LM3678SD-1.2/NOPB - NATIONAL SEMICONDUCTOR

LM3678

LM3678 High-Performance, Miniature 1.5A Step-Down DC-DC Converter for

Handheld Applications

Literature Number: SNVS464B

January 8, 2009

LM3678 High-Performance, Miniature 1.5A Step-Down DC-

DC Converter for Handheld Applications

General Description

The LM3678 step-down DC-DC converter is optimized for

powering low voltage circuits from a single Li-Ion cell battery

and input voltage rails from 2.5V to 5.5V. It provides up to 1.5A

load current, over the entire input voltage range. LM3678 of-

fers a 0.8V/1.2V option. One of the pair of voltages is set

through the VSELECT pin.

LM3678 operates in PWM mode with a fixed frequency of

3.3MHz. Internal synchronous rectification provides high ef-

ficiency during PWM mode operation. In shutdown mode, the

device turns off and reduces battery consumption to 0.01µA

(typ).

The LM3678 is available in a 3mm x 3mm LLP-10 package.

A high switching frequency of 3.3MHz (typ.) allows use of tiny

surface-mount components. Only three external surface-

mount components, an inductor and two ceramic capacitors,

are required (solution size less than 33 mm2). For voltages

other than the voltage shown, please refer to ordering infor-

mation section or contact National Semiconductor.

Features

■VOUT = 0.8V/1.2V

■VIN = 2.5V to 5.5V

■1.5A maximum load capability

■3.3MHz PWM fixed switching frequency (typ.) allows the

use of 1µH inductor

■+/- 3% DC output voltage precision

■0.01µA typical shutdown current

■Internal synchronous rectification for high efficiency

■Internal soft start

■Current overload and thermal shutdown protection

Applications

■PDAs and Smart Phones

■Personal Media Players

■W-LAN

■USB Modem Applications

■Digital still cameras

■Portable Hard disk drives

Typical Application Circuit

20204501

Note: VSEL H = 1.2V, VSEL L = 0.8V

Efficiency vs. Output Current

( VOUT = 1.2V)

20204504

FIGURE 1.

LM3678 High-Performance, Miniature 1.5A Step-Down DC-DC Converter for Handheld

Applications

Functional Block Diagram

20204505

FIGURE 2. LM3678 Block Diagram

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LM3678

Connection Diagram and Package Mark Information

20204502

Top View

20204503

Bottom View

Pin Descriptions

Pin # Name Description

1 GND Power Ground pin.

2 GND Analog Ground Pin

3 SW Switching node connection to the internal PFET switch and NFET synchronous rectifier

4 VDD Analog supply input. Connect to the input filter capacitor (Figure 1).

5 VDD Power supply Input. Connect to the input filter capacitor (Figure 1).

6 VSELECT Output voltage select ( For example)

VSELECT = LOW, VOUT = 0.8V

VSELECT = HIGH , VOUT = 1.2V

7 PGOOD Power Good Flag. This commom drain logic output is pulled to ground when the output

voltage is not within +/-7.5% of regulation.

8 PWM Connect PWM pin to VIN.

9 EN Enable pin. The device is in shutdown mode when voltage to this pin is <0.4V and enabled

when >1.0V. Do not leave this pin floating.

10 FB Feedback analog input. Connect directly to the output filter capacitor for fixed voltage

versions.

DAP DAP Die Attach Pad, connect the DAP to GND on PCB layout to enhance thermal

performance. It should not be used as a primary ground connection.

Ordering Information

Voltage Option Order Number Package Marking Supplied As

0.8V/1.2V

LM3678SDE-1.2 S021B 250 units, Tape-and-Reel

LM3678SD-1.2 S021B 1000 units, Tape-and-Reel

LM3678SDX-1.2 S021B 4500 units, Tape-and-Reel

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LM3678

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

VIN Pin: Voltage to GND −0.2V to 6.0V

EN Pin: −0.2V to 6.0V

FB, SW Pin: (GND−0.2V) to

(VIN + 0.2V)

Continuous Power Dissipation

(Note 3)

Internally Limited

Junction Temperature (TJ-MAX) +150°C

Storage Temperature Range −65°C to +150°C

Maximum Lead Temperature

(Soldering, 10 sec.)

