Bourns®
Circuit Protection Selection Guide
Circuit Protection Solutions
The Bourns Mission
Our goal is to satisfy customers on a global basis
while achieving sound growth with technological
products of innovative design, superior quality
and exceptional value. We commit ourselves to
excellence, to the continuous improvement
of our people, technologies, systems, products
and services, to industry leadership and to
the highest level of integrity.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Why Protection is Needed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Bourns® Circuit Protection Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Select the Appropriate Device for your Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Network Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Generic Circuit Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Central Office (CO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Customer Premises (CPE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
DSL and Voice Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
ADSL Splitter with Primary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
T1/E1 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
New Technology Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
USB OTG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Power over Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Product Selection Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Telecom Line Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Customer Premises Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Overvoltage Protection Components
GDT – Gas Discharge Tubes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
TSP – Thyristor Surge Protectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
TVS Diodes Transient Voltage Suppressor Diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Overcurrent Protection Components
Multifuse® Polymer PTCS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
LPMs - Line Protection Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
Telefuse™ – Telecom Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
ESD Protection Components
ESD Protection Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
ChipGuard® – Multilayer Varistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
Diode Arrays for ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
Outside Plant
Outside Plant Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
Signaling Protectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
Other Related Products and Capabilities
Transformers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
Module Solution Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
DC-DC Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76
Which Protection Technology is Right for the Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
Telecommunications Standards and Recommendation Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .92
Table of Contents
1
2
Bourns is pleased to present this comprehensive
guide to Telecom Circuit Protection, encompassing
our broad range of technologies and products. This
guide will provide the background information and
selection recommendations needed to ensure that
your next project achieves the level of cost-effective
field reliability demanded by today’s customers.
Bourns commissioned a survey of telecom circuit
protection users worldwide to determine their
priorities and needs. We found that reliability,
technical and design support and exemplary
knowledge of protection technology were by far the
three most cited items. Bourns is committed to
meeting each of the three following requirements.
Reliability – Reliability requires an understanding of
the capabilities and specifications of circuit
protection technology. Bourns has a global
reputation for quality products and our circuit
protection devices have consistently demonstrated
reliability in field applications. Bourns is committed
to the complete support of a circuit protection
solution for the life of a program.
Technical and Design Support – Bourns has a global
team of specialized sales and Field Applications
Engineers (FAEs) ready to bring in-depth circuit
protection expertise to your next project. Wherever
you are located in the world you have a regional
applications team available to help you from Asia
and Europe to the Americas. For your next
application why not contact your local sales office
which will put you in contact with your nearest FAE
to help you to make the right choice of circuit
protection solutions for your application.
Introduction
Knowledge of Protection Technology – Bourns
boasts the industry’s widest range of telecom
overvoltage and overcurrent protectors. Our active
involvement in international protection standards
organizations ensures world-class technology and
applications expertise. Bourns continues to develop
an innovative range of integrated circuit protection
products using our knowledge and expertise to
combine multiple technologies into optimized single
devices designed to save both cost and board space.
Whether you need a single product or a complete
protection solution, Bourns telecom circuit
protection team is there to help you. We look
forward to working with you.
The Bourns Website – Bourns website,
www.bourns.com, is an invaluable resource to
further help you determine your circuit protection
solution. The following information is available:
Comprehensive data sheets
A product selection tool
Reference Design Notes
(http://www.bourns.com/archive.aspx)
Tutorials in the area of circuit protection
(http://www.bourns.com/archive.aspx)
More detailed information on regulatory
requirements
Communication systems are vulnerable to damage
from lightning or other electrical surges. As systems
become more complex, they also become more
vulnerable. Balancing the cost, standards compliance
and field reliability of protection of such systems is
both a commercial and technical challenge,
compounded by the additional performance
constraints of modern digital networks such as xDSL.
A “surge” is a temporary increase in voltage, current
or both. Lightning and the AC power distribution
system cause surges, but of very different magnitudes
and durations (see Table 1). These events can either
be via direct contact or by field or resistive coupling
from events close to the telephone system, resulting
in a wide variety of threats. For example, the effects
of a power line fault caused by lightning may even be
more threatening to the telephone system than the
original lightning. The dangers of large voltages and
currents are obvious, but time is also important.
Lightning is too fast for bulk heating to be critical,
whereas for the longer term currents of AC power
faults, bulk heating can significantly effect device
survival and safety. Direct contact to the AC (power
cross) causes high currents, while lower currents
result from power induction. Obviously, a single
device protection solution is seldom possible.
Why Protection Is Needed
Lightning kA, kV µs Negligible
Power Cross 60 A <30 mins Significant
Power
Induction 7 A <30 mins Crucial
Bulk
Amplitude Duration Heating
Table 1. Different surge sources result in very different
effects
Figure 1. Protecting “ Quality of Service” requires
more than standards compliance
Protection performs several key functions as
outlined in Figure 1. First it must prevent or
minimize damage caused by a surge; then it must
ensure that the system returns to a working
condition with minimal disruption to service. It is
vital that under normal conditions the protection
does not interfere with the signal, creating special
challenges for xDSL and other digital technologies.
The protection must also fail in a safe manner during
overstress.
Development of Standards – Due to the enormous
cost of interrupted service and failed network
equipment, telephony service providers around the
world have adopted various specifications to help
regulate the reliability and performance of the
telecommunications products that they purchase. In
Europe and much of the Far East, the most common
standards are ITU-T K.20, K.21 and K.45. In North
America, most operating companies base their
requirements on GR-1089-CORE, TIA-968-A
(formerly known as FCC Part 68), and UL 60950.
The Telecommunication Standards and
Recommendations Summary discusses these various
standards in more depth. Figure 2 on the next page
summarizes the applicable standards.
3
Quality
of service
Field reliability
Standards
compliance
Signal
integrity
4
NID
NID
NID NID
Splitter
Intra-Building Wiring
Customer Premise
(Subscriber)
Customer Premise
(Subscriber)
Access Central Office
(Telecom Center)
Outside
Plant
Fiber
Twisted-
Pair
POTS
MDF
MDF
Circuit Protection Customer
Premise Access Central
Office
US
Region
Powered
IT Safety
UL 60950-1 UL 60950-21
(2003) (2003)
Primary
Protection
GR-974-CORE
2002)
GR-1361-CORE
(1998)
Equipment
Secondary
Protection
TIA-968-A + A1 + A2
(2002-2003-2004 – Part 68)
GR-1089-CORE
(2002)
GR-1089-CORE
(2002)
GR-1089-CORE
(2002)
Int’l
Powered
IT Safety
IEC 60950-1 IEC 60950-21 ITU-T K.50 ITU-T K.51
(2001) (2002) (2000) (2000)
Primary
Protection
ITU-T K.12
(2000)
ITU-T K.28
(1993)
Equipment
Secondary
Protection
ITU-T K.21/44
(2003)
ITU-T K.45/44
(2003)
ITU-T K.20/44
(2003)
Figure 2
5
Bourns®Circuit Protection Products
Overvoltage Products
Bourns family of Gas Discharge Tubes (GDTs) creates a
quasi short circuit across the line when the gas is
ionized quasi by an overvoltage, returning to their
high impedance state after the surge has terminated.
These robust devices have the highest impulse
current capability of any technology combined with
negligible capacitance, making them very attractive
for the protection of high speed digital lines as well
as standard POTS lines.
Bourns family of TISP® Thyristor-based devices initially
clamp the line voltage, and then switch to a low-
voltage “On” state. After the surge, when the current
drops below the “holding current,” the protector
returns to its original high impedance state.
Bourns offers a family of Transient Voltage Suppressor
(TVS) Diodes which operate by rapidly moving from
high impedance to a non-linear resistance
characteristic that clamps surge voltages. TVS diodes
provide a fast-acting and well-controlled clamping
voltage, however they exhibit high capacitance and
low energy capability thereby restricting the
maximum surge current.
Overcurrent Products
Bourns family of Multifuse® Polymer Positive Temperature
Coefficient (PPTC) Thermistor resettable fuses” is used in
a wide variety of circuit protection applications.
Under high current fault conditions the device
resistance will increase by many orders of magnitude
and remain in a “tripped” state, providing
continuous circuit protection until the fault is
removed. Once the fault is removed and the power
cycled, the device will return to its normal low
resistance state.
Bourns family of Telefuse™ Telecom Fuses is
constructed from a metal element encapsulated
in a ceramic housing. The fuse element heats up at
the rate of I2R. Once the temperature of the element
exceeds the melting point, it vaporizes and opens the
circuit. The low resistance of fuses is attractive
for xDSL applications.
MSP® and TRIGARD® Gas Discharge Tubes
TISP® – Telecom Overvoltage Protectors
TVS Diodes for low energy surge and ESD protection
Multifuse® Resettable Fuses
Telefuse™ Telecom Fuses
6
Bourns family of Line Protection Modules (LPMs) is based
on the most fundamental form of current protection
, the Line Feed Resistor (LFR), normally fabricated as a
thick-film resistor on a ceramic substrate. LPMs have
the ability to withstand high voltage impulses
without breaking down, AC current interruption
occurs when the high temperature developed by the
resistor causes mechanical expansion stresses that
result in the ceramic breaking open. Low current
power induction may not break the LFR open,
creating long-term surface temperatures of more
than 300 °C. To avoid heat damage to the PCB and
adjacent components, maximum surface temperature
can be limited to about 250 °C by incorporating a
series thermal fuse link on the LFR.
This capability is extended to the design and
manufacture of a full range of modules,
incorporating both overcurrent and overvoltage
devices on one ceramic substrate. Further
incorporation of silicon die and discrete components
is also possible to achieve small modules with high
performance and full functionality.
ESD PROTECTION PRODUCTS
Bourns family of ChipGuard® ESD clamp protectors
consists of multilayer varistors (MLV) designed to
protect equipment against electrostatic discharge
(ESD) conditions. The Bourns® ChipGuard® series
has low leakage currents that make the devices
transparent under normal operation. ESD transients
cause the device to clamp the voltage by reducing its
effective resistance and the device will reset to a high
impedance state after the disturbance has passed.
The Bourns® ChipGuard® product family is designed
to protect equipment such as communication ports
to IEC61000-4-2, level 4.
Bourns offers a family of Diode Arrays for ESD
protection. Using Thin Film on Silicon wafer
fabrication technology combined with Chip Scale
Packaging, such devices are commonly used in
portable electronics applications where the customer
has specified a particular electrical response
characteristic for a minimum real estate allowance.
