TFDU6100/TFDS6500/TFDT6500
Vishay Telefunken
Not for new designs
Rev . A4, 22-Jan-01 1
www.vishay.com
Document Number 82517
5 V Fast Infrared Transceiver Module Family
(FIR, 4 Mbit/s)
Description
The TFDU6100, TFDS6500, and TFDT6500 are a
family of low–power infrared transceiver modules
compliant to the latest IrDA physical layer standard for
fast infrared (FIR) data communication, supporting
IrDA speeds up to 4.0 Mbit/s, HP-SIR, Sharp ASK and
carrier based remote control modes up to 2 MHz.
Integrated within the transceiver modules are a photo
PIN diode, infrared emitter (IRED), and a low–power
CMOS control IC to provide a total front–end solution
in a single package. Vishay Telefunken’s FIR
transceivers are available in three package options,
including our Baby Face package (TFDU6100), the
smallest FIR transceiver available on the market. This
wide selection provides flexibility for a variety of
applications and space constraints. The transceivers
are capable of directly interfacing with a wide variety
of I/O chips which perform the modulation/
demodulation function, including National
Semiconductor ’s PC87338, PC87108 and PC87109,
SMC’s FDC37C669, FDC37N769 and CAM35C44,
and Hitachi’s SH3. At a minimum, a current–limiting
resistor in series with the infrared emitter and a VCC
bypass capacitor are the only external components
required to implement a complete solution.
Features
Compliant to latest IrDA physical layer
specification (Up to 4 Mbit/s),
HP–SIR, Sharp ASK and TV Remote
For 4.5 V to 5.5 V Operating Voltage
Low–Power Consumption (5 mA Supply Current)
Power Shutdown Mode
(35 A Shutdown Current)
Three Surface Mount Package Options
– Universal (9.7 × 4.7 × 4.0 mm)
– Side View (13.0 × 5.95 ×5.3 mm)
– Top View (13.0 × 7.6 × 5.95 mm)
Baby Face (Universal) Package Capable of
Surface Mount Solderability to Side and
Top View Orientation
Directly Interfaces with Various Super I/O and
Controller Devices
Built–In EMI Protection – No External Shielding
Necessary
Few External Components Required
Backward Compatible to all Telefunken SIR and
FIR Infrared Transceivers
Applications
Notebook Computers, Desktop PCs,
Palmtop Computers (Win CE, Palm PC), PDAs
Digital Still and Video Cameras
Printers, Fax Machines, Photocopiers,
Screen Projectors
Telecommunication Products
(Cellular Phones, Pagers)
Internet TV Boxes, Video Conferencing Systems
External Infrared Adapters (Dongles)
Medical and Industrial Data Collection Devices
Package Options
TFDU6100 TFDS6500 TFDT6500
Baby Face (Universal) Side View Top View
TFDU6100/TFDS6500/TFDT6500
Vishay Telefunken Not for new designs
Rev . A4, 22-Jan-012
www.vishay.com Document Number 82517
Ordering Information
Part Number Qty / Reel Description
TFDU6100–TR3 1000 pcs Oriented in carrier tape for side view surface mounting
TFDU6100–TT3 1000 pcs Oriented in carrier tape for top view surface mounting
TFDS6500–TR3 750 pcs
TFDT6500–TR3 750 pcs
Functional Block Diagram
Comparator
Amplifier
AGC
Logic
Driver
Open Drain Driver
VCC
SD/Mode
Txd
GND
Rxd
14871
IRED Anode
IRED Cathode
Figure 1. Functional Block Diagram
Pin Description
Pin Number Function Description I/O Active
“U” and “T” Option “S” Option
Function
Descri tion
I/O
Active
1 8 IRED Anode IRED anode, to be externally connected to
VCC through a current control resistor
2 1 IRED Cathode IRED cathode, internally connected to
driver transistor
3 7 Txd Transmit Data Input I HIGH
4 2 Rxd Received Data Output, push–pull CMOS
driver output capable of driving a standard