260°C

Operating Ratings (Notes 1, 2)

Input Voltage Range 2.5V to 5.5V

Recommended Load Current 0mA to 1.5A

Junction Temperature (TJ) Range −30°C to +125°C

Ambient Temperature (TA) Range (Note

−30°C to +85°C

Thermal Properties

Junction-to-Ambient Thermal

Resistance (θJA) (LLP-10) for

4 layer board (Note 5)

49.8°C/W

Electrical Characteristics (Notes 2, 6, 8) Limits in standard typeface are for TJ = 25°C. Limits in boldface type

apply over the full operating ambient temperature range (−30°C ≤ TA ≤ +85°C). Unless otherwise noted, specifications apply to

the LM3678 Typical Application Circuit (pg. 1) with VIN = EN = 3.6V

Symbol Parameter Condition Min Typ Max Units

VFB Feedback Voltage VSELECT = Low & High -3 +3 %

VREF Internal Reference Voltage (Note 7) 0.5 V

RDSON (P) Pin-Pin Resistance for PFET VIN= VGS= 3.6V 150 200 mΩ

RDSON (N) Pin-Pin Resistance for NFET VIN= VGS= 3.6V 110 150 mΩ

ILIM Switch Peak Current Limit Open loop 1.9 2.15 2.4 A

ISHDN Shutdown Supply Current EN = 0V 1 µA

VIH Logic High Input for EN & VSELECT VIN = 3.6V 1.2 V

VIL Logic Low Input for EN & VSELECT VIN = 3.6V 0.4 V

IEN Enable (EN) Input Current 0.01 1µA

FOSC Internal Oscillator Frequency PWM Mode 2.7 3.3 3.6 MHz

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of

the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see

the Electrical Characteristics tables.

Note 2: All voltages are with respect to the potential at the GND pin.

Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 150°C (typ.) and disengages at

TJ= 130°C (typ.).

Note 4: In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to be derated.

Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), the maximum power dissipation of the device in

the application (PD-MAX) and the junction to ambient thermal resistance of the package (θJA) in the application, as given by the following equation: TA-MAX= TJ-MAX

− (θJAx PD-MAX).

Note 5: Junction to ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation exists, special care

must be given to thermal dissipation issues in board design.

Note 6: Refer to datasheet curves for closed loop data and its variation with regards to supply voltage and temperature. Electrical Characteristic table reflects

open loop data (FB=0V and current drawn from SW pin ramped up until cycle by cycle current limit is activated). Closed loop current limit is the peak inductor

current measured in the application circuit by increasing output current until output voltage drops by 10%.

Note 7: Min and Max limits are guaranteed by design, test or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.

Note 8: The parameters in the electrical characteristic table are tested at VIN= 3.6V unless otherwise specified. For performance over the input voltage range

refer to datasheet curves.

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LM3678

Typical Performance Characteristics

LM3678SD, Circuit of Figure 1, VIN= 3.6V, VOUT= 1.2V, CIN = 10µF, COUT = 22µF, and TA= 25°C, unless otherwise noted.

Quiescent Supply Current vs. Temperature

20204533

Switching Frequency vs. Temperature

20204535

NFET_ RDSON vs. Temperature

20204536

PFET_RDSON vs. Temperature

20204537

ILIMIT vs. Temperature (Open Loop)

20204538

Efficiency PWM Mode vs. ILOAD (0.8V)

20204522

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LM3678

Efficiency PWM Mode vs. ILOAD (1.2V)

20204523

Line Transient Response

(VOUT = 0.8V, LOAD = 500mA)

20204552

Line Transient Response

(VOUT = 1.2V, LOAD = 500mA)

20204553

Load Transient Response

(VIN = 3.6V, VOUT = 1.2V, Load Step 0 ↔ 500mA)

20204513

Load Transient Response

(VIN = 3.6V, VOUT = 0.8V, Load Step 0 ↔ 500mA)

20204514

Load Transient Response

(VIN = 3.6V, VOUT = 0.8V, Load Step 500mA ↔ 1A)

20204515

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LM3678

Load Transient Response

(VIN = 3.6V, VOUT = 1.2V, Load Step 500mA ↔ 1A)

