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Semiconductor
/
Edition 05.99
This edition was realized using the software system FrameMaker.
Published by Siemens AG,
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© Siemens AG 6/2/99.
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C541U Data Sheet
Revision History : 05.99
Previous R eleases : 10.97(O riginal Version)
Page
(10.97
version)
Page
(05.99
version)
Subjec ts (c hanges since las t rev isio n)
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38
39 to 40
43
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44
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46
59
61
63
All sections
All sections
1
2
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2
4
5
5 to 8
20
22
24
31
37
38 to 39
42
42
42
42
43
43
43
43
44
44
45
58
60
61
All refere nc es to C540U is remov ed.
VCC is changed t o VDD.
Compliant to USB Spec if ica ti on “R ev 1. 0”.
Power supply voltage range changed to 4.25V to 5.5V.
Line “* P-S DIP-52 packa ge . ..” is added.
Table 1 is removed and rep lac ed by “Ordering I nf orm ation”.
Figure 3; pin 2 is changed to ECAP.
Figure 4 is rem ov ed.
Table 1; column P-SDIP-52 is deleted and any references to P-SDIP-52 is also
removed, the definiti on of pin 2 is ch anged to ECAP .
Table 3; m odif ied with addition of bit DRVI in GEPI R register.
Table 4; m odif ied with addition of bits DRVIE and XVREG in DPWD R register.
First sent enc e; ref erence to P-SDI P-52 is removed.
Figure 16 is m odified to include DRVI and DRVIE .
Figure 22 is rem oved.
Table 8; co lum n P-SDIP-52 is rem oved.
“Absolute Maximum Ratings” is changed to tabular form.
Fifth line; “D uring overload c onditions ...” ch anged to “During abs olute
maximum rating conditons ...”.
“Operating Conditions” is added.
VDD is changed t o 4. 25V to 5.5V (5V + 10%, -15%)
VCC = 5 V + 10% ... “ is repla c ed by “(Operating C onditions app ly) ”.
VIH min of EA is changed to 0.6 VDD.
VOL max of Port 0 is changed to 0.6 V.
IIL max is changed to -60 µA .
Values for IDD (active and idle mode) and IPD
No tes (6); mo dified.
VCC = 5 V + 10% ... “ is repla c ed by “(Operating C onditions app ly) ”.
VCC = 5 V + 10% ... “ is repla c ed by “(Operating C onditions app ly) ”.
Figure 37 is ad ded.
Figure 40 is rem oved.
Semiconductor Group 1
C541U
8-Bit CMOS Microcontroller
Advance Information
C541U
Enhanced 8-bit C500 CPU
Full software/toolset compatible to standard 80C51/80C52 microcontrollers
12 MHz external operating frequency
500 ns instruction cycle
Built-in PLL for USB synchronization
On-chip OTP program memory
8K byte
Alternatively up to 64K byte external program memory
Optional memory protection
On-chip USB module
Compliant to USB specification Rev1.0
Full speed or low speed operation
Five endpoints : one bidirectional control endpoint
four versatile programmable endpoints
Registers are located in special function register area
On-chip USB transceiver
Figure 1
C541U Functional Units
SSC T0
T1
CPU
Port 0
Port 1
Port 2
Port 3
I/O
I/O
OTP Prog. Memory
Watchdog
I/O
I/O
On-Chip Emulation Support Module
Module
RAM
256 × 8
Timer
Oscillator
Watchdog
Power
Saving
Modes
USB Trans c eiv er
D+ D-
USB
8k×8
Semiconductor Group 2
C541U
Features (continued) :
Up to 64K byte external data memory
256 byte on-chip RAM
Four parallel I/O ports
P-LCC-44 package : three 8-bit ports and one 6-bit port
P-SDIP-52* package : four 8-bit ports
LED current drive capability for 3 pins (10 mA)
Two 16-bit timer/counters (C501 compatible)
SSC synchronous serial interface (SPI compatible)
Master and slave capable
Programmable clock polarity / clock-edge to data phase relation
LSB/MSB first selectable
1.5 MBaud transfer rate at 12 MHz operating frequency
7 interrupt sources (2 external, 5 internal with 2 USB interrupts) selectable at 2 priority levels
Enhanced fail safe mechanisms
Programmable watchdog timer
Oscillato r watchdog
Power saving modes
idle mode
software power down mode with wake-up capability through INT0 pin or USB
On-chip emulation support logic (Enhanced Hooks Technology TM)
P-LCC-44 and P-SDIP-52* packages
Power supply voltage range : 4.25V to 5.5V
Temperature Range : TA= 0 to 70 °C
* P-SDIP-52 package is available on specific request from customer
Semiconductor Group 3
C541U
Figure 2
Logic Symbol
Port 0
8-bit Digital I/O
RESET
EA
ALE
PSEN
XTAL2
XTAL1
Port 1
6-bit Digital I/O
Port 2
8-bit Digital I/O
Port 3
8-bit Digital I/O
VSS
VDD
D+
D-
C541U
Semiconductor Group 4
C541U
Figure 3
Pin Configuration (Top View)
P1.5/SLS
P1.3/SRI
6
7
8
9
10
11
12
13
14
15
16
17
5 4 3 2 1 4443424140
39
38
37
36
35
34
33
32
31
30
29
18 19 20 21 2 2 23 24 25 26 27
P1.1/LED1
P1.0/LED0
D-
D+
ECAP
VDDU
P1.2/SCLK
VDD
VSS
P3.0/LED2
P3.1/DADD
P3.2/INT0
P3.3/INT1
P3.4/T0
P3.5/T1
P3.6/WR
P3.7/RD
XTAL2
XTAL1
VSS
VDD
P2.0/A8
P2.1/A9
P2.2/A10
P2.3/A11
P2.4/A12
RESET
P0.3/AD3
P0.2/AD2
P0.1/AD1
P0.0/AD0
P0.4/AD4
P0.5/AD5
P0.6/AD6
P0.7/AD7
EA
P1.4/STO
PSEN
P2.7/A15
P2.6/A14
P2.5/A13
ALE
28
C541U
Semiconductor Group 5
C541U
Table 1
Pin Definitions and Functions
Symbol Pin
Numbers I/O*) Function
P-LCC-44
D+ 3 I/O USB D+ Data Line
The pin D+ can be directly connected to USB cable (transceiver
is integrated on-chip).
D- 4 I/O USB D- Data Line
The pin D- can be di rectly connected to USB cable (transceiver is
integrated on-chip).
P1.0 - P1.4 5 - 7,
12, 34, 44
5
6
7
12
34
44
I/O Port 1
is an 6-bit quasi-bidirectional I/O port with internal pullup
resistors. Port 1 pins that have 1’ s written to th em are pulled high
by the internal pullup resistors, and in that state can be used as
inputs. As inputs, port 1 pins being externally pulled low will
source current (I IL, in the DC characteristics) because of the
internal pullup resistors.
Port 1 also contains two outputs with LED drive capability as well
as the four pins of the SSC. The pins with LED drive capability are
able to sink current up to 10 mA. The output la tch correspondi ng
to a secondary function must be programmed to a one (1) for that
function to operate (except when used for the compare functions).
The secondary functions are assigned to the port 1 pins as
follows :
P1.0 / LED0 LED0 output
P1.1 / LED1 LED1 output
P1.2 / SCLK SSC Master Clock Output /
SSC Slave Clock Input
P1.3 / SRI SSC Receive Input
P1.4 / STO SSC Transmit Output
P1.5 / SLS SSC Slave Select Inp.
RESET 10 I RESET
A high level on this pin for the duration of two machine cycles
while the oscillator is running resets the C541U. A small internal
pulldown resistor permits power-on reset using only a capacitor
connected to VDD.
*) I = Input
O = Output
Semiconductor Group 6
C541U
P3.0 - P3.7 11, 13 - 19
11
13
14
15
16
17
18
19
I/O Port 3
is an 8-bit quasi-bidirectional I/O port with internal pullup
resistors. Port 3 pins that have 1’ s written to th em are pulled high
by the internal pullup resistors, and in that state can be used as
inputs. As inputs, port 3 pins being externally pulled low will
source current (I IL, in the DC characteristics) because of the
internal pullup resistors. Port 3 also contains the interrupt, timer,
serial port and external memory strobe pins that are used by
various options. The pin with LED drive capability are able to sink
current up to 10 mA. The output latch corresponding to a
secondary function must be programmed to a one (1) for that
function to operate. The secondary functions are assigned to the
pins of port 3, as follows:
P3.0 / LED2 LED2 output
P3.1 / DADD Device attached input
P3.2 / INT0 External interrupt 0 input /
timer 0 gate control input
P3.3 / INT1 External interrupt 1 input /
timer 1 gate control input
P3.4 / T0 Timer 0 counter input
P3.5 / T1 Timer 1 counter input
P3.6 / WR WR control output; latches the
data byte from port 0 into the
external data memory
P3.7 / RD RD control output; enables the
external data memory
XTAL2 20 XTAL2
is the output of the inverting oscillator amplifier. This pin is used
for the oscillator operation with crystal or ceramic resonator.
XTAL1 21 XTAL1
is the input to the inverting oscillator amplifier and input to the
internal clock generator circuits.
To drive the dev ice from an ex ternal clock source, XTAL1 should
be driven, while XTAL2 is left unconnected. Minimum and
maximum high and low times as well as rise/fall times specified in
the AC characteristics must be observed.
*) I = Input
O = Output
Table 1
Pin Definitions and Functions (cont’d)
Symbol Pin
Numbers I/O*) Function
P-LCC-44
Semiconductor Group 7
C541U
P2.0 - P2.7 24 - 31 I/O Port 2
is an 8-bit quasi-bidirectional I/O port with internal pullup
resistors. Port 2 pins that have 1’ s written to th em are pulled high
by the internal pullup resistors, and in that state can be used as
inputs. As inputs, port 2 pins being externally pulled low will
source current (I IL, in the DC characteristics) because of the
internal pullup resistors.
