General Description
The MAX8556/MAX8557 low-dropout linear regulators
operate from input voltages as low as 1.425V and are
able to deliver up to 4A of continuous output current with a
typical dropout voltage of only 100mV. The output voltage
is adjustable from 0.5V to VIN - 0.2V.
Designed with an internal p-channel MOSFET pass tran-
sistor, the MAX8556/MAX8557 maintain a low 800μA typi-
cal supply current, independent of the load current and
dropout voltage. Using a p-channel MOSFET eliminates
the need for an additional external supply or a noisy inter-
nal charge pump. Other features include a logic-controlled
shutdown mode, built-in soft-start, short-circuit protection
with foldback current limit, and thermal-overload protec-
tion. The MAX8556 features a POK output that transitions
high when the regulator output is within ±10% of its nomi-
nal output voltage. The MAX8557 offers a power-on reset
output that transitions high 140ms after the output has
achieved 90% of its nominal output voltage.
The MAX8556/MAX8557 are available in a 16-pin TQFN
5mm x 5mm package with exposed paddle.
Applications
Benets and Features
●1.425V to 3.6V Input Voltage Range
●Guaranteed 4A Output Current
●±1% Output Accuracy Over Load/Line/Temperature
●100mV Dropout at 4A Load (typ)
●Built-In Soft-Start
● 800μA (typ) Operating Supply Current
● 150μA (max) Shutdown Supply Current
●Short-Circuit Current Foldback Protection
●Thermal-Overload Protection
●±10% Power-OK (MAX8556)
●140ms Power-On Reset Output (MAX8557)
●Fast Transient Response
●16-Pin TQFN (5mm x 5mm) Package
19-3257; Rev 3; 4/17
●Servers and Storage
Devices
●Networking
●Base Stations
●Optical Modules
●Point-of-Load Supplies
●ATE
Ordering Information appears at end of data sheet.
IN
EN
GND
OUT
FB
N.C.
POK
(POR)
VIN
1.425V TO 3.6V
VOUT
0.5V TO VIN - 0.2V
MAX8556
(MAX8557)
MAX8556/MAX8557 4A Ultra-Low-Input-Voltage
LDO Regulators
Typical Operating Circuit
EVALUATION KIT AVAILABLE
IN, EN, POK, POR to GND .....................................-0.3V to +4V
FB, OUT to GND ........................................-0.3V to (VIN + 0.3V)
Output Short-Circuit Duration .................................... Continuous
Continuous Power Dissipation (TA = +70°C)
16-Pin TQFN (derate 33.3mW/°C
above +70°C) (Note 1) ...........................................2666.7mW
Operating Temperature Range ........................... -40°C to +85°C
Junction Temperature ...................................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
(VEN = VIN = 1.8V, VOUT = 1.5V, IOUT = 2mA, TA = -40°C to +105°C (MAX8556ETE+) and TA = -40°C to +85°C (MAX8557ETE+),
typical values are at TA = +25°C, unless otherwise noted.) (Note 2)
Note 1: Maximum power dissipation is obtained using JEDEC JESD51-5 and JESD51-7 standards.