CMOS or TTL load. No external pull–up or
pull–down resistor is required (pin is float-
ing when device is in shutdown mode)
O LOW
5 6 SD/Mode Shutdown/Mode I HIGH
6 3 VCC Supply Voltage
7 5 NC Do not connect
8 4 GND Ground
TFDU6100/TFDS6500/TFDT6500
Vishay Telefunken
Not for new designs
Rev . A4, 22-Jan-01 3
www.vishay.com
Document Number 82517
“U” Option Baby Face
(Universal)
IRED Detector
IRED Detector
IRED Detector
14885
“S” Option Side View “T” Option Top View
Figure 2. Pinnings
Absolute Maximum Ratings
Reference point Pin GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameters Test Conditions Symbol Min. Typ. Max. Unit
Supply Voltage Range VCC – 0.5 6 V
Power Dissipation See Derating Curve PD350 mW
Junction Temperature TJ125 °C
Ambient Temperature
Range (Operating) Tamb –25 +85 °C
Storage Temperature
Range Tstg –25 +85 °C
Soldering Temperature See Recommended Solder
Profile (see figure 9) 240 °C
Average Output Current IIRED (DC) 130 mA
Repetitive Pulsed Output
Current <90 µs, ton <20% IIRED (RP) 600 mA
IRED Anode Voltage VIREDA – 0.5 VCC+0.5 V
Transmitter Data Input
Voltage VTxd – 0.5 VCC+0.5 V
Receiver Data Output
Voltage VRxd – 0.5 VCC+0.5 V
Virtual Source Size Method:
(1–1/e) encircled energy d 2.5 2.8 mm
Maximum Intensity for
Class 1 Operation of
IEC825–1 or EN60825–1
(worst case IrDA FIR
pulse pattern)
EN60825, 1997 320 mW/sr
TFDU6100/TFDS6500/TFDT6500
Vishay Telefunken Not for new designs
Rev . A4, 22-Jan-014
www.vishay.com Document Number 82517
Electrical Characteristics
Tamb = 25_C, VCC = 5.0 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameters Test Conditions / Pins Symbol Min. Typ. Max. Unit
Transceiver
Supply Voltage VCC 4.5 5 5.5 V
Dynamic Supply Current SD = Low
Receive mode only.
In transmit mode, add
additional 100 mA (typ)
for IRED current.
ICC 5 7 mA
Standby Supply Current SD = VCC –0.5 ISD 35 100 µA
Operating Temperature
Range TA–25 +85 °C
Output Voltage Low IOL = 2.5 mA VOL 0.3 0.5 V
Output Voltage High IOH = –2.5 mA VOH VCC–0.5 V
Input Voltage Low (Txd) VIL 0 0.8 V
Input Voltage High (Txd) VIH 3.5 V
Input Voltage Low
(SD/Mode) VIL 0 0.8 V
Input Voltage High
(SD/Mode) VIH VCC –0.5 V
Input Leakage Current IL–10 +10 µA
Input Capacitance CI5 pF
TFDU6100/TFDS6500/TFDT6500
Vishay Telefunken
Not for new designs
Rev . A4, 22-Jan-01 5
www.vishay.com
Document Number 82517
Optoelectronic Characteristics
Tamb = 25_C, VCC = 5.0 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameters Test Conditions Symbol Min. Typ. Max. Unit
Receiver
Minimum Detection
Threshold Irradiance 9.6 kbit/s to 115.2 kbit/s,
l= 850 nm – 900 nm Ee25 35 mW/m2
Threshold
Irradiance
1.152 Mbit/s to 4 Mbit/s,
l = 850 nm – 900 nm Ee70 80 mW/m2
Maximum Detection
Threshold Irradiance Ee5 10 kW/m2
Logic LOW Receiver
Input Irradiance Ee4 mW/m2
Rise Time of Output
Signal 10% to 90%, @2.2 kΩ, 15pF tr (Rxd) 10 40 ns
Fall Time of Output Signal 90% to 10%, @2.2 kΩ, 15pF tf (Rxd) 10 40 ns
Rxd Pulse Width of Output Input pulse length 20 µs, 9.6 kbit/s tPW 0.8 20 µs
Rxd
Pulse
Width
of
Out ut
Signal, 50% Input pulse length 125 ns,
4.0 Mbit/s mode tPW 60 165 ns
Input pulse length 250 ns,
4.0 Mbit/s mode (double pulse) tPW 185 290 ns
Jitter, Leading Edge Input Irradiance = 90 mW/m2,
4.0 Mbit/s mode 10 ns
Latency tL120 µs
Transmitter
IRED Operating Current R1 = 7.2 Ω, VCC = 5.0 V ID0.4 0.55 A
Output Radiant Intensity Vcc = 5.0 V, α = 0_, 15_
Txd = Low or SD = High
(Receiver is inactive as long as
SD = High) R1 = 7.2 Ω
Ie0.04 mW/sr