Port 2 emits the high-order address byte during fetches from
external program memory and during accesses to external data
memory that use 16-bit addresses (MOVX @DPTR). In this
application it uses strong internal pullup resistors when issuing
1’s. During accesses to external data memory that use 8-bit
addresses (MOVX @ Ri), port 2 issues the contents of the P2
special function register.
PSEN 32 O The Program Store Enable
output is a control signal that enables the external program
memory to the bus during external fetch operations. It is activated
every three oscillator periods except during external data memory
accesses. The signal remains high during internal program
execution.
ALE 33 O The Address Latch enable
output is used for latching the address into external memory
during normal operation. It is activated every three oscillator
periods except during an external data memory access.
EA 35 I External Access Enable
When held high, the C541U executes instructions from the
internal OTP program memory as long as the PC is less than
2000H for the C541U. When held low, the C541U fetches all
instructions from external program memory. For the C541U-L this
pin must be tied low.
P0.0 - P0.7 43 - 36 I/O Port 0
is an 8-bit open-d rain bid irecti onal I/O port. Port 0 pins that hav e
1’s written to them float, and in that state can be used as high-
impedance inputs. Port 0 is also the multiplexed low-order
address and data bus during accesses to external program and
data memory. In this application it uses strong internal pullup
resistors when issuing 1’s.
*) I = Input
O = Output
Table 1
Pin Definitions and Functions (cont’d)
Symbol Pin
Numbers I/O*) Function
P-LCC-44
Semiconductor Group 8
C541U
ECAP 2 External Capacitor
This pin is required to be connected to an external capacitor
which is connected to VSS. The recommended value for the
capacitor is 6.8 nF.
VDDU 1–Supply voltage
for the on-chip USB transceiver circuitry
VDD 8, 23 Supply voltage
for ports and internal logic circuitry during normal, idle, and power
down mode.
VSS 9, 22 Ground (0V)
during normal, idle, and power down mode.
*) I = Input
O = Output
Table 1
Pin Definitions and Functions (cont’d)
Symbol Pin
Numbers I/O*) Function
P-LCC-44
Semiconductor Group 9
C541U
Figure 4
Block Diagram of the C541U
Port 0
8-bit digit. I/O
Port 2
8-bit digit. I/O
Port 3
8-bit digit. I/O
Port 0
Port 1
Port 2
Port 3
OSC & Timing
CPU
Timer 0
Interrupt Unit
XTAL2
XTAL1
RESET
ALE
PSEN
EA
Port 1
6-bit digit. I/O
256 x 8
RAM
Timer
Progr. Watchdog
Emulation
Support
Logic
Oscillator Watchdog OTP
Timer 1
SSC (SPI) Interface
USB
Module
Memory
D+
D-
C541U
8k x 8
PLL
Transceiver
Semiconductor Group 10
C541U
CPU
The C541U is efficient both as a co ntroller and as an arithmetic processo r. It has extensive facili ties
for binary and BCD arithmetic and excels in its bit-handling capabilities. Efficient use of program
memory results from an instruction se t consisting of 4 4 % one-byte, 41 % two-byte, an d 15% three-
byte instructions. With a 12 MHz crystal, 58% of the instructions are executed in 500ns.
Special Function Register PSW (Address D0H) Reset Value : 00H
Bit Function
CY Carry Flag
Used by arithmetic instruction.
AC Auxiliary Carry Flag
Used by instructions which execute BCD operations.
F0 General Purpose Flag
RS1
RS0 Register Bank Select Control Bits
These bits are used to select one of the four register banks.
OV Overflow Flag
Used by arithmetic instruction.
F1 General Purpose Flag
PParity Flag
Set/cleared by hardware after each instruction to indicate an odd/even
number of "one" bits in the accumulator, i.e. even parity.
CY AC F0 RS1 RS0 OV F1 PD0HPSW
D7HD6HD5HD4HD3HD2HD1HD0H
Bit No. MSB LSB
RS1 RS0 Function
0 0 Bank 0 selected, data address 00H-07H
0 1 Bank 1 selected, data address 08H-0FH
1 0 Bank 2 selected, data address 10H-17H
1 1 Bank 3 selected, data address 18H-1FH
Semiconductor Group 11
C541U
Memory Organization
The C541U CPU manipulates operands in the following four address spaces:
8KByte on-chip OTP program memory
Totally up to 64 Kbyte internal/external program memory
up to 64 Kbyte of external data memory
256 bytes of internal data memory
a 128 byte special function register area
Figure 5 illustrates the memory address spaces of the C541U.
Figure 5
C541U Memory Map Memory Map
FFFFH
2000H
1FFFH
0000H
"Code Space"
Internal
(EA = 1) External
(EA = 0)
"internal Data Space"
indirect direct
addr.
7FH
00H
Internal
RAM
Special
Function
Register 80H
FFH
80H
FFH
addr.
External
Internal
RAM
"External Data Space"
0000H
FFFFH
External
Semiconductor Group 12
C541U
Reset and System Clock
The reset input i s an ac tive high inp ut at pin RESET. Since the reset is s ynch ronized internally , the
RESET pin must be held high for at least two machine cycles (12 oscillator periods) while the
oscillator is running. A pulldown resistor is internally connected to VSS to allow a power-up reset with
an external capacitor only. An automatic reset can be obtained when VDD is applied by connecting
the RESET pin to VDD via a capacitor. Figure 6 shows the possible reset circuitries.
Figure 6
Reset Circuitries
RESET
+
a)
RESET
b)
&
RESET
c)
VDD
+
VDD
VDD
C541U C541U
C541U
Semiconductor Group 13
C541U
The oscillator and clock generation circuitry of the C541U is shown in figure 5-7. The crystal
oscillator generate s the system cloc k for the microcontroller. The USB module can be prov ided with
the following clocks :
Full speed operation : 48 MHz with a data rate of 12 Mbit/s
Low speed operation : 6 MHz with a data rate of 1.5 Mbit/s
The low speed clock is generated by a dividing the system clock by 2. The full speed clock is
generated by a PLL, which multiplie s the sy stem cl ock by a fix fact or of 4. Thi s PLL can be enabled
or disabled by bit PCLK of SFR DCR. Depending on full or low speed operation of the USB bit
SPEED of SFR has to be set or cleared for the selection of the USB clock. Bit UCLK is a general
enable bit for the USB clock.
Figure 7
Block Diagram of the Clock Generation Circuitry
XTAL1
Crystal
Oscillator
12
XTAL2
Pin
Pin
System clock
of the
microcontroller
6 MHz
MHz
UCLK
DCR.1
PLL
x 4
48 MHz
0
1
Divider
by 2
SPEED
DCR.7
to USB
Module
DCR.0
PCLK
Enable
12 MHz
C541U
Semiconductor Group 14
C541U
The clock generator prov ides the internal clock signals to the chip. These signals define the internal
phases, states and ma chine cycl es. Figure 8 shows the recommend ed o scillato r circuits for crystal
and external clock operation.
Figure 8
Recommended Oscillator Circuitries
XTAL1
XTAL2
C
C
12
MHz
C = 20pF ± 10pF for crystal operation
C541U
External
Clock
Signal
VDD
N.C. XTAL2
XTAL1
C541U
Semiconductor Group 15
C541U
Enhanced Hooks Emulation Concept
The Enhanced Hooks Emulation Concept of the C500 microcontroller family is a new, innovative
way to control the execution of C500 MCUs and to gain extensive information on the internal
operation of the controllers. Emulation of on-chip ROM based programs is possible, too.
Each production chip has built-in logic for the supprt of the Enhanced Hooks Emulation Concept.
Therefore, no costly bond-out chips are necessary for emulation. This also ensure that emulation
and production chips are identical.
The Enhanced Hooks TechnologyTM 1), which requires e mbedded logic in the C500 allows the C500
together with an EH-IC to functio n similar to a bond-out chi p. This simplifies the desi gn and reduces
costs of an ICE-system. ICE-systems using an EH-IC and a compatible C500 are able to emulate
all operating modes of the different versions of the C500 microcontrollers. This includes emulation
of ROM, ROM with code rollover and ROMless modes of operation. It is also able to operate in
single step mode and to read the SFRs after a break.
Figure 9
Basic C500 MCU Enhanced Hooks Concept Configuration
Port 0, port 2 and some of the control lines of the C500 based MCU are used by Enhanced Hooks
Emulation Concept to control the operation of the device during emulation and to transfer
informations about the programm execution and data transfer between the external emulation
hardware (ICE-system) and the C500 MCU.
1“Enhanc ed H ooks Techno logy“ is a tradema rk and patent of Metalink Corpora ti on lic ensed to Siemens.
MCS02647
SYSCON
PCON
TCON
RESET
EA
PSEN
ALE
Port 0
Port 2
I/O Ports
Optional Port 3 Port 1
C500
MCU Interface Circuit
Enhanced Hooks
RPort 0RPort 2
RTCON
RPCON
RSYSCON
TEA TALE TPSEN
EH-IC
Target System Interface
ICE-System Interface
to Emulation Hardware
Semiconductor Group 16
C541U
Special Function Registers
The registers, except the program counter and the four general purpose register banks, reside in
the special function register area. The special function register area consists of two portions: the
standard special functi on register area and the mapped special func tion regis ter area. One spe cial
function register of the C541U (PCON1) is located in the mapped special function regis ter area. All
other SFRs are located in the standard special function register area.
For accessing PCON1 in the mapped special function register area, bit RMAP in special function
register SYSCON must be set.
Special Function Register SYSCON (Address B1H) Reset Value : XX10XXXXB
As long as bit RMAP is set, a mapped special function register can be accessed. This bit is not
cleared by hardware automatically. Thus , when non-mapped/mapped registers are to be accessed,
the bit RMAP must be cleared/set by software, respectively each.
The registers, except the program counter and the four general purpose register banks, reside in the
special function register area. All SFRs with addresses where address bits 0-2 are 0 (e.g. 80H,
88H, 90H, 98H, ..., F8H, FFH) are bitaddressable.
