Semiconductor Components Industries, LLC, 2005
April, 2005 − Rev. 4 1Publication Order Number:
RB521S30T1/D
RB521S30T1
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
•Extremely Fast Switching Speed
•Extremely Low Forward Voltage 0.5 V (max) @ IF = 200 mA
•Low Reverse Current
MAXIMUM RATINGS
Rating Symbol Value Unit
Reverse Voltage VR30 Vdc
Forward Current DC IF200 mA
Peak Forward Surge Current (Note 1) IFSM 1.0 A
ESD Rating: Class 1C per Human Body Model
ESD Rating: Class C per Machine Model
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR−5 Board,
(Note 2) TA = 25°C
Derate above 25°C
PD200
1.57
mW
mW/°C
Thermal Resistance, Junction− to−Ambient RJA 635 °C/W
Junction and Storage
Temperature Range TJ, Tstg −55 to +125 °C
1. 60 Hz for 1 cycle.
2. FR−5 Minimum Pad.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Reverse Leakage
(VR = 10 V) IR− − 30.0 A
Forward Voltage
(IF = 200 mA) VF− − 0.50 Vdc
30 V SCHOTTKY
BARRIER DIODE
Device Package Shipping†
ORDERING INFORMATION
RB521S30T1 SOD−523 4 mm Pitch
3000/Tape & Reel
1
CATHODE
2
ANODE
RB521S30T5 SOD−523 2 mm Pitch
8000/Tape & Reel
http://onsemi.com
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
SOD−523
CASE 502
PLASTIC
5M = Specific Device Code
d = Date Code
MARKING
DIAGRAM
1
2
5Md
12
RB521S30T1
http://onsemi.com
2
100
0
VR, REVERSE VOLTAGE (VOLTS)
10
1
100n
1n 510152025
20
0
VR, REVERSE VOLTAGE (VOLTS)
12
4
2
051015 30
TA = 125°C
TA = −25°C
1m
10m
30
2520
6
8
10
IR, REVERSE CURRENT (A)
CT, TOATAL CAPACITANCE (pF)
0 0.1 0.2 0.3 0.4 0.5 0.6
1µ
10µ
100µ
1m
10m
100m
1
Figure 1. Forward Characteristics
VF, FORWARD VOLTAGE (V)
IF, FORWARD CURRENT (A)
TA = 125°C
TA = 75°C
TA = 25°C
TA = 75°C
TA = 25°C
TA = −25°C
Figure 2. Reverse Characteristics
Figure 3. Total Capacitance
10n
14
16
18
RB521S30T1
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3
PACKAGE DIMENSIONS
SOD−523
CASE 502−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
−T−
SEATING
PLANE
B
A−X−
−Y−
D2 PL
T
M
0.08 (0.003) X Y
C
S
JK
DIM MIN NOM MAX
MILLIMETERS
A1.10 1.20 1.30
B0.70 0.80 0.90
C0.50 0.60 0.70
D0.25 0.30 0.35
J0.07 0.14 0.20
K0.15 0.20 0.25
S1.50 1.60 1.70
0.043 0.047 0.051
0.028 0.032 0.035
0.020 0.024 0.028
0.010 0.012 0.014
0.0028 0.0055 0.0079
0.006 0.008 0.010
0.059 0.063 0.067
MIN NOM MAX
INCHES
12
0.40
0.0157
0.40
0.0157
1.40
0.0547
mm
inches
SCALE 10:1
SOLDERING FOOTPRINT
RB521S30T1
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4
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Phone: 81−3−5773−3850
RB521S30T1/D
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