20204520

VSELECT Transient Response

(VIN = 3.6V, LOAD = 500mA)

20204541

VSELECT Transient Response

(VIN = 3.6V, No LOAD)

20204542

VSELECT Transient Response

(VIN = 3.6V, LOAD = 1A)

20204547

Start Up

(VIN = 3.6V, VOUT = 1.2V, LOAD = 1A)

20204550

Start Up

(VIN = 3.6V, VOUT = 1.2V, LOAD = 500mA)

20204551

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LM3678

Switching Waveform

(VOUT = 1.2V, LOAD = 1A)

20204556

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LM3678

Operation Description

DEVICE INFORMATION

The LM3678, a high efficiency step down DC-DC switching

buck converter, delivers a constant voltage from a single Li-

Ion battery and input voltage rails from 2.5V to 5.5V to

portable devices such as cell phones and PDAs. Using a volt-

age mode architecture with synchronous rectification, the

LM3678 has the ability to deliver up to 1.5A depending on the

input voltage, output voltage, ambient temperature and the

inductor chosen.

Additional features include soft-start, under voltage protec-

tion, current overload protection, and thermal shutdown pro-

tection. As shown in Figure 1, only three external power

components are required for implementation.

The part uses an internal reference voltage of 0.5V. It is rec-

ommended to keep the part in shutdown until the input voltage

is 2.5V or higher.

CIRCUIT OPERATION

During the first portion of each switching cycle, the control

block in the LM3678 turns on the internal PFET switch. This

allows current to flow from the input through the inductor to

the output filter capacitor and load. The inductor limits the

current to a ramp with a slope of (VIN–VOUT)/L, by storing en-

ergy in a magnetic field.

During the second portion of each cycle, the controller turns

the PFET switch off, blocking current flow from the input, and

then turns the NFET synchronous rectifier on. The inductor

draws current from ground through the NFET to the output

filter capacitor and load, which ramps the inductor current

down with a slope of - VOUT/L.

The output filter stores charge when the inductor current is

high, and releases it when inductor current is low, smoothing

the voltage across the load.

The output voltage is regulated by modulating the PFET

switch on time to control the average current sent to the load.

The effect is identical to sending a duty-cycle modulated rect-

angular wave formed by the switch and synchronous rectifier

at the SW pin to a low-pass filter formed by the inductor and

output filter capacitor. The output voltage is equal to the av-

erage voltage at the SW pin.

PWM OPERATION

During device operation the converter operates as a voltage-

mode controller with input voltage feed forward. This allows

the converter to achieve good load and line regulation. The

DC gain of the power stage is proportional to the input voltage.

To eliminate this dependence, feed forward inversely propor-

tional to the input voltage is introduced.

The output voltage is regulated by switching at a constant

frequency and then modulating the energy per cycle to control

power to the load. At the beginning of each clock cycle the

PFET switch is turned on and the inductor current ramps up

until the comparator trips and the control logic turns off the

switch. The current limit comparator can also turn off the

switch in case the current limit of the PFET is exceeded. Then

the NFET switch is turned on and the inductor current ramps

down. The next cycle is initiated by the clock turning off the

NFET and turning on the PFET.

20204555

FIGURE 3. Typical PWM Operation

INTERNAL SYNCHRONOUS RECTIFICATION

The LM3678 uses an internal NFET as a synchronous rectifier

to reduce rectifier forward voltage drop and associated power

loss. Synchronous rectification provides a significant im-

provement in efficiency whenever the output voltage is rela-

tively low compared to the voltage drop across an ordinary

rectifier diode.

CURRENT LIMITING

A current limit feature allows the LM3678 to protect itself and

external components during overload conditions by imple-

menting current limiting with an internal comparator that trips

at 2.15A (typ). If the output is shorted to ground the device

enters a timed current limit mode where the NFET is turned

on for a longer duration until the inductor current falls below

a low threshold. This allows the inductor current more time to

decay, thereby preventing runaway.

SHUTDOWN MODE

Setting the EN input pin low (<0.4V) places the LM3678 in

shutdown mode. During shutdown the PFET switch, NFET

switch, reference, control and bias circuitry of the LM3678 are

turned off. Setting EN high (>1.0V) enables normal operation.

