Pressure Freescale Semiconductor MPX4115A Rev 5, 1/2009 Media Resistant, Integrated Silicon Pressure Sensor for Manifold Absolute Pressure, Altimeter or Barometer Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPX4115A series is designed to sense absolute air pressure in altimeter or barometer (BAP) applications. Freescale's BAP sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high level analog output signal and temperature compensation. The small form factor and high reliability of on-chip integration makes the Freescale BAP sensor a logical and economical choice for application designers. Features * * * * * MPX4115A Series INTEGRATED PRESSURE SENSOR 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.8 V Output Application Examples * * * * * * Altimeter Barometer Aviation Altimeters Industrial Controls Engine Control Weather Stations and Weather Reporting Devices 1.5% Maximum Error Over 0 to 85C Ideally Suited for Microprocessor Interfacing or Microcontroller-Based Systems Temperature Compensated Over -40C to +125C Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package Available as Standard Fluorosilicone Gel (MPXA4115A, MPX4115A) or Media Resistant Gel (MPXAZ4115A) ORDERING INFORMATION Package Device Name Options Unibody Package (MPX4115A Series) MPX4115A Tray MPX4115AP Tray Case No. None 867-08 * # of Ports Single Dual * * 867B-04 MPX4115AS Tray 867E-03 Small Outline Package (Media Resistant Gel) (MPXAZ4115A Series) MPXAZ4115A6U Rails 482 * MPXAZ4115AC6U Rails 482A * MPXAZ4115A6T1 Tape and Reel 482 Small Outline Package (MPXA4115A Series) MPXA4115AC6U Rails 482A MPXA4115AP Tray 1369-01 * MPXA4115A6T1 Tape and Reel 482 MPXA4115A6U Rails 482 * * * * (c) Freescale Semiconductor, Inc., 2006-2009. All rights reserved. Gauge Pressure Type Differential Absolute Device Marking * * * MPX4115A * * * MPXAZ4115A * * * * MPXA4115A MPX4115AP MPX4115A MPXAZ4115A MPXAZ4115A MPXA4115AP MPXA4115A MPXA4115A Pressure UNIBODY PACKAGES MPX4115A CASE 867-08 MPX4115AP CASE 867B-04 MPX4115AS CASE 867E-03 SMALL OUTLINE PACKAGES MPXAZ4115A6U/T1 MPXA4115A6U/T1 CASE 482-01 MPXAZ4115AC6U MPXA4115AC6U CASE 482A-01 MPXA4115AP CASE 1369-01 MPX4115A 2 Sensors Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Symbol Min Typ Max Unit POP 15 -- 115 kPa VS 4.85 5.1 5.35 Vdc Io -- 7.0 10 mAdc Minimum Pressure Offset @ VS = 5.1 Volts(3) (0 to 85C) Voff 0.135 0.204 0.273 Vdc Full Scale Output @ VS = 5.1 Volts(4) (0 to 85C) VFSO 4.725 4.794 4.863 Vdc Full Scale Span @ VS = 5.1 Volts(5) (0 to 85C) VFSS 4.521 4.59 4.659 Vdc Accuracy(6) (0 to 85C) -- -- -- 1.5 %VFSS V/P -- 46 -- mV/kPa tR -- 1.0 -- ms Output Source Current at Full Scale Output lo+ -- 0.1 -- mAdc Warm-Up Time(8) -- -- 20 -- mSec -- -- 0.5 -- %VFSS Sensitivity Response Time Offset (7) Stability(9) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: TcSpan: TcOffset: Variation from Nominal: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. Output deviation over the temperature range of 0 to 85C, relative to 25C. Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX4115A Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Table 2. MAXIMUM RATINGS(1) Rating Symbol Value Unit PMAX 400 kPa Storage Temperature Tstg -40 to +125 C Operating Temperature TA -40 to +125 C Maximum Pressure (P1 > P2) 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 3 (Unibody) 2 (Small Outline Package) Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry 2 (Unibody) 3 (Small Outline Package) VOUT 1 (Unibody) 4 (Small Outline Package) Pins 4, 5, and 6 are NO CONNECTS for unibody package devices. Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package devices. Figure 1. Fully Integrated Pressure Sensor Schematic for Unibody Package and Small Outline Package MPX4115A 4 Sensors Freescale Semiconductor Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates an absolute sensing chip in the basic chip carrier (Case 867) and the small outline chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4115A series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and longterm reliability. Contact the factory for information regarding media compatibility in your application. Fluoro Silicone Gel Die Coat Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 3. (The output will saturate outside of the specified pressure range.) Fluoro Silicone Gel Die Coat Stainless Steel Metal Cover Die P1 Stainless Steel Steel Cap P1 Epoxy Plastic Case Wire Bond Die Wire Bond Thermoplastic Case Lead Frame Lead Frame Die Bond Absolute Element P2 Sealed Vacuum Reference Absolute Element Sealed Vacuum Reference Die Bond Figure 2. Cross-Sectional Diagram (not to scale) +5.1 V Output Vout Vs IPS 1.0 F 0.01 F GND 470 pF Figure 3. Recommended Power Supply Decoupling and Output Filtering (For output filtering recommendations, refer to Application Note AN1646.) 