NCP4623HSN120T1G - ON Semiconductor L.L.C.

February, 2012 − Rev. 2

1Publication Order Number:

NCP4623/D

NCP4623

150 mA, Wide Input Voltage

Range, Low Dropout

Regulator

The NCP4623 is a CMOS Linear Voltage Regulator designed for

wide input voltage range. The maximum operating input voltage is up

to 24 V with a minimum voltage starting from 2 V. The Chip Enable

(CE) pin allows the device to lower standby current to 0.1 mA typ. The

NCP4623 features many protections for any current or thermal

sensitive devices with current fold−back protection, thermal shutdown

protection, and peak and short current protection. This device is

available in adjustable and fixed voltage output in 0.1 V steps. They

are available in very thin XDFN6 1.6x1.6x0.4 mm in size and the very

popular SOT23−5 and SOT89−5 packages. Please contact your local

sales office for additional output voltage options.

Features

•Maximum Operating Input Voltage: 24 V

•Output Voltage Range: 2.5 V to 12.0 V (available in 0.1 V steps)

2.5 V to 24.0 V (adjustable version)

•Output Voltage Accuracy: ±2.0%

•Supply Current: 5 mA

•Stable with Ceramic Capacitors: 1 mF or more

•Current Fold Back Protection

•Peak and Short Current Protection

•Thermal Shutdown Protection

•Available in XDFN6 1.6 x 1.6 mm, SOT23−5, SOT89−5 Packages

•These are Pb−Free Devices

Typical Applications

•Battery−powered Equipment

•Networking and Communication Equipment

•Cameras, DVRs, STB and Camcorders

•Home Appliances

VIN VOUT

GND

C1 C2

100n 100n

VIN VOUT

NCP4623x

VIN VOUT

GND

C1 C2

100n 100n

VIN VOUT

NCP4623xADJ

ADJ

Figure 1. Typical Application Schematics

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See detailed ordering and shipping information in the package

dimensions section on page 17 of this data sheet.

ORDERING INFORMATION

XDFN6

CASE 711AC

XXX, XXXX = Specific Device Code

M, MM = Date Code

A = Assembly Location

Y = Year

W = Work Week

G= Pb−Free Package

MARKING

DIAGRAMS

(*Note: Microdot may be in either location)

SOT−89 5

CASE 528AB

SOT−23−5

CASE 1212

XXX

XMM

XXX

XMM

XXXMM

NCP4623

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Peak Current

Protection

Vref

VIN

GND

VOUT

Short

Protection

NCP4623Hxxxxx

Thermal

Protection

Peak Current

Protection

Vref

VIN

GND

VOUT

Short

Protection

Thermal

Protection

ADJ

NCP4623HxxADJ

Figure 2. Simplified Schematic Block Diagram

PIN FUNCTION DESCRIPTION

Pin No.

XDFN

(Note 1)

Pin No.

SOT89−5

Pin No.

SOT23 Pin Name Description

3 1 1 VOUT Output pin

6 2 2 GND Ground

4 3 5 CE Chip enable pin (Active “H”)

1 5 3 VIN Input pin

5 4 4 NC/ADJ No connection (non ADJ versions) / Reference Voltage of Adjustable

Output Pin (ADJ versions)

2− − NC No connection

1. Tab is connected to GND. Tab should be connected to GND, but leaving it unconnected is also acceptable

NCP4623

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ABSOLUTE MAXIMUM RATINGS

Rating Symbol Value Unit

Input Voltage (Note 2) VIN 26.0 V

Output Voltage VOUT −0.3 to VIN + 0.3 V

Chip Enable Input VCE −0.3 to VIN + 0.3 V

Reference Input Voltage VADJ −0.3 to VIN + 0.3 V

Output Current IOUT 250 mA

Power Dissipation XDFN6−1616

640

Power Dissipation SOT89−5 900

Power Dissipation SOT23−5 420

Junction Temperature TJ−40 to 150 °C

Operation Temperature TA−40 to 85 °C

Storage Temperature TSTG −55 to 125 °C

ESD Capability, Human Body Model (Note 3) ESDHBM 2000 V

ESD Capability, Machine Model (Note 3) ESDMM 200 V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

2. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.

3. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

Latchup Current Maximum Rating tested per JEDEC standard: JESD78.