PARAMETER CONDITIONS MIN TYP MAX UNITS
IN
Input Voltage Range 1.425 3.600 V
Input Undervoltage Lockout VIN rising, 70mV hysteresis 1.30 1.35 1.40 V
VIN falling 1.23 1.28 1.33
OUT
Output Voltage Range 0.5 3.4 V
Load Regulation IOUT = 2mA to 4A 0.1 %/A
Line Regulation VIN = 1.425V to 3.6V, VOUT = 1.225V -0.15 0 +0.15 %/V
Dropout Voltage VIN = 1.425V, IOUT = 4A, VFB = 480mV 100 200 mV
Regulated Output-Voltage Current
Limit VIN = 3.6V, VOUT = 3V, VFB = 460mV 5 7 9 A
Load Capacitance ESR < 50mA (Note 3) 16 120 µF
FB
FB Threshold Accuracy
(Note 4)
VOUT = 1.225V to 3V, VIN = VOUT + 0.2V to 3.6V,
IOUT = 2mA to 4A 495 500 505 mV
FB Input Bias Current VFB = 0.5V, VIN = 3.6V 0.001 1 µA
PACKAGE TYPE: 16 TQFN
Package Code T1655+3
Outline Number 21-0140
Land Pattern Number 90-0072
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Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package Information
(VEN = VIN = 1.8V, VOUT = 1.5V, IOUT = 2mA, TA = -40°C to +105°C (MAX8556ETE+) and TA = -40°C to +85°C (MAX8557ETE+),
typical values are at TA = +25°C, unless otherwise noted.) (Note 2)
Note 2: Specifications to TA = -40°C are guaranteed by design and not production tested.
Note 3: Guaranteed by design, not production tested.
Note 4: Minimum supply voltage for output accuracy must be at least 1.425V.
PARAMETER CONDITIONS MIN TYP MAX UNITS
GND
GND Supply Current VIN = 1.425V to 3.6V, VOUT = 1.225V 800 1600 µA
Dropout, VIN = 3.6V, VFB = 480mV 1000 2000
GND Shutdown Current VIN = 3.6V, EN = GND 150 µA
POK
FB Power-OK Fault Threshold FB moving out of regulation,
VIN = 1.425V to 3.6V, 10mV hysteresis
FB high 540 550 560 mV
FB low 440 450 460
POK Output Voltage, Low VFB = 0.4V or 0.6V, IPOK = 2mA 25 200 mV
POK Output Current, High VPOK = 3.6V VFB = 0.5 0.001 1 µA
POK Delay Time From FB rising to POK high 25 50 100 µs
EN
Enable Input Threshold VIN = 1.425V to 3.6V EN rising 1.25 V
EN falling 0.4
Enable Input Bias Current VEN = 0V or 3.6V -1 +1 µA
THERMAL SHUTDOWN
Thermal-Shutdown Threshold Output on and off TJ rising +160 °C
TJ falling +115
POR
FB Power-On Reset Fault
Threshold FB falling, VIN = 1.425V to 3.6V, 10mV hysteresis 440 450 460 mV
POR Output Voltage, Low VFB = 0.4V, IPOR = 2mA 25 200 mV
POR Output Current, High VPOR = 3.6V, VFB = 0.5V 0.001 1 µA
POR Rising Delay Time FB rising to POR high impedance 100 140 200 ms
SOFT-START
Soft-Start Time 100 µs
MAX8556/MAX8557 4A Ultra-Low-Input-Voltage
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Electrical Characteristics (continued)
(VEN = VIN = +1.8V, VOUT = +1.5V, IOUT = 4A, COUT = 20μF, CIN = 20μF, and TA = +25°C, unless otherwise noted.)
GND CURRENT vs. TEMPERATURE
MAX8556 toc04
TEMPERATURE (°C)
GND CURRENT (µA)
603510-15
100
200
300
400
500
600
700
800
900
0
-40 85
ILOAD = 2A
ILOAD = 0A
DROPOUT VOLTAGE vs. LOAD CURRENT
MAX8556 toc05
LOAD CURRENT (A)
DROPOUT VOLTAGE (mV)
3.53.02.0 2.51.0 1.50.5
10
20
30
40
50
60
70
80
90
0
0 4.0
VIN = 1.5V
LINE-TRANSIENT RESPONSE
MAX8556 toc06
100µs/div
1.8V
10mV/div
2.5V
VIN
VOUT
(AC-COUPLED)
OUTPUT VOLTAGE vs. INPUT VOLTAGE
MAX8556 toc01
INPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
3.02.41.8
1.35
1.40
1.45
1.50
1.55
1.30
1.2 3.6
TA = -25°C
TA = -40°C
TA = -85°C
ILOAD = 2A
OUTPUT VOLTAGE vs. LOAD CURRENT
MAX8556 toc02
LOAD CURRENT (A)
OUTPUT VOLTAGE (V)
321
1.4980
1.4985
1.4990
1.4995
1.5000
1.5005
1.5010
1.5015
1.5020
1.5025
1.4975
0 4
TA = -40°C
TA = +85°C
TA = +25°C
GND CURRENT vs. INPUT VOLTAGE
MAX8556 toc03
INPUT VOLTAGE (V)
GND CURRENT (µA)
2.41.2
100
200
300
400
500
600
700
800
900
1000
0
0 3.6
ILOAD = 4A
ILOAD = 2A
ILOAD = 0A
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Typical Operating Characteristics
(VEN = VIN = +1.8V, VOUT = +1.5V, IOUT = 4A, COUT = 20μF, CIN = 20μF, and TA = +25°C, unless otherwise noted.)
