Approval sheet High Q / Low ESR Series (HH) MULTILAYER CERAMIC CAPACITORS High Q / Low ESR Series (HH) 0402, 0603 & 0805 Sizes NP0 Dielectric RoHS Compliance *Contents in this sheet are subject to change without prior notice. Page 1 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012 Approval sheet High Q / Low ESR Series (HH) 1. INTRODUCTION MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. WTC HH series MLCC is used at high frequencies generally have a small temperature coefficient of capacitance, typical within the 30ppm/C required for NP0 (C0G) classification and have excellent conductivity internal electrode. Thus, WTC HH series MLCC will be with the feature of low ESR and high Q characteristics. 2. FEATURES 3. APPLICATIONS a. b. a. b. c. High Q and low ESR performance at high frequency. Quality improvement of telephone calls for low power loss and better performance. Mobile telecommunication: Mobile phone, WLAN. RF module: Power amplifier, VCO. Tuners. 4. HOW TO ORDER HH 15 N 100 G 500 C T Series Size Dielectric Capacitance Tolerance Rated voltage Termination Packaging HH=High Q/ Low ESR 15=0402 (1005) 18=0603 (1608) 21=0805 (2012) N=NP0 (C0G) Two significant digits followed by no. of zeros. And R is in place of decimal point. eg.: R47=0.47pF 0R5=0.5pF 1R0=1.0pF 100=10x100 =10pF Page 2 of 11 B=0.1pF C=0.25pF D=0.5pF F=1% G=2% J=5% Two significant L=Ag/Ni/Sn digits followed by C=Cu/Ni/Sn no. of zeros. And R is in place of decimal point. T=7" reeled G=13" reeled 160=16 VDC 250=25 VDC 500=50 VDC 101=100 VDC 201=200 VDC 251=250 VDC 501=500 VDC 631=630 VDC ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012 Approval sheet High Q / Low ESR Series (HH) 5. EXTERNAL DIMENSIONS Size Inch (mm) L (mm) W (mm) 0402 (1005) 1.000.05 0.500.05 0.500.05 N 1.600.10 0.800.10 0.800.07 S 1.60 +0.15/-0.10 0.80 +0.15/-0.10 0.80 +0.15/-0.10 X 0.600.10 A 0.800.10 B 1.250.10 D 0603 (1608) 0805 (2012) 2.000.15 1.250.10 T (mm)/Symbol Remark MB (mm) # 0.25 +0.05/-0.10 L T W 0.400.15 MB MB Fig. 1 The outline of MLCC 0.500.20 # # Reflow soldering only is recommended. 6. GENERAL ELECTRICAL DATA Dielectric NP0 Size 0402, 0603, 0805 Capacitance* 0402: 0.5pF to 470pF** 0603: 0.5pF to 3300pF 0805: 0.5pF to 390pF Capacitance tolerance Cap5pF: B (0.1pF), C (0.25pF) 5pF<Cap<10pF: C (0.25pF), D (0.5pF) Cap10pF: F (1%), G (2%), J (5%) Rated voltage (WVDC) 16V, 25V, 50V, 100V, 200V, 250V, 500V, 630V Q* Cap<30pF: Q400+20C Cap30pF: Q1000 Insulation resistance at Ur 10G or RxC100-F whichever is smaller. Operating temperature -55 to +125C Capacitance change 30ppm Termination Ni/Sn (lead-free termination) * Measured at the conditions of 25C ambient temper ature and 30~70% related humidity. Apply 1.00.2Vrms, 1.0MHz10% for Cap1000pF and 1.00.2Vrms, 1.0kHz10% for Cap>1000pF. ** 0402, Capacitance <0.5pF: On request. Page 3 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012 Approval sheet High Q / Low ESR Series (HH) Capacitance 7. CAPACITANCE RANGE DIELECTRIC SIZE Rated Voltage 0.5pF (0R5) 0.6pF (0R6) 0.7pF (0R7) 0.8pF (0R8) 0.9pF (0R9) 1.0pF (1R0) 1.2pF (1R2) 1.5pF (1R5) 1.8pF (1R8) 2.2pF (2R2) 2.7pF (2R7) 3.3pF (3R3) 3.9pF (3R9) 4.7pF (4R7) 5.6pF (5R6) 6.8pF (6R8) 8.2pF (8R2) 10pF (100) 12pF (120) 15pF (150) 18pF (180) 22pF (220) 27pF (270) 33pF (330) 39pF (390) 47pF (470) 56pF (560) 68pF (680) 82pF (820) 100pF (101) 120pF (121) 150pF (151) 180pF (181) 220pF (221) 270pF (271) 330pF (331) 390pF (391) 470pF (471) 560pF (561) 680pF (681) 820pF (821) 1,000pF (102) 1,200pF (122) 1,500pF (152) 1,800pF (182) 2,200pF (222) 2,700pF (272) 3,300pF (332) NP0 16 N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N N N N N N N N N N N N N N N N N N