INTEGRATED CIRCUITS DIVISION
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DS-CPC1335-R07 1
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CPC1335
Single Pole OptoMOS® Relay with
Bi-directional Transient Protection
Part # Description
CPC1335P 8-Pin Flatpack (50/Tube)
CPC1335PTR 8-Pin Flatpack (1000/Reel)
Parameters Ratings Units
Blocking Voltage 350 VP
Load Current 100 mArms / mADC
On-Resistance (max) 35
LED Current to Operate 1 mA
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
• Meets Requirements of EN50130-4
(Installation Class 3)
• 3750Vrms Input/Output Isolation
• 100% Solid State
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Switching Characteristics
of Normally Open Devices
Peak Pulse Power VWM
600W 40.2V
Transient Protection Characteristics
• Security
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Aerospace
• Industrial Controls
The CPC1335 is a single-pole, normally open
(1-Form-A) solid state relay with bi-directional
transient voltage suppressor (TVS) relay protection,
which is designed to meet the requirements of
EN50130-4 (installation class 3).
The relay output is constructed with efficient
MOSFET switches that use IXYS Integrated Circuits
Division's patented OptoMOS architecture. The input,
a highly efficient GaAlAS infrared LED, controls the
optically coupled output.
The CPC1335 is available in an 8-pin, space-saving
surface-mount package.
Form-A
IF
ILOAD
10%
90%
ton toff
1
2
3
4
8
7
6
5
+ Control
– Control
TVS +/-
TVS -/+
Load
Load
INTEGRATED CIRCUITS DIVISION
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2R07
CPC1335
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1IF=2mA IL- - 100 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-resistance 2IL=100mA RON -2535
Off-State Leakage Current VL=350VPILEAK -- 1 A
Switching Speeds
Turn-On IF=2mA, VL=10V ton --10 ms
Turn-Off toff --10
Output Capacitance VL=50V, f=1MHz COUT -40 - pF
Input Characteristics
Input Control Current to Activate 3IL=100mA IF-- 1 mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Input to Output Capacitance - CI/O -3 - pF
1 Load current derates linearly from 100mA @ 25ºC to 70ma @ 85ºC
2 Measurement taken within 1 second of on-time
3 For applications requiring high temperature operation (greater than 60ºC) a minimum LED drive current of 3mA is recommended.
Electrical Characteristics: TVS
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics @ 25°C
Clamping Voltage IPP=9.3A VC- - 66.5 V
Reverse Breakdown Voltage I=1mA VBR 44.4 - - V
Reverse Leakage Current VWM=40.2V IL-- 5 A
Parameter Ratings Units
SSR Output Blocking Voltage 350 VP
TVS Working Voltage, Maximum (VWM) 40.2 V
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 1150 mW
SSR Output Power Dissipation 2400 mW
TVS Peak Pulse Power (PPP)
(IPP=9.3A, 10/1000s pulse)
600 W
Isolation Voltage, Input to Output 3750 Vrms
Operating Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
INTEGRATED CIRCUITS DIVISION
CPC1335
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R07
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
35
30
25
20
15
10
5
0
377 399 421 443388 410 432
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
Temperature (ºC)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=10mA
I
F
=5mA
LED Forward Current (mA)
0 1020304050
Turn-On Time (Ps)
0
500
1000
1500
2000
2500
3000
3500
Turn-On Time
vs. LED Forward Current
(TA=25ºC)
LED Forward Current (mA)
0 1020304050
Turn-Off Time (Ps)
462
464
466
468
470
472
474
476
Typical Turn-Off
vs. LED Forward Current
(TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.08
0.12
0.16
0.20
0.24
0.28
Typical LED Current to Operate
vs. Temperature
(IL=70mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (Ps)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Typical Turn-On Time
vs. Temperature
(VL=10V)
IF=1mA
IF=2mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (ms)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Typical Turn-Off Time
vs. Temperature
(VL=10V)
IF=1mA
IF=5mA
IF=2mA
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
0.50 0.70 0.90 1.100.60 0.80 1.00
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA, TA=25ºC)
0.26 0.30 0.34 0.380.360.320.28
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA, TA=25ºC)
0.35 0.45 0.550.30 0.40 0.50 0.60
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=100mA, TA=25ºC)
35
30
25
20
15
10
5
0
26 28 30 3227 29 31
Device Count (N)
Typical On-Resistance Distribution
(N=50, IL=120mA, TA=25ºC)
On-Resistance (:)
INTEGRATED CIRCUITS DIVISION
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4R07
CPC1335
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
On-Resistance (:)
Temperature (ºC)
Typical On-Resistance
vs. Temperature
(IF=3mA, IL=50mA)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-3 -2 -1 0 1 2 3
Typical Load Current
vs. Load Voltage
(IF=5mA, TA=25ºC)
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
I
F
= 5mA
I
F
= 2mA
Maximum Load Current
vs. Temperature
Blocking Voltage (VP)
-40
430
425
420
415
410
405
400
395
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
Leakage (PA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 5 & 6
(VL=350V)
Temperature (ºC) Time
Load Current (A)
10Ps
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100Ps 100ms 1s
10ms 10s 100s
Energy Rating Curve
Temperature (ºC)
-40 -20 0 20 40 60 80 100
TVS Breakdown Voltage (V)
45
46
47
48
49
50
51
52
TVS Diode Breakdown Voltage
vs. Temperature
(Pins 7 & 8)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
5
10
15
20
25
TVS Diode Leakage vs. Temperature
(Pins 7 & 8)
(VL=40V)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Peak Pulse Power (% PPP @ 25ºC)
0
20
40
60
80
100
120
TVS Derating Curve
Time (Ps)
1
PPP - Peak Pulse Current (% IPP)
0
10
20
30
40
50
60
70
80
90
100
110
TVS Pulse Waveform 10/1000 (Ps)
10 100 1000 104105106
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CPC1335
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R07
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1335P MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1335P 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1335-R07
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/16/2012
For additional information please visit our website at: www.ixysic.com
6
CPC1335
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
User Direction of Feed
P = 12.00
(0.472)
W = 16.00
(0.63)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1 = 2.00
(0.079)
K0 = 2.70
(0.106)
7.50
(0.295)
2.00
(0.079)
4.00
(0.157)
CPC1335P
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Mouser Electronics
Authorized Distributor
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