4A LOAD-TRANSIENT RESPONSE
MAX8556 toc07
40µs/div
2A/div
50mV/div
VOUT
(AC-COUPLED)
IOUT
PSRR vs. FREQUENCY
MAX8556 toc11
FREQUENCY (kHz)
PSRR (dB)
10010
10
20
30
40
50
60
70
80
90
0
1 1000
VIN = 2.5V
ILOAD = 1A
2A LOAD-TRANSIENT RESPONSE
MAX8556 toc08
40µs/div
1A/div
50mV/div
VOUT
(AC-COUPLED)
IOUT
STARTUP WAVEFORMS
MAX8556 toc12
100µs/div
1V/div
2V/div
2A/div
VIN
IIN
VOUT
ENABLE WAVEFORMS
MAX8556 toc09
100µs/div
1V/div
2V/div
VEN
VOUT
SHORT-CIRCUIT WAVEFORMS
MAX8556 toc10
200µs/div
1V/div
5A/div
2V/div
VIN
3.6V
VOUT
IOUT
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Typical Operating Characteristics (continued)
(VEN = VIN = +1.8V, VOUT = +1.5V, IOUT = 4A, COUT = 20μF, CIN = 20μF, and TA = +25°C, unless otherwise noted.)
EXPOSED PADDLE TEMPERATURE
vs. AMBIENT TEMPERATURE
MAX8556 toc13
AMBIENT TEMPERATURE (°C)
EXPOSED PADDLE TEMPERATURE (°C)
68513417
10
20
30
40
50
60
70
80
90
100
0
0 85
DATA TAKEN USING
MAX8556 EVALUATION KIT
FB REGULATION vs. TEMPERATURE
MAX8556 toc14
TEMPERATURE (°C)
FB (V)
603510-15
0.495
0.500
0.505
0.510
0.490
-40 85
ILOAD = 50mA
FOLDBACK CURRENT-LIMIT WAVEFORMS
MAX8556 toc15
100µs/div
500mV/div
5A/div
VOUT
IOUT
CURRENT-LIMIT THRESHOLD
vs. TEMPERATURE
MAX8556 toc16
TEMPERATURE (°C)
CURRENT-LIMIT THRESHOLD (A)
603510-15
6.2
6.4
6.6
6.8
7.0
7.2
7.4
7.6
7.8
8.0
6.0
-40 85
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Typical Operating Characteristics (continued)
Pin Conguration
PIN NAME FUNCTION
1–6 IN LDO Input. Connect to a 1.425V to 3.6V input voltage. Bypass with a 22µF ceramic capacitor to GND.
7–11 OUT LDO Output. Bypass with 2 x 10µF ceramic capacitors to GND. A smaller capacitance can be used if
the maximum load current is less than 4A.
12
POK
(MAX8556)
Power-OK Output. Open-drain output that pulls low when VOUT is outside ±10% of the expected
regulation voltage or when EN is low. POK is high impedance when VOUT is within ±10% of the
nominal output voltage. Connect a resistor from POK to a logic supply of less than 3.6V.
