Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.
10
Copyright © 2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc.
10
Cree 5-mm Round LED
C503D-WAN
REFLOW SOLDERING
The LED soldering specication is shown below(suitable for both leaded solder & lead-free solder):
Manual Soldering Solder Dipping
Soldering iron 35 W max Preheat 110 ºC max
Temperature 300 ºC max
Preheat time 60 seconds max
Solder-bath temperature 260 ºC Max
Soldering time 3 seconds max Dipping time 5 seconds max
Position Not less than 3 mm from the base of the package. Position Not less than 3 mm from the base of the package.
• Manual soldering onto the PCB is not recommended because soldering time is uncontrollable.
• The recommended wave soldering is as below:
10 20 30 40 50 60 70 80 90 100 110 120
0
30
150
100
250
200
50
Temperature ºC
Times (sec)
laminar wave
Fluxing
Preheat
• Do not apply any stress to the LED package, particularly when heated.
• Only bottom preheat is suggested & should not preheat on top in order to reduce thermal stress experienced by the
LEDs.
• The LEDs must not be re used once they have been extracted from PCB.
• After soldering the LEDs, the package should be protected from mechanical shock or vibration until the LEDs have
reached 40 ºC or below.
• Precautions must be taken as mechanical stress on the LEDs may be caused by PCB warpage or from the clinching
and cutting of the LED leads.
• When it is necessary to clam the LEDs during soldering, it is important to ensure no mechanical stress is exerted on
the LEDs.
• Cut the LED lead at normal room temperature. Lead cutting at high temperature may cause failure of the LEDs.
Refer to "http://www.cree.com/led-components/media/documents/sh-HB.pdf" for soldering & handling details.