N N N 0402 25 N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N N N N N N N N N N N N N N N N N N N N N 0603 50 N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N N N N N N N N N N N N N N N N N N N N N 16 S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S S S S S S S S S S S S S S S S S S S S S S S S S X X X X X X 25 S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S S S S S S S S S S S S S S S S S S S S S S S S S X X X X X X 50 S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S S S S S S S S S S S S S S S S S S S S S S S S S X X X X X X 100 S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S S S S S S S S S S S S S S S S S S S S S S S S S 50 B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B D D 100 B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B D D 0805 200 250 B B B B B B B B B B B B B B B B B B B B B B B B B D D D D D D D B B B B B B B B B B B B B B B B B B B B B B B B B D D D D D D D 500 630 B B B B B B B B B B B B B B B B B B B B B B B B B D D D D D D D B B B B B B B B B B B B B B B B B B B B B B B B B D D D D D D D 1. The letter in cell is expressed the symbol of product thickness. 2. The letter in cell with "^" mark is expressed product with Ag/Ni/Sn terminations. 3. 0402, Capacitance <0.5pF: On request. 4. For more information about products with special capacitance or other data, please contact WTC local representative. Page 4 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012 Approval sheet High Q / Low ESR Series (HH) 8. PACKAGING DIMENSION AND QUANTITY Size Paper tape Thickness (mm)/Symbol 0402 0603 0.500.05 N 0.800.07 S 0.80 +0.15/-0.10 X 0805 0.600.10 A 0.800.10 B 1.250.10 D Plastic tape 7" reel 13" reel 10K 50K 4K 15K 4k 15k 7" reel 3k 13" reel 10k Unit: pieces 9. ELECTRICAL CHARACTERISTICS Q factor specification vs. Specific frequency Q value criteria vs. Specific frequency HH series, 0402 10000 1GHz 100MHz 500MHz Q 1000 100 10 Minimum (Solid line) Typical (Broken line) 1 0.1 1 10 100 Capacitance (pF) Fig. 2 Q factor specification vs. Specific frequency for 0402 Q factor specification vs. Specific frequency Q value criteria vs. Specific frequency HH series, 0603 10000 1GHz 100MHz 500MHz Q 1000 100 10 Minimum (Solid line) Typical (Broken line) 1 0.1 1 10 100 Capacitance (pF) Fig. 3 Q factor specification vs. Specific frequency for 0603 Page 5 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012 Approval sheet High Q / Low ESR Series (HH) Typical ESR vs. Frequency 0402 "HH" Series 0603 "HH" Series 10 10 100pF 100pF 1 1 1.0pF ESR (ohm) ESR (ohm) 1.0pF 4.7pF 10pF 0.1 4.7pF 10pF 0.1 0.01 100 1,000 0.01 100 10,000 1,000 Frequency (MHz) 10,000 Frequency (MHz) Fig. 4 ESR vs. Frequency 0402 Fig. 5 ESR vs. Frequency 0603 Typical Impedance vs. Frequency 0603 "HH" Series 100000 10000 10000 1000 1000 100 1.0pF |Z| (ohm) |Z| (ohm) 0402 "H H" Series 100000 1.0pF 100 4.7pF 4.7pF 10 10 10pF 10pF 1 1 100pF 100pF 0.1 0.1 10 100 1,000 10,000 10 100 1,000 10,000 Frequency (MHz) Frequency (MH z) Fig. 6 Impedance vs. Frequency 0402 Fig. 7 Impedance vs. Frequency 0603 SRF vs. Capacitance Series Reasonant Frequency (MHz) 10000 0402 0603 1000 100 1 10 Capacitance (pF) 100 Fig. 8 SRF vs. Capacitance Page 6 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012 Approval sheet High Q / Low ESR Series (HH) 10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS No. 1. Item Visual and Test Conditions --- * No remarkable defect. Mechanical 2. 