Vcc = 5.0 V, α = 0_, 15_
Txd = High, SD = Low, R1 = 7.2 ΩIe100 140 320 mW/sr
Radiant Intensity,
Half – Intensity Angle a1/2 ±24 _
Peak – Emission
Wavelength lP880 900 nm
Optical Rise Time,
Fall T ime tropt,
tfopt 10 40 ns
Optical Overshoot 25 %
TFDU6100/TFDS6500/TFDT6500
Vishay Telefunken Not for new designs
Rev . A4, 22-Jan-016
www.vishay.com Document Number 82517
Recommended Circuit Diagram
The only required component for designing an
IrDA 1.2 compatible design using Telefunken FIR
transceivers is a current limiting resistor, R1, to the
IRED. However, depending on the entire system
design and board layout, additional components may
be required (see figure KEIN MERKER).
IRED
Cathode IRED
Anode
Rxd
Vcc
GND
Txd
SD/Mode
NC
TFDx6x00
C2C1
R2
R1
VCC
Rxd
GND
SD/Mode
Txd Note: Outlined components are optional depending
on the quality of the power supply 14872
Figure 3. Recommended Application Circuit
Telefunken FIR transceivers integrate a sensitive
receiver and a built–in power driver. The combination
of both needs a careful circuit board layout. The use of
thin, long resistive and inductive wiring should be
avoided. The inputs (Txd, SD/Mode) and the output
Rxd should be directly (DC) coupled to the I/O circuit.
R1 is used for controlling the current through the IR
emitter. For increasing the output power of the IRED,
the value of the resistor should be reduced. Similarly,
to reduce the output power of the IRED, the value of
the resistor should be increased. For typical values of
R1 see figure KEIN MERKER. For IrDA compliant op-
eration, a current control resistor of 7.2 Ω is
recommended. The upper drive current limitation is
dependent on the duty cycle and is given by the
absolute maximum ratings on the data sheet.
R2, C1 and C2 are optional and dependent on the
quality of the supply voltage VCC and injected noise.
An unstable power supply with dropping voltage during
transmission may reduce sensitivity (and transmission
range) of the transceiver.
0
100
200
300
400
500
0246810121416
Current Control Resistor ( W )14379
Intensity (mW/sr)
min. intensity in emission cone 15°
max.Rdson, max.VF
max. intensity in
emission cone 15°
Vcc=4.75V
min. Rdson, min. VF
5.0V
5.0V
5.25V
Figure 4. Intesity Ie vs. Current Control Resistor R1
The placement of these parts is critical. It is strongly
recommended to position C2 as near as possible to the
transceiver power supply pins. A tantalum capacitor
should be used for C1 while a ceramic capacitor is
used for C2. Also, when connecting the described
circuit to the power supply, low impedance wiring
should be used.
Table 1. Recommended Application Circuit Components
Component Recommended Value Vishay Part Number
C1 4.7 mF, Tantalum 293D 475X9 016B 2T
C2 0.1 µF, Ceramic VJ 1206 Y 104 J XXMT
R1 7.2 Ω , 0.25 W (recommend using
two 3.6 W, 0.125 W resistors in series) CRCW–1206–3R60–F–RT2
R2 47 Ω , 0.125 W CRCW–1206–47R0–F–RT2
TFDU6100/TFDS6500/TFDT6500
Vishay Telefunken
Not for new designs
Rev . A4, 22-Jan-01 7
www.vishay.com
Document Number 82517
Mode Switching
The TFDU6100, TFDS6500 and TFDT6500 powers
on with a default of low frequency mode.
The low frequency mode covers speeds up to
115.2 kbit/s. Signals with higher data rates should be
detected in the high frequency mode. Lower frequency
data can also be received in the high frequency mode
but with reduced sensitivity . To switch the transceivers
from low frequency mode to the 4.0 Mbit/s mode and
vice versa, the programming sequences described be-
low are required.