The 75 special function registers (SFRs ) in the SFR area include pointers and registers that provide
an interface between the CPU and the other on-chip peripherals. The SFRs of the C541U are listed
in table 2 to table 4. In table 2 they are organized in groups which refer to the functional blocks of
the C541U. Table 4 and table 4 illustrate the contents of the SFRs in numeric order of their
addresses.
Bit Function
RMAP Special function register map bit
RMAP = 0 : The access to the non-mapped (standard) special function
register area is enabled.
RMAP = 1 : The access to the mapped special function register area
(PCON1) is enabled.
76543210
EALE RMAP
B1HSYSCON
Bit No. MSB LSB
––
––
The functions of the shaded bits are not described in this section.
Semiconductor Group 17
C541U
Table 2
Special Function Registers - Functional Blocks
Block Symbol Name Address Contents after
Reset
CPU ACC
B
DPH
DPL
PSW
SP
VR0
VR1
VR2
SYSCON
Accumulator
B Register
Data Pointer, High Byte
Data Pointer, Low Byte
Program Status Word Register
Stack Pointer
Version Register 0
Version Register 1
Version Register 2
System Control Register
E0H 1)
F0H 1)
83H
82H
D0H 1)
81H
FCH
FDH
FEH
B1H
00H
00H
00H
00H
00H
07H
C5H
C1H
YYH 3)
XX10XXXXB 2)
Interrupt
System IEN0
IEN1
IP0
IP1
ITCON
Interrupt Enable Register 0
Interrupt Enable Register 1
Interrupt Priority Register 0
Interrupt Priority Register 1
External Interrupt Trigger Condition Register
A8H1)
A9H
B8H 1)
B9H)
9AH
0XXX0000B 2)
XXXXX000B 2)
XXXX0000B 2)
XXXXX000B 2)
XXXX1010B 2)
Ports P0
P1
P2
P3
Port 0
Port 1
Port 2
Port 3
80H 1)
90H 1)
A0H 1)
B0H 1)
FFH
FFH
FFH
FFH
Timer 0 /
Timer 1 TCON
TH0
TH1
TL0
TL1
TMOD
Timer 0/1 Control Register
Timer 0, High Byte
Timer 1, High Byte
Timer 0, Low Byte
Timer 1, Low Byte
Timer Mode Register
88H 1)
8CH
8DH
8AH
8BH
89H
00H
00H
00H
00H
00H
00H
SSC
Interface SSCCON
STB
SRB
SCF
SCIEN
SSCMOD
SSC Control Register
SSC Transmit Buffer
SSC Receive Register
SSC Flag Register
SSC Interrupt Enable Register
SSC Mode Test Register
93H 1)
94H
95H
ABH 1)
ACH
96H
07H
XXH 2)
XXH 2)
XXXXXX00B 2)
XXXXXX00B 2)
00H
Watchdog WDCON
WDTREL Watchdog Timer Control Register
Watchdog Timer Reload Register C0H 1)
86HXXXX0000B 2)
00H
1) Bit-ad dres s able special func t ion registers
2) “X“ mea ns tha t the v alue is undefin ed and the location is reserved
3) The cont ent of this SFR varies with the actu al of the step C541U (eg. 01H for the first step)
4) This SF R is loc at ed in the mapped SF R area. F or ac c es si ng t his SF R , bit RMAP in SFR SYS C ON m us t be
set.
Semiconductor Group 18
C541U
Pow.
Sav.
Modes
PCON
PCON1 Power Control Register
Power Control Register 1 87H
88H 4) X00X0000B 2)
0XX0XXXXB 2)
USB
Module EPSEL
USBVAL
ADROFF
GEPIR
DCR
DPWDR
DIER
DIRR
FNRL
FNRH
EPBCn 1)
EPBSn 1)
EPIEn 1)
EPIRn 1)
EPBAn 1)
EPLENn 1)
USBPWD4)
USBDCR 4)
USBDR0 4)
USBDR1 4)
USBDR2 4)
USBDR3 4)
USBDR4 4)
USBDR5 4)
USBDR6 4)
USBDR7 4)
USB Endpoint Select Register
USB Data Register
USB Address Offset Register
USB Global Endpoint Interrupt Request Reg.
USB Device Control Register
USB Device Power Down Register
USB Device Interrupt Control Register
USB Device Interrupt Request Register
USB Frame Number Register, Low Byte
USB Frame Number Register, High Byte
USB Endpoint n Buffer Control Register
USB Endpoint n Buffer Status Register
USB Endpoint n Interrupt Enable Register
USB Endpoint n Interrupt Request Register
USB Endpoint n Base Address Register
USB Endpoint n Buffer Length Register
USB Power Down Register
USB Control Register
USB Data Register 0
USB Data Register 1
USB Data Register 2
USB Data Register 3
USB Data Register 4
USB Data Register 5
USB Data Register 6
USB Data Register 7
D2H
D3H
D4H
D6H
C1H
C2H
C3H
C4H
C6H
C7H
C1H
C2H
C3H
C4H
C5H
C6H
E6H
E7H
E8H
E9H
EAH
EBH
ECH
EDH
EEH
EFH
80H
00H
00H 2)
00H
000X0000B
00H
00H
00H
XXH
00000XXXB
00H
20H
00H
10H 3)
00H
0XXXXXXXB
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
1) These register are multiple registers (n= 0-4) with the same SFR address; selection of register “n“ is done by
SFR EPSEL.
2) The reset value of ADROFF is valid only if USBVAL has not been read or written since the last hardware reset.
3) The reset value of EPIR0 is 11H.
4) These registers are only us ed in USB low-speed operation.
Table 2
Special Function Registers - Functional Blocks (cont’d)
Block Symbol Name Address Contents after
Reset
Semiconductor Group 19
C541U
Table 3
Contents of the SFRs, SFRs in numeric order of their addresses
Addr Register Reset
Value1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
80H 2) P0 FFH.7 .6 .5 .4 .3 .2 .1 .0
81HSP 07H.7 .6 .5 .4 .3 .2 .1 .0
82HDPL 00H.7 .6 .5 .4 .3 .2 .1 .0
83HDPH 00H.7 .6 .5 .4 .3 .2 .1 .0
86H WDTREL 00HWDT
PSEL .6 .5 .4 .3 .2 .1 .0
87HPCON X00X-
0000B PDS IDLS GF1 GF0 PDE IDLE
88H 2) TCON 00HTF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0
88H
2) 3) PCON1 0XX0-
XXXXBEWPD WS
89HTMOD 00HGATE C/T M1 M0 GATE C/T M1 M0
8AHTL0 00H.7 .6 .5 .4 .3 .2 .1 .0
8BHTL1 00H.7 .6 .5 .4 .3 .2 .1 .0
8CHTH0 00H.7 .6 .5 .4 .3 .2 .1 .0
8DHTH1 00H.7 .6 .5 .4 .3 .2 .1 .0
90H2) P1 FFH.7 .6 SLS STO SRI SCLK LED1 LED0
93H SSCCON 07HSCEN TEN MSTR CPOL CPHA BRS2 BRS1 BRS0
94H STB XXH.7 .6 .5 .4 .3 .2 .1 .0
95H SRB XXH.7 .6 .5 .4 .3 .2 .1 .0
96H SSCMOD 00HLOOPB TRIO00000LSBSM
9AHITCON XXXX-
1010B I1ETF I1ETR I0ETF I0ETR
A0H2) P2 FFH.7 .6 .5 .4 .3 .2 .1 .0
A8H2) IEN0 0XXX-
0000BEA ET1 EX1 ET0 EX0
A9HIEN1 XXXX-
X000B EUDI EUEI ESSC
ABHSCF XXXX-
XX00B––––––WCOLTC
1) X means tha t the v alue is undefin ed and the location is reserved
2) Bit-addre s sa ble s pec ial function registers
3) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set.
Semiconductor Group 20
C541U
ACH
SCIEN XXXX-
XX00B––––––WCENTCEN
B0H2) P3 FFHRD WR T1 T0 INT1 INT0 DADD LED2
B1HSYSCON XX10-
XXXXB––EALERMAP––––
B8H2) IP0 XXXX-
0000B––––PT1 PX1 PT0 PX0
B9HIP1 XXXX-
X000B PUDI PUEI PSSC
C0H 2) WDCON XXXX-
0000B––––OWDS WDTS WDT SWDT
C1H to C7HUSB Device and Endpoint Register definition see table 3-3
D0H
2) PSW 00HCY AC F0 RS1 RS0 OV F1 P
D2HEPSEL 80HEPS7 0 0 0 0 EPS2 EPS1 EPS0
D3HUSBVAL 00H.7 .6 .5 .4 .3 .2 .1 .0
D4HADROFF 00H 6) 0 0 AO5 AO4 AO3 AO2 AO 1 AO0
D6HGEPIR 00HDRVI 0 0 EPI4 EPI3 EPI2 EPI1 EPI0
E0H2) ACC 00H.7 .6 .5 .4 .3 .2 .1 .0
E6H 7) USBPWD 00H00SUSPIE DADDIE SUSP DADD TPWD RPWD
E7H 7) USBDCR 00HTYPE3 TYPE2 TYPE1 TYPE0 LEN3 LEN2 LEN1 LEN0
E8H 7) USBDR0 00H.7 .6 .5 .4 .3 .2 .1 .0
E9H 7) USBDR1 00H.7 .6 .5 .4 .3 .2 .1 .0
EAH 7) USBDR2 00H.7 .6 .5 .4 .3 .2 .1 .0
EBH 7) USBDR3 00H.7 .6 .5 .4 .3 .2 .1 .0
ECH7) USBDR4 00H.7 .6 .5 .4 .3 .2 .1 .0
EDH7) USBDR5 00H.7 .6 .5 .4 .3 .2 .1 .0
EEH 7) USBDR6 00H.7 .6 .5 .4 .3 .2 .1 .0
1) X means tha t the v alue is undefin ed and the location is reserved
2) Bit-addre s sa ble s pec ial function registers
3) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set.