Handheld wireless devices, in particular, cell phones
and PDAs often have data and/or audio ports that
Line Protection Modules
ChipGuard® Multilayer Varistors for ESD protection
Diode Arrays for ESD protection (CSP options)
7
connect the device to other external devices such as
laptop computers and headsets. Bourns offers the
capability to integrate resistors, capacitors, inductors,
diodes and transistors into a single monolithic device
with minimal packaging overhead.
Outside Plant
Bourns Outside Plant product line offers a full line of
protection products based on our own Gas Discharge
Tube (GDT) and patented Multi-Stage Protection
(MSP®) technology. Products include
5-Pin protectors for the central office, building
entrances and a wide range of station protectors for
the customer premises. We also offer a complete line
of fully modular Network Interface Devices (NIDs)
available from one to one hundred lines. Our NIDs
are flexible with a wide variety of customizations
available. Additionally, we round out our offering
with a full line of ADSL and VDSL splitters available
in both binding post and snap-in packages. All of
our products are UL listed and manufactured to RUS
and Telcordia technical requirements.
Bourns® Data and Signal Systems Surge Protectors offer
surge protection to field mounted 4-20 mA
transmitters. They feature a 1669 series protector
with a sealed stainless steel pipe for easy connection
to a field transmitter 1/2 inch NPT port and typically
a rail-mounted 1820 series protector to protect the
DCS equipment at the opposite end of the loop.
Other Products
Bourns offers a family of Transformers suitable for use
in Telecom, LAN, Ethernet and xDSL applications.
They exhibit high isolation and are ideal for signal
conditioning, impedance matching and noise
filtering applications. Devices are available for all
leading chipsets.
A comparison of technologies used in telecom
applications is described in the section entitled, “Which
Protection Technology is Right for the Equipment,
including technologies not offered by Bourns, describing
the general advantages and disadvantages of each and
also giving suggestions for appropriate applications.
Outside Plant – NID Boxes and Data Line Protectors
Station Protectors – Central office / customer
premises protectors
Custom Telecom Transformers
8
The following Network Diagram gives an overview of where the
various technologies are used in today’s communication
electronics industry.
Selecting the Appropriate Device for your Application
Circuit Protection Solutions
9
10
TEST
RELAY
RING
RELAY
SLIC
RELAY
TEST
EQUIP-
MENT RING
GENERATOR
S1a
S1b
Th1
Th2
Th3
Th4
Th5
SLIC
SLIC
PROTECTOR
RING/TEST
PROTECTION
S2a
S2b
TISP
3xxxF3
or
7xxxF3
S3a
S3b
VBATH
TISP
61089B
C1
220 nF
RING
TIP
4B06B-524-400
or
4B06B-522-500
or
MF-RX012/250
2026-xx
or
2036-xx
Multifuse®
Resettable Fuse
LPM
GDT
TISP® -
Thyristor Surge
Protection
TISP® -
Thyristor Surge
Protection
Line Card Protection with Electromechanical Relays
Central Office (CO)
C2
100 nF
IG
SLIC 2
TISP6NTP2A
C1
100 nF
SLIC 1
SLIC
PROTECTOR
0 V
0 V
VBAT2
VBAT1
4A12P-516-500
or
MF-RX012/250
Multifuse®
Resettable Fuse
LPM
TISP® -
Thyristor Surge
Protection
Integrated Line Protection for Multiple SLICs
Several generic examples of the use of protection
components are given over the following pages for
your reference. Our field application engineers are
available to discuss your actual circuit configuration
and requirements.
11
RING
RELAY
SLIC
RELAY
RING
GENERATOR
SW5b
SW5a
R1R2
VBAT
VRING
Th1
Th2
Th3
Th4
SLIC
Vbat
RING
TIP
SW3
SW4
SW1
SW2
CONTROL
LOGIC
LCAS
4B06B-540-125/219
or
MF-RX012/250
2026-xx
or
2036-xx
GDT
Multifuse®
Resettable Fuse
LPM
Line Card Protection with Solid-State Line Card Access Switch
Central Office (CO) – continued
12
Basic ADSL Interface
C Signal
Tx
TISP4360MM
or
TISP4360H3
RING
TIP
+t˚
B1250T
MF-RX018/250
TIA/EIA-IS-968 / UL 60950
ITU-T K.21 (Basic)
2027-xx
or
2035/37-xx
Multifuse®
Telefuse
TISP® GDT
Customer Premises (CPE)
Basic Electronic Hook Switch Protection
Ring
Detector
Polarity
Bridge
Power
Isolation B arrier
Tx Sig nal
Hook
Switch
Solid
State
Relay
OC1
OC2
Rx S ignal
D1 D2
D3 D4
TISP4350H3
or
TISP4290L3
RING
TIP
B1250T
MF-RX018/250
+t˚
TIA/EIA-IS-968 / UL 60950
ITU-T K.21 (Basic)
Multifuse®
Telefuse
TISP®
Basic Electromechanical Hook Switch Protection
Ring
Detector
Hook
Switc h
Polarity
Bridge
Relay
DC
Sink Sig nal
C1
R1
D5
D6
D7
OC1
D1 D2
D3 D4
Isolation B arrier
T1
C2
R2
C3
TISP4350H3
RING
TIP
B1250T
TISP4290L3
MF-RX018/250
2027-xx
or
2035/37-xx
+t˚
TIA/EIA-IS-968 / UL 60950
ITU-T K.21 (Basic)
Multifuse®
TISP® GDT
Telefuse
13
DSL and Voice Protection
Ringing SLIC Dual Voltage
Ringing SLIC SLIC
LCAS
(Line Card Access Switch) DSL
(Data Subscriber Line)
SPLITTER
SPLITTER
SPLITTER
DSL
DSL
30 20
20
30
50 30
50 30
TISP61089B
TISP®
TISP®
Telefuse
Fuses
TIP
B1250T
Telecom
Fuse
B1250T
Telecom
Fuse
B1250T
Telecom
Fuse
B1250T
Telecom
Fuse
B1250T
Telecom
Fuse
B1250T
Telecom
Fuse
RING
TISP4290H3BJR
TISP4290H3BJ
TISP8201MD
TISP8200MD
TIP
RING
thy1
thy2
TIP
RING
Telefuse
Fuses
Telefuse
Fuses
14
ADSL Splitter with Primary
TIP
RING
TISP4360H3
TISP®
ADSL
Analog
T1/E1 Application
Base
Station
Receiver
B1250
B1250T
TISP4015H1BJ
Telefuse
Telefuse
TISP®
TISP®
VCC
VC
1
TX1
TX2
RX1
RX2
T1 = 2.4
E1 = 1
5.6
5.6
5.6
5.6
TISP4015H1BJR
TISP®
TISP4015H1BJR
TX1
TX2
RX1
RX2
1515
ESD Protection
Communication Port Protection
USB
Port
Firewire Port
Controller
MF-SM150/33
Power
MF-MSMF110
Data
Power
Data-a
GND
GND
Data-a
Data-b
Data-b
Data
GND
USB
Controller
Multifuse®
Multifuse®
CG0603MLC-05E
ChipGuard®
CG0603MLA-18KE
ChipGuard®
10/100 Base Ethernet Protection
LAN Driver
RJ45 socket
LAN Receiver
CG0603MLC-
CG0603MLC-
CG0603MLC-05E
CG0603MLC-05E
ChipGuard®
ChipGuard®
16
New Technology Applications
USB On The Go (OTG)
After the success of the USB 2.0 standard, the USB
Implementers Forum, Inc. developed an expansion
standard called USB OTG (On The Go). USB OTG
was developed based on the concept of allowing
peripheral devices to communicate directly with
each other without going through a PC host. USB 2.0
traditionally consisted of a host/periphery topology
where a PC was the host and the peripheral could
communicate only through the host device.
However, USB OTG was introduced to supplement
USB 2.0 to allow existing mobile devices to
communicate in a point-to-point manner without
the traditional host (PC).
Under USB OTG any peripheral device that is
designed to act as a limited host (A-Device) must be
able to transmit and receive power. In such
equipment, if the current rating per port of the
A-device is greater than 100 mA, then the voltage
regulation is required to be between 4.75 V and
5.25 V, and the A-device is required to meet the
USB 2.0 specification requirements for power
providers. USB 2.0 makes overcurrent protection a
requirement and a polymer PTC resettable fuse, such
as a Bourns® Multifuse® polymer PTC resettable fuse,
is a solution for providing such overcurrent
protection. The Bourns® Multifuse® MF-MSMF
Series and MF-NSMF Series have been introduced
specifically for overcurrent protection of USB OTG
ports.
Power over Ethernet (PoE)
The IEEE 803.3af Ethernet specification standard
defines the voltage and current requirements of
powered Ethernet equipment delivering up to 48
volts of DC power to PoE-compliant devices over
eight-wire Category 5 and 6 cabling. There are two
types of architecture. One is called mid-span, which
involves running power over unused wire pairs in a
LAN cable. Mid-span products are built into patch
panel-like devices that can add PoE to existing LAN
infrastructures. The other, an increasingly popular
version of 802.3af is called end-span. End-span runs
DC power signals over the same wire pairs used for
data transmission. Industry experts say end-span
devices are becoming popular because they are
usually built into new switches with PoE, which
users often buy for IP telephony or WLAN rollouts.
Typically, designers chose to back up the power
management circuit with a solid state polymer PTC
resettable fuse. The resettable fuse deactivates any
port not protected by the power management circuit
due to a temporary or permanent fault and thereby
prevents further system failures.
The Bourns® device is a compact, symmetrical 2018
footprint design with a very low profile. The design
facilitates incorporation onto the already densely
populated boards of today's network equipment.
1717
Product Selection Tables
It is important to read the Technology Comparison
section of this guide prior to deciding what device is
right for the application. We strongly advise that you
contact your local Bourns Field Applications Engineer
to discuss your exact application and choice of
device(s). The advantages and disadvantages of each
technology is discussed which will further help in the
correct choice of components and/or modules.
