SDFS063A - D2932, MARCH 1987 - REVISED OCTOBER 1993 * SN54F244 . . . J PACKAGE SN74F244 . . . DB, DW, OR N PACKAGE (TOP VIEW) 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND description These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the F240 and F241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical OE (active-low output-enable) inputs, and complementary OE and OE inputs. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 2Y4 1A1 1OE VCC SN54F244 . . . FK PACKAGE (TOP VIEW) The F244 is organized as two 4-bit buffers/line drivers with separate output enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. 1A2 2Y3 1A3 2Y2 1A4 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 1Y1 2A4 1Y2 2A3 1Y3 2Y1 GND 2A1 1Y4 2A2 The SN74F244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. 2OE * The SN54F244 is characterized for operation over the full military temperature range of - 55C to 125C. The SN74F244 is characterized for operation from 0C to 70C. FUNCTION TABLE (each buffer) INPUTS OE A OUTPUT Y L H H L L L H X Z Copyright 1993, Texas Instruments Incorporated !"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($% %$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- * DALLAS, TEXAS 75265 * HOUSTON, TEXAS 77251-1443 POST OFFICE BOX 655303 POST OFFICE BOX 1443 2-1 SDFS063A - D2932, MARCH 1987 - REVISED OCTOBER 1993 logic symbol 1OE 1A1 1A2 1A3 1A4 1 logic diagram (positive logic) 1OE 1 EN 2 18 4 16 6 14 8 12 1A1 1Y1 2 18 4 16 1Y2 1Y3 1A2 6 2OE EN 14 1Y3 8 12 1A4 2A1 2A2 2A3 2A4 11 9 13 7 15 5 17 3 1Y2 1Y4 1A3 19 1Y1 1Y4 2Y1 2Y2 19 2OE 2Y3 2Y4 11 9 13 7 15 5 17 3 2Y1 2A1 This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2Y2 2A2 2Y3 2A3 2A4 2Y4 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.2 V to 7 V Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -30 mA to 5 mA Voltage range applied to any output in the disabled or power-off state . . . . . . . . . . . . . . . . . . . -0.5 V to 5.5 V Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to VCC Current into any output in the low state: SN54F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Operating free-air temperature range: SN54F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55C to 125C SN74F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed. 2-2 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * SDFS063A - D2932, MARCH 1987 - REVISED OCTOBER 1993 recommended operating conditions SN54F244 SN74F244 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 UNIT VCC VIH Supply voltage VIL IIK Low-level input voltage 0.8 0.8 V Input clamp current -18 -18 mA IOH IOL High-level output current - 12 - 15 mA 64 mA TA Operating free-air temperature 70 C High-level input voltage 2 2 Low-level output current V 48 -55 125 V 0 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VCC = 4.5 V, VCC = 4.5 V VOH SN54F244 TYP MAX TEST CONDITIONS VCC = 4.75 V, VOL VCC = 4.5 V IOZH IOZL VCC = 5.5 V, VCC = 5.5 V, II IIH VCC = 5.5 V, VCC = 5.5 V, MIN II = - 18 mA IOH = - 3 mA -1.2 IOH = - 12 mA IOH = - 15 mA 2.4 3.3 2 3.2 IOH = - 3 mA IOL = 48 mA IOS Any A 0.38 IOL = 64 mA VO = 2.7 V VI = 2.7 V VI = 0.5 V VCC = 5.5 V, VO = 0 Outputs high 3.3 2 3.1 V -100 0.55 -50 -50 A 0.1 0.1 mA A 20 20 -1 -1 - 1.6 - 1.6 -225 -100 -225 40 60 60 90 60 90 Outputs disabled 60 90 60 All typical values are at VCC = 5 V, TA = 25C. Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. 90 Outputs low * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * A 50 60 VCC = 5.5 V, Outputs open V 50 40 ICC V 0.55 0.42 VO = 0.5 V VI = 7 V VCC = 5.5 V, -1.2 2.4 UNIT 2.7 OE IIL SN74F244 TYP MAX MIN mA mA mA 2-3 SDFS063A - D2932, MARCH 1987 - REVISED OCTOBER 1993 switching characteristics (see Note 2) PARAMETER FROM (INPUT) VCC = 5 V, CL = 50 pF, RL = 500 , TA = 25C TO (OUTPUT) VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 , TA = MIN to MAX F244 tPLH tPHL A Y tPZH tPZL OE Y tPHZ tPLZ OE Y SN74F244 MIN TYP MAX MIN MAX MIN MAX 1.7 3.6 5.2 2 6.5 1.7 6.2 1.7 3.6 5.2 2 7 1.7 6.5 1.2 3.9 5.7 2 7 1.2 6.7 1.2 5 7 2 8.5 1.2 8 1.2 4.1 6 2 7 1.2 7 1.2 4.1 6 2 7.5 1.2 7 For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. NOTE 2: Load circuits and waveforms are shown in Section 1. 2-4 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * UNIT SN54F244 ns ns ns PACKAGE OPTION ADDENDUM www.ti.com 21-Jan-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) 5962-9758601Q2A ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 59629758601Q2A SNJ54F 244FK 5962-9758601QRA ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9758601QR A SNJ54F244J 5962-9758601QRA ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9758601QR A SNJ54F244J 5962-9758601QSA ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9758601QS A SNJ54F244W 5962-9758601QSA ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9758601QS A SNJ54F244W JM38510/33203B2A ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 33203B2A JM38510/33203B2A ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 33203B2A JM38510/33203BRA ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 33203BRA JM38510/33203BRA ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 33203BRA JM38510/33203BSA ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 33203BSA JM38510/33203BSA ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 33203BSA M38510/33203B2A ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 33203B2A M38510/33203B2A ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 33203B2A M38510/33203BRA ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 33203BRA Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Jan-2021 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) M38510/33203BRA ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 33203BRA M38510/33203BSA ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 33203BSA M38510/33203BSA ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 33203BSA SN54F244J ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 SN54F244J SN54F244J ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 SN54F244J SN74F244DB ACTIVE SSOP DB 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM F244 SN74F244DB ACTIVE SSOP DB 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM F244 SN74F244DBR ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 F244 SN74F244DBR ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 F244 SN74F244DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 F244 SN74F244DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 F244 SN74F244DWG4 ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 F244 SN74F244DWG4 ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 F244 SN74F244DWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 F244 SN74F244DWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 F244 SN74F244N ACTIVE PDIP N 20 20 RoHS & Non-Green NIPDAU N / A for Pkg Type 0 to 70 SN74F244N SN74F244N ACTIVE PDIP N 20 20 RoHS & Non-Green NIPDAU N / A for Pkg Type 0 to 70 SN74F244N SN74F244NE4 ACTIVE PDIP N 20 20 RoHS & Non-Green NIPDAU N / A for Pkg Type 0 to 70 SN74F244N SN74F244NE4 ACTIVE PDIP N 20 20 RoHS & Non-Green NIPDAU N / A for Pkg Type 0 to 70 SN74F244N Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Jan-2021 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) SN74F244NSR ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 74F244 SN74F244NSR ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 74F244 SN74F244NSRE4 ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 74F244 SN74F244NSRE4 ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 74F244 SNJ54F244FK ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 59629758601Q2A SNJ54F 244FK SNJ54F244FK ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 59629758601Q2A SNJ54F 244FK SNJ54F244J ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9758601QR A SNJ54F244J SNJ54F244J ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9758601QR A SNJ54F244J SNJ54F244W ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9758601QS A SNJ54F244W SNJ54F244W ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9758601QS A SNJ54F244W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Jan-2021 RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54F244, SN74F244 : * Catalog: SN74F244 * Military: SN54F244 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 30-Dec-2020 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74F244DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74F244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74F244NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Dec-2020 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74F244DBR SSOP DB 20 2000 853.0 449.0 35.0 SN74F244DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74F244NSR SO NS 20 2000 367.0 367.0 45.0 Pack Materials-Page 2 PACKAGE OUTLINE DB0020A SSOP - 2 mm max height SCALE 2.000 SMALL OUTLINE PACKAGE C 8.2 TYP 7.4 A 0.1 C PIN 1 INDEX AREA SEATING PLANE 18X 0.65 20 1 2X 7.5 6.9 NOTE 3 5.85 10 11 20X B 5.6 5.0 NOTE 4 SEE DETAIL A (0.15) TYP 0.38 0.22 0.1 C A B 2 MAX 0.25 GAGE PLANE 0 -8 0.95 0.55 0.05 MIN DETAIL A A 15 TYPICAL 4214851/B 08/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. www.ti.com EXAMPLE BOARD LAYOUT DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE SYMM 20X (1.85) (R0.05) TYP 1 20 20X (0.45) SYMM 18X (0.65) 11 10 (7) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK OPENING SOLDER MASK OPENING METAL UNDER SOLDER MASK METAL EXPOSED METAL EXPOSED METAL 0.07 MAX ALL AROUND NON-SOLDER MASK DEFINED (PREFERRED) 0.07 MIN ALL AROUND SOLDER MASK DEFINED SOLDER MASK DETAILS 15.000 4214851/B 08/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20 20X (0.45) SYMM 18X (0.65) 10 11 (7) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4214851/B 08/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 TYP 9.97 SEATING PLANE PIN 1 ID AREA A 0.1 C 20 1 13.0 12.6 NOTE 3 18X 1.27 2X 11.43 10 11 B 7.6 7.4 NOTE 4 20X 0.51 0.31 0.25 C A B 2.65 MAX 0.33 TYP 0.10 SEE DETAIL A 0.25 GAGE PLANE 0 -8 0.3 0.1 1.27 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 11 10 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. 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