4) These are read-only regis t ers
5) The conte nt of this SF R varies with the act ual s t ep of th e C5 41U (e.g. 01H for the first step )
6) The reset value of ADROFF is valid only if USBVAL has not been read or written since the last hardware reset
7) These regis t ers are only used in USB low -s peed opera ti on.
Table 3
Contents of the SFRs, SFRs in numeric order of their addresses (cont’d)
Addr Register Reset
Value1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Semiconductor Group 21
C541U
EFH 7) USBDR7 00H.7 .6 .5 .4 .3 .2 .1 .0
F0H2) B00H.7 .6 .5 .4 .3 .2 .1 .0
FCH 3)
4) VR0 C5H11000101
FDH
3) 4) VR1 C1H11000001
FEH 3)
4) VR2 5) .7 .6 .5 .4 .3 .2 .1 .0
1) X means tha t the v alue is undefin ed and the location is reserved
2) Bit-addre s sa ble s pec ial function registers
3) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set.
4) These are read-only regis t ers
5) The conte nt of this SF R varies with the act ual s t ep of th e C5 41U (e.g. 01H for the first step )
6) The reset value of ADROFF is valid only if USBVAL has not been read or written since the last hardware reset.
7) These regis t ers are only used in USB low -s peed opera ti on.
Table 3
Contents of the SFRs, SFRs in numeric order of their addresses (cont’d)
Addr Register Reset
Value1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Semiconductor Group 22
C541U
Table 4
Contents of the USB Device and Endpoint Registers (Addr. C1H to C7H)
Addr Register Reset
Value Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
EPSEL = 1XXX.XX XXB Device Registers
C1HDCR 000X.
0000B
SPEED DA SWR SUSP DINIT RSM UCLK PCLK
C2HDPWDR 00HDRVIE XVREG 0 0 0 0 TPWD RPWD
C3HDIER 00HSE0IE DAIE DDIE SBIE SEIE STIE SUIE SOFIE
C4HDIRR 00HSE0I DAI DDI SBI SEI STI SUI SOFI
C5Hreserved
C6HFNRL XXHFNR7 FNR6 FNR5 FNR4 FNR3 FNR2 FNR1 FNR0
C7HFNRH 0000.
0XXXB
0 0 0 0 0 FNR10 FNR9 FNR8
EPSEL = 0XXX.X000BEndpoint 0 Registers
C1HEPBC0 00HSTALL0 0 0 GEPIE0 SOFDE0 INCE0 0 DBM0
C2HEPBS0 20HUBF0 CBF0 DIR0 ESP0 SETRD0 SETWR0 CLREP0 DONE0
C3HEPIE0 00HAIE0 NAIE0 RLEIE0 DNRIE0 NODIE0 EODIE0 SODIE0
C4HEPIR0 11HACK0 NACK0 RLE0 DNR0 NOD0 EOD0 SOD0
C5HEPBA0 00HPAGE0 0 0 0 A06 A05 A04 A03
C6HEPLEN0 0XXX.
XXXXB
0 L06 L05 L04 L03 L02 L01 L00
C7Hreserved
EPSEL = 0XXX.X001BEndpoint 1 Registers
C1HEPBC1 00HSTALL1 0 0 GEPIE1 SOFDE1 INCE1 0 DBM1
C2HEPBS1 20HUBF1 CBF1 DIR1 ESP1 SETRD1 SETWR1 CLREP1 DONE1
C3HEPIE1 00HAIE1 NAIE1 RLEIE1 DNRIE1 NODIE1 EODIE1 SODIE1
C4HEPIR1 10HACK1 NACK1 RLE1 DNR1 NOD1 EOD1 SOD1
C5HEPBA1 00HPAGE1 0 0 0 A16 A15 A14 A13
C6HEPLEN1 0XXX.
XXXXB
0 L16 L15 L14 L13 L12 L11 L10
C7Hreserved
Semiconductor Group 23
C541U
EPSEL = 0XXX.X010BEndpoint 2 Registers
C1HEPBC2 00HSTALL2 0 0 GEPIE2 SOFDE2 INCE2 0 DBM2
C2HEPBS2 20HUBF2 CBF2 DIR2 ESP2 SETRD2 SETWR2 CLREP2 DONE2
C3HEPIE2 00HAIE2 NAIE2 RLEIE2 DNRIE2 NODIE2 EODIE2 SODIE2
C4HEPIR2 10HACK2 NACK2 RLE2 DNR2 NOD2 EOD2 SOD2
C5HEPBA2 00HPAGE2 0 0 0 A 62 A52 A42 A32
C6HEPLEN2 0XXX.
XXXXB
0 L62 L52 L42 L32 L22 L12 L02
C7Hreserved
EPSEL = 0XXX.X011BEndpoint 3 Registers
C1HEPBC3 00HSTALL3 0 0 GEPIE3 SOFDE3 INCE3 0 DBM3
C2HEPBS3 20HUBF3 CBF3 DIR3 ESP3 SETRD3 SETWR3 CLREP3 DONE3
C3HEPIE3 00HAIE3 NAIE3 RLEIE3 DNRIE3 NODIE3 EODIE3 SODIE3
C4HEPIR3 10HACK3 NACK3 RLE3 DNR3 NOD3 EOD3 SOD3
C5HEPBA3 00HPAGE3 0 0 0 A63 A52 A43 A33
C6HEPLEN3 0XXX.
XXXXB
0 L63 L53 L43 L33 L23 L13 L03
C7Hreserved
EPSEL = 0XXX.X100BEndpoint 4 Registers
C1HEPBC4 00HSTALL4 0 0 GEPIE4 SOFDE4 INCE4 0 DBM4
C2HEPBS4 20HUBF4 CBF4 DIR4 ESP4 SETRD4 SETWR4 CLREP4 DONE4
C3HEPIE4 00HAIE4 NAIE4 RLEIE4 DNRIE4 NODIE4 EODIE4 SODIE4
C4HEPIR4 10HACK4 NACK4 RLE4 4 DNR4 NOD4 EOD4 SOD4
C5HEPBA4 00HPAGE4 0 0 0 A64 A54 A44 A34
C6HEPLEN4 0XXX.
XXXXB
0 L64 L54 L44 L34 L24 L14 L04
C7Hreserved
Table 4
Contents of the USB Device and Endpoint Registers (Addr. C1H to C7H) (cont’d)
Addr Register Reset
Value Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Semiconductor Group 24
C541U
Digital I/O Ports
The C541U three 8-bit I/O ports and one 6-bit I/O port (Port 1). Port 0 is an op en-drain bidirec tional
I/O port, while ports 1 to 3 are quasi-bidirectional I/O ports with internal pullup resistors. That means,
when configured as inputs, ports 1 to 3 will be pulled high and will source current when externally
pulled low. Port 0 will float when configured as input.
The output drivers of port 0 and 2 and the i nput buffers of port 0 are also used for accessing external
memory. In this application, port 0 outputs the low byte of the external memory address, time
multiplexed with the by te being written or rea d. Port 2 output s the high byt e of the external memory
address when the ad dress is 16 bits wide. Otherwis e, the port 2 pi ns conti nue em ittin g the P2 SFR
contents. In this function, port 0 is not an open-drain port, but uses a strong internal pullup FET.
Two port lines of port 1 (P1.0/LED0, P1.1/LED1) and one port line of port 3 (P3.0/LED2) have the
capability of driving external LEDs in the output low state.
Semiconductor Group 25
C541U
Timer / Counter 0 and 1
Timer/Counter 0 and 1 can be used in four operating modes as listed in table 5 :
In the “timer” function (C/T = ‘0’) the register is incremented every machine cycle. Therefore the
count rate is fOSC/6.
In the “counter” function the register is incremented in response to a 1-to-0 transition at its
corresponding external input pin (P3.4/T0, P3.5/T1). Since it takes two machine cycles to detect a
falling edge the max. count rate is fOSC/12. External inputs INT0 and INT1 (P3.2, P3.3) can be
programmed to function as a gate to facilitate pulse width measurements. Figure 10 illustrates the
input clock logic.
Figure 10
Timer/Counter 0 and 1 Input Clock Logic
Table 5
Timer/Counter 0 and 1 Operating Modes
Mode Description TMOD Input Clock
M1 M0 internal external (max)
0 8-bit timer/counter with a
divide-by-32 prescaler 00 fOSC/6x32 fOSC/12x32
1 16-bit timer/counter 1 1
fOSC/6 fOSC/12
2 8-bit timer/counter with
8-bit autoreload 10
3 Timer/counte r 0 used as one
8-bit timer/counter and one
8-bit timer
Timer 1 stops
11
MCS03117
1
&
OSC
C/T = 0
C/T = 1
Control
=1
6
TR1
P3.5/T1
(TMOD)
P3.2/INT0
f
Timer 0/1
Input Clock
OSC
/6
P3.4/T0
TR0
Gate
P3.3/INT1
÷
_
<
Semiconductor Group 26
C541U
SSC Interface
The C541U microcontrolle r provides a Synchrono us Serial Channel unit, the SSC. This interface is
compatible to the popula r SPI s erial bus interfac e. Figure 11 shows the bloc k di agram o f the SSC.
The central eleme nt of the SSC is an 8-bit shift register. The input and the output of this shift regist er
are each connected via a control logic to the pin P1.3 / SRI (SSC Receive r In) and P1.4 / STO (SSC
Transmitter Out). This shift register can be written to (SFR STB) and can be read through the
Receive Buffer Register SRB.
Figure 11
SSC Block Diagram
The SSC has implemented a clock control circuit, which can generate the clock via a baud rate
generator in the master mode, or receive the transfer clock in the slave mode. The clock signal is
fully programmable for clock polarity and phase. The pin used for the clock signal is P1.2/ SCLK.
When operating in slave mode, a slave select input is provided which enables the SSC interface
and also will control the transmitter output. The pin used for this is P1.5 / SLS.
The SSC control block is responsible for controlling the different modes and operation of the SSC,
checking the status, and generating the respective status and interrupt signals.
