APM9926A Dual N-Channel Enhancement Mode MOSFET Features * Pin Description 20V/6A , RDS(ON)=28m(typ.) @ VGS=4.5V RDS(ON)=34m(typ.) @ VGS=2.5V * Super High Dense Cell Design for Extremely S1 1 8 D D1 1 8 G1 2 7 D S1 2 7 S2 S2 3 6 D S1 3 6 S2 G2 4 5 D G1 4 5 G2 Low RDS(ON) * * SO-8 TSSOP-8 Reliable and Rugged D D SO-8 and TSSOP-8 Packages Applications * D2 G1 G1 Power Management in Notebook Computer , S1 S1 D Portable Equipment and Battery Powered Systems. S1 D G2 G2 Ordering and Marking Information L e a d F re e C o d e H a n d lin g C o d e Tem p. Range P ackage C ode A P M 9926A XXXXX S2 X X X X X - D a te C o d e Absolute Maximum Ratings Symbol S2 P ackage C ode K : S O -8 O : T S S O P -8 O p e ra tio n J u n c tio n T e m p . R a n g e C : -5 5 to 1 5 0 C H a n d lin g C o d e TR : Tape & Reel L e a d F re e C o d e L : L e a d F re e D e v ic e B la n k : O rig in a l D e v ic e APM 9926A A P M 9 9 2 6 A K /O : S2 (TA = 25C unless otherwise noted) Parameter Rating VDSS Drain-Source Voltage 20 VGSS Gate-Source Voltage 10 ID * Maximum Drain Current - Continuous 6 IDM Maximum Drain Current - Pulsed 20 Unit V A * Surface Mounted on FR4 Board, t 10 sec. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2003 1 www.anpec.com.tw APM9926A Absolute Maximum Ratings (Cont.) Symbol Parameter Rating TA=25C PD Maximum Power Dissipation SO-8 1.6 TSSOP-8 1.0 SO-8 TA=100C TJ (TA = 25C unless otherwise noted) Storage Temperature Range RjA Thermal Resistance - Junction to Ambient W 0.625 TSSOP-8 0.4 150 C -55 to 150 C 80 C/W Maximum Junction Temperature TSTG Unit * Surface Mounted on FR4 Board, t 10 sec. Electrical Characteristics Symbol Parameter (TA = 25C unless otherwise noted) Test Condition APM9926A Typ. Max. Min. Unit Static BVDSS Drain-Source Breakdown Voltage VGS=0V , IDS=250A IDSS Zero Gate Voltage Drain Current VDS=16V , VGS=0V VGS(th) IGSS Gate Threshold Voltage Gate Leakage Current V 20 1 A 0.7 1.5 100 V nA 28 32 Drain-Source On-state VDS=VGS , IDS=250A VGS=10V , VDS=0V VGS=4.5V , IDS=6A Resistance VGS=2.5V , IDS=5.2A 34 45 Diode Forward Voltage ISD=1.7A , VGS=0V 0.7 1.3 Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-on Delay Time VDS=10V , IDS= 6A 12 VGS=4.5V , 10 3.6 VDD=10V , IDS=1A , VGEN=4.5V , RG=0.2 45 Tf Ciss Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time Input Capacitance 2 17 15 VGS=0V Coss Output Capacitance VDS=15V 25 520 110 Crss Reverse Transfer Capacitance Frequency=1.0MHz RDS(ON)a VSDa Dynamic Qg Qgs Qgd td(ON) Tr td(OFF) Notes a b 0.5 m V b nC ns pF 70 : Pulse test ; pulse width 300s, duty cycle 2% : Guaranteed by design, not subject to production testing Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2003 2 www.anpec.com.tw APM9926A Typical Characteristics Output Characteristics Transfer Characteristics 20 20 VGS=2,3,4,5,6,7,8,9,10V 1V ID-Drain Current (A) ID-Drain Current (A) 16 12 0.5V 8 4 0 15 10 TJ=25C 5 TJ=-55C TJ=125C 0 1 2 3 4 0 0.0 5 VDS - Drain-to-Source Voltage (V) 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VGS - Gate-to-Source Voltage (V) Threshold Voltage vs. Junction Temperature On-Resistance vs. Drain Current 60 1.50 RDS(ON)-On-Resistance () IDS=250uA VGS(th)-Threshold Voltage (V) (Normalized) 0.1 1.25 1.00 0.75 0.50 0.25 55 50 45 40 VGS=2.5V 35 30 VGS=4.5V 25 20 15 0.00 -50 -25 0 25 50 75 10 100 125 150 Tj - Junction Temperature (C) Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2003 0 2 4 6 8 10 12 14 16 18 20 ID - Drain Current (A) 3 www.anpec.com.tw APM9926A Typical Characteristics (Cont.) On-Resistance vs. Gate-to-Source Voltage 0.12 2.00 ID=6A RDS(ON)-On-Resistance () (Normalized) 0.11 RDS(ON)-On-Resistance () On-Resistance vs. Junction Temperature 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 1.50 1.25 1.00 0.75 0.50 0.25 0.01 0.00 VGS=4.5V 1.75 ID=6A 0 1 2 3 4 5 6 7 8 9 0.00 -50 10 VGS - Gate-to-Source Voltage (V) -25 0 50 100 125 150 Capacitance 750 10 Frequency=1MHz V DS =10V ID=6A 625 Capacitance (pF) 8 6 4 Ciss 500 375 250 