MPX4115A
Rev 5, 1/2009
Freescale Semiconductor
© Freescale Semiconductor, Inc., 2006-2009. All rights reserved.
Pressure
Media Resistant, Integrated Silicon
Pressure Sensor for Manifold
Absolute Pressure, Altimeter or
Barometer Applications On-Chip
Signal Conditioned, Temperature
Compensated and Calibrated
The MPX4115A series is designed to sense absolute air pressure in
altimeter or barometer (BAP) applications. Freescale's BAP sensor integrates
on-chip, bipolar op amp circuitry and thin film resisto r networks to provide a
high level analog output signal and temperature compensation. The small form
factor and high reliability of on -chip integration makes the Freescale BAP
sensor a logical and economical choice for application designers.
Features
• 1.5% Maximum Error Over 0° to 85°C
• Ideally Suited for Microprocessor Interfacing or Microcontroller-Based Systems
• Temperature Compensated Over -40°C to +125°C
• Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package
• Available as Standard Fluorosilicone Gel (MPXA4115A, MPX4115A) or Media Resistant Gel (MPXAZ4115A)
ORDERING INFORMATION
Device Name Package
Options Case
No. # of Ports Pressure Type Device Marking
None Single Dual Gauge Differential Absolute
Unibody Package (MPX4115A Series)
MPX4115A Tray 867-08 • • MPX4115A
MPX4115AP Tray 867B-04 • • MPX4115AP
MPX4115AS Tray 867E-03 • • MPX4115A
Small Outline Package (Media Resistant Gel) (MPXAZ4115A Series)
MPXAZ4115A6U Rails 482 • • MPXAZ4115A
MPXAZ4115AC6U Rails 482A • • MPXAZ4115A
MPXAZ4115A6T1 Tape and Reel 482 • • MPXAZ4115A
Small Outline Package (MPXA4115A Series)
MPXA4115AC6U Rails 482A • • MPXA4115A
MPXA4115AP Tray 1369-01 • • MPXA4115AP
MPXA4115A6T1 Tape and Reel 482 • • MPXA4115A
MPXA4115A6U Rails 482 • • MPXA4115A
MPX4115A
INTEGRATED
PRESSURE SENSOR
15 to 115 kPa (2.2 to 16.7 psi)
0.2 to 4.8 V Output
Series
Application Examples
• Altimeter
• Barometer
• Aviation Altimeters
• Industrial Controls
• Engine Control
• Weather Stations and Weather
Reporting Devices
MPX4115A
Sensors
2Freescale Semiconductor
Pressure
MPX4115A
CASE 867-08 MPX4115AP
CASE 867B-04 MPX4115AS
CASE 867E-03
MPXAZ4115A6U/T1
MPXA4115A6U/T1
CASE 482-01
MPXAZ4115AC6U
MPXA4115AC6U
CASE 482A-01
SMALL OUTLINE PACKAGES
UNIBODY PACKAGES
MPXA4115AP
CASE 1369-01
MPX4115A
Sensors
Freescale Semiconductor 3
Pressure
Operating Characteristics
Table 1. Operating Chara cteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 3 required to meet electrical sp ecifications.)
Characteristic Symbol Min Typ Max Unit
Pressure Range(1)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
POP 15 — 115 kPa
Supply Voltage(2)
2. Device is ratiometric within this specified excitation range.
VS4.85 5.1 5.35 Vdc
Supply Current Io— 7.0 10 mAdc
Minimum Pressure Offset (0 to 85°C)
@ VS = 5.1 Volts(3)
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
Voff 0.135 0.204 0.273 Vdc
Full Scale Output (0 to 85°C)
@ VS = 5.1 Volts(4)
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
VFSO 4.725 4.794 4.863 Vdc
Full Scale Span (0 to 85°C)
@ VS = 5.1 Volts(5)
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
VFSS 4.521 4.59 4.659 Vdc
Accuracy(6) (0 to 85°C)
6. Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycle d to and from the
minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
———±1.5 %VFSS
Sensitivity V/P — 46 — mV/kPa
Response Time(7)
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
tR—1.0—ms
Output Source Current at Full Scale Output lo+ — 0.1 — mAdc
Warm-Up Time(8)
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
——20—mSec
Offset Stability(9)
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
——±0.5 — %VFSS
MPX4115A
Sensors
4Freescale Semiconductor
Pressure
Maximum Ratings
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
Figure 1. Fully Integrated Pressure Sens or Schematic
for Unibody Package and Small Ou tline Package
Table 2. MAXIMUM RATINGS(1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating Symbol Value Unit
Maximum Pressure (P1 > P2) PMAX 400 kPa
Storage Temperature Tstg -40 to +125 °C
Operating Temperature TA-40 to +125 °C
Sensing
Element
GND
VOUT
VS
Pins 4, 5, and 6 are NO CONNECTS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitr y
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline pac kage devices.
for unibody package devices.