Clock Divider
Clock Selection
Receive Buffer Register
Int. Enable Reg.
Control Register
. . .
f
OSC
Shift Register
STB
SRB
Pin
Control
Logic
Pin
Pin
Pin
Pin
P1.2 / SCLK
P1.3 / SRI
P1.4 / STO
P1.5 / SLS
SCIEN
SSCCON SCF
Status Register
Control Logic
Interrupt
Internal Bus
MCB03379
Semiconductor Group 27
C541U
USB Module
The USB module in the C541U handles all transactions between the serial USB bus and the internal
(parallel) bus of the microcontroller. The USB module includes several units which are required to
support data handling with the USB bus : the on-chip USB bus transceiver, the USB memory with
two pages of 128 bytes each, the memory management unit (MMU) for USB and CPU memory
access control, the UDC device core for USB protocol handling, the microcontroller interface with
the USB specific special function registers and the interrupt control logic. A clock generation unit
provides the clock signal for the USB module for full speed and low speed USB operation. Figure
12 shows the block diagram of the functional units of the USB module with their interfaces.
Figure 12
USB Module Block Diagram
MCB03380
Pin Pin PinPin
XTAL1 XTAL2 D+ D-
USB Bus
Osc.
12 MHz
(On-chip)
Transceiver
x 4
PLL 2
48 MHz 6 MHz
USB
Page 0
(128 x 8)
F
00
00
Data Data
Control USB Memory
Management
MMU
Interrupt Generation
SFR
Addr.
11
Core
Device
USB
MCU
Interface
Module
USB
Internal
Bus
Memory
Page 1
(UDC)
Control
H
H
H
7
7
H
F
Address
Semiconductor Group 28
C541U
USB Full-Speed Registers
Two different kinds of registers are implemented for full speed operation in the USB module. The
global registers (GEPIR, EPSEL, ADROFF, USBVAL) describe the basic functionality of the
complete USB module and can be accessed via unique SFR addresses. For reduction of the
number of SFR addresses which are needed to control the USB module inside the C541U, device
registers and endpoint registers are mapped into an SFR address block of seven SFR addresses
(C1H to C7H). The endpoint specific functionality of the USB module is controlled via the device
registers DCR, DPWDR, DIER, DIRR and the frame number registers. An endpoint register set is
available for each endpo int (n=0..4) and describes the functionali ty of the selected endpoint. Figure
13 explains the structure of the USB module registers.
Figure 13
Register Structure of the USB Module
D
Global Registers
EPSEL(D2H)
Endpoint 0
Registers
EPBC0
EPBS0
EPIE0
EPIR0
EPBA0
EPLEN0
C1H
C2H
C3H
C4H
C5H
C6H
C7Hreserved
Endpoint 1
Registers
EPBC1
EPBS1
EPIE1
EPIR1
EPBA1
EPLEN1
C1H
C2H
C3H
C4H
C5H
C6H
C7Hreserved
Endpoint 2
Registers
EPBC2
EPBS2
EPIE2
EPIR2
EPBA2
EPLEN2
C1H
C2H
C3H
C4H
C5H
C6H
C7Hreserved
Endpoint 3
Registers
EPBC3
EPBS3
EPIE3
EPIR3
EPBA3
EPLEN3
C1H
C2H
C3H
C4H
C5H
C6H
C7Hreserved
Endpoint 4
Registers
EPBC4
EPBS4
EPIE4
EPIR4
EPBA4
EPLEN4
C1H
C2H
C3H
C4H
C5H
C6H
C7Hreserved
Device
Registers
DCR
DIER
DIRR
FNRL
C1H
C2H
C3H
C4H
C5H
C6H
C7H
reserved
DPWDR
FNRH
.0.1.2.7
USBVAL(D3H)
ADROFF(D4H)
GEPIR(D6H).0.1.2.7 .6 .5 .4 .3
.0.1.2.4 .3.5
.0.1.2.4 .300
00 0000
Decoder
Semiconductor Group 29
C541U
Interrupt System
The C541U provides seven interrupt sources with two priority levels. Five interrupts can be
generated by the on-chip peripherals (timer 0, timer 1, SSC interface, and USB module), and two
interrupts may be triggered externally (P3.2/INT0 and P3.3/INT1).
Figure 14 to 16 give a general overview of the interrupt sources and illustrate the request and
control flags which are described in the next sections.
Figure 14
Interrupt Request Sources (Part 1)
EA
ET0
TF0
IEN0.1
TCON.5 000B
H
IEN0.7
Low Priority
MCT03684
Bit addressable
Request flag is cleared by hardware
IP0.1
PT0 High Priority
TCON.7
TF1 ET1
IEN0.3
H
001B
Timer 1
Timer 0
IEN0.0
TCON.1
IE0 0003
EX0
H
Overflow
Overflow
INT0
P3.2 /
IT0
TCON.0 ITCON.0
ITCON.1
>1
ITCON.3
TCON.2
P3.3 /
INT1
IT1 ITCON.2
>1
IEN0.2
TCON.3
IE0 0013
EX1
H
IP0.3
PT1
IP0.0
PX0
PX1
IP0.2
Semiconductor Group 30
C541U
Figure 15
Interrupt Request Sources (Part 2)
Endpoint 4 In te rrupts
Endpoint 3 Int errupts
Endpoint 2 In te rrupts
Low Priority
High Priority
004BH
EUEI
IEN1.1 IP1.1
PUEI
IEN0.7
EA
Bit address able
Request fla g is cleared by hardw are after the corr es ponding regist er has been read.
Endpoint 0 In te rrupts
1
ACK0
NACK0
RLE0
DNR0
NOD0
EOD0
AIE0
EPIE0.7
NAIE0
EPIE0.6
RLEIE0
EPIE0.5
DNRIE0
EPIE0.3
NODIE0
EPIE0.2
EODIE0
EPIE0.1
EPIR0.7
EPIR0.6
EPIR0.5
EPIR0.3
EPIR0.2
EPIR0.1
Endpoint 1 Int errupts
1
Endpoint Interrupts
0043H
ESSC
IEN1.0
SSC WCEN
TCEN
SCIEN.1
SCIEN.0
1
SCF.0
WCOL
SCF.1
TC
Interrupts
PSSC
IP1.0
GEPIE0
EPBC0.4
EPI0
GEPIR.0
SOD0 SODIE0
EPIE0.0
EPIR0.0
Low Speed Interrupts
1
SUSP SUSPIE
USBPWD.3
DADD DADDIE
USBPWD.2
USBPWD.5
USBPWD.4
SETUP packet
OU T p acket
USB Reset
Semiconductor Group 31
C541U
Figure 16
Interrupt Request Sources (Part 3)
Table 6
Interrupt Source and Vectors
Interrupt Source Interrupt Vector Address Interrupt Request Flags (SFRs)
External Interrupt 0 0003HIE0
Timer 0 Overflow 000BHTF0
External Interrupt 1 0013HIE1
Timer 1 Overflow 001BHTF1
SSC Interrupt 0043HTC, WCOL
USB Endpoint Interrupt 004BHin SFRs EPIR0-4 and GEPIR
USB Device Interrupt 0053Hin SFRs DIRR and GEPIR
Wake-up from power down 007BH
Low Priority
High Priority
IE0.7
EA
0053H
IP1.2
PUDI
1
SE0I
DAI
DDI
SBI
SEI
STI
SUI
SE0IE
DIER.7
DAIE
DIER.6
DDIE
DIER.5
SBIE
DIER.4
SEIE
DIER.3
STIE
DIER.2
SUIE
DIER.1
DIRR.7
DIRR.6
DIRR.5
DIRR.4
DIRR.3
DIRR.2
DIRR.1
EUDI
IEN1.2
SOFI SOFIE
DIER.0
DIRR.0
Device Interrupts
Bit address able
Request flag is cleared by hardware after t he c orresponding regis t er has been read.
DRVI DRVIE
DPWDR.7
GEPIR.7
Semiconductor Group 32
C541U
Fail Save Mechanisms
The C541U offers enhanced fail safe mechanisms, which allow an automatic recovery from
software upset or hardware failure :
a programmable watchdog timer (WDT), with variable time-out period from 256 µs up to
approx. 0.55 µs at 12 MHz.
an oscillator watchdog (OWD) which monitors the on-chip oscillator and forces the
microcontroll er into reset state in cas e the on-chip oscillator fail s; it also provides the clock for
a fast internal reset after power-on.
The watchdog timer in the C541U is a 15-bit timer, which is incremented by a count rate of fOSC/12
or fOSC/192. The system clock of the C541U is divided by two prescalers, a divide-by-two and a
divide-by-16 prescaler which are selected by bit W DTPSEL (WDTREL.7). For programming of the
watchdog timer overflow rate, the upper 7 bit of the watchdog timer can be written. Figure 8-17
shows the block diagram of the watchdog timer unit.
Figure 17
Block Diagram of the Watchdog Timer
The watchdog timer can be started by software (bit SWDT) but it cannot be stopped during active
mode of the C541U. If the software fa ils to re fresh the run ning watchdog timer an internal reset will
be initiated on watchdog timer overflow. For refreshing of the watchdog timer the content of the SFR
WDTREL is transfered to the upper 7-bit of the watchdog timer. The refresh sequence consists of
two consequtive instructions which set the bits WDT and SWDT each. The reset cause (external
reset or reset caused by the watchdog) can be examined by software (flag WDTS). It must be noted,
however, that the watchdog timer is halted during the idle mode and power down mode of the
processor.
MCB03384
WDCON (CO )
H
OSC
f
-
---
OWDS WDTS WDT SWDT
2 16
14
07
8
WDTL
WDTH
/ 6
External HW Reset
Control Logic
670
WDT Reset-Request
WDTPSEL
WDTREL
Semiconductor Group 33
C541U
Oscillator Watchdog
The oscillator watchdog unit serves for three functions:
Monitoring of the on-chip oscillator’s function
The watchdog supervises the on-chip oscillator's frequenc y; if it is lower than the frequency of
the auxiliary RC oscillator in the watchdog unit, the internal clock is supplied by the RC
oscillator and the device is brought into reset; if the failure condition disappears (i.e. the on-
chip oscillator has a higher frequency than the RC oscillator), the part executes a final reset
phase of typ. 1 ms in order to allow the oscillator to stabilize; then the oscillator watchdog reset
is released and the part starts program execution again.