POR
(MAX8557)
Power-On Reset. Open-drain output goes high impedance 140ms after the output is above 90% of
its nominal regulation voltage. POR pulls low immediately after an output fault or when EN is low.
Connect a resistor from POR to a logic supply of less than 3.6V.
13 FB Feedback Input. VFB is regulated to 0.5V. Connect to the center tap of a resistor-divider from output
to GND to set the desired output voltage.
14 GND Ground
15 N.C. Connect to GND or Leave Unconnected
16 EN Enable Input. Connect to GND or a logic low to shut down the device. Connect to IN or a logic high for
normal operation.
— EP Exposed Paddle. Connect to GND and to a ground plane for heatsinking.
12 11 10 9
5
6
7
EP
8
IN
IN
OUT
OUT
TOP VIEW
16
15
14
13
EN
+
N.C.
GND
FB
1 2 3 4
IN
IN
IN
IN
MAX8556
(MAX8557)
POK (POR)
OUT
OUT
OUT
16 TQFN
5mm x 5mm
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Pin Description
P
MAX8556
(MAX8557)
THERMAL-
OVERLOAD
PROTECTION
REF
SHUTDOWN
LOGIC
ERROR
AMP
CURRENT-
LIMIT
COMPARATOR
THRESHOLD
EN
GND
IN
0.50V
OUT
FB
POK
(POR)
0.45V
0.55V
UNDERVOLTAGE
LOCKOUT
POK (POR)
CIRCUITRY N
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Block Diagram
Detailed Description
The MAX8556/MAX8557 low-dropout linear regulators
are capable of delivering up to 4A from low-input voltage
supplies ranging from 1.425V to 3.6V with only 200mV
of dropout (max). The pMOS output stage can be driven
from input voltages down to 1.425V without sacrificing
stability or transient performance. Supply current is not
a significant function of load or input headroom because
this regulator has a pMOS output device.
The MAX8556/MAX8557 are fully protected from an out-
put short circuit by current-limiting and thermal-overload
circuitry. The low-power shutdown mode reduces supply
current to 0.2μA (typ) to maximize battery life in por-
table applications. The MAX8556 includes an open-drain
power-OK signal (POK) that goes high when the regulator
output is within ±10% of its nominal output voltage. The
MAX8557 includes an open-drain power-on-reset output
(POR) that goes high 140ms after the output has risen
above 90% of its nominal value.
Internal p-Channel Pass Transistor
The MAX8556/MAX8557 feature a 25mΩ p-channel
MOSFET pass transistor. Unlike similar designs using pnp
pass transistors, p-channel MOSFETs require no base
drive, which reduces quiescent current; pnp-based regu-
lators also waste considerable current in dropout when
the pass transistor saturates, and use high base-drive
currents under large loads. The MAX8556/MAX8557 do
not suffer from these problems and consume only 800μA
(typ) of quiescent current under heavy loads, as well as
in dropout.
Short-Circuit/Thermal Fault Protection
The MAX8556/MAX8557 are fully protected from output
short circuits through current-limiting and thermal-over-
load circuitry. When the output is shorted to ground, the
output current is foldback limited to 3A (max). Under these
conditions, the device quickly heats up. When the junc-
tion temperature reaches +160°C, the thermal-overload
circuitry turns off the output, allowing the device to cool.
When the junction cools to +115°C, the output turns back
on and attempts to establish regulation. Current limiting
and thermal protection continue until the fault is removed.
Shutdown Mode
The MAX8556/MAX8557 feature a low-power shutdown
mode that reduces quiescent current to 0.2μA (typ). Drive
EN low to disable the voltage reference, error amplifier,
gate-drive circuitry, and pass transistor, and pull the out-
put low with 5kΩ impedance. Drive EN high or connect to
IN for normal operation.