THERMAL CHARACTERISTICS

Rating Symbol Value Unit

Thermal Characteristics, XDFN6

Thermal Resistance, Junction−to−Air

RqJA 156 °C/W

Thermal Characteristics, SOT23−5

Thermal Resistance, Junction−to−Air

RqJA 238 °C/W

Thermal Characteristics, SOT89−5

Thermal Resistance, Junction−to−Air

RqJA 111 °C/W

ELECTRICAL CHARACTERISTICS NCP4623Hxxxx, CIN = COUT = 0.1 mF, TA = +25°C

Parameter Test Conditions Symbol Min Typ Max Unit

Operating Input Voltage VIN 2 24 V

Output Voltage VIN = VOUT(NOM) + 2.0 V, IOUT = 20 mA VOUT x0.98 x1.02 V

Output Voltage Temp. Coeffi-

cient

VIN = VOUT(NOM) + 2.0 V, IOUT = 20 mA,

−40°C ≤ TA ≤ 105ºC

DVOUT/DTA±100 ppm/°C

Line Regulation VOUT(NOM) + 1 V ≤ VIN ≤ 24 V, IOUT = 20 mA LineReg 0.05 0.20 %/V

Load Regulation VIN = VOUT(NOM) +

2.0 V, IOUT = 1 mA to

40 mA

2.5 V ≤ VOUT ≤ 3.0 V LoadReg 20 50

3.1 V ≤ VOUT ≤ 5.0 V 30 75

5.1 V ≤ VOUT ≤ 12.0 V 40 115

Dropout Voltage

IOUT = 20 mA 2.5 V ≤ VOUT ≤ 7.0 V VDO 0.20 0.40 V

7.1 V ≤ VOUT ≤ 10.0 V 0.25 0.50

10.1 V ≤ VOUT ≤ 12.0 V 0.30 0.55

Output Current VIN = VOUT(NOM) +

2.0 V

2.5 V ≤ VOUT ≤ 2.9 V IOUT 140 mA

3.0 V ≤ VOUT ≤ 12.0 V 150

NCP4623

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ELECTRICAL CHARACTERISTICS NCP4623Hxxxx, CIN = COUT = 0.1 mF, TA = +25°C