Fast internal reset after power-on
The oscillator watchd og unit provides a clock suppl y for the reset before the on-chip osci llator
has started. The oscillator watchdog unit also works identically to the monitoring function.
Control of external wa ke-up from software power-down mode (desc ription see chapter 9)
When the power-down mode is left by a low le vel at the INT0 pin or by the USB, the oscillat or
watchdog unit assures that the microcontroller resumes operation (execution of the power-
down wake-up interrupt) with the nominal clock rate. In the power-down mode the RC
oscillator and the on-chip oscillator are stopped. Both oscillators are started again when
power-down mode is released. When the on-chip oscillator has a higher frequency than the
RC oscillator, the microcontroller starts operation after a final delay of typ. 1 ms in order to
allow the on-chip oscillator to stabilize.
Semiconductor Group 34
C541U
Figure 18
Functional Block Diagram of the Oscillator Watchdog
Int. Clock
XTAL2
XTAL1
OWDS
MCD03385
WDCON (C0 )
H
3 MHz
f
RC
Delay
1
f
2
f
2
f
1
f
<
Activity on
Start /
Stop
Start /
Stop
Mode Activated
Power - Down
Power-Down Mode
Wake - Up Interrupt
Internal Reset
10
P3.2 / INT0 Control
WS
(PCON1.4)(PCON1.7)
EWPD
>1
Frequency
Comparator
RC
On-Chip
Oscillator
Logic
Oscillator
Logic
Control
USB Bus
Semiconductor Group 35
C541U
Power Saving Modes
The C541U provides two basic power saving modes, the idle mode and the power down mode.
Idle mode
In the idle mode the main oscillator of the C541U continues to run, but the CPU is gated off
from the clock signal. However, the interrupt system, the SSC, the USB module, and the
timers with the exception of the watchdog timer are further provided with the clock. The CPU
status is preserved in its entirety : the stack pointer, program counter, program status word,
accumulator, and all other registers maintain their data during idle mode. The idle mode can
be terminated by activating any enabled interrupt. or by a hardware reset.
Power down mode
In the power down mode, the RC osciillator and the on-chip os cillator which operates wit h the
XTAL pins is stopp ed. Therefore, all f unctions of t he micr ocontroller a re stopped and on ly the
contents of the on-chip RAM, XRAM and the SFR's are maintained. The power down mode
can be left either by an active reset signal or by a low signal at the P3.2/INT0 pin or any activity
on the USB bus. Using reset to l eave power down mode puts the microcontroller with its SFRs
into the reset state. Using the INT0 pin or USB bus for power down mode exit maintains the
state of the SFRs, which has been frozen when power down mode is entered.
In the power down mode of operation, VDD can be reduced to m inimize po wer consumption . It must
be ensured, however, that VDD is not reduced before the power down mode is invok ed, and that VDD
is restored to its normal operating level, before the power down mode is terminated. Table 7 gives
a general overview of the entry and exit procedures of the power saving modes.
Table 7
Power Saving Modes Overview
Mode Entering
2-Instruction
Example
Leaving by Remarks
Idle mode ORL PCON, #01H
ORL PCON, #20H Ocurrence of an
interrupt from a
peripheral unit
CPU clock is stopped;
CPU maintains their data;
peripheral units are active (if
enabled) and provided with
clock
Hardware Reset
Power Down Mode ORL PCON, #02H
ORL PCON, #40H Hardware Reset Oscillator is stopped;
contents of on-chip RAM and
SFR’s are maintained;
Short low pulse at
pin P3.2/INT0 or
activity on the USB
bus
Semiconductor Group 36
C541U
OTP Memory Operation
The C541U contains a 8k byte one-time programmable (OTP) program memory. With the C541U
fast programming cycles are achieved (1 byte in 100 µsec). Also several levels of OTP memory
protection can be selected.
For programming of the device, the C541U must be put into the programming mode. This typically
is done not in-sys tem but in a special programming hardware. In the programmi ng mode the C541U
operates as a slave device similar as an EPROM standalone memory device and must be controlled
with address/da ta information, control lines, and an external 11.5V programming voltage. Figure 19
shows the pins of the C541U-1E which are required for control ling of the OTP programmin g mode .
Figure 19
Programming Mode Configuration
Port 0 D0-D7
VDD VSS
C541U PROG
A0-A7 / Port 2
EA/VPP
PMSEL0
PSEL
RESET
PSEN
PMSEL1 PRD
A8-A12
PALE
XTAL1
XTAL2
Semiconductor Group 37
C541U
Pin Configuration in Programming Mode
Figure 20
Pin Configuration of the C541U in Programming Mode (Top View)
6
7
8
9
10
11
12
13
14
15
16
17
5 4 3 2 1 4443424140
39
38
37
36
35
34
33
32
31
30
29
18 19 20 21 22 23 24 25 26 27
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
VDD
VSS
PMSEL0
N.C.
PMSEL1
PSEL
PRD
PALE
RESET
D3
N.C.
D2
D1
D0
D4
D5
D6
D7
EA/VPP
N.C.
PSEN
A7
A6
A5
PROG
28
GND
GND
XTAL2
XTAL1
VSS
VDD
A0/A8
A1/A9
A2/A10
A3/A11
A4/A12
Programming
Mode
C541U
GND
Semiconductor Group 38
C541U
The following table 8 contains the functional de scription of all C541U-1E pins which are required for
OTP memory programming.
Table 8
Pin Definitions and Functions in Programming Mode
Symbol Pin Num-
bers I/O*) Function
P-LCC-44
RESET 10 I Reset
This input must be at static “1“ (active) level during the whole
programming mode.
PMSEL0
PMSEL1 11
13 I
IProgramming mode selection pins
These pins are used to select the different access modes in
programming mode. PMSEL1,0 must satisfy a setup time to the
rising edge of PALE. When the logic level of PMSEL1,0 is changed,
PALE must be at low level.
PSEL 14 I Basic programming mode select
This input is used for the basic programming mode selection and
must be switched according figure 10-21.
PRD 15 I Programming mode read strobe
This input is used for read access control for OTP memory read,
version byte read, and lock bit read operations.
PALE 16 I Programming mode address latch enable
PALE is used to latch the high address lines. The high address
lines must satisfy a setup and hold time to/from the falling edge of
PALE. PALE must be at low level whenever the logic level of
PMSEL1,0 is changed.
XTAL2 20 O XTAL2
Output of the inverting oscillator amplifier.
XTAL1 21 I XTAL1
Input to the oscillator amplifier.
*) I = Input
O = Output
PMSEL
1PMSEL
0Access Mode
00Reserved
0 1 Read version bytes
1 0 Program/read lock bits
1 1 Program/read OTP memory byt
e
Semiconductor Group 39
C541U
A0/ A8 -
A7 24 - 31 I Address lines
P2.0-7 are used as multiplexed address input lines A0-A7 and A8-
A12. A8-A12 must be latched with PALE.
PSEN 32 I Program store enable
This input must be at static “0“ level duri ng the whole programming
mode.
PROG 33 I Programming mode write strobe
This input is us ed i n prog rammi ng m ode as a wri te s trobe for OTP
memory program and lock bit write operations During basic
programming mode selection a low level must be applied to PROG.
EA/VPP 35 I External Access / Programming voltage
This pin must be at 11.5 V (VPP) voltage level during programmin g
of an OTP memory byte or lock bit. During an OTP memory read
operation this pin must be at high level (VIH). This pin is also used
for basic programming mode selection. At basic programming
mode selection a low level must be applied to EA/VPP.
D0 - 7 43 - 36 I/O Data lines 0-7
During programming mode, data bytes are read or written from or
to the C541U via the bidirectional D0-7 lines which are located at
port 0.
VSS 9, 22 Circuit ground potential
must be applied to these pins in programming mode.
VDD 8, 23 Power supply terminal
must be applied to these pins in programming mode.
N.C. 1 - 7, 12,,
34, 44 Not Connected
These pins should not be connected in programming mode.
GND 17 - 19 I Ground pins
In programming mode these pins must be connected to VIL level.
*) I = Input
O = Out put
Table 8
Pin Definitions and Functions in Programming Mode (cont’d)
Symbol Pin Num-
bers I/O*) Function
P-LCC-44
Semiconductor Group 40
C541U
Basic Programmin g Mode Selection
The basic programming mode selection scheme is shown in figure 21.
Figure 21
Basic Programming Mode Selection
RESET
PSEN
PROG
EA/VPP
“1“
“0“
PSEL
“0“
VDD
Clock
(XTAL1/XTAL2)
5V
stable
PRD
PALE
“1“
“0“
Ready for acc es s
mode selection
During this period signals
are not actively driven
0V VIH1
VPP
PMSEL1,0 0,1
Semiconductor Group 41
C541U
Lock Bits Programming / Read
The C541U has two programmable lock bits which, when programmed acco rding tabie 10, provide
four levels of protection for the on-chip OTP code memory. The state of the lock bits can also be
read.
Table 9
Access Modes Selection
Access Mode EA/
VPP PROG PRD PMSEL Address
(Port 2) Data
(Port 0)
10
Program OTP memory byte VPP HH H A0-7
A8-15 D0-7
Read OTP memory byte VIH H
Program OTP lock bits VPP HH L –D1,D0 see
table 10
Read OTP lock bits VIH H
Read OTP version byte VIH H L H Byte addr.
of sign. byte D0-7
Table 10
Lock Bit Protection Types
Lock Bits at D1,D0 Protection
Level Protection Type
D1 D0
1 1 Level 0 The OTP lock feature is disabled. During normal operation of
the C541U, the state of the EA pin is not latched on reset.