Txd
SD/Mode
tsth
50%
High : FIR
Low : SIR
50%
50%
14873
Figure 5. Mode Switching Timing Diagram
Setting to the High Bandwidth Mode
(0.576 Mbit/s to 4.0 Mbit/s)
1. Set SD/MODE input to logic “HIGH”.
2. Set Txd input to logic “HIGH”. Wait ts ≥200 ns.
3. Set SD/MODE to logic “LOW” (this negative
edge latches state of Txd, which determines
speed setting).
4. After waiting th ≥200 ns Txd can be set to logic
“LOW”. The hold time of Txd is limited by the
maximum allowed pulse length.
Txd is now enabled as normal Txd input for the high
bandwidth mode.
Setting to the Lower Bandwidth Mode
(2.4 kbit/s to 115.2 kbit/s)
1. Set SD/MODE input to logic “HIGH”.
2. Set Txd input to logic “LOW”. Wait ts ≥200 ns.
3. Set SD/MODE to logic “LOW” (this negative
edge latches state of Txd, which determines
speed setting).
4. Txd must be held for th ≥200 ns.
Txd is now enabled as normal Txd input for the lower
bandwidth mode.
TFDU6100/TFDS6500/TFDT6500
Vishay Telefunken Not for new designs
Rev . A4, 22-Jan-018
www.vishay.com Document Number 82517
Recommended SMD Pad Layout
The leads of the device should be soldered in the center position of the pads.
7 x 1 = 7
0.6
2.5
81
1
15067
Figure 6. TFDU6100 BabyFace (Universal)
11.8
5.1 2.5 2.5
5876
1.8
0.63
1.1
1.0 0.6 1 8.3
2.2
4123
2.5 2.5
5.08
15069
Figure 7. TFDS6500 Side V iew Package
8.89
15068
1.27 0.8
81
1.8
Figure 8. TFDT6500 Top View Package
Note: Leads of the device should be at least 0.3 mm within the ends of the pads.
Pad 1 is longer to designate Pin 1 connection to transceiver.
TFDU6100/TFDS6500/TFDT6500
Vishay Telefunken
Not for new designs
Rev . A4, 22-Jan-01 9
www.vishay.com
Document Number 82517
Recommended Solder Profile
Time ( s )
Temperature ( C )
14874
°
0
30
60
90
120
150
180
210
240
0 50 100 150 200 250 300 350
2 - 4°C/s
10 s max.
@ 230°C
90 s max.120 - 180 s
2 - 4°C/s
Figure 9. Recommended Solder Profile
Current Derating Diagram
0
100
200
300
400
500
600
–40 –20 0 20 40 60 80 100 120 140
Peak Operating Current ( mA )
Temperature ( °C )14875
Current derating as a function of
the maximum forward current of
IRED. Maximum duty cycle: 25%.
Figure 10. Current Derating Diagram
TFDU6100/TFDS6500/TFDT6500
Vishay Telefunken Not for new designs
Rev . A4, 22-Jan-0110
www.vishay.com Document Number 82517
TFDU6100 – Baby Face (Universal) Package (Mechanical Dimensions)
12249
TFDU6100/TFDS6500/TFDT6500
Vishay Telefunken
Not for new designs
Rev . A4, 22-Jan-01 11
www.vishay.com
Document Number 82517
TFDS6500 – Side View Package (Mechanical Dimensions)
14322
TFDU6100/TFDS6500/TFDT6500
Vishay Telefunken Not for new designs
Rev . A4, 22-Jan-0112
www.vishay.com Document Number 82517
TFDT6500 – T op View Package (Mechanical Dimensions)
14325
TFDU6100/TFDS6500/TFDT6500
Vishay Telefunken
Not for new designs
Rev . A4, 22-Jan-01 13
www.vishay.com
Document Number 82517
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. V arious national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
W e reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer application
by the customer. Should the buyer use Vishay Telefunken products for any unintended or unauthorized application, the
buyer shall indemnify Vishay Telefunken against all claims, costs, damages, and expenses, arising out of, directly or
indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.
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Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