Parameter UnitMaxTypMinSymbolTest Conditions

Short Current Limit VOUT = 0 V ISC 45 mA

Quiescent Current VIN = VOUT(NOM) + 2.0 V, VCE = VIN IQ5 10 mA

Standby Current VIN = 24 V, VCE = 0 V ISTB 0.1 1.0 mA

CE Pin Threshold Voltage CE Input Voltage “H” VCEH 2.1 VIN V

CE Input Voltage “L” VCEL 0 0.3

Power Supply Rejection Ratio VOUT = 3.3V V, VIN = 5.3 V, DVIN = 0.2 Vpk−pk,

IOUT = 30 mA, f = 1 kHz

PSRR 35 dB

Output Noise Voltage f = 10 Hz to 100 kHz, VOUT = 3.3 V, VIN = 5.3 V,

IOUT = 30 mA

VN90 mVrms

Thermal Shutdown Temperature TSD 150 °C

Thermal Shutdown Release

Temperature

TSR 125 °C

ELECTRICAL CHARACTERISTICS NCP4623HxxxADJ, VADJ = VOUT

, CIN = COUT = 0.1 mF, TA = +25°C

Parameter Test Conditions Symbol Min Typ Max Unit

Operating Input Voltage VIN 2 24 V

Output Voltage VIN = VOUT(NOM) + 2.0 V, IOUT = 20 mA VOUT 2.45 2.50 2.55 V

Output Voltage Temp. Coeffi-

cient

VIN = VOUT(NOM) + 2.0 V, IOUT = 20 mA,

−40°C ≤ TA ≤ 105ºC

DVOUT/DTA±100 ppm/°C

Line Regulation VOUT(NOM) + 1 V ≤ VIN ≤ 24 V, IOUT = 20 mA LineReg 0.05 0.20 %/V

Load Regulation VIN = VOUT(NOM) + 2.0 V, IOUT = 1 mA to 40 mA LoadReg 20 50 mV

Dropout Voltage IOUT = 20 mA VDO 0.20 0.40 V

Output Current VIN = VOUT(NOM) + 2.0 V IOUT 140 mA

Short Current Limit VOUT = 0 V ISC 45 mA

3 Quiescent Current VIN = VOUT(NOM) + 2.0 V, VCE = VIN IQ5 10 mA

Standby Current VIN = 24 V, VCE = 0 V ISTB 0.1 1.0 mA

CE Pin Threshold Voltage CE Input Voltage “H” VCEH 2.1 VIN V

CE Input Voltage “L” VCEL 0 0.3

Power Supply Rejection Ratio VIN = 4.5 V, VOUT = 2.5 V, DVIN = 0.2 Vpk−pk,

IOUT = 30 mA, f = 1 kHz

PSRR 40 dB

Output Noise Voltage f = 10 Hz to 100 kHz, VOUT = 2.5 V, VIN = 4.5 V,

IOUT = 30 mA

VN80 mVrms

Thermal Shutdown Temperature TSD 150 °C

Thermal Shutdown Release

Temperature

TSR 125 °C

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TYPICAL CHARACTERISTICS

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0 50 100 150 200 250 300

Figure 3. Output Voltage vs. Output Current

3.3 V Version (TJ = 255C)

VOUT

, OUTPUT VOLTAGE (V)

IOUT

, OUTPUT CURRENT (mA)

VIN = 4.3 V

5.0 V

7.0 V

6.0 V

Figure 4. Output Voltage vs. Output Current

3.3 V Version VIN = 5.3 V

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0 50 100 150 200 250 300

IOUT

, OUTPUT CURRENT (mA)

VOUT

, OUTPUT VOLTAGE (V)

TJ = −40°C25°C

105°C

Figure 5. Output Voltage vs. Output Current

5.0 V Version (TJ = 255C)

0.0

1.0

2.0

3.0

4.0

5.0

6.0

0 50 100 150 200 250 300

VOUT

, OUTPUT VOLTAGE (V)

IOUT

, OUTPUT CURRENT (mA)

VIN = 6.5 V

6.0 V

7.0 V

8.0 V

0.0

1.0

2.0

3.0

4.0

5.0

6.0

0 50 100 150 200 250 300

Figure 6. Output Voltage vs. Output Current

5.0 V Version VIN = 7.0 V

TJ = −40°C

25°C

105°C

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

0 50 100 150 200 250 300

IOUT

, OUTPUT CURRENT (mA)

VOUT

, OUTPUT VOLTAGE (V)

VOUT

, OUTPUT VOLTAGE (V)

IOUT

, OUTPUT CURRENT (mA)

Figure 7. Output Voltage vs. Output Current

12.0 V Version (TJ = 255C)

VIN = 13 V

13.5 V

14 V

15 V

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

0 50 100 150 200 250 300

TJ = −40°C

25°C

105°C

IOUT

, OUTPUT CURRENT (mA)

VOUT

, OUTPUT VOLTAGE (V)

Figure 8. Output Voltage vs. Output Current

12.0 V Version VIN = 14.0 V

NCP4623

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TYPICAL CHARACTERISTICS

0.0

0.5

1.0

1.5

2.0

0 30 60 90 120 150

Figure 9. Dropout Voltage vs. Output Current

3.3 V Version

TJ = −40°C

25°C

105°C

IOUT

, OUTPUT CURRENT (mA)

VDO, DROPOUT VOLTAGE (V)

Figure 10. Dropout Voltage vs. Output Current

5.0 V Version

0.0

0.5

1.0

1.5

2.0

0 30 60 90 120 150

IOUT

, OUTPUT CURRENT (mA)

VDO, DROPOUT VOLTAGE (V)

TJ = −40°C

25°C

105°C

0.0

0.5

1.0

1.5

2.0

0 30 60 90 120 150

TJ = −40°C

25°C105°C

Figure 11. Dropout Voltage vs. Output Current

12.0 V Version

IOUT

, OUTPUT CURRENT (mA)

VDO, DROPOUT VOLTAGE (V)

3.25

3.26

3.27

3.28

3.29

3.30

3.31

3.32

3.33

3.34

3.35

−40 −200 20406080100

Figure 12. Output Voltage vs. Temperature,

3.3 V Version, VIN = 5.3 V, IOUT = 20 mA

TJ, JUNCTION TEMPERATURE (°C)

VOUT

, OUTPUT VOLTAGE (V)

4.95

4.96

4.97

4.98

4.99

5.00

5.01

5.02

5.03

5.04

5.05

VOUT

, OUTPUT VOLTAGE (V)

TJ, JUNCTION TEMPERATURE (°C)