1 0 Level 1 During normal operation of the C541U, MOVC instructions
executed from external program memory are disabled from
fetching code bytes from internal memory. EA is sa mpled and
latched on reset. An OTP memory read operation is only
possible using the OTP verification mode for protection level 1.
Further programming of the OTP memory is disabled
(reprogramming security).
0 1 Level 2 Same as level 1, but also OTP memory read operation using
OTP verification mode is disabled.
0 0 Level 3 Same as level 2; but additionally external code execution by
setting EA=low during normal operation of the C541U is no
more possible.
External code execution, which is initiated by an internal
program (e.g. by an internal jump instruction above the ROM
boundary), is still possible.
Semiconductor Group 42
C541U
Absolute Maximum Ratings
Note:Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage of the device. This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for longer
periods may affect device reliability. During absolute maximum rating overload conditions
(VIN >VDD or VIN <VSS) the voltage on VDD pins with respect to ground (VSS) must not exceed
the values defined by the absolute maximum ratings.
Operating Conditions
Parameter Symbol Limit Values Unit Notes
min. max.
Storage temperature TST 65 150 °C
Voltage on VDD p ins with respect
to ground (VSS)VDD –0.5 6.5 V–
Voltage on any pin with respect
to ground (VSS)VIN –0.5 VDD + 0.5 V–
Input current on any pin during
overload condition 10 10 mA
Absolute sum of all input
currents during overload
condition
| 100 | mA
Power dissipation PDISS –TBDW
Parameter Symbol Limit Values Unit Notes
min. max.
Supply voltage VDD 4.25 5.5 V
Ground voltage VSS 0V–
Ambient temperature TA070°C
CPU clock fCPU 212MHz
Semiconductor Group 43
C541U
DC Characteristics
(Operating Conditions apply)
Notes see next page
Parameter Symbol Limit Values Unit Test Condition
min. max.
Input low voltage (except EA,
RESET) VIL 0.5 0.2 VDD
0.1 V–
Input low voltage (EA)VIL1 0.5 0.2 VDD
0.3 V–
Input low voltage (RESET) VIL2 0.5 0.2 VDD +
0.1 V–
Input high volt age (except XTAL1,
RESET and EA)VIH 0.2 VDD +
0.9 VDD + 0.5 V
Input high voltage to XTAL1 VIH1 0.7 VDD VDD + 0.5 V
Input high voltage to RESET and
EA VIH2 0.6 VDD VDD + 0.5 V
Output low voltage
Ports 1, 2, 3
P1.0, P1.1, P3.0 VOL
0.45
0.45 V
VIOL = 1.6 mA 1)
IOL =10 mA 1)
Output low voltage (ALE, PSEN)VOL1 –0.45VIOL = 3.2 mA 1)
Output low voltage (Port 0) VOL2 –0.6VIOL = 3.2 mA 1)
Output high voltage (ports 1, 2, 3) VOH 2.4
0.9 VDD
VIOH =–80µA,
IOH =–10µA
Output high voltage (port 0 in
external bus mode, ALE, PSEN)VOH2 2.4
0.9 VDD
VIOH = 800 µA
IOH =–80µA 2)
Logic 0 input current (ports 1, 2 , 3) IIL –10 –60 µAVIN =0.45V
Logical 1-to-0 transition current
(ports 1, 2, 3) ITL –65 –650 µAVIN =2V
Input leakage current (port 0, EA)ILI ±1µA0.45<VIN <VDD
Pin capacitance CIO –10pFfc=1MHz,
TA=25°C 7)
Overload current IOV ± 5mA 6) 7)
Programming voltage VPP 10.9 12.1 V11.5 V ± 5%
Semiconductor Group 44
C541U
Power Supply Current
Notes :
1) Capac it ive loading o n ports 0 a nd 2 may c aus e spurious noise puls es t o be superimposed on the VOL of ALE
and port 3. The noise is due to external bus capacitance discharging into the port 0 and port 2 pins when these
pins make 1-to-0 transitions dur ing bus operation . In the worst case (capacitiv e loading > 100 pF), the noise
pulse on AL E line may exceed 0. 8 V. In such c ases it may be de sirable to qualif y ALE with a schmitt- trigger,
or use an address latch with a schmitt-trigger strobe input.
2) Capacitive loading on ports 0 and 2 may cause the VOH on ALE and PSEN to momentarily fall below the 0.9 VDD
specificat ion when the ad dres s lines are stabiliz ing.
3) IPD (power-down mo de) is m eas ured under following cond iti ons :
EA =Port 0=VDD ; XTAL2 = N.C.; XTAL1 = VSS ; RESET = VSS; all other pins are dis co nnected.
the USB transceiver is switched off;
4) IDD (active mode) is m eas ured with:
XTAL1 dr ive n w ith tCLCH , tCHCL =5ns, VIL =VSS +0.5V, VIH =VDD 0.5 V; XTAL2 = N.C.;
EA = RESET = Port 0 = Port 1 = VDD ; all other pins are dis c onnected.
IDD would be slightly higher if a crystal oscillator is used (appr. 1 mA ).
5) IDD (idle mode) is meas ured with all outpu t pin s disconnected and w it h all peripherals dis abled;
XTAL1 dr ive n w ith tCLCH , tCHCL =5ns, VIL =VSS + 0.5 V, VIH =VDD 0.5 V; XTAL2 = N.C.;
EA = RESET = Vss ; Port 0 = VDD ; all other pins are dis c onnected;
6) Overload conditions under operating conditions occur if the voltage on the respective pin exceeds the specified
operating range (i.e. VOV > VDD + 0.5 V or VOV < VSS - 0.5 V). The absolute sum of input currents on all port
pins ma y no t exc eed 50 mA. The supply voltage VDD and VSS must remain wit hin t he s pec if ied limits.
7) Not 100% tested, guaranteed by design characterization.
8) The typical IDD values are periodically m eas ured at TA = +25 °C but not 100% tested.
9) The maximum IDD values are meas ured under wors t ca se con dit ions (TA = 0 °C and VDD =5.5V)
Parameter Symbol Limit Values Unit Test Condition
typ. 8) max. 9)
Active mode 12 MHz IDD 25 30 mA 4)
Idle mode 12 MHz IDD 15 20 mA 5)
Power-down mode IPD 550µAVDD =25.5 V 3)
Semiconductor Group 45
C541U
AC Characteristics
(Operating Conditions apply)
(CL for port 0, ALE and PSEN outputs = 100 pF; CL for all other outputs = 80 pF)
Program Memory Characteristics
*) Interfacing the C541U to devices with float times up to 28 ns is permissible. This limited bus contention will not
cause any damage to port 0 drivers.
**) For correct function of the USB module the C541U must operate with 12 MHz external clock. The
microco nt roller (except the US B m odule) operates dow n to 2 MHz.
Parameter Symbol Limit Values Unit
10-MHz cl ock
Duty Cycle
0.4 to 0.6
Variable Clock
1/CLP = 2 MHz to
12 MHz **)
min. max. min. max.
ALE pulse width tLHLL 43 CLP - 40 ns
Address setup to ALE tAVLL 13 TCLHmin -20 ns
Address hold after ALE tLLAX 13 TCLHmin -20 ns
ALE to valid instruction in tLLIV 80 2 CLP - 87 ns
ALE to PSEN tLLPL 13 TCLLmin -20 ns
PSEN pulse width tPLPH 86 CLP+
TCLHmin -30 –ns
PSEN to valid instruction in tPLIV –51 CLP+
TCLHmin- 65 ns
Input instruction hold after PSEN tPXIX 00–ns
Input instruction float after PSEN tPXIZ *) –23 TCL
Lmin -10 ns
Address valid after PSEN tPXAV *) 28 TCLLmin - 5 ns
Address to valid instruction in tAVIV 140 2 CLP +
TCLHmin -60 ns
Address float to PSEN tAZPL 0 0–ns
Semiconductor Group 46
C541U
AC Characteristics (cont’d)
External Data Memory Characteristics
Parameter Symbol Limit Values Unit
10-MHz
clock
Duty Cycle
0.4 to 0.6
Variable Clock
1/CLP= 2 MHz to 12 MHz
min. max. min. max.
RD pulse width tRLRH 180 3 CLP - 70 ns
WR pulse width tWLWH 180 3 CLP - 70 ns
Address hold after ALE tLLAX2 56 CLP - 27 ns
RD to valid data in tRLDV –110 2 CLP+
TCLHmin - 90 ns
Data hold after RD tRHDX 00ns
Data float after RD tRHDZ 63 CLP - 20 ns
ALE to valid data in tLLDV 200 4 CLP - 133 ns
Address to valid data in tAVDV 211 4 CLP +
TCLHmin -155 ns
ALE to WR or RD tLLWL 66 166 CLP +
TCLLmin - 50 CLP+
TCLLmin+ 50 ns
Address valid to WR tAVWL 70 2 CLP - 97 ns
WR or RD high to ALE high tWHLH 858TCL
Hmin - 25 TCLHmin + 25 ns
Data valid to WR transition tQVWX 8–TCL
Lmin - 25 ns
Data setup before WR tQVWH 163 3 CLP +
TCLLmin - 120 –ns
Data hold after WR tWHQX 8–TCL
Hmin - 25 ns
Address float after RD tRLAZ –0– 0 ns
Semiconductor Group 47
C541U
AC Characteristics (cont’d)
External Clock Drive Characteristics
Parameter Symbol CPU Clock = 12 MHz
Duty cycle 0.4 to 0.6 Variable CPU Clock
1/CLP = 2 to 12 MHz Unit
min. max. min. max.
Oscillator period CLP 83.3 83.3 83.3 500 ns
High time TCLH33 33 CLP-TCLLns
Low time TCLL33 33 CLP-TCLHns
Ri se time tR 12 12 ns
Fall time tF 12 12 ns
Oscillator duty cycle DC 0.4 0.6 33 / CLP 1 - 33 / CLP
Clock cycle TCL 33 50 CLP * DCmin CLP * DC max ns
SSC Interface Characteristics
Parameter Symbol Limit Values Unit
min. max.