It is recommended to set EN pin low to turn off the LM3678

during system power up and undervoltage conditions when

the supply is less than 2.5V. Do not leave the EN pin floating.

SOFT START

The LM3678 has a soft-start circuit that limits in-rush current

during start-up. During start-up the switch current limit is in-

creased in steps. Soft start is activated only if EN goes from

logic low to logic high after VIN reaches 2.5V. Soft start is im-

plemented by increasing switch current limit in steps of

250mA, 500mA, 1A and 2A (typical switch current limit). The

start-up time thereby depends on the output capacitor and

load current demanded at start-up.

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LM3678

Inductor Selection

There are two main considerations when choosing an induc-

tor; the inductor should not saturate, and the inductor current

ripple should be small enough to achieve the desired output

voltage ripple. Different saturation current rating specifica-

tions are followed by different manufacturers so attention

must be given to details. Saturation current ratings are typi-

cally specified at 25°C. However, ratings at the maximum

ambient temperature of application should be requested from

the manufacturer. Shielded inductors radiate less noise and

should be preferred.

There are two methods to choose the inductor saturation cur-

rent rating.

Method 1:

The saturation current should be greater than the sum of the

maximum load current and the worst case average to peak

inductor current. This can be written as

•IRIPPLE: average to peak inductor current

•IOUTMAX: maximum load current (1.5A)

•VIN: maximum input voltage in application

•L : minimum inductor value including worst case

tolerances (30% drop can be considered for method 1)

•f : minimum switching frequency (2.7Mhz)

•VOUT: output voltage

For a more conservative approach, a 1µH inductor with a sat-

uration current rating of at least 2.5A is recommended for

most applications.

Input Capacitor Selection

A ceramic input capacitor of 10uF, 6.3V is sufficient for most

applications. Place the input capacitor as close as possible to

the VIN pin of the device. A larger value may be used for im-

proved input voltage filtering. Use X7R or X5R types; do not

use Y5V. DC bias characteristics of ceramic capacitors must

be considered when selecting case sizes like 0805 and 0603.

The input filter capacitor supplies current to the PFET switch

of the LM3678 in the first half of each cycle and reduces volt-

age ripple imposed on the input power source. A ceramic

capacitor’s low ESR provides the best noise filtering of the

input voltage spikes due to this rapidly changing current. Se-

lect a capacitor with sufficient ripple current rating. The input

current ripple can be calculated as:

TABLE 1. Suggest Inductors and Their Suppliers

Model Vendor Dimensions

LxWxH (mm)

D.C.R (max) ISAT

NR4012T1R0N Taiyo Yuden 4 x 4 x 1.2 60mΩ2.5A

LPS4012-102L Coilcraft 3.9 x 3.9 x 1.2 100mΩ2.5A

LPS4012-102L Coilcraft 3.9 x 3.9 x 1.8 40mΩ3.4A

Output Capacitor Selection

A ceramic output capacitor of 22µF, 6.3V is sufficient for most

applications. Use X7R or X5R types; do not use Y5V. DC bias

characteristics of ceramic capacitors must be considered

when selecting case sizes like 0805 and 0603. DC bias char-

acteristics vary from manufacturer to manufacturer and dc

bias curves should be requested from them as part of the ca-

pacitor selection process.

The output filter capacitor smooths out current flow from the

inductor to the load, helps maintain a steady output voltage

during transient load changes and reduces output voltage

ripple. These capacitors must be selected with sufficient ca-

pacitance and sufficiently low ESR to perform these functions.

The output voltage ripple is caused by the charging and dis-

charging of the output capacitor and by the RESR and can be

calculated as:

Voltage peak-to-peak ripple due to capacitance can be ex-

pressed as follow:

Voltage peak-to-peak ripple due to ESR can be expressed as

follow:

VPP-ESR = (2 * IRIPPLE) * RESR

Because these two components are out of phase the rms (root

mean squared) value can be used to get an approximate val-

ue of peak-to-peak ripple.

The peak-to-peak ripple voltage rms value can be expressed

as follow:

Note that the output voltage ripple is dependent on the induc-

tor current ripple and the equivalent series resistance of the

output capacitor (RESR).