3. Requirements * Dimensions to conform to individual specification sheet. Capacitance Cap1000pF, 1.00.2Vrms, 1MHz10% * Shall not exceed the limits given in the detailed spec. Q/ D.F. Cap>1000pF, 1.00.2Vrms, 1KHz10% * NP0: Cap30pF, Q1000; Cap<30pF, Q400+20C (Dissipation At 25C ambient temperature. Factor) 4. Dielectric * To apply voltage: ( 100V ) 250% of rated voltage. Strength * Duration: 1 to 5 sec. * No evidence of damage or flash over during test. * Charge and discharge current less than 50mA. * To apply voltage: 200V~300V 2 times VDC 500V~999V 1.5 times VDC * Cut-off, set at 10mA * TEST= 15 sec. * RAMP=0 5. 10G Insulation Rated voltage:<200V Resistance To apply rated voltage for max. 120 sec. Rated voltage:200~630V 10G or RxC100-F whichever is smaller To apply rated voltage (500V max.) for 60 sec. 6. 7. Temperature With no electrical load. Coefficient Operating temperature: -55~125C at 25C Adhesive * Pressurizing force Strength of 8. * Capacitance change: within 30ppm/C * No remarkable damage or removal of the terminations. 5N (0603) and 10N (>0603) Termination * Test time: 101 sec. Vibration * Vibration frequency: 10~55 Hz/min. * No remarkable damage. Resistance * Total amplitude: 1.5mm * Cap change and Q/D.F.: To meet initial spec. * Test time: 6 hrs. (Two hrs each in three mutually perpendicular directions.) * Measurement to be made after keeping at room temp. for 242 hrs. 9. Solderability * Solder temperature: 2355C 95% min. coverage of all metalized area. * Dipping time: 20.5 sec. 10. Bending Test * The middle part of substrate shall be pressurized by means * No remarkable damage. of the pressurizing rod at a rate of about 1 mm per second until * Cap change: within 5.0% or 0.5pF whichever is larger. the deflection becomes 1 mm and then the pressure shall be (This capacitance change means the change of capacitance under maintained for 51 sec. specified flexure of substrate from the capacitance measured before * Measurement to be made after keeping at room temp. for the test.) 242 hrs. 11. Resistance to * Solder temperature: 2605C Soldering Heat * Dipping time: 101 sec * No remarkable damage. * Cap change: within 2.5% or 0.25pF whichever is larger. * Preheating: 120 to 150C for 1 minute before imme rse the * Q/D.F., I.R. and dielectric strength: To meet initial requirements. capacitor in a eutectic solder. * 25% max. leaching on each edge. * Before initial measurement (Class II only): Perform 150+0/-10C for 1 hr and then set for 242 hrs at r oom temp. * Measurement to be made after keeping at room temp. for 242 hrs. Page 7 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012 Approval sheet High Q / Low ESR Series (HH) No. 12. Item Temperature Cycle Test Condition Requirements * Conduct the five cycles according to the temperatures and time. Step Temp. (C) Time (min.) 1 Min. operating temp. +0/-3 2 Room temp. 2~3 3 Max. operating temp. +3/-0 303 4 Room temp. 2~3 * No remarkable damage. * Cap changewithin 2.5 or 0.25pF whichever is larger. * Q/D.F., I.R. and dielectric strength: To meet initial requirements. 303 * Before initial measurement (Class II only): Perform 150+0/-10C for 1 hr and then set for 242 hrs at r oom temp. * Measurement to be made after keeping at room temp. for 242 hrs. 13. Humidity * Test temp.: 402C (Damp Heat) * Humidity: 90~95% RH Steady State * Test time: 500+24/-0hrs. *Before initial measurement (Class II only): Perform 150+0/-10C for 1 hr and then set for 242 hrs at r oom temp. * Measurement to be made after keeping at room temp. for 242 hrs. 14. * No remarkable damage. * Cap change: within 5.0% or 0.5pF whichever is larger. * Q/D.F. value: NP0: Cap30pF, Q350; 10pFCap<30pF, Q275+2.5C Cap<10pF; Q200+10C * I.R.: 1Gor RxC50-F whichever is smaller. Humidity * Test temp.: 402C * No remarkable damage. (Damp Heat) * Humidity: 90~95%RH * Cap change: within 7.5% or 0.75pF whichever is larger. Load * Test time: 500+24/-0 