−40 −200 20406080100

Figure 13. Output Voltage vs. Temperature,

5.0 V Version, VIN = 7.0 V, IOUT = 20 mA

11.95

11.96

11.97

11.98

11.99

12.00

12.01

12.02

12.03

12.04

12.05

−40 −200 20406080100

TJ, JUNCTION TEMPERATURE (°C)

VOUT

, OUTPUT VOLTAGE (V)

Figure 14. Output Voltage vs. Temperature,

12.0 V Version, VIN = 14.0 V, IOUT = 20 mA

NCP4623

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TYPICAL CHARACTERISTICS

0 5 10 15 20 25

Figure 15. Supply Current vs. Input Voltage,

3.3 V Version

IGND (mA)

VIN, INPUT VOLTAGE (V)

0 5 10 15 20 25

IGND (mA)

VIN, INPUT VOLTAGE (V)

Figure 16. Supply Current vs. Input Voltage,

5.0 V Version

Figure 17. Supply Current vs. Input Voltage,

12.0 V Version

0 5 10 15 20 25

IGND (mA)

VIN, INPUT VOLTAGE (V)

−40 −200 20406080100

TJ, JUNCTION TEMPERATURE (°C)

IGND (mA)

Figure 18. Supply Current vs. Temperature, 3.3

Version, VIN = 5.3 V

TJ, JUNCTION TEMPERATURE (°C)

−40 −200 20406080100

IGND (mA)

Figure 19. Supply Current vs. Temperature,

5.0 V Version, VIN = 7.0 V

Figure 20. Supply Current vs. Temperature,

12.0 V Version, VIN = 14.0 V

−40 −200 20406080100

TJ, JUNCTION TEMPERATURE (°C)

IGND (mA)

NCP4623

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TYPICAL CHARACTERISTICS

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0 5 10 15 20 25

IOUT = 40 mA

20 mA

VOUT

, OUTPUT VOLTAGE (V)

1 mA

VIN, INPUT VOLTAGE (V)

Figure 21. Output Voltage vs. Input Voltage,

3.3 V Version

0.0

1.0

2.0

3.0

4.0

5.0

6.0

0 5 10 15 20 25

VOUT

, OUTPUT VOLTAGE (V)

VIN, INPUT VOLTAGE (V)

IOUT = 40 mA

20 mA

1 mA

Figure 22. Output Voltage vs. Input Voltage,

5.0 V Version

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

0 5 10 15 20 25

VOUT

, OUTPUT VOLTAGE (V)

VIN, INPUT VOLTAGE (V)

Figure 23. Output Voltage vs. Input Voltage,

12.0 V Version

IOUT = 40 mA

20 mA

1 mA

0.1 1 10 100 1000

PSRR (dB)

FREQUENCY (kHz)

IOUT = 1 mA

30 mA

150 mA

Figure 24. PSRR, 3.3 V Version, VIN = 6.3 V

0.1 1 10 100 1000

VOUT

, OUTPUT VOLTAGE (V)

VIN, INPUT VOLTAGE (V)

Figure 25. PSRR, 5.0 V Version, VIN = 8.0 V

IOUT = 1 mA

30 mA

150 mA

0.1 1 10 100 1000

Figure 26. PSRR, 12.0 V Version, VIN = 15.0 V

PSRR (dB)

FREQUENCY (kHz)

IOUT = 1 mA

30 mA

150 mA

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TYPICAL CHARACTERISTICS

Figure 27. Output Voltage Noise, 3.3 V Version,

VIN = 5.3 V, IOUT = 30 mA

0.01 0.1 1 10 100 1000

VN (mVrms/√Hz)

FREQUENCY (kHz)

Figure 28. Output Voltage Noise, 5.0 V Version,

VIN = 7.0 V, IOUT = 30 mA

2.0

4.0

6.0

8.0

0.01 0.1 1 10 100 1000

VN (mVrms/√Hz)

FREQUENCY (kHz)

Figure 29. Output Voltage Noise, 12.0 V Version,

VIN = 14.0 V, IOUT = 30 mA

5.0

0.01 0.1 1 10 100 1000

1.0

2.0

3.0

4.0

5.0

6.0

7.0

FREQUENCY (kHz)

VN (mVrms/√Hz)

Figure 30. Line Transients, 2.5 V Version,

tR = tF = 5 ms, IOUT = 30 mA

1.9

2.1

2.3

2.5

2.7

2.9

3.1

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

4.5

5.0

5.5

6.0

VOUT (V)

t (ms)

VIN (V)