Coss 2 0 75 TJ - Junction Temperature (C) Gate Charge VGS-Gate-Source Voltage (V) 25 125 0 2 4 6 8 10 12 14 16 0 18 QG - Gate Charge (nC) Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2003 Crss 0 5 10 15 20 VDS - Drain-to-Source Voltage (V) 4 www.anpec.com.tw APM9926A Typical Characteristics (Cont.) Source-Drain Diode Forward Voltage Single Pulse Power 80 10 60 Power (W) IS-Source Current (A) 20 TJ=150C 40 TJ=25C 20 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 0.01 0.1 VSD -Source-to-Drain Voltage (V) 1 10 Time (sec) Normalized Effective Transient Thermal Impedance Normalized Thermal Transient Impedence, Junction to Ambient 1 Duty Cycle=0.5 D=0.2 D=0.1 0.1 D=0.05 1.Duty Cycle, D=t1/t2 2.Per Unit Base=RthJA=80C/W 3.TJM-TA=PDMZthJA D=0.02 SINGLE PULSE 0.01 1E-4 1E-3 0.01 0.1 1 10 Square Wave Pulse Duration (sec) Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2003 5 www.anpec.com.tw APM9926A Packaging Information E e1 0.015X45 SOP-8 pin ( Reference JEDEC Registration MS-012) H e2 D A1 A 1 L 0.004max. Dim Mi ll im et er s Inche s A Min . 1. 35 Max . 1. 75 Min. 0. 053 Max . 0. 069 A1 D E 0. 10 4. 80 3. 80 0. 25 5. 00 4. 00 0. 004 0. 189 0. 150 0. 010 0. 197 0. 157 H L e1 e2 5. 80 0. 40 0. 33 6. 20 1. 27 0. 51 0. 228 0. 016 0. 013 0. 244 0. 050 0. 020 1 Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2003 1. 27B S C 0. 50B S C 8 8 6 www.anpec.com.tw APM9926A Packaging Information (Cont.) TSSOP-8 e 8 7 2x E/2 E1 ( 2) E GAUGE PLANE S 1 2 e/2 0.25 D L A2 A b Dim A A1 A2 b D e E E1 L L1 R R1 S 1 2 3 1 (L1) ( 3) A1 Millimeters Min. Inches Max. 1.2 0.15 1.05 0.30 3.1 0.00 0.80 0.19 2.9 Min. 0.000 0.031 0.007 0.114 0.65 BSC 6.40 BSC 4.30 0.45 0.026 BSC 0.252 BSC 4.50 0.75 0.169 0.018 8 0.004 0.004 0.008 0 1.0 REF 0.09 0.09 0.2 0 Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2003 Max. 0.047 0.006 0.041 0.012 0.122 0.177 0.030 0.039REF 12 REF 12 REF 8 12 REF 12 REF 7 www.anpec.com.tw APM9926A Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone T L to T P Temperature Ram p-up TL tL Tsm ax Tsm in Ram p-down ts Preheat 25 t 25 C to Peak Tim e Classificatin Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Large Body Small Body Average ramp-up rate 3C/second max. (TL to TP) Preheat - Temperature Min (Tsmin) 100C - Temperature Mix (Tsmax) 150C - Time (min to max)(ts) 60-120 seconds Tsmax to TL - Ramp-up Rate Tsmax to TL - Temperature(TL) 183C - Time (tL) 60-150 seconds Peak Temperature(Tp) 225 +0/-5C 240 +0/-5C Time within 5C of actual Peak 10-30 seconds 10-30 seconds Temperature(tp) Ramp-down Rate 6C/second max. 6 minutes max. Time 25C to Peak Temperature Pb-Free Assembly Large Body Small Body 3C/second max. 150C 200C 60-180 seconds 3C/second max 217C 60-150 seconds 245 +0/-5C 250 +0/-5C 10-30 seconds 20-40 seconds 6C/second max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface. Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2003 8 www.anpec.com.tw APM9926A Reliability test program Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245C,5 SEC 1000 Hrs Bias @ 125C 168 Hrs, 100% RH, 121C -65C ~ 150C, 200 Cycles Carrier Tape & Reel Dimensions D P Po E t P1 Bo F W Ao D1 Ko T2 J C A B T1 A p p lic a tio n SOP- 8 A B T1 T2 W P E 6 2 + 1 .5 C 1 2 .7 5 + 0 .1 5 J 330 1 2 0 .5 1 2 .4 0 .2 2 0 .2 12 0. 3 8 0 .1 1 .7 5 0 .1 F D D1 Po P1 Ao Bo Ko t 2 .0 0 .1 6 .4 0 .1 5 .2 0 . 1 5 .5 1 A p p lic a tio n T S S O P -8 1 .5 5 + 0 .1 1 .5 5 + 0 .2 5 4 .0 0 .1 2 .1 0 .1 0 .3 0 .0 1 3 A B T1 T2 W P E 6 2 + 1 .5 C 1 2 .7 5 + 0 .1 5 J 330 1 2 + 0 .5 1 2 .4 0 .2 2 0 .2 12 0. 3 8 0 .1 1 .7 5 0 .1 F D D1 Po P1 Ao Bo Ko t 5 .5 0 . 1 1 .5 + 0 .1 1 .5 + 0 .1 4 .0 0 .1 2 .0 0 .1 7 .0 0 .1 3 .6 0 .3 1 .6 0 .1 0 .3 0 .0 1 3 (mm) Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2003 9 www.anpec.com.tw APM9926A Cover Tape Dimensions Application SOP- 8 TSSOP- 8 Carrier Width 12 12 Cover Tape Width 9.3 9.3 Devices Per Reel 2500 2500 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2003 10 www.anpec.com.tw