Telecom Line Protection
Central Office & Access Equipment
U.S.A. International
Central Office / Access
GR-1089-CORE
Central Office
ITU-T K.20 & K.44
Access
ITU-T K.44 & K.45
Application/
Function
Protected
Element
Overvoltage
Protection
Overcurrent
Protection
Overvoltage
Protection
Overcurrent
Protection
Overvoltage
Protection
Overcurrent
Protection
xDSL
Line Card
DSLAM
Capacitor
2X TISP4xxxH3BJ
+ TISP4xxxJ1BJ
2X TISP4xxxH3BJ
2035-35-SM
B1250T
2X TISP4xxxL/M3
+ TISP4xxxH3
2X TISP4xxxL/M3
MF-RX018/250
B1250T
2X TISP4xxxL/M3
+ TISP4xxxH3
2X TISP4xxxL/M3
MF-RX018/250
B1250T
Analog
Line Card
Mechanical
Relay
TISP3xxxH3SL
TISP7xxxH3SL
2X TISP4xxxH3BJ
+ TISP4xxxJ3BJ
2X TISP4xxxH3BJ
2035-35-SM
B1250T
4B06B-524-500
4A12P-516-500
MF-R016/600
TISP3xxxF3
TISP7xxxF3
MF-R012/250
MF-SM013/250
TISP3xxxF3
TISP7xxxF3
MF-R012/250
MF-SM013/250
Analog
Line Card
WLL
SLIC
TISP1xxxF3D
TISP5xxxH3BJ
TISP61089AD
TISP61089BD
TISP820xMD
TISP83121DR
4B04B-524-500
B1250T
4B04B-524-500
MF-R016/600
4A12P-516-500
4B07-530-400
TISP1xxxF3
TISP61089
TISP61089
TISP820x
TISP83121
TISP6NTP2x
MF-R012/250
MF-SM013/250
4B07B-530-400
4B04B-524-500
4B06B-514-500
TISP1xxxF3
TISP61089
TISP820x
TISP83121
TISP6NTP2x
MF-R012/250
MF-SM013/250
4B07B-530-400
4B04B-524-500
4B06B-514-500
xDSL
Line Card Transformer/C
TISP4xxxH3BJ
2035-35-SM
2036-40-SM
B1250T
MF-R016/600
TISP4xxxL3AJ
TISP4xxxM3BJ
TISP4xxxM3AJ
2036-40-SM
MF-R018/250
TISP4xxxL3AJ
TISP4xxxM3BJ
TISP4xxxM3AJ
2036-40-SM
MF-R018/250
Analog
Line Card
Solid State
Relay (LCAS)
TISP4A270BJ
+ TISP4125H3BJ
TISP4219H3BJ
+ TISP4125H3BJ
TISP4A265H3BJ
+ TISP4125H3BJ
B1250T
4B06B-540-
125/219
MFR016/600
B1250T
B1250T
TISPL758F3
MF-R012/250
MF-SM013/250
Various LPMs
TISPL758F3
MF-R012/250
MF-SM013/250
Various LPMs
Note: Central Office Primary Protection comes in various forms of 5-Pin protection modules,
complying with UL 497, GR 974, GR 1361 and RUS-PE 80.
18
Customer Premises Equipment
U.S.A.
TIA-968-A
UL 60950
International
ITU-T K.21 & K.44
IEC 60950
Application/
Function
Protected
Element
Overvoltage
Protection
Overcurrent
Protection
Overvoltage
Protection
Overcurrent
Protection
DECT / 900 MHz /
2.4 GHz Phone
Hook Switch /
Electronic Relay
Rechargeable Battery
TISP4350H3LM
TISP4350H3BJ
CD214B-TxxxC
MF-R016/600
B1250T
MF-VS210*
TISP4290F3LMx
MF-SM013/250
4B04B-503-500
4B06B-514-500
MF-VS210*
Phone Hook Switch/
Electronic Relay
TISP4350T3BJ
CD214B-Txxx
2035-35-SM
B1250T
MF-R015/600
Feature Phone Hook Switch/
Electronic Relay
TISP4350MMBJ
TISP4350MMAJ
CD214B-Txxx
2035-35-SM
MF-R015/600-A
MF-R015/600
LAN Phone Insulation
TISP4600/4700
CD214Cxxx
2035-60-SM
B1250T TISP4600/4700 MF-SM013/250
Surge Bar Phone Port Insulation 2035-60-SM MF-R012/250
FAX Hook Switch/
Mechanical Relay
2035-35-SM
CD214B-Txxx MF-R015/600
Analog Modem Hook Switch/
Mechanical Relay
TISP4350T3BJ
2035-35-SM
CD214B-TxxxC
MF-R016/600
MF-R015/600-A
B1250T
TISP4290L3AJ MF-R012/250
Digital Modem Transformer/C 2035-35-SM MF-R015/600 2035-40 MF-R015/600
Set Top Box
Modem
Hook Switch/
Electronic Relay
USB Port*
TISP4350T3BJ
2035-35-SM
CD214B-Txxx
B1250T
MF-R015/600
MF-MSMF110
2035-35-SM MF-MSMF110
Set Top Box
DSL Modem Transformer/C
TISP4395H3
CD214C-TxxxC
2035-35-SM
B1250T
MF-R015/600
TISP4395L3
2035-40 MF-RX018/250
Set Top Box
DSL Modem
SLIC
DSL Transformer
TISP5xxxH3BJ
CD214C-Txxx
2035-35-SM
B1250T
MF-R015/600 TISP1072F3 LPM
Set Top Box SLIC TISP6NTP2xD
CD214C-Txxx MF-R015/600 TISP6NTP2x
4B06B-514-500
MF-R012/250
MF-SM013/250
Cable Telephony
Data Port
Transformer
Power Passing Tap*
TISP4350T3BJ
CD214C-Txxx
MF-R015/600
MF-R055/90* TISP4290L3AJ MF-RX018/250
MF-R055/90*
*Different Regulatory Standards apply
19
Customer Premises Equipment – continued
U.S.A.
TIA-968-A
UL 60950
International
ITU-T K.21 & K.44
IEC 60950
Application/
Function
Protected
Element
Overvoltage
Protection
Overcurrent
Protection
Overvoltage
Protection
Overcurrent
Protection
POS Equipment
Hook Switch /
Mechanical Relay
Electric Motor*
2035-35-SM
TISP4350H3BJ
MF-R015/600
B1250T
MF-SM100*
2027-xx MF-SM100*
Routers –
LAN Linked Insulation 2035-60-SM
CD214B-Txxx
Surge Bar
Phone Port Insulation 2035-60-SM
CD214C-TxxxC
UPS MF-R015/600 MF-R014/250
PABX SLIC TISP61089BD
CD214A-Txxx
B1250T
MF-R015/600 TISP61089 4B06B-514-500
WLL SLIC TISP1072F3DR MF-R016/600 TISP820x MF-R015/600
Pairgain SLIC TISP820xMD MF-R015/600
Home LAN
Transformer/C
Power over
Ethernet port*
TISP4350H3LM
CD214A-TxxxC
B1250T
MF-SMDF050* TISP4290F3LMx MF-SMDF050*
*Different Regulatory Standards apply
Note: Primary Protection of Customer Premises Equipment is provided by our line of 5-Pin Building Entrance Modules and our conventional
Station Protectors, Bourns® MSP®, IPA and Coax C-TV Protectors, complying to UL 497, 497C, GR 974, GR 1361 and RUS-PE 80. Various
Network Interface Devices (NIDs) are available for these Customer Premises protectors.
20
ESD Protection Selection
No
Yes
Yes
Yes
Yes
Yes
Yes
No
No No
NoNo
START
ESD
Protection Request?
(IEC61000-4-2)
Array
Required?
Is Surge
Required?
(8/20 µs)
Low Capacitance
Requirement?
Low Capacitance
Requirement?
TSP
(Thyristor Surge
Protector)
See
Diode Arrays
(page 64)
Tolerance Capacitance
Requirement?
MLE Series
8/20 µs + ESD
specified
18 V max. DC
operation
• Leakage current
characterized
MLD Series
12 V DC voltages
ESD data sheet
characterized
5 pF max.
MLC Series
5 V plus DC voltages
ESD data sheet
characterized
0.5 pF max.
12 V option
• Ultra-low leakage
current
MLA Series
5.5 V plus DC voltages
8/20 µs specified
140 pF typical for 18
Other Devices
For Outside Plant Protectors, Signaling System Surge
Protectors, Line Protection Modules, TVS Diodes
and Telecom Transformers, please refer to the
Product Selection Guides in the next section and/or
contact your local representative for more
information.
21
GDT – Gas Discharge Tubes
Selection Guide
Bourns® Gas Discharge Tubes (GDTs) prevent
damage from overvoltages by acting as acrowbar”,
i.e. a short circuit. When a voltage surge exceeds the
GDT’s defined sparkover voltage level (surge
breakdown voltage), the GDT becomes ionized and
conduction takes place within a fraction of a
microsecond. When the surge passes and the system
voltage returns to normal levels, the GDT returns to
its high-impedance (off) state.
Features
Unmatched performance and reliability
Various lead configurations
Smallest size in the industry
(Mini 2-Pole and MINI TRIGARD™)
Very high surge handling capability
Extremely low work function for long service life
Low capacitance & insertion loss
Highly symmetrical cross-ionization
Non-radioactive materials
Optional Switch-Grade Fail-Short Device
Crowbar” function to less than 10 V arc voltage
Telcordia, RUS, ITU-T, IEC, IEEE and UL
compliant
Broadband network capable
Through-hole, SMT and cassette mounting
configurations available
Surge Protector Test Set (Model 4010-01) available
for GDTs and other technologies
3-Terminal GDTs (Switch-Grade Fail-Short Device option available)
Model
DC
Sparkover
Voltage
Max. Single
Surge Rating
(8/20 µs)
DC
Surge Rating
(8/20 µs) AC Rating Capacitance
Min. Surge
Life Rating
(10/1000 µs
waveshape)
2026-07
2026-09
2026-15
2026-20
2026-23
2026-25
2026-30
2026-35
2026-40
2026-42
2026-47
2026-60
75 V
90 V
150 V
200 V
230 V
250 V
300 V
350 V
400 V
420 V
470 V
600 V
40 kA 10 x 20 kA 10 x 20 A rms, 1 s <2 pF 400 x 1000 A
2036-07
2036-09
2036-15
2036-20
2036-23
2036-25
2036-30
2036-35
2036-40
2036-42
2036-47
2036-60
75 V
90 V
150 V
200 V
230 V
250 V
300 V
350 V
400 V
420 V
470 V
600 V
20 kA 10 x 10 kA 10 x 10 A rms, 1 s <2 pF
300 x 200 A
or 500 x 200 A
10/700 µs
The rated discharge current for 3-Electrode GDTs is the total current equally divided between each line to ground.