Figure 31. Line Transients, 3.3 V Version,

tR = tF = 5 ms, IOUT = 30 mA

2.7

2.9

3.1

3.3

3.5

3.7

3.9

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

5.3

5.8

6.3

6.8

VOUT (V)

t (ms)

VIN (V)

NCP4623

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TYPICAL CHARACTERISTICS

Figure 32. Line Transients, 5.0 V Version,

tR = tF = 5 ms, IOUT = 30 mA

4.4

4.6

4.8

5.0

5.2

5.4

5.6

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

7.0

7.5

8.0

8.5

VOUT (V)

t (ms)

VIN (V)

Figure 33. Line Transients, 12.0 V Version,

tR = tF = 5 ms, IOUT = 30 mA

11.4

11.6

11.8

12.0

12.2

12.4

12.6

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

14.0

14.5

15.0

15.5

VOUT (V)

t (ms)

Load Transients, 2.5 V Version, IOUT = 1 -

30 mA, tR = tF = 50 ms, VIN = 4.5 V

1.9

2.1

2.3

2.5

2.7

2.9

3.1

0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0

VIN (V)

VOUT (V)

IOUT (mA)

t (ms)

NCP4623

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TYPICAL CHARACTERISTICS

Figure 34 - Load Transients, 3.3 V Version,

IOUT = 1 - 30 mA, tR = tF = 50 ms, VIN = 5.3 V

2.7

2.9

3.1

3.3

3.5

3.7

3.9

0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0

VOUT (V)

IOUT (mA)

t (ms)

Figure 35. Load Transients, 5.0 V Version,

IOUT = 1 − 30 mA, tR = tF = 50 ms, VIN = 7.0 V

4.4

4.6

4.8

5.0

5.2

5.4

5.6

0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0

VOUT (V)

IOUT (mA)

t (ms)

Figure 36. Load Transients, 12.0 V Version,

IOUT = 1 − 30 mA, tR = tF = 50 ms, VIN = 14.0 V

11.4

11.6

11.8

12.0

12.2

12.4

12.6

0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0

VOUT (V)

IOUT (mA)

t (ms)

NCP4623

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TYPICAL CHARACTERISTICS

Figure 37. Load Transients, 2.5 V Version,

IOUT = 1 − 100 mA, tR = tF = 50 ms, VIN = 4.5 V

1.0

1.5

2.0

2.5

3.0

3.5

4.0

0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0

100

150

VOUT (V)

IOUT (mA)

t (ms)

Figure 38. Load Transients, 3.3 V Version,

IOUT = 1 − 100 mA, tR = tF = 50 ms, VIN = 5.3 V

1.8

2.3

2.8

3.3

3.8

4.3

4.8

0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0

100

150

VOUT (V)

IOUT (mA)

t (ms)

Figure 39. Load Transients, 5.0 V Version,

IOUT = 1 − 100 mA, tR = tF = 50 ms, VIN = 7.0 V

3.5

4.0

4.5

5.0

5.5

6.0

6.5

0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0

100

150

VOUT (V)

IOUT (mA)

t (ms)

NCP4623

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TYPICAL CHARACTERISTICS

Figure 40. Load Transients, 12.0 V Version,

IOUT = 1 − 100 mA, tR = tF = 50 ms, VIN = 14.0 V

VOUT (V)

IOUT (mA)

t (ms)

10.5

11.0

11.5

12.0

12.5

13.0

13.5

0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0

100

150

Figure 41. Start−up, 2.5 V Version, VIN = 4.5 V

−0.5

0.5

1.0

1.5

2.0

2.5

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

2.25

4.50

6.75

VOUT (V)

VCE (V)

t (ms)

IOUT = 150 mA

IOUT = 1 mA

IOUT = 30 mA

Chip Enable

Figure 42. Start−up, 3.3 V Version, VIN = 5.3 V

−1.0

1.0

2.0

3.0

4.0

2.65

5.30

7.95

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

VOUT (V)

VCE (V)

t (ms)

IOUT = 150 mA

IOUT = 1 mA

IOUT = 30 mA

Chip Enable

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TYPICAL CHARACTERISTICS

Figure 43. Start−up, 5.0 V Version, VIN = 7.0 V

−1.0

1.0

2.0

3.0

4.0

5.0

3.50

7.00

10.50

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

VOUT (V)

VCE (V)

t (ms)