3 (Unibody)
2 (Small Outline Package)
4 (Small Outline Package)
1 (Unibody)
3 (Small Outline Package)
2 (Unibody)
MPX4115A
Sensors
Freescale Semiconductor 5
Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates an absolute sensing chip in the basic
chip carrier (Case 867) and the small outline chip carrier
(Case 482). A fluorosilicone gel isolates the die surface and
wire bonds from the environment, while allowing the pressure
signal to be transmitted to the sensor diaphragm. The
MPX41 15A series pressure sensor operating characteristics,
and internal reliability and qualification tests are based on use
of dry air as the pressure media. Media, other than dry air,
may have adverse effects on sensor performance and long-
term reliability. Contact the factory for information regarding
media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller . Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3.
(The output will saturate outside of the specified pressure
range.)
Figure 2. Cross-Sectional Diagram (not to scale)
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For output filtering recomme ndations, refer to Application Note AN1646 .)
Figure 4. Output versus Absolute Pressure
Fluoro Silicone
Gel Die Coat
Die
P1 Metal Cover Epoxy Plastic
Case
Absolute Element
P2
Lead Frame
Wire Bond
Die
Bond
Stainless Steel
Sealed Vacuum Reference
P1
Fluoro Silicone
Gel Die Coat
Die
Steel Cap
Stainless Steel
Thermoplastic
Case
Die
Bond
Absolute Element
Sealed Vacuum Reference
Lead Frame
Wire Bond
+5.1 V
1.0 μF0.01 μF470 pFGND
Vs
Vout
IPS
Output
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
TRANSFER FUNCTION:
Vout = Vs* (.009*P-.095) ± Error
VS = 5.1 Vdc
TEMP = 0 to 85°C
Pressure (ref. to sealed vacuum) in kPa
TYP
MAX
MIN
5.0
4.5
3.5
4.0
3.0
2.5
2.0
1.5
1.0
0
0.5
Output (Volts)
MPX4115A
Sensors
6Freescale Semiconductor
Pressure
Nominal Transfer Value: Vout = VS (P x 0.009 - 0.095)
± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 5.1 V ± 0.25 Vdc
Transfer Function (MPX4115A)
MPX4115A Series
Temp Multiplier
- 40 3
0 to 85 1
+125 3
Temperature in °C
4.0
3.0
2.0
0.0
1.0
-40 -20 0 20 40 60 14012010080
Temperature
Error
Factor
Temperature Error Band
NOTE: The Temperature Multiplier is a linear response from 0°C to-40°C and from 85°C to 125°C.
Pressure Error (Max)
Error Limits for Pressure
3.0
2.0
1.0
-1.0
-2.0
-3.0
0.0 20 40 60 80 100 120 Pressure (in kPa)
Pressure Error (kPa)
15 to 115 (kPa) ±1.5 (kPa)
Pressure Error Band
MPX4115A
Sensors
Freescale Semiconductor 7
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor are designated as
the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel,
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positi ve differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table:
INFORMATION FOR USING THE SMALL OUTLIN E PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridgi ng and
shorting between solder pads.
Figure 5. SOP Footprint (Case 482)
Part Number Case Type Pressure (P1) Side Identifier
MPX4115A 867 Stainless Steel Cap
MPX4115AP 867B Side with Part Marking
MPX4115AS 867E Side with Port Attached
MPXAZ4115A6U/T1, MPXA4115A6U/T1 482 Side with Part Marking
MPXAZ4115AC6U, MPXA4115AC6U 482A Side with Port Attached
MPXA4115AP 1369 Side with Port Attached
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm SCALE 2:1
MPX4115A
Sensors
8Freescale Semiconductor
Pressure PACKAGE DIMENSIONS
S
D8 PL
G
4
5
8
1
S
B
M
0.25 (0.010) A S
T
-A-
-B-
N
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A10.540.4250.415 10.79
B10.540.4250.415 10.79
C5.380.2300.212 5.84
D0.960.0420.038 1.07
G0.100 BSC 2.54 BSC
H0.002 0.010 0.05 0.25
J0.009 0.011 0.23 0.28
K0.061 0.071 1.55 1.80
M0˚ 7˚ 0˚ 7˚
N0.405 0.415 10.29 10.54
S0.709 0.725 18.01 18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
W
C
M
J
K
V
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A10.540.4250.415 10.79
B10.540.4250.415 10.79
C12.700.5200.500 13.21
D0.960.0420.038 1.07
G0.100 BSC 2.54 BSC
H0.002 0.010 0.05 0.25
J0.009 0.011 0.23 0.28
K0.061 0.071 1.55 1.80
M0˚ 7˚ 0˚ 7˚
N0.444 0.448 11.28 11.38
S0.709 0.725 18.01 18.41
V0.245 0.255 6.22 6.48
W0.115 0.125 2.92 3.17
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
S
D8 PL
G
4
5
8
1
S
B
M
0.25 (0.010) AT
-A-
-B-
N
S
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX4115A
Sensors
Freescale Semiconductor 9
Pressure
PACKAGE DIMENSIONS
PIN 1
F
G
NL
R
123456
6 PL
D
SEATING
PLANE -T-
M
A
M
0.136 (0.005) T
POSITIVE PRESSURE
(P1)
C
B
M
J
S
-A-
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
MAX
MILLIMETERSINCHES
16.00
13.56
5.59
0.84
1.63
0.100 BSC 2.54 BSC
0.40
18.42
30˚ NOM 30˚ NOM
12.57
11.43
DIM
A
B
C
D
F
G
J
L
M
N
R
S
MIN
0.595
0.514
0.200
0.027
0.048
0.014
0.695
0.475
0.430
0.090
MAX
0.630
0.534
0.220
0.033
0.064
0.016
0.725
0.495
0.450
0.105
MIN
15.11
13.06
5.08
0.68
1.22
0.36
17.65
12.07
10.92
2.29 2.66
NOTES:
1.