22
3-Terminal GDTs (Switch-Grade Fail-Short Device option available) – continued
Model
DC
Sparkover
Voltage
Max. Single
Surge Rating
(8/20 µs)
DC
Surge Rating
(8/20 µs) AC Rating Capacitance
Min. Surge
Life Rating
(10/1000 µs
waveshape)
2026-23-xx-MSP 230 V
40 kA 10 x 20 kA 20 x 10 A rms, 1 s <20 pF 1000 x 1000 A
2026-33-xx-MSP 330 V
MSP® = Multi-Stage Protection. MSP® devices have has a patented Switch-Grade Fail-Short Device as standard configuration and contains 2 minia-
ture MOVs in parallel with each line.
The rated discharge current for 3-Electrode GDTs is the total current equally divided between each line to ground.
2-Terminal GDTs
Model
DC
Sparkover
Voltage
Max. Single
Surge Rating
(8/20 µs)
DC
Surge Rating
(8/20 µs) AC Rating Capacitance
Min. Surge
Life Rating
(10/1000 µs
waveshape)
2027-09
2027-15
2027-20
2027-23
2027-25
2027-30
2027-35
2027-40
2027-42
2027-47
2027-60
90 V
150 V
200 V
230 V
250 V
300 V
350 V
400 V
420 V
470 V
600 V
20 kA 10 x 10 kA 10 x 10 A rms, 1 s <1 pF 400 x 500 A
2037-09
2037-15
2037-20
2037-23
2037-25
2037-30
2037-35
2037-40
2037-42
2037-47
2037-60
90 V
150 V
200 V
230 V
250 V
300 V
350 V
400 V
420 V
470 V
600 V
10 kA 10 x 5 kA 10 x 5 A rms, 1 s <1 pF
300 x 100 A
or 500 x 100 A
10/700 µs
2035-09
2035-15
2035-20
2035-23
2035-25
2035-30
2035-35
2035-40
2035-42
2035-47
2035-60
90 V
150 V
200 V
230 V
250 V
300 V
350 V
400 V
420 V
470 V
600 V
10 kA 10 x 5 kA 10 x 5 A rms, 1 s <2 pF
300 x 100 A
or 500 x 100 A
10/700 µs
23
GDT Product Dimensions
0.6
(.024)
1.6
(.063)
9.0
(.354)
11.7
(.460)
7.8
(.307)
1.0
(.04) DIA.
7.5
(.29)
0.7 - 1.0
(.028 - .040)
1.0
(.04) DIA.
REF.
7.9
(.311) 11.2
(.440)
MAX.
13.0
(.512)
REF.
15.5
(.610)
MIN.
4.5
(.177)
4.4
(.173)
4.4
(.173)
1.0
(.04) DIA.
7.5
(.295)
MIN.
4.5
(.177)
4.75
(.187)
4.75
(.187)
1.0
(.04) DIA.
2026-XX-A 2026-XX-C8
1.0
(.04) DIA.
30
(1.2)
LONG
2 PLCS.
7.5
(.29)
2026-XX-C – 1.0 mm (0.040 ˝) dia. lead wire
2026-XX-CB – 0.8 mm (0.032 ˝) dia. lead wire
2026-XX-A1
1.0
(.04) DIA.
7.5
(0.3)
MIN.
4.4
(0.18)
5.5
(0.22) 5.5
(0.22)
2026-XX-C13
8.1
(.32)
9.8
(.38)
Fail-Short Configuration
2026-XX-C2F Shown
2026-XX-C2
7.5
(.295)
6.6
(.26)
6.6
(.26)
1.0
(.04)
DIA.
REF.
2026-XX-C14
2026-XX-C3
1.0
(.04) DIA.
3.04
(.120)
17.8
(.70)
3.93
(.155)
6.4
(.25) 6.4
(.25)
2026-XX-C18
Specifications are subject to change without notice.
Customers should verify actual device
performance in their specific applications.
DIMENSIONS = MILLIMETERS
(INCHES)
24
GDT Product Dimensions
5.1
(.202)
0.7 - 1.0
(.028 - .040)
DIA.
DIA.
7.4 - 7.7
(.290 - .303)
2036-XX-A
4.0
(.157)
25.0
(0.99) LONG MIN.
0.8
(.032)
4.0
(.157)
25.0
(0.99) LONG MIN.
2036-XX-B – 0.8 mm (0.032 ˝) dia. lead wire
2036-XX-C – 1.0 mm (0.040 ˝) dia. lead wire*
15.5
(.61)
7.4
(.29)
4.3
(.17)
2026-XX-C2M1XX
7.4
(0.29)
3.8
(0.15)
3.8
(0.15)
14.2
(.558)
8.9
(.352)
2026-XX-C16M1XX
4.0
(.157)
0.8
(.032)
2036-XX-B8 – 0.8 mm (0.032 ˝) dia. lead wire
2036-XX-C8 – 1.0 mm (0.040 ˝) dia. lead wire*
6.2
(.244)
5.3
(.208)
Fail-Short Configuration
2036-XX-B2F Shown
4.0
(.157)
1.0
(.040)
Center Electrode Lead: C-Configuration
2036-XX-B2 – 0.8 mm (0.032 ˝) dia. lead wire
2036-XX-C2 – 1.0 mm (0.040 ˝) dia. lead wire*
4.0
(.157)
3.8
(.150)
3.8
(.150)
2036-XX-B3 – 0.8 mm (0.032 ˝) dia. lead wire
2036-XX-C3 – 1.0 mm (0.040 ˝) dia. lead wire*
4.0
(.157)
9.5
(.374)
19.0
(.748)
2036-XX-B9 – 0.8 mm (0.032 ˝) dia. lead wire
2036-XX-C9 – 1.0 mm (0.040 ˝) dia. lead wire*
*Center Electrode Lead:
See Center Lead C-Configuration detail.
Optional
Conguration
2026-23-C2M136
2026-25-C2M136
2026-33-C2M143
2026-23-C16M136
2026-25-C16M136
2026-33-C16M143
6.35
(.250)
6.35
(.250)
15.5
(.61)
1.02
(.040)
3 X DIA.
7.49
(.295)
2026-XX-C4M1XX
2026-23-C4M136
2026-25-C4M136
2026-33-C4M143
DIMENSIONS = MILLIMETERS
(INCHES)
Specifications are subject to change without notice.
Customers should verify actual device
performance in their specific applications.
25
6.0
(.236)
8.0
(.314) DIA.
2027-XX-A
5.0
(.197)
4.1
(.161)
DIA.
2035-XX-A
52.4
(2.1)
10.0
(0.4)
2027-XX-BT1 – 0.8 mm (0.032 ˝) dia. lead wire
20
(0.78)
LONG
2 PLCS.
MIN.
2035-XX-B – 0.8 mm (0.032 ˝) dia. lead wire
2035-XX-C – 1.0 mm (0.040 ˝) dia. lead wire
7.6
(.30)
3.8
(.15)
16.7
(.658)REF.
14.2
(.560)MIN.
2035-XX-B5 – 0.8 mm (0.032 ˝) dia. lead wire
2035-XX-C5 – 1.0 mm (0.040 ˝) dia. lead wire
65.0
(2.5)
30.0
(1.2)
2 PLCS.
LONG
2027-XX-B – 0.8 mm (0.032 ˝) dia. lead wire
2027-XX-C – 1.0 mm (0.040 ˝) dia. lead wire
8.1
(.318)
2.0
(.078)
1.5
(.060)
12.7
(.500)
0.8
(.030)
2 PLCS.
R
2.0
(.075)
2 PLCS.
R
2027-XX-B10 – 0.8 mm (0.032 ˝) dia. lead wire
2027-XX-C10 – 1.0 mm (0.040 ˝) dia. lead wire
GDT Product Dimensions
Specifications are subject to change without notice.
Customers should verify actual device
performance in their specific applications.
DIMENSIONS = MILLIMETERS
(INCHES)
26
GDT Product Dimensions
5.0
(.197)
5.0
(.197)
DIA.
2037-XX-A
4.4
(.173)
3.9
(.155)
1.3
(.050)
4.8
(.190) DIA.
5.0
(.195) 5.6
(.220)
2035-XX-SM Recommended Pad Layout
7.2
(.283)
3.3
(.130)
0.9
(.035)
0.5
(.020)
0.7
(.028)
8.2
(.323)
1.6
(.063)
4.8
(.190) DIA.
6.2
(.244) DIA.
5.0
(.195) DIA.
5.0
(.195) 5.6
(.220)
2036-XX-SM
20
(0.78)
LONG
2 PLCS.
MIN.
2037-XX-B – 0.8 mm (0.032 ˝) dia. lead wire
2037-XX-C – 1.0 mm (0.040 ˝) dia. lead wire
7.6
(.30)
3.8
(.15)
16.7
(.658)REF.
14.2
(.560)MIN.
2037-XX-B5 – 0.8 mm (0.032 ˝) dia. lead wire
2037-XX-C5 – 1.0 mm (0.040 ˝) dia. lead wire
Specifications are subject to change without notice.
Customers should verify actual device
performance in their specific applications.
DIMENSIONS = MILLIMETERS
(INCHES)
Recommended Pad Layout
27
Bourns®TISP®Thyristor Surge Protectors
Selection Guide
Bourns® TISP® thyristor surge protector products
prevent damage from overvoltages, as these silicon
based devices initially clamp the line voltage to limit
overvoltages on telephone lines, then switch to a low
voltage “On” state. After the surge, when the current
drops below the “holding current,” the protector
returns to its original high impedance state.
Features
Extensive range offering multiple voltage variants
Surface mount and through-hole packages
Designed to withstand international lightning.