Power-OK Output (POK, MAX8556 Only)
The MAX8556 features a power-OK (POK) output to
indicate the status of the output. POK is high impedance
when the regulator output is within ±10% of its nominal
output voltage. If the output voltage falls/rises outside
this range or the IC experiences thermal fault, POK is
internally pulled low. This open-drain output requires an
external pullup resistor to VIN or another logic supply
below 3.6V. For glitch immunity, an internal delay circuit
prevents the output from switching for 50μs (typ) after the
trip threshold is initially reached. POK is low when the IC
is in shutdown mode.
Power-On Reset (POR, MAX8557 Only)
The MAX8557 features a power-on reset output that goes
high impedance 140ms (typ) after the output reaches
90% of its nominal value. This open-drain output requires
an external pullup resistor to VIN or another logic supply
less than 3.6V. When the output falls below 90% of the
nominal output voltage or the IC experiences a thermal
fault, POR immediately transitions low. POR is low when
the IC is in shutdown mode.
Operating Region and Power Dissipation
The maximum power dissipation depends on the ther-
mal resistance of the IC package and the circuit board,
the temperature difference between the die junction and
ambient air, and the rate of ambient airflow. The power
dissipated by the IC is P = IOUT x (VIN - VOUT). Proper
PCB layout can increase the allowed power dissipation
by dissipating heat in the board instead of the package.
See the Thermal Considerations in PCB Layout section
for more details.
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Applications Information
Output Voltage Selection
The MAX8556/MAX8557 feature an adjustable output
voltage from 0.5V to 3.4V. Set the output voltage using an
external resistor-divider from the output to GND with FB
connected to the center tap as shown in Figures 1 and 2.
Choose R3 ≤ 1kΩ for light-load stability. Determine R2
using the following equation:
OUT
FB
V
R2 R3 x 1
V
= −
where VOUT is the desired output voltage and VFB is 0.5V.
Capacitor Selection and
Regulator Stability
Capacitors are required at the MAX8556/MAX8557 inputs
and outputs for stable operation over the full temperature
range and with load currents up to 4A. Connect 2 x 10μF
capacitors between IN and GND and 2 x 10μF low equiva-
lent-series-resistance (ESR) capacitors between OUT and
GND. The input capacitor (CIN) lowers the source imped-
ance of the input supply. If the MAX8556/MAX8557s’ input
is close to the output of the source supply, a smaller input
capacitance can be used. Otherwise, 2 x 10μF ceramic
input capacitors are recommended. The output capacitor’s
(COUT) ESR affects output noise and can affect output
stability. Use output capacitors with an ESR of 0.05Ω or
less to ensure stability and optimum transient dropout.
For good output transient performance, use the following
formula to select a minimum output capacitance:
COUT = IOUT(MAX) x 1μF/200mA
Noise, PSRR, and Transient Response
The MAX8556/MAX8557 are designed to operate with
low-dropout voltages and low quiescent currents while still
maintaining low noise, good transient response, and high
AC rejection (see the Typical Operating Characteristics
for a plot of Power-Supply Rejection Ratio (PSRR) vs.
Frequency). When operating from noisy sources, improved
supply-noise rejection and transient response can be
achieved by increasing the values of the input and output
bypass capacitors and through passive filtering tech-
niques. The MAX8556/MAX8557 load-transient response
graphs (see the Typical Operating Characteristics) show
two components of the output response: a DC shift from
the output impedance due to the load current change,
and the transient response. A typical transient overshoot
for a step change in the load current from 40mA to 4A is
40mV. Use an output capacitance from 20μF to 120μF to
attenuate the overshoot.
Figure 1. MAX8556 Typical Application Circuit
Figure 2. MAX8557 Typical Application Circuit
IN 7–11
13
14
15
POK
POK
GND
SHUTDOWN
OUT
FB
1–6
12
R1
100kΩ
R2
1.4kΩ
R3
1kΩ
C1
2 x 10µF
C2
2 x 10µF
18
N.C.