2.
3.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
CASE 867-08
ISSUE N
BASIC ELEMENT
MPX4115A
Sensors
10 Freescale Semiconductor
Pressure PACKAGE DIMENSIONS
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
INCHES
0.100 BSC
MILLIMETERS
2.54 BSC
DIM
A
B
C
D
E
F
G
J
K
N
S
V
MIN
0.690
0.245
0.780
0.027
0.178
0.048
0.014
0.345
0.300
0.220
0.182
MAX
0.255
0.820
0.033
0.186
0.064
0.016
0.375
0.310
0.240
0.720
0.194
MIN
17.53
6.22
19.81
0.69
4.52
1.22
0.36
8.76
7.62
5.59
4.62
MAX
18.28
6.48
20.82
0.84
4.72
1.63
0.41
9.53
7.87
6.10
4.93
STYLE 1:
PIN 1. V
OUT
2. GROUND
3. V
CC
4. V1
5. V2
6. V
EX
A
654321
C
K
NE
-B-
PORT #1
POSITIVE
PRESSURE
(P1)
J
-T-
S
G
FD6 PL
PIN 1
M
B
M
0.13 (0.005) T
V
CASE 867E-O3
ISSUE D
STOVE PIPE PORT (AS)
MPX4115A
Sensors
Freescale Semiconductor 11
Pressure
PACKAGE DIMENSIONS
CASE 867B-04
ISSUE G
PORTED (AP)
PAGE 1 OF 2
MPX4115A
Sensors
12 Freescale Semiconductor
Pressure PACKAGE DIMENSIONS
CASE 867B-04
ISSUE G
PORTED (AP)
PAGE 2 OF 2
MPX4115A
Sensors
Freescale Semiconductor 13
Pressure
PACKAGE DIMENSIONS
NOTES:
1.
2.
3.
4.
CONTROLLING DIMENSION: INCH.
INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
N
A
C
0.004 (0.1)
DETAIL G
SEATING
PLANE
8X
P
T
∅
D
E
e/2
e
A
M
0.004 (0.1) BC
E1
A
B
A0.008 (0.20) B
C
8X b
2 PLACES 4 TIPS
1
4
8
5
F
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.300 0.330 7.11 7.62
A1 0.002 0.010 0.05 0.25
b0.038 0.042 0.96 1.07
D0.465 0.485 11.81 12.32
E
E1 0.465 0.485 11.81 12.32
e
M0.270 0.290 6.86 7.36
N0.080 0.090 2.03 2.28
P0.009 0.011 0.23 0.28
T0.115 0.125 2.92 3.17
0.100 BSC 2.54 BSC
F0.245 0.255 6.22 6.47
K0.120 0.130 3.05 3.30
L0.061 0.071 1.55 1.80
0˚ 7˚ 0˚ 7˚
θ
0.717 BSC 18.21 BSC
K
M
GAGE
PLANE
DETAIL G
LA1
θ
.014 (0.35)
CASE 1369-01
ISSUE O
SMALL OUTLINE PACKAGE
MPX4115A
Rev. 5
1/2009
How to Reach Us:
Home Page:
www.freescale.com
Web Support:
http://www.freescale.com/support
USA/Europe or Locations Not Listed:
Freescale Semiconductor, Inc.
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
1-800-521-6274 or +1-480-768-2130
www.freescale.com/support
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
www.freescale.com/support
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
support.japan@freescale.com
Asia/Pacific:
Freescale Semiconductor China Ltd.
Exchange Building 23F
No. 118 Jianguo Road
Chaoyang District
Beijing 100022
China
+86 010 5879 8000
support.asia@freescale.com
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447 or +1-303-675-2140
Fax: +1-303-675-2150
LDCForFreescaleSemiconductor@hibbertgroup.com
Information in this document is provided solely to enable system and sof tware
implementers to use Freescale Semiconduct or products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the ri ght to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequen tial or incidental damages. “Typical” parameters that may be
provided in Freescale Se miconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, includin g “Typicals”, must be validated for each customer application by
customer’s technical experts . Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which th e failure of th e Freescale Semiconductor product
could create a situation where personal injury or deat h may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemn ify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Fr eescale
Semiconductor was negligent regarding the design or manuf acture of the part.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2009. All rights reserved.