Fixed Voltage Gated (Programmable) Voltage
Series Device Symbol Applications
TISP1xxx
Dual
Unidirectional
SLIC Line Card
TISP3xxx
TISPL758L
Dual Bidirectional
3 Wire Ground
Backed Ringer
Solid State Relay
Surge Bars
TISP4xxx
Single
Bidirectional
Modems
Telephones
Fax Machines
xDSL
Set Top Boxes
Surge Bars
TISP5xxx
Single
Unidirectional
SLIC Line Card
ISDN
TISP70xx
Triple
Unidirectional
xDSL
ISDN
T1/E1/E3
Series Device Symbol Applications
TISP6xxx
TISPPBLx
Dual
Programmable
SLIC Line Card
Ericsson PBL3xx
SLIC
TISP6NTP2x
Quad
Programmable
Dual SLIC Lines
Cable Modems
ISDN Power
Feeds
Smart NT
Set Top Boxes
TISP83121
Dual Gate
Unidirectional
Positive &
Negative Polarity
Ringing SLICs
TISP8200
Dual
Programmable
Unidirectional for
Negative Polarity
Analog Line Card
Dual Supply
Ringing SLIC
TISP8200 &
TISP8201 typically
used as a
complementary
pair
TISP8201
Dual
Programmable
Unidirectional for
Positive Polarity
TISP9xxx
Integrated
Complementary
Buffered-Gate
Protector for Dual
Polarity Protection
CO & Access
Equipment Line
Cards
Protection of
Dual Polarity
Ringing SLICs
G
TRK1
K2
A
A
G1,G2
K1
K2
G
TR
K1
K3
K4
K2
G3,G4
A
A
G1,G2
K
G1
G2
A
A
A
G1
G2
K1
K2
A1
A2
K
K
G1
G2
T
R
K
A
G
T1 T2
Telecom System Primary Overvoltage Protection
Series Applications
2ELx
7ELx
Single
Bidirectional
Solid state
replacement for
Gas Discharge
Tubes
G2
G1
Ground
Line
Line
28
TISP1xxxF3 Series – Dual Unidirectional Overvoltage Protectors (IH= -150 mA)
General fixed voltage SLIC protection for Line Cards and VOIP
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP1072F3 DR, P, SL -58 -72
80 35 50
TISP1082F3 DR, P, SL -66 -82
G
TR
TISP1xxxH3 Series – Dual Unidirectional Overvoltage Protectors (IH= -150 mA)
SLIC protection for Line Cards and VOIP
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP1070H3 BJR -58 -70
500 100 150
TISP1080H3 BJR -65 -80
TISP1095H3 BJR -75 -95
TISP1120H3 BJR -95 -120
G
TR
29
TISP3xxx Series – Dual Bidirectional Overvoltage Protectors (IH= 150 mA)
Legerity and Intersil Line Card Access Switch (LCAS) protection, L7581/2/3 protection – TISPL758L3
General 3-point protection – TISP3xxxF3
CO Line Card and CPE modem protection where a ground is available – TISP3xxxT3
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISPL758LF3DR 105, 180 130, 220 175 35 50
TISP3072F3 DR, P, SL 58 72 80 35 50
TISP3082F3 DR, P, SL 66 82
TISP3125F3 DR, P, SL 100 125
175 35 50
TISP3150F3 DR, P, SL 120 150
TISP3180F3 DR, P, SL 145 180
TISP3240F3 DR, P, SL 180 240
TISP3260F3 DR, P, SL 200 260
TISP3290F3 DR, P, SL 220 290
TISP3320F3 DR, P, SL 240 320
TISP3380F3 DR, P, SL 270 380
TISP3600F3 SL 420 600 190 45 70
TISP3700F3 SL 500 700
TISP3070T3 BJR 58 70
250 80 120
TISP3080T3 BJR 65 80
TISP3095T3 BJR 75 95
TISP3115T3 BJR 90 115
TISP3125T3 BJR 100 125
TISP3145T3 BJR 120 145
TISP3165T3 BJR 135 165
TISP3180T3 BJR 145 180
TISP3200T3 BJR 155 200
TISP3219T3 BJR 180 219
TISP3250T3 BJR 190 250
TISP3290T3 BJR 220 290
TISP3350T3 BJR 275 350
TISP3395T3 BJR 320 395
TISP3070H3 SL 58 70
500 100 200
TISP3080H3 SL 65 80
TISP3095H3 SL 75 95
TISP3115H3 SL 90 115
TISP3125H3 SL 100 125
TISP3135H3 SL 110 135
TISP3145H3 SL 120 145
TISP3180H3 SL 145 180
TISP3210H3 SL 160 210
TISP3250H3 SL 190 250
TISP3290H3 SL 220 290
TISP3350H3 SL 275 350
G
TR
30
TISP4xxxF3 Series – Single Bidirectional Overvoltage Protectors (IH= 150 mA)
General purpose 2-point protection
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP4072F3 LM, LMR, LMFR 58 72 80 35 50
TISP4082F3 LM, LMR, LMFR 66 82
TISP4125F3 LM, LMR, LMFR 100 125
175 35 50
TISP4150F3 LM, LMR, LMFR 120 150
TISP4180F3 LM, LMR, LMFR 145 180
TISP4240F3 LM, LMR, LMFR 180 240
TISP4260F3 LM, LMR, LMFR 200 260
TISP4290F3 LM, LMR, LMFR 220 290
TISP4320F3 LM, LMR, LMFR 240 320
TISP4380F3 LM, LMR, LMFR 270 380
TISP4600F3 LM, LMR, LMFR 420 600 190 45 70
TISP4700F3 LM, LMR, LMFR 500 700
TISP4xxxL1 Series – Single Bidirectional Overvoltage Protectors (IH= 50 mA)
Dataline protection such as E1/T1 or xDSL with ITU-T compliance
Ideal for use with MF-RX018/250 Multifuse® PPTC device
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP4015L1 AJR, BJR 8 15
150 30 45TISP4030L1 AJR, BJR 15 30
TISP4040L1 AJR, BJR 25 40
T
R
T
R
31
TISP4xxxL3 Series – Single Bidirectional Overvoltage Protectors (IH= 150 mA)
General 2-point protection for European applications
Ideal for use with MF-SM013/250 Multifuse® PPTC device
TISP4xxxL3 Series – Single Bidirectional Overvoltage Protectors (IH= 150 mA)
General 2-point protection for European applications
Ideal for use with MF-SM013/250 Multifuse® PPTC device
TISP4xxxMM Series – Single Bidirectional Overvoltage Protectors (IH= 150 mA)
General 2-point protection for European applications
Ideal for use with MF-SM013/250 Multifuse® PPTC device
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP4070L3 AJR 58 70
125 30 50
TISP4080L3 AJR 65 80
TISP4090L3 AJR 70 90
TISP4125L3 AJR 100 125
TISP4145L3 AJR 120 145
TISP4165L3 AJR 135 165
TISP4180L3 AJR 145 180
TISP4220L3 AJR 160 220
TISP4240L3 AJR 180 240
TISP4260L3 AJR 200 260
TISP4290L3 AJR 230 290
TISP4320L3 AJR 240 320
TISP4350L3 AJR 275 350
TISP4360L3 AJR 290 360
TISP4395L3 AJR 320 395
T
R
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
TIA-968-A
10/160 µs
(A)
TIA-968-A
5/310 µs
(A)
TIA-968-A
10/560 µs
(A)
TISP4070L3 BJR 58 70
50 40 30
TISP4350L3 BJR 275 350
T
R
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP4300MM AJR, BJR 230 300
250 55 50TISP4350MM AJR, BJR 275 350
TISP4360MM AJR, BJR 290 360
T
R
32
TISP4xxxM3 Series – Single Bidirectional Overvoltage Protectors (IH= 150 mA)
General 2-point protection
Ideal for use with MF-SM013/250 Multifuse® PPTC device
TISP4xxxT3 Series – Single Bidirectional Overvoltage Protectors for Modem Protection (IH= 150 mA)
TIA-968-A protection
Ideal for use with Telefuse™ B1250 or Multifuse® MF-R015/600 PPTC device
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP4070M3 AJR, BJR, LM, LMR, LMFR 58 70
300 50 100
TISP4080M3 AJR, BJR, LM, LMR, LMFR 65 80
TISP4095M3 AJR, BJR, LM, LMR, LMFR 75 95
TISP4115M3 AJR, BJR, LM, LMR, LMFR 90 115
TISP4125M3 AJR, BJR, LM, LMR, LMFR 100 125
TISP4145M3 AJR, BJR, LM, LMR, LMFR 120 145
TISP4165M3 AJR, BJR, LM, LMR, LMFR 135 165
TISP4180M3 AJR, BJR, LM, LMR, LMFR 145 180
TISP4200M3 AJR, BJR 155 200
TISP4219M3 BJR 180 219
TISP4220M3 AJR, BJR, LM, LMR, LMFR 160 220
TISP4240M3 AJR, BJR, LM, LMR, LMFR 180 240
TISP4250M3 AJR, BJR, LM, LMR, LMFR 190 250
TISP4260M3 LM, LMR, LMFR 200 260
TISP4265M3 AJR, BJR, LM, LMR, LMFR 200 265
TISP4290M3 AJR, BJR, LM, LMR, LMFR 220 290
TISP4300M3 AJR, BJR, LM, LMR, LMFR 230 300
TISP4350M3 AJR, BJR, LM, LMR, LMFR 275 350
TISP4360M3 AJR, BJR, LM, LMR, LMFR 290 360
TISP4395M3 AJR, BJR, LM, LMR, LMFR 320 395
TISP4400M3 BJR, LM, LMR, LMFR 300 400
T
R
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP4290T3 BJR 220 290
250 80 120TISP4350T3 BJR 275 350
TISP4400T3 BJR 335 400
T
R
33
TISP4xxxH1 Series – Single Bidirectional Overvoltage Protectors (IH= 50 mA)
Dataline protection such as E1/T1 or xDSL with GR-1089-CORE compliance
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP4015H1 BJR 8 15
500 100 150TISP4030H1 BJR 15 30
TISP4040H1 BJR 25 40
T
R
TISP4xxxH3 Series – Single Bidirectional Overvoltage Protectors (IH= 150 mA)
General telecom protection, either for enhanced ITU-T or Telecordia GR-1089-CORE designs
Ideal for use with Telefuse™ B1250T and Multifuse® MF-R015/600 PPTC device
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP4070H3 BJR, LM, LMR, LMFR 58 70
500 100 200
TISP4080H3 BJR, LM, LMR, LMFR 65 80
TISP4095H3 BJR, LM, LMR, LMFR 75 95
TISP4115H3 BJR, LM, LMR, LMFR 90 115
TISP4125H3 BJR, LM, LMR, LMFR 100 125
TISP4145H3 BJR, LM, LMR, LMFR 120 145
TISP4165H3 BJR, LM, LMR, LMFR 135 165
TISP4180H3 BJR, LM, LMR, LMFR 145 180
TISP4200H3 BJR, LM, LMR, LMFR 155 200
TISP4219H3 BJR 180 219
TISP4220H3 BJR 160 220
TISP4240H3 BJR, LM, LMR, LMFR 180 240
TISP4250H3 BJR, LM, LMR, LMFR 190 250
TISP4260H3 LM, LMR, LMFR 200 260
TISP4265H3 BJR 200 265
TISP4290H3 BJR, LM, LMR, LMFR 220 290
TISP4300H3 BJR, LM, LMR, LMFR 230 300