5.0 4.5 4.0 Output (Volts) 3.5 TRANSFER FUNCTION: Vout = Vs* (.009*P-.095) Error VS = 5.1 Vdc TEMP = 0 to 85C MAX 3.0 2.5 TYP 2.0 1.5 1.0 0.5 MIN 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 0 Pressure (ref. to sealed vacuum) in kPa Figure 4. Output versus Absolute Pressure MPX4115A Sensors Freescale Semiconductor 5 Pressure Transfer Function (MPX4115A) Nominal Transfer Value: Vout = VS (P x 0.009 - 0.095) (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.1 V 0.25 Vdc Temperature Error Band MPX4115A Series 4.0 3.0 Temperature Error Factor 2.0 Temp Multiplier - 40 0 to 85 +125 3 1 3 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0C to-40C and from 85C to 125C. Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 0.0 -1.0 20 40 60 80 100 120 Pressure (in kPa) -2.0 -3.0 Pressure 15 to 115 (kPa) Error (Max) 1.5 (kPa) MPX4115A 6 Sensors Freescale Semiconductor Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE The two sides of the pressure sensor are designated as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel, which protects the die from harsh media. The MPX pressure Part Number sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table: Case Type MPX4115A 867 Pressure (P1) Side Identifier Stainless Steel Cap MPX4115AP 867B Side with Part Marking MPX4115AS 867E Side with Port Attached 482 Side with Part Marking MPXAZ4115AC6U, MPXA4115AC6U 482A Side with Port Attached MPXA4115AP 1369 Side with Port Attached MPXAZ4115A6U/T1, MPXA4115A6U/T1 INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) MPX4115A Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. -BG 8 1 S DIM A B C D G H J K M N S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPX4115A 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS C R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30 NOM 30 NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN CASE 867-08 ISSUE N BASIC ELEMENT MPX4115A Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS -B- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A C DIM A B C D E F G J K N S V V PIN 1 PORT #1 POSITIVE PRESSURE (P1) 6 K J N 5 -T- 3 2 1 S G F E 4 D 6 PL 0.13 (0.005) M T B M INCHES MILLIMETERS MIN MAX MIN MAX 0.690 0.720 17.53 18.28 0.245 0.255 6.22 6.48 0.780 0.820 19.81 20.82 0.027 0.033 0.69 0.84 0.178 0.186 4.52 4.72 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.345 0.375 8.76 9.53 0.300 0.310 7.62 7.87 0.220 0.240 5.59 6.10 0.182 0.194 4.62 4.93 STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX CASE 867E-O3 ISSUE D STOVE PIPE PORT (AS) MPX4115A 10 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G PORTED (AP) MPX4115A Sensors Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G PORTED (AP) MPX4115A 12 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.008 (0.20) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) L D A1 DETAIL G 8 1 b 0.004 (0.1) NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. 8X F M E1 B T N K A P C A B 8X M 0.004 (0.1) DETAIL G C SEATING PLANE DIM A A1 b D E E1 e F K L M N P T INCHES MILLIMETERS MIN MAX MIN MAX 0.300 0.330 7.11 7.62 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.717 BSC 18.21 BSC 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.245 0.255 6.22 6.47 0.120 0.130 3.05 3.30 0.061 0.071 1.55 1.80 0.270 0.290 6.86 7.36 0.080 0.090 2.03 2.28 0.009 0.011 0.23 0.28 0.115 0.125 2.92 3.17 0 7 0 7 CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE MPX4115A Sensors Freescale Semiconductor 13 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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