IOUT = 150 mA

IOUT = 1 mA

IOUT = 30 mA

Chip Enable

Figure 44. Shutdown, 2.5 V Version, VIN = 4.5 V

−0.5

0.5

1.0

1.5

2.0

2.5

2.25

4.50

6.75

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

VOUT (V)

VCE (V)

t (ms)

IOUT = 1 mA

IOUT = 30 mA

IOUT = 150 mA

Chip Enable

Figure 45. Start−up, 12.0 V Version, VIN = 14.0 V

−3.0

3.0

6.0

9.0

12.0

VOUT (V)

VCE (V)

t (ms)

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

IOUT = 1 mA

IOUT = 30 mA

IOUT = 150 mA

Chip Enable

NCP4623

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TYPICAL CHARACTERISTICS

Figure 46. Shutdown, 3.3 V Version, VIN = 5.3 V

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

VOUT (V)

VCE (V)

t (ms)

IOUT = 1 mA

IOUT = 30 mA

IOUT = 150 mA

Chip Enable

−1.0

1.0

2.0

3.0

4.0

2.65

5.30

7.95

Figure 47. Shutdown, 5.0 V Version, VIN = 7.0 V

−1.0

1.0

2.0

3.0

4.0

5.0

3.5

7.0

10.5

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

VOUT (V)

VCE (V)

t (ms)

IOUT = 150 mA

IOUT = 30 mA

IOUT = 1 mA

Chip Enable

Figure 48. Shutdown, 12.0 V Version,

VIN = 14.0 V

−3.0

3.0

6.0

9.0

12.0

IOUT = 1 mA

IOUT = 30 mA

IOUT = 150 mA

Chip Enable

VOUT (V)

VCE (V)

t (ms)

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

NCP4623

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APPLICATION INFORMATION

A typical application circuits for NCP4623 series is

shown in Figure 49.

VIN VOUT

GND

C1 C2

100n 100n

VIN VOUT

NCP4623x

VIN VOUT

GND

C1 C2

100n 100n

VIN VOUT

NCP4623xADJ

ADJ

Figure 49. Typical Application Schematics

Input Decoupling Capacitor (C1)

A 0.1 mF ceramic input decoupling capacitor should be

connected as close as possible to the input and ground pin of

the NCP4623. Higher values and lower ESR improves line

transient response.

Output Decoupling Capacitor (C2)

Recommended values of the ceramic output decoupling

capacitor is in the range from 0.1 mF to 2.2 mF. Stable

operation of the regulator should be achieved within this

range. If a tantalum capacitor is used, and its ESR is high,

loop oscillation may result. The capacitors should be

connected as close as possible to the output and ground pins.

Larger values and lower ESR improves dynamic

parameters.

Output Voltage Setting (ADJ version)

The output voltage of the adjustable regulator may be set

for any output voltage from its voltage reference (2.5 V) up

to VIN voltage by an external voltage divider connected

between VOUT and GND pins with its center connected to

the ADJ pin. The voltage divider is loaded by current into

ADJ pin that is typically around 200 nA. This current may

cause an error in VOUT, therefore it is good to choose values

of voltage divider low enough to achieve cross current

around 2 mA to eliminate error. Output voltage can be

computed from the equation:

VOUT +2.5ǒ1)R1

R2Ǔ)R1 @IADJ (eq. 1)

Enable Operation

The enable pin CE may be used for turning the regulator

on and off. The IC is switched on when a high level voltage

is applied to the CE pin. Do not leave the CE pin

unconnected or between VCEH and VCEL voltage levels as

this may leave the output voltage unstable or cause indefinite

and unexpected currents flows internally.

Current Limit

This regulator includes a fold−back type current limit

circuit. This type of protection doesn’t limit output current

up to specified current capability in normal operation, but

when an over current occurs, output voltage and current

decrease until the over current condition ends. Typical

characteristics of this protection type can be observed in the

Output Voltage vs. Output Current graphs shown in the

typical characteristics section of this datasheet.

Thermal

As power across the IC increase, it might become

necessary to provide some thermal relief. The maximum

power dissipation supported by the device is dependent

upon board design and layout. Mounting pad configuration

on the PCB, the board material, and also the ambient

temperature affect the rate of temperature increase for the

part. When the device has good thermal conductivity

through the PCB the junction temperature will be relatively

low in high power dissipation applications.

The IC includes internal thermal shutdown circuit that

stops operation of regulator, if junction temperature is

higher than 150°C. After that, when junction temperature

decreases below 125°C, the operation of voltage regulator

will resume. During high power dissipation condition, the

regulator shuts down and resumes repeatedly protecting

itself from overheating.