The RESR is frequency dependent (as well as temperature

dependent); make sure the value used for calculations is at

the switching frequency of the part.

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LM3678

TABLE 2. Suggested Capacitors and Their Suppliers

Model Type Vendor Voltage Rating Case Size

Inch (mm)

10µF for CIN

GRM21BR60J106K Ceramic, X5R Murata 6.3V 0805 (2012)

JMK212BJ106K Ceramic, X5R Taiyo-Yuden 6.3V 0805 (2012)

C2012X5R0J106K Ceramic, X5R TDK 6.3V 0805 (2012)

22µF for COUT

JMK212BJ226MG Ceramic, X5R Taiyo-Yuden 6.3V 0805 (2012)

Board Layout Considerations

PC board layout is an important part of DC-DC converter de-

sign. Poor board layout can disrupt the performance of a DC-

DC converter and surrounding circuitry by contributing to EMI,

ground bounce, and resistive voltage loss in the traces. These

can send erroneous signals to the DC-DC converter IC, re-

sulting in poor regulation or instability.

Good layout for the LM3678 can be implemented by following

a few simple design rules below.

1. Place the LM3678, inductor and filter capacitors close

together and make the traces short. The traces between

these components carry relatively high switching

currents and act as antennas. Following this rule reduces

radiated noise. Special care must be given to place the

input filter capacitor very close to the VIN and GND pin.

2. Arrange the components so that the switching current

loops curl in the same direction. During the first half of

each cycle, current flows from the input filter capacitor

through the LM3678 and inductor to the output filter

capacitor and back through ground, forming a current

loop. In the second half of each cycle, current is pulled

up from ground through the LM3678 by the inductor to

the output filter capacitor and then back through ground

forming a second current loop. Routing these loops so

the current curls in the same direction prevents magnetic

field reversal between the two half-cycles and reduces

radiated noise.

3. Connect the ground pins of the LM3678 and filter

capacitors together using generous component-side

copper fill as a pseudo-ground plane. Then, connect this

to the ground-plane (if one is used) with several vias. This

reduces ground-plane noise by preventing the switching

currents from circulating through the ground plane. It also

reduces ground bounce at the LM3678 by giving it a low-

impedance ground connection.

4. Use wide traces between the power components and for

power connections to the DC-DC converter circuit. This

reduces voltage errors caused by resistive losses across

the traces.

5. Route noise sensitive traces, such as the voltage

feedback path, away from noisy traces between the

power components. The voltage feedback trace must

remain close to the LM3678 circuit and should be direct

but should be routed opposite to noisy components. This

reduces EMI radiated onto the DC-DC converter’s own

voltage feedback trace. A good approach is to route the

feedback trace on another layer and to have a ground

plane between the top layer and layer on which the

feedback trace is routed. In the same manner for the

adjustable part it is desired to have the feedback dividers

on the bottom layer.

6. Place noise sensitive circuitry, such as radio IF blocks,

away from the DC-DC converter, CMOS digital blocks

and other noisy circuitry. Interference with noise-

sensitive circuitry in the system can be reduced through

distance.

For detailed layout information, refer to Application Note 1722

LM3678 Evaluation Board.

In mobile phones, for example, a common practice is to place

the DC-DC converter on one corner of the board, arrange the

CMOS digital circuitry around it (since this also generates

noise), and then place sensitive preamplifiers and IF stages

on the diagonally opposing corner. Often, the sensitive cir-

cuitry is shielded with a metal pan and power to it is post-

regulated to reduce conducted noise, using low-dropout

linear regulators.

11 www.national.com

LM3678

Physical Dimensions inches (millimeters) unless otherwise noted

Non Pullback LLP-10, 0.5mm Pitch

NS Package Number SDA10A

The dimensions for X1, X2, and X3 are as given:

X1 = 3mm +/- 0.030mm

X2 = 3mm +/- 0.030mm

X3 = 0.800mm +/- 0.075mm

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LM3678

Notes

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LM3678

Notes

LM3678 High-Performance, Miniature 1.5A Step-Down DC-DC Converter for Handheld

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and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be

provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in

such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are

specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military

specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265