U1
EN
ENABLED
VIN
1.425V TO 3.6V
VOUT
1.2V AT 4A
MAX8556
IN 7–11
13
14
15
POR
POR
GND
SHUTDOWN
OUT
FB
1–6
12
R1
100kΩ
R2
2kΩ
R3
1kΩ
C1
2 x 10µF
C2
2 x 10µF
18
N.C.
U2
EN
ENABLED
VIN
1.7V TO 3.6V
VOUT
1.5V AT 4A
MAX8557
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Thermal Considerations in PCB Layout
How much power the package can dissipate strongly
depends on the mounting method of the IC to the PCB
and the copper area for cooling. Using the JEDEC test
standard, the maximum power dissipation allowed in
the package is 2667mW. This data is obtained with
+70°C ambient temperature and +150°C maximum
junction temperature. The test board has dimensions
of 7.62cm x 7.62cm (3in x 3in) with four layers of 2oz
copper and FR-4 material with 62mil finished thickness.
Nine thermal vias are used under the thermal paddle with
a diameter of 12mil and 1mil plated copper thickness.
Top and bottom layers are used to route the traces. Two
middle layers are solid copper and isolated from the nine
thermal vias.
More power dissipation can be handled by the package if
great attention is given during PCB layout. For example,
using the top and bottom copper as a heatsink and con-
necting the thermal vias to one of the middle layers (GND)
transfers the heat from the package into the board more
efficiently, resulting in lower junction temperature at high
power dissipation in some MAX8556/MAX8557 applica-
tions. Furthermore, the solder mask around the IC area
on both top and bottom layers can be removed to radi-
ate the heat directly into the air. The maximum allowable
power dissipation in the IC is as follows:
)
J(MAX) A
MAX
JC CA
(T T
P
−
=θ +θ
where:
TJ(MAX) = the maximum junction temperature (+150°C)
TA = the ambient air temperature
θJC = the thermal resistance from the junction to the case
(1.7°C/W for the 16-pin TQFN)
θCA = the thermal resistance from the case to the sur-
rounding air through the PCB, copper traces, and the
package materials. θCA is directly related to system level
variables and can be modified to increase the maximum
power dissipation.
The TQFN package has an exposed thermal pad on its
underside. This pad provides a low thermal resistance
path for heat transfer into the PCB. This low thermally
resistive path carries a majority of the heat away from the
IC. The PCB is effectively a heatsink for the IC.
The exposed paddle should be connected to a large
ground plane for proper thermal and electrical perfor-
mance. The minimum size of the ground plane is depen-
dent upon many system variables. To create an efficient
path, the exposed paddle should be soldered to a thermal
landing, which is connected to the ground plane by ther-
mal vias. The thermal landing should be at least as large
as the exposed paddle and can be made larger depend-
ing on the amount of free space from the exposed paddle
to the other pin landings.
A sample layout is available on the MAX8556 evaluation
kit to speed designs.
+Denotes a lead(Pb)-free/RoHS-compliant package.
/V Denotes an automotive qualified part.
*EP = Exposed pad.
PART TEMP RANGE PIN-
PACKAGE FEATURE
MAX8556ETE+ -40°C to +105°C 16 TQFN-EP* POK
MAX8556ETE/V+ -40°C to +85°C 16 TQFN-EP* POK
MAX8557ETE+ -40°C to +85°C 16 TQFN-EP* POR
Ordering Information
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Chip Information
TRANSISTOR COUNT: 3137
PROCESS: BiCMOS
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 4/04 Initial release —
1 8/08 Revised Pin Conguration 1
2 8/09 Added automotive version of the MAX8556 1
3 4/17
Updated MAX8556ETE+ operating temperature range in Electrical
Characteristics and Ordering Information tables. Updated Package
Information table.
1 –3, 11
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
MAX8556/MAX8557 4A Ultra-Low-Input-Voltage
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Revision History
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
