State of the Art, Inc. www.resistor.com $0505DBX High Power Thick Film Chip Resistor Standard Grade, Solderable, Bottom Meiallized O7/49/10 Length 052 {ba8 ~ 058) 41.32 (1.27-1.47 Width 048 (.046 - 050) 1.22 ( 17-1 oA Thickness -010 (.008-.018) 6.25 (0.20~-0.46 Top Term -015 (010+ .020) 0.38 (0.25 - Ost} Bottom Term (L) 048 (043 -.054) 1.22 (1,09 - 1.37} Bottom Term (W} 044 (.039-.050) 1.12 (0.99- 4.27} Approx. Weight 002 grams + High stability thick flim resistor + Produced with the same stringent element on a high thermal quality and reliability standards as conductivity BeO chip. our QPL S level Mi-PRF-55342 and space level products Terminations are pretinned (Sn60) solder over nicke! barrier compatible with reflow, vapor phase, wave and + Alternate termination styles are hand soldering. available to accommodate other Resistance Range 4 ohm to 12 K ohm . . attachment needs Tolerance (others available) 4,2,5,10,20 % + Operation temperature range: -55C Maximum Vollage 40 volts dc to + 150C Therrnal Resistance (typical) 2.26 CAwatt TCR (-65 / + 128C} 100, 200, 300 ppm/ C Power Rating 1GW Maximum * Maximum power is based upon mounting to an Infinite and ideal heat sink maintained at 100C and a maximum film ternperature of 450C. Maximum power dissipation in thick film chip resistors is determined by the ENVIRONMENTAL PERFORMANCE* thermal properties of the chip and condition under which it is mounted. The ability of the mounting assembly to remove heat from the resistor is a primary Thermal Shock +.03 % consideration in determining the maximum load a resistor can safely handle. Low Temperature Operation +.03 % Maintaining the film temperature at or below 750C ensures reliable Short Time Overload 4.03 % operation. Higher power dissipation is attainable by providing paths of low Resistance to Bonding Exposure .03 % thermal resistance from the chip base to the surrounding ambient conditions. Moisture Resistance t.05 % High Termperature Exposure .05 % POWER DERATING * Typical percent resistance change -test methods and actual specification limits are in accordance with MiL-PRF-55342. For operation in ambient conditions in excess of 70C, use the chart on the right. Long term operation of the resistor fim at temperatures higher than 150C is not recommended. TYPICAL LIFE PERFORMANCE Parts are solder mourited on FR-4 board and tested at 70C. Power is applied for 90 minutes on and 30 minutes off at a rafe that achieves a film temperature 30C above ambient. Maximurn Power (% ) 75 50 -25 0 25 50 75 100 125 150 175 Ambient Temperature {degrees C} 0 250500 1K 2K 4K 6K BK 10K Test Duration in Hours Absolute Percent Resistance Change Consuit our engineering department for specific performance needs. Two packaging options are available: Waffle Pack - 400 per tray maximum Tape & Reel - 5000 per 7 inch reel maximum Three digits eink tol erence and lower) are used with all ig. fic: eee digit Specie 168 ae yn Optional high reliability screening or custom testing or other special requirements can also be furnished. Consult our factory with your special needs. Spacifications subject to change without notice. STATE OF THE ART, ING. 2470 Fox Hill Road State College, PA 16603-1797 Phone (814)355-8004 Fax (814)355-2714 TOLL FREE 1-800-458-3401