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Page <1> V1.025/02/13
Surface Mount
Zener Diode
Features:
• Planar Die Construction
• 500mW Power Dissipation On Ceramic PCB
• General Purpose, Medium Current
• Ideally Suited For Automated Assembly Processes
Applications:
• Zener diode
• Ultra-small surface mount package
Maximum Rating @ Ta = 25°C unless otherwise specied
Characteristic Symbol Value Unit
Forward voltage @ IF=10mA VF0.9 V
Power dissipation PD500 mW
Thermal resistance, junction to ambient air RθjA 305 °C/W
Junction temperature Tj150 °C
Storage temperature range Tstg -65 to +150 °C
Note : Device mounted on ceramic PCB; 7.6mm × 9.4mm × 0.87mm with pad areas 25mm2
Short duration test pulse used to minimize self-heating effect.
When provided, otherwise, parts are provided with date code only, and type number identications appears on reel only.
f = 1kHz
Electrical Characteristics @ Ta = 25°C unless otherwise specied
Type
Number
Marking
Code
Zener Voltage Range Maximum Zener
Impedance
Maximum
Reverse
Current
Typical
Temperature
Coefcient@
IZTC mV/°C
Test
Current
IZTC
Vz@IZT IZT ZZT@IZT ZZK@IZK IZk IR@VR
Nom(V) Min(V) Max(V) mA ΩmA μA V Min Max mA
BZT52C33 WR 33 31 35 2 80 325 0.5 0.1 23.1 27.4 33.4 2
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Page <2> V1.025/02/13
Surface Mount
Zener Diode
Typical Characteristics @ Ta = 25°C unless otherwise specied
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Page <3> V1.025/02/13
Surface Mount
Zener Diode
Package Outline
Plastic surface mounted package
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Page <4> V1.025/02/13
Surface Mount
Zener Diode
Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted
for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change
without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any
error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any
assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the
Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence.
Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012.
Part Number Table
Description Part Number
Surface Mount Zener Diode BZT52C33-7-F
Package Information
Device Package Shipping
BZT52C33-7-F SOD-123 3,000/Tape & Reel
Dimensions : Millimetres
Soldering Footprint
