◇ Meet IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
◇ Designed for mounting on small surface
◇ Moisture sensitivity level 1
◇ Protects one Bi-directional I/O line
◇ Working Voltage : 5V, 12V, 24V
◇ Case : 0503 Standard package, molded plastic
◇ Terminal : Gold plated, solder per
MIL-STD-705, method 2026 guaranteed
◇ Marking code : E05, E12, E24
Applications
◇ Cell Phone Handsets and Accessories
◇ Notebooks, Desktops, and Servers
◇ Keypads, Side Keys, USB 2.0, LCD Displays
◇ Portable Instrumentation
◇ Touch Panel
TESDE5V0 0503 4K / 7" Reel RZ RZG
Maximum Ratings and Electrical Characteristics
Rating at 25
o
C ambient temperature unless otherwise specified.
Maximum Ratings Symbol Units
TESDE5V0
TESDE12V
TESDE24V
T
J
, T
STG o
C
KV
Junction and Storage Temperature Range -55 to +150
ESD per IEC 61000-4-2 (Contact) ± 8
± 15
PackingPackage
Value
75
25
Parameter
P
PP
47
Peak Pulse Power
(tp=8/20µs waveform)
TESDE5V0/TESDE12V/TESDE24V
Bi-directional ESD Protection Diode
ESD per IEC 61000-4-2 (Air)
◇ Pb free version, RoHS compliant, and Halogn free
Part No. Manufacture code
Packing code
(Green)
Mechanical Data
◇ Weight : 2 mg (approximately)
Ordering Information
Version：E14
0503
Packing code
Small Signal Product
Features
◇ Mounting position : Any
W
◇ High Temperature soldering guaranteed : 260
o
C/10s
V
ESD
Note : Detail please see "Ordering Information(detail, example)" below.
Electrical Characteristics Symbol Units
TESDE5V0
TESDE12V
TESDE24V
TESDE5V0
TESDE12V I
R
= 1 mA
TESDE24V
TESDE5V0 V
R
= 5 V
TESDE12V V
R
= 12 V
TESDE24V V
R
= 24 V
I
PP
= 5 A
I
PP
= 5 A
I
PP
= 1 A
I
PP
= 1 A
I
PP
= 1 A
I
PP
= 1 A
TESDE5V0
TESDE12V
TESDE24V
Version：E14
12Reverse Stand-Off Voltage V
RWM
24 V
pF
V
R
= 0 V , f = 1.0 MHz
Junction Capacitance C
J
15 (Typ.)
12 (Typ.)
10 (Typ.)
-
25 -
Reverse Leakage Current I
R
Reverse Breakdown Voltage V
(BR)
Small Signal Product
Parameter
V13
5.1 -
Min
-Max
5
V
µA-
- 15
2
- 15
25
- 25
Clamping Voltage V
C
TESDE5V0
Clamping Voltage TESDE12V V
C
V
Clamping Voltage TESDE24V V
C
- 47 V
- 47
-
Version : E14
Small Signal Product
RATINGS AND CHARACTERISTIC CURVES
0.01
0.1
1
10
0.1 1 10 100 1000
Peak Pulse Power Ppp (KW)
Fig. 1 Non-Repetitive Peak Pulse Power VS. Pulse Time
Pulse Duration (µs)
0
10
20
30
40
50
60
70
80
90
100
110
0 5 10 15 20 25 30
Percent of IPP
Time (us)
Fig. 2 Pulse Waveform
td = Ipp / 2
0
20
40
60
80
100
120
0 20 40 60 80 100 120 140 160 180
Power Rating (%)
Ambient Temperature(oC)
Fig. 3 Admissible Power Dissipation Curve
0
5
10
15
0 5 10 15 20 25
Normalized Capacitance (pF)
Reverse Voltage (V)
Fig. 4 Typical Junction Capacitance
f = 1.0 MHz
TESDE12V
TESDE24V
Waveform parameters:
tr = 8 µs , td = 20 µs
0
10
20
30
40
50
60
012345
Clamping Voltage (V)
Peak Pulse Current (A)
Fig. 5 Clamping Voltage VS. Peak Pulse Current
Waveform parameters:
tr = 8 µs , td = 20 µs
TESDE5V0
TESDE12V
TESDE24V
TESDE5V0
Ordering information (Detail, example)
TESDE5V0 4K / 7" Reel RZ
TESDE5V0 4K / 7" Reel RZ
Tape & Reel specification
Symbol
A
B
C
d
D
D1
D2
E
F
P
P0
P1
T
W
W1
Reel width
13.0 ± 0.20
178 ± 1
0.80 ± 0.10
Carrier length 1.46 ± 0.10
Version : E14
60.0 Min.
Carrier depth
4.00 ±0.10
Tape width
4.00 ±0.10
Small Signal Product
Part No. Package Packing codePacking Packing code
(Green)
Dimension(mm)
0.90 ± 0.10
1.55 ± 0.05
Embossment center
Overall tape thickness
Sprocket hole pitch
Punch hole pitch
1.75 ±0.10
13.5 Max.
3.50 ±0.05
2.00 ±0.05
0.23 ±0.05
8.00 ±0.20
Sprocket hole
Reel outside diameter
Reel inner diameter
Feed hole width
Sprocket hole position
Punch hole position
Item
Carrier width
Manufacture code
(Note 2)
RZG
TESDExxx
(Note 1)
Note 1 : "xxx" is Device Code from "5V0" thru "24V".
Note 2 : Manufacture special control, if empty means no special control requirement.
0503 4K / 7" Reel RZ RZG
0503
0503 RZG
Min Max Min Max
A 1.15 1.35 0.045 0.053
B 0.65 0.85 0.026 0.033
C 0.60 0.75 0.024 0.030
D
E
A
B
C
D
Applications Information
Circuit Board Layout Recommendations
Part NO. Marking
TESDE5V0 E05
TESDE12V E12
TESDE24V E24
0.55
0.85
0.30
◇ Never run critical signals near board edges
Good circuit board layout is critical for the suppression of ESD induced transients
◇ Minimize all conductive loops including power and ground loops
◇ The ESD transient return path to ground should be kept as short as possible
◇ Place the ESD Protection Diode near the input terminals or connectors to restrict transient coupling
◇ Minimize the path length between the ESD Protection Diode and the protected line
◇ Features large cross-sectional area junctions for conducting high transient currents
◇ Use ground planes whenever possible
0.40 (Typ.)
0.55 (Typ.) 0.016 (Typ.)
0.022 (Typ.)
1.40
Unit (inch)
0.022
0.033
◇ Designed to replace multilayer varistors (MLVs) in portable applications
Small Signal Product
◇ Designed to protect one data, I/O, or power supply line
Dimensions
Unit(inch)Unit(mm)
DIM.
0.012
0.055
Unit (mm)
Marking
Suggested PAD Layout
Version : E14
DIM. Typ. Typ.
◇ Offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs
◇ The combination of small size and high ESD surge capability makes them ideal for use in portable applications
◇ Designed to protect sensitive electronics from damage or latch-up due to ESD
