9 http://store.iiic.cc/ Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ http://store.iiic.cc/