TISP4350H3 BJR, LM, LMR, LMFR 275 350
TISP4360H3 BJR 290 360
TISP4395H3 BJR, LM, LMR, LMFR 320 395
TISP4400H3 BJR, LM, LMR, LMFR 300 400
TISP4500H3 BJR 320 500
T
R
34
TISP4xxxH4 Series – Single Bidirectional Overvoltage Protectors (IH= 225 mA)
Full temperature general overvoltage protection, where holding current must exceed 150 mA
TISP4xxxJ1 Series – Single Bidirectional Overvoltage Protectors (IH= 20 mA)
General high current dry line data protection or bottom element in a “Y” protection solution
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP4165H4 BJR 135 165
500 100 200
TISP4180H4 BJR 145 180
TISP4200H4 BJR 155 200
TISP4265H4 BJR 200 265
TISP4300H4 BJR 230 300
TISP4350H4 BJR 270 350
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP4070J1 BJR 58 70
1000 200 350
TISP4080J1 BJR 65 80
TISP4095J1 BJR 75 95
TISP4115J1 BJR 90 115
TISP4125J1 BJR 100 125
TISP4145J1 BJR 120 145
TISP4165J1 BJR 135 165
TISP4180J1 BJR 145 180
TISP4200J1 BJR 155 200
TISP4219J1 BJR 180 219
TISP4250J1 BJR 190 250
TISP4290J1 BJR 220 290
TISP4350J1 BJR 275 350
TISP4395J1 BJR 320 395
T
R
T
R
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP4C290H3 BJR 220 290
500 100 150TISP4C350H3 BJR 275 350
TISP4C395H3 BJR 320 395
T
R
TISP4CxxxH3 Series – Low Capacitance Single Bidirectional Overvoltage Protectors (IH= 150 mA)
General low capacitance telecom protection for xDSL or data applications
35
TISP4xxxJ3 Series – Single Bidirectional Overvoltage Protectors (IH= 150 mA)
High current POTS protection or powered xDSL protection
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP5070H3 BJR -58 -70
500 100 200
TISP5070H3 BJR -65 -80
TISP5110H3 BJR -80 -110
TISP5115H3 BJR -90 -115
TISP5150H3 BJR -120 -150
TISP5190H3 BJR -160 -190
K
A
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP4290J3 BJR 220 290
1000 200 350TISP4350J3 BJR 275 350
TISP4395J3 BJR 320 395
T
R
TISP5xxxH3 Series – Single Unidirectional Overvoltage Protectors (IH= -150 mA)
General fixed voltage SLIC protection ideal for VOIP applications
TISP7xxxL1 Series – Triple Bidirectional Overvoltage Protectors (IH= 30 mA)
Balanced 3-point protection for ISDN or xDSL data communications applications
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
TIA-968-A
10/160 µs
(A)
TIA-968-A
5/310 µs
(A)
TIA-968-A
10/560 µs
(A)
TISP7015L1 DR 8 15
200 30 50
TISP7038L1 DR 28 38
G
T1 T2
36
TISP7xxx Series – Triple Bidirectional Overvoltage Protectors (IH= 150 mA)
General balanced 3-point protection – TISP70xxF3
General balanced 3-point protection typically for European ITU-T applications – TISP7xxxF3
General balanced 3-point protection typically for Telecordia GR-1089-CORE applications – TISP7xxxH3
G
T1 T2
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP7072F3 DR, P, SL 58 72 85 45 70
TISP7082F3 DR, P, SL 66 82
TISP7125F3 DR, P, SL 100 125
190 45 70
TISP7150F3 DR, P, SL 120 150
TISP7180F3 DR, P, SL 145 180
TISP7240F3 DR, P, SL 180 240
TISP7260F3 DR, P, SL 200 260
TISP7290F3 DR, P, SL 220 290
TISP7320F3 DR, P, SL 240 320
TISP7350F3 DR, P, SL 275 350
TISP7380F3 DR, P, SL 270 380
TISP7070H3 SL 58 70
500 100 200
TISP7080H3 SL 65 80
TISP7095H3 SL 75 95
TISP7125H3 SL 100 125
TISP7135H3 SL 110 135
TISP7145H3 SL 120 145
TISP7165H3 SL 130 165
TISP7180H3 SL 145 180
TISP7200H3 SL 150 200
TISP7210H3 SL 160 210
TISP7220H3 SL 160 210
TISP7250H3 SL 200 250
TISP7290H3 SL 230 290
TISP7350H3 SL 275 350
TISP7400H3 SL 300 400
37
TISP6xxx Series – Programmable Overvoltage Protectors for SLIC Protection
Ringing SLIC protection for CO and VOIP applications
Alternative to Legerity (Previously Lucent) L7591 protector – TISPL7591
Infineon (previously Ericsson) PBL386 SLIC protection – TISPPBL1, BL2, BL3
TISP6NPT2x Series – Programmable Overvoltage Protectors for Dual SLIC Protection
Dual SLIC VOIP applications, with reduced protection cost per line
TISP83121 – Dual-Gate Unidirectional Overvoltage Protectors for Dual Supply SLIC Protection
±ve protection for multiple lines on CO Line Cards
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP61089H DM Programmable -20 to -170 V 500 100 150
TISP61060 DR, P Programmable -5 to -85 V 50
30 40
TISP61089 DR, P Programmable -20 to -85 V 120
TISP61089A DR, P Programmable -20 to -120 V 120
TISP61089B DR Programmable -20 to -170 V 120
TISP61511 DR Programmable 0 to -85 V 170
TISP61512 P Programmable 0 to -85 V 170
TISP61521 DR Programmable 0 to -170 V 170
TISPL7591 DR Programmable 0 to -80 V 80
TISPPBL1 DR, P, SE Programmable 0 to -90 V 100
TISPPBL2 DR, P Programmable 0 to -90 V 100
TISPPBL3 DR Programmable 0 to -170 V 100
K1
K2
A
A
G1,G2
K1
K2
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP6NTP2A DR Programmable 0 to -90 V 85 20 25
TISP6NTP2C DR Programmable 0 to -170 V 90 25 40
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP83121 DR Programmable 0 to ±100 V 150 250
K1
K3
K4
K2
G3,G4
A
A
G1,G2
K
G1
G2
A
38
TISP820xM Series – Dual Unidirectional Reverse Blocking Programmable
Overvoltage Protectors for Dual Supply SLIC Protection
Protection for Infineon PEB4265 and Legerity 79R251 SLICs
TISP9110LDM – Integrated Complementary Buffered-Gate SCRs for Dual Polarity SLIC Overvoltage Protection
Integrated ITU-T or GR-1089-CORE intrabuilding protection for Infineon PEB4265 and Legerity 79R251 SLICs
‘EL Series – Single Bidirectional Primary Overvoltage Protectors for GR-974-CORE Designs
CO Primary Protection – 2EL2, 2EL3, 2EL4
CO Primary Protection for Datalines – 2EL5
High Exposure Station Protector – 2EL6
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
Holding
Current
IH
(mA)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP8200M DR Programmable 0 to -90 V -150 -210 -45 -70
TISP8201M DR Programmable 0 to +90 V 20 210 45 70
Device Delivery
Options
Standoff
Voltage
VDRM
(V)
Protection
Voltage
V(BO)
(V)
Holding
Current
IH
(mA)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
GR-1089-CORE
10/1000 µs
(A)
ITU-T K20/21
5/310 µs
(A)
TISP9110L DM Programmable
+110 to -110 V
+20,
-150 100 30 45
A
A
G1
G2
K1
K2
A1
A2
K
K
G1
G2
G2
G1
Ground
Line
Line
Device Delivery
Options
Protection
Voltage
V(BO)
(V)
ITSP Ratings for Lightning Surge Standards
GR-1089-CORE
2/10 µs
(A)
ITU-T K20/21
5/310 µs
(A)
2EL2 Button Cell 265 V to 400 V 100 125
2EL3 Button Cell 200 V to 265 V 100 125
2EL4 Button Cell 215 V to 265 V 100 125
2EL5 Button Cell 65 V to 90 V 100 125
7EL2 Button Cell 265 V to 400 V 300 400
T
R
39
TISP® Product Dimensions
SMAJ – Plastic Surface Mount Diode
Suffix – AJR
SMBJ – Plastic Surface Mount Diode
Suffix – BJ, BJR
2
Index
Mark
(if needed)
2.29 - 2.92
(.090 - .115)
4.06 - 4.57
(.160 - .180)
2.00 - 2.40
(.079 - .095)
0.76 - 1.52
(.030 - .060)
4.83 - 5.59
(.190 - .220)
1.58 - 2.16
(.062 - .085)
0.10 - 0.20
(.004 - .008)
1.27 - 1.63
(.050 - .064)
2
Index
Mark
(if needed)
4.06 - 4.57
(.160 - .180)
3.30 - 3.94
(.130 - .155)
1.96 - 2.32
(.077 - .091)
0.10 - 0.20
(.004 - .008)
0.76 - 1.52
(.030 - .060)
2.00 - 2.40
(.079 - .094)
1.90 - 2.10
(.075 - .083)
5.21 - 5.59
(.205 - .220)
DIMENSIONS = MILLIMETERS
(INCHES)
40
SOIC – Plastic Small Outline
Suffix – D, DR
8765
4
3
2
1
INDEX
4.80 - 5.00
(0.189 - 0.197)
5.80 - 6.20
(0.228 - 0.244)
3.81 - 4.00
(0.150 - 0.157)
1.35 - 1.75
(0.053 - 0.069)
0.102 - 0.203
(0.004 - 0.008)
0.28 - 0.79
(0.011 - 0.031)
0.51 - 1.12
(0.020 - 0.044)
4.60 - 5.21
(0.181 - 0.205)
0.36 - 0.51
(0.014 - 0.020)
0.25 - 0.50
(0.010 - 0.020)
0.190 - 0.229
(0.0075 - 0.0090)
Pin Spacing
1.27
(0.050)
(see Note A)
6 places
x 45 N0M
8 Places
7 NOM
4 Places
7 NOM
3 Places
4 4
DIMENSIONS = MILLIMETERS
(INCHES)
2.00 - 2.40
(.079 - .094)
1
0.10 - 0.20
(.004 - .008)
5.21 - 5.59
(.205 - .220)
0.56 - 0.71
(.022 - .028)
3.30 - 3.94
(.130 - .155)
4.06 - 4.57
(.160 - .180)
0.76 - 1.52
(.030 - .060)
1.90 - 2.10
(.075 - .083) 0.79 - 0.94
(.031 - .037)
1.42 - 1.57
(.056 - .062)
3
2
SMB03 (Modified DO-214AA Package)
41
DO92 – Cylindrical Plastic
Suffix – LM, LMR, LMFR
13
2A
31
2
VIEW A
4.44 - 5.21
(.175 - .205)
3.43
(.135)
4.32 - 5.34
(.170 - .210)
3.17 - 4.19
(.125 - .165)
2.03 - 2.67
(.080 - .105)
0.40 - 0.56
(.016 - .022)
0.35 - 0.41
(.014 - .016)
MIN.