Clock Cycle Time : Master Mode
Slave Mode tSCLK
tSCLK
667
667
ns
ns
Clock high time tSCH 300 ns
Clock low time tSCL 300 ns
Data output delay tD 100 ns
Data output hold tHO 0–ns
Data input setup tS100 ns
Data input hold tHI 50 ns
TC bit set delay tDTC –8 CLPns
SLS low to first SCLK clock edge tSC 2 tCLCL –ns
Last SCLK clock edge to SLS high tCS tCLCL –ns
SLS low to STO activ e tTS 0 100 ns
SLS high to STO tristate tST 100 ns
Data output d elay (al ready defin ed) tD 100 ns
Semiconductor Group 48
C541U
Figure 22
Program Memory Read Cycle
MCT00096
ALE
PSEN
Port 2
LHLL
t
A8 - A15 A8 - A15
A0 - A7 Instr.IN A0 - A7
Port 0
t
AVLL PLPH
t
t
LLPL
t
LLIV
t
PLIV
t
AZPL
t
LLAX
t
PXIZ
t
PXIX
t
AVIV
t
PXAV
Semiconductor Group 49
C541U
Figure 23
Data Memory Read Cycle
MCT00097
ALE
PSEN
Port 2
WHLH
t
Port 0
RD
t
LLDV
t
RLRH
t
LLWL
t
RLDV
t
AVLL
t
LLAX2
t
RLAZ
t
AVWL
t
AVDV
t
RHDX
t
RHDZ
A0 - A7 from
Ri or DPL from PCL
A0 - A7 Instr.
IN
Data IN
A8 - A15 from PCHP2.0 - P2.7 or A8 - A15 from DPH
Semiconductor Group 50
C541U
Figure 24
Data Memory Write Cycle
Figure 25
External Clock Drive on XTAL1
MCT00098
ALE
PSEN
Port 2
WHLH
t
Port 0
WR
t
WLWH
t
LLWL
t
QVWX
t
AVLL
t
LLAX2
t
QVWH
t
AVWL
t
WHQX
A0 - A7 from
Ri or DPL from PCL
A0 - A7 Instr.IN
Data OUT
A8 - A15 from PCHP2.0 - P2.7 or A8 - A15 from DPH
TCL
H
TCL
L
CLP
t
R
t
F
0.2
V
CC
0.7
CC
V
- 0.1
MCT03310
XTAL1 VDD
VDD
Semiconductor Group 51
C541U
Figure 26
SSC Master Mode Timing
Notes : Shown is the data/clock relationship for CPOL=CPHA=1. The timing diagram is valid for the other
cases acc ordingly.
In the c as e of slave m ode and CP H A=0, the out put delay for th e M SB applie s to the fallin g edge
of SLS (if transmitter is ena bled).
In the case of master mode and CPHA=0, the MSB becomes valid after the data has been written
into the sh ift register, i.e. at lea s t on e half SC LK clock cycle bef ore t he f irs t cloc k tra ns iti on.
Semiconductor Group 52
C541U
Figure 27
SSC Slave Mode Timing
t
SCLK SCH
t
SCL
t
SCLK (CPOL = 1)
SCLK (CPOL = 0)
SLS
STO (CPHA = 0)
STO (CPHA = 1)
t
TS
t
D
t
D
t
D
D
tt
D
t
ST
CS
t
SC
t
DOUT 7 DOUT 0
DOUT 7 DOUT 1 DOUT 0
MCT03390
Semiconductor Group 53
C541U
AC Characteristics of Programming Mode
VDD = 5 V ±10 %; VPP = 11.5 V ±5%; TA = 25 °C ±10 °C
Parameter Symbol Limit Values Unit
min. max.
ALE pulse width tPAW 35 ns
PMSEL setup to ALE rising edge tPMS 10
Addr ess setup to AL E, PRO G, or PRD falling
edge tPAS 10 ns
Address hold after ALE, PROG, or PRD
falling edge tPAH 10 ns
Address, data setup to PROG or PRD tPCS 100 ns
Address, data hold after PROG or PRD tPCH 0–ns
PMSEL setup to PROG or PRD tPMS 10 ns
PMSEL hold after PROG or PRD tPMH 10 ns
PROG pulse width tPWW 100 µs
PRD pulse width tPRW 100 ns
Address to valid data out tPAD –75ns
PRD to valid data out tPRD –20ns
Data hold after PRD tPDH 0–ns
Data float after PRD tPDF –20ns
PROG high between two consecutive PROG
low pulses tPWH1 1–µs
PRD high between two consecutive PRD low
pulses tPWH2 100 ns
XTAL clock period tCLKP 83.3 500 ns
Semiconductor Group 54
C541U
Figure 28
Programming Code Byte - Write Cycle Timing
t
PAW
t
PMS
PAH
t
PAS
t
A8-A13 A0-A7
D0-D7
PCS
t
PWW
t
PCH
t
t
PWH
MCT03369
H, H
PALE
PMSEL1,0
Port 2
Port 0
PROG
Semiconductor Group 55
C541U
Figure 29
Verify Code Byte - Read Cycle Timing
t
PAW
t
PMS
PAH
t
PAS
t
A8-13 A0-7
PAD
t
D0-7
t
PDH
t
PDFPRD
t
PCS
t
PRW
t
PCH
t
t
PWH
MCT03392
H, H
PALE
PMSEL1,0
Port 2
Port 0
PRD
Notes: PROG must be high during a programming read cycle.
Semiconductor Group 56
C541U
Figure 30
Lock Bit Access Timing
Figure 31
Version Byte Read Timing
H, L H, L
D0, D1 D0, D1
t
PCS
PMS
t
PMH
t
t
PCH
PWW
t
PMS
t
PRD
tt
PDH
PDF
t
PMH
t
PRW
t
MCT03393
PMSEL1,0
Port 0
PROG
PRD
PALE should be low during a lock bit read / write cycle.Note:
e. g. FD
D0-7
t
PCS
PMS
t
t
PDH
PDF
t
PMH
t
MCT03394
Port 2
Port 0
PRD
PMSEL1,0 L, H
H
PRW
t
PRD
t
PCH
t
PROG must be high during a programming read cycle.Note:
Semiconductor Group 57
C541U
OTP Verification Characteristics
OTP Verification Mode for Protection Level 1
Figure 32
OTP Verification Mode for Protection Level 1
Parameter Symbol Limit Values Unit
min. typ max.
ALE pulse width tAWD –2 tCLCL –ns
ALE period tACY 12 tCLCL –ns
Data valid after ALE tDVA ––4 tCLCL ns
Data stable after ALE tDSA 8 tCLCL ––ns
P3.5 setup to ALE low tAS tCLCL –ns
Oscillator frequency 1/tCLCL 4–6MHz
MCT02613
t
ACY
t
AWD
t
DSA
DVA
t
t
AS
Data Valid
ALE
Port 0
P3.5
Semiconductor Group 58
C541U
USB Transceiver Characteristics
(Operating Conditions apply)
Notes :
1) This value includes an ex te rnal resistor of 30 ± 1% (see “Load for D +/ D -“ diagram for tes tin g det ails)
2) The c rossover p oint is in t he range of 1.3V to 2.0V for t he high s peed m ode with a 50pF c apacitanc e. In the
low-speed mode with a 100pF or greate r ca pac it ance, the cross ov er point is in the range of 1.3V to 2.0V.
Parameter Symbol Limit Values U nit Test Condition
min. max.
Output impedance (high state) RDH 28 43 1)
Output impedance (low state) RDL 28 51
Input leakage current I I –± 5µAVIN = VSS or VDD
Tristate output off-state current I OZ –± 10µAVOUT = VSS or VDD 1)
Crossover point VCR 1.3 2.0 V 2)
Parameter Symbol Limit Values Unit
min. max.
High speed mode rise time tFR 420ns
High speed mode fall time tFF 420ns
Low speed mode rise time tLR 75 300 ns
Low speed mode fall time tLF 75 300 ns
Semiconductor Group 59
C541U
Figure 33
AC Testing: Input, Output Waveforms
Figure 34
AC Testing : Float Waveforms
Figure 35
Load for D+/D-
VDD
V
DD
V
DD
AC Inputs during testing are driven at VDD - 0.5 V for a logic ’1’ and 0.45 V for a logic ’0’.
Timing measurements are made at VIHmin for a logic ’1’ and VILmax for a logic ’0’.
For timing purposes a port p in is no l onger fl oating when a 100 mV change from load voltage
occurs and begins to float when a 100 mV change from the loaded VOH/VOL level occurs.
IOL/IOH ≥±20 mA
Test Point
30 k
15 k
D.U.T
C
L
2.8 V
1.5 k *)
S1
MCS03425
C
L
L
C
L
C
= 50 pF, full speed
= 50 pF, low speed (min. timing)
= 350 pF, low speed (max. timing)
*) 1.5 kon D- (low speed) or D+ (full speed) only
Test S1
D- / LS
D+ / LS
D- / FS
D+ / FS
Open
Open
Close
Close
3.3V
27
D.U.T.
D+/D-
Semiconductor Group 60
C541U
Figure 36
Recommended Oscillator Circuits for Crystal Oscillator
Figure 37
Recommended External Capacitor for On-Chip USB Transceiver
MCS03426
C
C
2 - 12
MHz
XTAL2
XTAL1 XTAL1
XTAL2
N.C.
External Oscillator
Signal
Crystal Oscillator Mode Driving from External Source
Crystal Mode: C = 20 pF 10 pF
(Incl. Stray Capacitance)
C541U
2
VSS
C = 6.8nF
9
Semiconductor Group 61
C541U
Figure 38
P-LCC-44-1 Package Outline
Plastic Package, P-LCC-44-1 (SMD)
(Plastic Leaded Chip Carrier Package)
GPL05102
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information” Dimensions in mm
SMD = Surface Mounted Device