PCB layout

Make the VIN and GND line as large as practical. If their

impedance is high, noise pickup or unstable operation may

result. Connect capacitors C1 and C2 as close as possible to

the IC, and make wiring as short as possible.

NCP4623

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ORDERING INFORMATION

Device

Nominal Output

Voltage Description Marking Package Shipping†

NCP4623HSNADJT1G Adjustable Enable high J24 SOT23−5

(Pb−Free)

3000 / Tape & Reel

NCP4623HSN050T1G 5.0 V Enable high J50 SOT23−5

(Pb−Free)

3000 / Tape & Reel

NCP4623HSN100T1G 10.0 V Enable high J00 SOT23−5

(Pb−Free)

3000 / Tape & Reel

NCP4623HSN120T1G 12.0 V Enable high J20 SOT23−5

(Pb−Free)

3000 / Tape & Reel

NCP4623HMXADJTCG Adjustable Enable high BQ24 XDFN1616−6

(Pb−Free)

5000 / Tape & Reel

NCP4623HMX033TCG 3.3 V Enable high BQ33 XDFN1616−6

(Pb−Free)

5000 / Tape & Reel

NCP4623HMX045TCG 4.5 V Enable high BQ45 XDFN1616−6

(Pb−Free)

5000 / Tape & Reel

NCP4623HMX048TCG 4.8 V Enable high BQ48 XDFN1616−6

(Pb−Free)

5000 / Tape & Reel

NCP4623HMX050TCG 5.0 V Enable high BQ50 XDFN1616−6

(Pb−Free)

5000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*To order other package and voltage variants, please contact your ON Semiconductor sales representative.

NCP4623

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PACKAGE DIMENSIONS

XDFN6 1.6x1.6, 0.5P

CASE 711AC−01

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

ÉÉÉ

BOTTOM VIEW

E33X

0.05 C

PIN ONE

REFERENCE

TOP VIEW

0.05 C

NOTE 3

AA1

0.05 C

CSEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A−−− 0.40

A1 0.00 0.05

E3 0.15 REF

b0.15 0.25

D1.60 BSC

D2 1.25 1.35

E1.60 BSC

E2 0.65 0.75

e0.50 BSC

L0.15 0.25

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MOUNTING FOOTPRINT*

1.70

0.77

0.50

0.38

6X 1.79

DIMENSIONS: MILLIMETERS

0.36

RECOMMENDED

L1 0.05 BSC

0.05 BC

PITCH

PACKAGE

OUTLINE

NCP4623

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PACKAGE DIMENSIONS

SOT−89, 5 LEAD

CASE 528AB−01

ISSUE O

MOUNTING FOOTPRINT*

RECOMMENDED

C0.10

TOP VIEW

SIDE VIEW

BOTTOM VIEW

DIM MIN MAX

MILLIMETERS

A1.40 1.60

b1 0.37 0.57

b0.32 0.52

c0.30 0.50

D4.40 4.60

D2 1.40 1.80

E2.40 2.60

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. LEAD THICKNESS INCLUDES LEAD FINISH.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS.

5. DIMENSIONS L, L2, L3, L4, L5, AND H ARE MEAS-

URED AT DATUM PLANE C.

e1.40 1.60

L1.10 1.50

H4.25 4.45

L2 0.80 1.20

L3 0.95 1.35

L4 0.65 1.05

L5 0.20 0.60

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

bb1 L2

0.62

DIMENSIONS: MILLIMETERS

2X 1.50

1.30

2.79 0.45 1.50

1.65

4.65

4X 0.57

1.75

NCP4623

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PACKAGE DIMENSIONS

SOT−23 5−LEAD

CASE 1212−01

ISSUE A

DIM MIN MAX

MILLIMETERS

A1 0.00 0.10

A2 1.00 1.30

b0.30 0.50

c0.10 0.25

D2.70 3.10

E2.50 3.10

E1 1.50 1.80

e0.95 BSC

L1 0.45 0.75

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSIONS: MILLIMETERS.

3. DATUM C IS THE SEATING PLANE.

0.10 C S

0.05

0.20 ---

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.95

DIMENSIONS: MILLIMETERS

PITCH

3.30

0.56

0.85

A--- 1.45

RECOMMENDED

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

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USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

NCP4623/D

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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

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