hrs. * Q/D.F. value: * To apply voltagerated voltage (Max. 500V) * Before initial measurement (Class II only): To apply test NP0: Cap30pF, Q200; Cap<30pF, Q100+10/3C * I.R.: 500M or RxC25-F whichever is smaller. voltage for 1hr at 40C and then set for 242 hrs a t room temp. * Measurement to be made after keeping at room temp. for 242 hrs. 15. High Temperature * Test temp.: * No remarkable damage. NP0: 1253C * Cap change: within 3.0% or 0.3pF whichever is larger. Load * To apply voltage: (Endurance) (1) <500V: 200% of rated voltage. * Q/D.F. value: (2) 500V: 150% of rated voltage. (3) 630V: 120% of rated voltage. * Test time: 1000+24/-0 hrs. NP0: Cap30pF, Q350 10pFCap<30pF, Q275+2.5C Cap<10pF, Q200+10C * I.R.: 1G or RxC50-F whichever is smaller. *Before initial measurement (Class II only): To apply test voltage for 1hr at test temp. and then set for 242 hrs at room temp. *Measurement to be made after keeping at room temp. for 242 hrs Page 8 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012 Approval sheet High Q / Low ESR Series (HH) APPENDIXES Tape & reel dimensions Fig. 9 The dimension of paper tape Fig. 10 The dimension of plastic tape Size Thickness A0 B0 T K0 W P0 10xP0 P1 P2 D0 D1 E F 0402 N 0.620.05 1.120.05 0.600.05 8.000.10 4.000.10 40.00.10 2.000.05 2.000.05 1.550.05 1.750.05 3.500.05 0603 S, X 1.020.05 1.800.05 0.950.05 8.000.10 4.000.10 40.00.10 4.000.10 2.000.05 1.550.05 1.750.05 3.500.05 Size Reel size C W1 A N A 1.500.10 2.300.10 0.750.05 8.000.10 4.000.10 40.00.10 4.000.10 2.000.05 1.550.05 1.750.05 3.500.05 0805 B 1.500.10 2.300.10 0.950.05 8.000.10 4.000.10 40.00.10 4.000.10 2.000.05 1.550.05 1.750.05 3.500.05 C, D, I <1.57 <2.40 0.230.05 <2.50 8.000.10 4.000.10 40.00.10 4.000.10 2.000.05 1.500.05 1.000.10 1.750.10 3.500.05 7" 13.0+0.5/-0.2 8.4+1.5/-0 178.00.10 60.0+1.0/-0 0402, 0603, 0805 10" 13.0+0.5/-0.2 8.4+1.5/-0 250.01.0 100.01.0 13" 13.0+0.5/-0.2 8.4+1.5/-0 330.01.0 1001.0 Fig. 11 The dimension of reel Page 9 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012 Approval sheet High Q / Low ESR Series (HH) Description of customer label a. Customer name b. WTC order series and item number c. Customer P/O d. Customer P/N e. Description of product f. Quantity g. Bar code including quantity & WTC P/N or customer h. WTC P/N i. Shipping date j. Order bar code including series and item numbers k. Serial number of label Constructions No. Name 1 Ceramic material 2 Inner electrode 3 4 NP0* CaZrO3 / BaTiO3 based AgPd alloy Ni Ag Cu Inner layer Termination 5 NP0 Middle layer Ni Outer layer Sn Fig. 12 The construction of MLCC * Partial NP0 items are with Ag/Ni/Sn(NME) terminations, please ref to product range for detail. Storage and handling conditions (1) To store products at 5 to 40C ambient temperature and 20 to 70%. related humidity conditions. (2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life extension is needed. Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability. Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.) b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low reliability. c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture. . Page 10 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012 Approval sheet High Q / Low ESR Series (HH) Recommended soldering conditions The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N2 within oven are recommended. 4 / sec max Over 60sec at least by natural cooling Fig. 13 Recommended reflow soldering profile for SMT process with SnAgCu series solder paste. Page 11 of 11 Fig. 14 Recommended wave soldering profile for SMT process with SnAgCu series solder. ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012