2.20
(.086)
MAX.
12.7
(0.5)
MIN.
1.14 - 1.40
(.045 - .055)
2.41 - 2.67
(.095 - .105)
2.03 - 2.67
(.080 - .105)
A
VIEW A
31
2
13
2
4.44 - 5.21
(.175 - .205)
3.43
(.135)
4.32 - 5.34
(.170 - .210)
3.17 - 4.19
(.125 - .165)
2.03 - 2.67
(.080 - .105)
2.03 - 2.67
(.080 - .105)
0.40 - 0.56
(.016 - .022)
0.35 - 0.41
(.014 - .016)
MIN.
2.20
(.086)
MAX. 4.00
(.157)
MAX.
2.40 - 2.90
(.094 - .114)
2.40 - 2.90
(.094 - .114)
SOIC – 8-pin Plastic Small Outline (210 mil)
Suffix – DM
8
7.40 - 8.20
(0.291 - 0.323)
(0.197 - 0.220)
5.00 - 5.60
(0.087)
2.20 MAX.
(0.197 - 0.220)
5.00 - 5.60
0.10
(0.004) MIN.
TYP.
1.27
(0.050)
0.35 - 0.51
(0.014 - 0.200)
7
1
6
2
5
43
DIMENSIONS = MILLIMETERS
(INCHES)
42
312 4
8765
Seating
Plane
Index
Notch
9.25 - 9.75
(0.364 - 0.384)
6.10 - 6.60
(0.240 - 0.260)
5.08
(0.200)
1.78
(0.070) MAX.
4 Places
8 Places
MAX.
3.17
(0.125) MIN.
0.51
(0.020) MIN.
2.54
(0.100) Typical
(see Note A)
6 Places
0.38 - 0.53
(0.015 - 0.021)
7.62 - 8.23
(0.300 - 0.324)
8.38 - 9.40
(0.330 - 0.370)
0.20 - 0.36
(0.008 - 0.014)
PDIP – Plastic Dual-in-Line
Suffix – P
DIMENSIONS = MILLIMETERS
(INCHES)
DIMENSIONS = MILLIMETERS
(INCHES)
2
13
Index
Notch
9.25 - 9.75
(0.364 - 0.384)
3.20 - 3.40
(0.126 - 0.134)
6.10 - 6.60
(0.240 - 0.260)
0.203 - 0.356
(0.008- 0.014)
0.559 - 0.711
(0.022 - 0.028)
3 Places
12.9
(0.492)
4.267
(0.168)
MIN.
MAX.
1.854
(0.073)
MAX.
8.31
(0.327)
MAX.
2.54
(0.100) Typical
(See Note A)
2 Places
SIP – Plastic Single-in-Line
Suffix – SL
43
2.11 - 2.31
(0.083 - 0.091)
0.508
(0.020) MAX.
0.178
(0.007) MAX.
To p E le c tr o de
Sleeve
Bidirectional
Bottom Electrode
Silicon Chip
1.27 - 1.65
(0.050 - 0.065) DIA.2 x
3.76 - 4.27
(0.148 - 0.168) DIA.
9ELX – Primary Protector Series
To p Electrode
Sleeve
Bidirectional
Silicon Chip
Bottom Electrode
2.16 - 2.45
(0.085 - 0.096)
0.508
(0.020) MAX.
0.178
(0.007) MAX.
2.16 - 2.67
(0.085 - 0.105) DIA.
6.10
(0.240) DIA.
7EL2 – Primary Protector
DIMENSIONS = MILLIMETERS
(INCHES)
44
2.11 - 2.31
(0.083 - 0.091)
0.508
(0.020) MAX.
0.178
(0.007) MAX.
To p E le c t r o de
Sleeve
Bidirectional
Bottom Electrode
Silicon Chip
1.27 - 1.65
(0.050 - 0.065) DIA.2 x
3.76 - 4.27
(0.148 - 0.168) DIA.
Button Cell
DIMENSIONS = MILLIMETERS
(INCHES)
45
TVS Diodes
Selection Guide
Bourns offers Transient Voltage Suppressor diodes for
low energy surge and ESD protection applications
that meet the following standards: IEC 61000-4-2,
IEC 61000-4-4 and IEC 61000-4-5
Features
Compact package options: DO-214AC (SMA),
DO-214AA (SMB) and DO-214AB (SMC)
•Working Peak Reverse Voltages
from 5 V up to 170 V
Breakdown Voltages up to 200 V
Typical fast response times are less than 1.0 ns
(Unidirectional), 5.0 ns (Bidirectional)
Conforms to JEDEC standards
Easy to handle on standard pick and place
equipment
Flat configuration minimizes roll away
• RoHS compliance optional
Minimum Peak Pulse
Power Dissipation
(TP = 1 ms)
PPK
Working Peak
Reverse Voltages
VRWM
Peak Forward Surge Current
8.3 ms Single Half Sine Wave
Superimposed on Rated Load
(JEDEC Method)
Package
Reference*
CD214A-TX.XX 400 W 5 to 170 V 40 A SMA
CD214B-TX.XX 600 W 5 to 170 V 100 A SMB
CD214C-TX.XX 1500 W 5 to 170 V 200 A SMC
*See data sheet for mechanical specification.
46
CD214A Series (SMA Package)
Electrical Characteristics (@ TA= 25 °C unless otherwise noted)
Part Number
(Unidirectional
Device)
Part
Mrkg
Part Number
(Bidirectional
Device)
Part
Mrkg
Breakdown Voltage
VBR Volts
Working Peak
Reverse
Voltage
Max. Reverse
Leakage
at VRWM
Max. Reverse
Voltage
at IRSM
Max. Reverse
Surge Current Pkg
Min. Max. @IT (mA) VRWM (Volts) IR(uA) VRSM (Volts) IRSM (Amps)
CD214A-T5.0A HE CD214A-T5.0CA TE 6.40 7.00 10 5.0 800 / 1600 9.2 43.5 SMA
CD214A-T6.0A HG CD214A-T6.0CA TG 6.67 7.37 10 6.0 800 / 1600 10.3 38.8 SMA
CD214A-T6.5A HK CD214A-T6.5CA TK 7.22 7.98 10 6.5 500 / 1000 11.2 35.7 SMA
CD214A-T7.0A HM CD214A-T7.0CA TM 7.78 8.60 10 7.0 200 / 400 12.0 33.3 SMA
CD214A-T7.5A HP CD214A-T7.5CA TP 8.33 9.21 1.0 7.5 100 / 200 12.9 31.0 SMA
CD214A-T8.0A HR CD214A-T8.0CA TR 8.89 9.83 1.0 8.0 50 / 100 13.6 29.4 SMA
CD214A-T8.5A HT CD214A-T8.5CA TT 9.44 10.4 1.0 8.5 10 / 20 14.4 27.7 SMA
CD214A-T9.0A HV CD214A-T9.0CA TV 10.0 11.1 1.0 9.0 5 / 10 15.4 26.0 SMA
CD214A-T10A HX CD214A-T10CA TX 11.1 12.3 1.0 10 5 / 10 17.0 23.5 SMA
CD214A-T11A HZ CD214A-T11CA TZ 12.2 13.2 1.0 11 5.0 18.2 22.0 SMA
CD214A-T12A IE CD214A-T12CA UE 13.3 14.7 1.0 12 5.0 19.9 20.1 SMA
CD214A-T13A IG CD214A-T13CA UG 14.4 15.9 1.0 13 5.0 21.5 18.6 SMA
CD214A-T14A IK CD214A-T14CA UK 15.6 17.2 1.0 14 5.0 23.2 17.2 SMA
CD214A-T15A IM CD214A-T15CA UM 16.7 18.5 1.0 15 5.0 24.4 16.4 SMA
CD214A-T16A IP CD214A-T16CA UP 17.8 19.7 1.0 16 5.0 26.0 15.3 SMA
CD214A-T17A IR CD214A-T17CA UR 18.9 20.9 1.0 17 5.0 27.6 14.5 SMA
CD214A-T18A IT CD214A-T18CA UT 20.0 22.1 1.0 18 5.0 29.2 13.7 SMA
CD214A-T20A IV CD214A-T20CA UV 22.2 24.5 1.0 20 5.0 32.4 12.3 SMA
CD214A-T22A IX CD214A-T22CA UX 24.4 26.9 1.0 22 5.0 35.5 11.2 SMA
CD214A-T24A IZ CD214A-T24CA UZ 26.7 29.5 1.0 24 5.0 38.9 10.3 SMA
CD214A-T26A JE CD214A-T26CA VE 28.9 31.9 1.0 26 5.0 42.1 9.5 SMA
CD214A-T28A JG CD214A-T28CA VG 31.1 34.4 1.0 28 5.0 45.4 8.8 SMA
CD214A-T30A JK CD214A-T30CA VK 33.3 36.8 1.0 30 5.0 48.4 8.3 SMA
CD214A-T33A JM CD214A-T33CA VM 36.7 40.6 1.0 33 5.0 53.3 7.5 SMA
CD214A-T36A JP CD214A-T36CA VP 40 44.2 1.0 36 5.0 58.1 6.9 SMA
CD214A-T40A JR CD214A-T40CA VR 44.4 49.1 1.0 40 5.0 64.5 6.2 SMA
CD214A-T43A JT CD214A-T43CA VT 47.8 52.8 1.0 43 5.0 69.4 5.7 SMA
CD214A-T45A JV CD214A-T45CA VV 50 55.3 1.0 45 5.0 72.7 5.5 SMA
CD214A-T48A JX CD214A-T48CA VX 53.3 58.9 1.0 48 5.0 77.4 5.2 SMA
CD214A-T51A JZ CD214A-T51CA VZ 56.7 62.7 1.0 51 5.0 82.4 4.9 SMA
CD214A-T54A RE CD214A-T54CA WE 60 66.3 1.0 54 5.0 87.1 4.6 SMA
CD214A-T58A RG CD214A-T58CA WG 64.4 71.2 1.0 58 5.0 93.6 4.3 SMA
CD214A-T60A RK CD214A-T60CA WK 66.7 73.7 1.0 60 5.0 96.8 4.1 SMA
CD214A-T64A RM CD214A-T64CA WM 71.1 78.6 1.0 64 5.0 103 3.9 SMA
CD214A-T70A RP CD214A-T70CA WP 77.8 86.0 1.0 70 5.0 113 3.5 SMA
CD214A-T75A RR CD214A-T75CA WR 83.3 92.1 1.0 75 5.0 121 3.3 SMA
CD214A-T78A RT CD214A-T78CA WT 86.7 95.8 1.0 78 5.0 126 3.2 SMA
CD214A-T85A RV CD214A-T85CA WV 94.4 104 1.0 85 5.0 137 2.9 SMA
CD214A-T90A RX CD214A-T90CA WX 100 111 1.0 90 5.0 146 2.7 SMA
CD214A-T100A RZ CD214A-T100CA WZ 111 123 1.0 100 5.0 162 2.5 SMA
CD214A-T110A SE CD214A-T110CA XE 122 135 1.0 110 5.0 177 2.3 SMA
CD214A-T120A SG CD214A-T120CA XG 133 147 1.0 120 5.0 193 2.0 SMA
CD214A-T130A SK CD214A-T130CA XK 144 159 1.0 130 5.0 209 1.9 SMA
CD214A-T150A SM CD214A-T150CA XM 167 185 1.0 150 5.0 243 1.6 SMA
CD214A-T160A SP CD214A-T160CA XP 178 197 1.0 160 5.0 259 1.5 SMA
CD214A-T170A SR CD214A-T170CA XR 189 209 1.0 170 5.0 275 1.4 SMA
Notes:
1. Suffix A denotes 5 % tolerance device.
2. Suffix “C” denotes Bidirectional device.
3. Suffix “CA denotes 5 % tolerance Bidirectional device.
4. 10 % tolerance devices are available but not shown above.
5. For Bidirectional devices having VR= 10 Volts or under, the IRlimit is double.
6. For Unidirectional devices having VFMax = 3.5 V at IF= 35 A, 0.5 Sine Wave of 8.3 ms pulse width.
7. For RoHS compliant devices, add suffix "LF" to part number.
47
CD214B Series (SMB Package)
Electrical Characteristics (@ TA= 25 °C unless otherwise noted)
Part Number
(Unidirectional
Device)
Part
Mrkg
Part Number
(Bidirectional
Device)
Part
Mrkg
Breakdown Voltage
VBR Volts
Working Peak
Reverse
Voltage
Max. Reverse
Leakage
at VRWM
Max. Reverse
Voltage
at IRSM
Max. Reverse
Surge Current Pkg
Min. Max. @IT (mA) VRWM (Volts) IR(uA) VRSM (Volts) IRSM (Amps)
CD214B-T5.0A HKE CD214B-T5.0CA AE 6.40 7.25 10 5.0 800 9.2 65.2 SMB
CD214B-T6.0A KG CD214B-T6.0CA AG 6.67 7.67 10 6.0 800 10.3 58.3 SMB
CD214B-T6.5A KK CD214B-T6.5CA AK 7.22 8.30 10 6.5 500 11.2 53.6 SMB
CD214B-T7.0A KM CD214B-T7.0CA AM 7.78 8.95 10 7.0 200 12.0 50.0 SMB
CD214B-T7.5A KP CD214B-T7.5CA AP 8.33 9.58 1.0 7.5 100 12.9 46.5 SMB
CD214B-T8.0A KR CD214B-T8.0CA AR 8.89 10.2 1.0 8.0 50 13.6 44.1 SMB
CD214B-T8.5A KT CD214B-T8.5CA AT 9.44 10.8 1.0 8.5 20 14.4 41.7 SMB
CD214B-T9.0A KV CD214B-T9.0CA AV 10.0 11.5 1.0 9.0 10 15.4 39.0 SMB
CD214B-T10A KX CD214B-T10CA AX 11.1 12.8 1.0 10 5.0 17.0 35.3 SMB
CD214B-T11A KZ CD214B-T11CA AZ 12.2 14.4 1.0 11 5.0 18.2 33.0 SMB
CD214B-T12A LE CD214B-T12CA BE 13.3 15.3 1.0 12 5.0 19.9 30.2 SMB
CD214B-T13A LG CD214B-T13CA BG 14.4 16.5 1.0 13 5.0 21.5 27.9 SMB
CD214B-T14A LK CD214B-T14CA BK 15.6 17.9 1.0 14 5.0 23.2 25.8 SMB
CD214B-T15A LM CD214B-T15CA BM 16.7 19.2 1.0 15 5.0 24.4 24.0 SMB
CD214B-T16A LP CD214B-T16CA BP 17.8 20.5 1.0 16 5.0 26.0 23.1 SMB
CD214B-T17A LR CD214B-T17CA BR 18.9 21.7 1.0 17 5.0 27.6 21.7 SMB
CD214B-T18A LT CD214B-T18CA BT 20.0 23.3 1.0 18 5.0 29.2 20.5 SMB
CD214B-T20A LV CD214B-T20CA BV 22.2 25.5 1.0 20 5.0 32.4 18.5 SMB
CD214B-T22A LX CD214B-T22CA BX 24.4 28.0 1.0 22 5.0 35.5 16.9 SMB
CD214B-T24A LZ CD214B-T24CA BZ 26.7 30.7 1.0 24 5.0 38.9 15.4 SMB
CD214B-T26A ME CD214B-T26CA CE 28.9 32.2 1.0 26 5.0 42.1 14.2 SMB
CD214B-T28A MG CD214B-T28CA CG 31.1 35.8 1.0 28 5.0 45.4 13.2 SMB
CD214B-T30A MK CD214B-T30CA CK 33.3 38.3 1.0 30 5.0 48.4 12.4 SMB
CD214B-T33A MM CD214B-T33CA CM 36.7 42.2 1.0 33 5.0 53.3 11.3 SMB
CD214B-T36A MP CD214B-T36CA CP 40 46.0 1.0 36 5.0 58.1 10.3 SMB
CD214B-T40A MR CD214B-T40CA CR 44.4 51.1 1.0 40 5.0 64.5 9.3 SMB
CD214B-T43A MT CD214B-T43CA CT 47.8 54.9 1.0 43 5.0 69.4 8.6 SMB
CD214B-T45A MV CD214B-T45CA CV 50 57.5 1.0 45 5.0 72.7 8.3 SMB
CD214B-T48A MX CD214B-T48CA CX 53.3 61.3 1.0 48 5.0 77.4 7.7 SMB
CD214B-T51A MZ CD214B-T51CA CZ 56.7 65.2 1.0 51 5.0 82.4 7.3 SMB
CD214B-T54A NE CD214B-T54CA DE 60 69 1.0 54 5.0 87.1 6.9 SMB
CD214B-T58A NG CD214B-T58CA DG 64.4 74.6 1.0 58 5.0 93.6 6.4 SMB
CD214B-T60A NK CD214B-T60CA DK 66.7 76.7 1.0 60 5.0 96.8 6.2 SMB
CD214B-T64A NM CD214B-T64CA DM 71.1 81.8 1.0 64 5.0 103 5.8 SMB
CD214B-T70A NP CD214B-T70CA DP 77.8 89.5 1.0 70 5.0 113 5.3 SMB
CD214B-T75A NR CD214B-T75CA DR 83.3 95.8 1.0 75 5.0 121 4.9 SMB
CD214B-T78A NT CD214B-T78CA DT 86.7 99.7 1.0 78 5.0 126 4.7 SMB
CD214B-T85A NV CD214B-T85CA DV 94.4 109 1.0 85 5.0 137 4.4 SMB
CD214B-T90A NX CD214B-T90CA DX 100 116 1.0 90 5.0 146 4.1 SMB
CD214B-T100A NZ CD214B-T100CA DZ 111 128 1.0 100 5.0 162 3.7 SMB
CD214B-T110A PE CD214B-T110CA EE 122 140 1.0 110 5.0 177 3.4 SMB
CD214B-T120A PG CD214B-T120CA EG 133 153 1.0 120 5.0 193 3.1 SMB
CD214B-T130A PK CD214B-T130CA EK 144 165 1.0 130 5.0 209 2.9 SMB
CD214B-T150A PM CD214B-T150CA EM 167 192 1.0 150 5.0 243 2.5 SMB
CD214B-T160A PP CD214B-T160CA EP 178 205 1.0 160 5.0 259 2.3 SMB
CD214B-T170A PR CD214B-T170CA ER 189 218 1.0 170 5.0 275 2.2 SMB
Notes:
1. Suffix A denotes 5 % tolerance device.
2. Suffix “C” denotes Bidirectional device.
3. Suffix “CA denotes 5 % tolerance Bidirectional device.
4. 10 % tolerance devices are available but not shown above.
5. For Bidirectional devices having VR= 10 Volts or under, the IRlimit is double.
6. For Unidirectional devices having VFMax = 3.5 V at IF= 35 A, 0.5 Sine Wave of 8.3 ms pulse width.
7. For RoHS compliant devices, add suffix "LF" to part number.
48
CD214C Series (SMC Package)
Electrical Characteristics (@ TA= 25 °C unless otherwise noted)
Part Number
(Unidirectional
Device)
Part
Mrkg
Part Number
(Bidirectional
Device)
Part
Mrkg
Breakdown Voltage
VBR Volts
Working Peak
Reverse
Voltage
Max. Reverse
Leakage
at VRWM
Max. Reverse
Voltage
at IRSM
Max. Reverse
Surge Current Pkg
Min. Max. @IT (mA) VRWM (Volts) IR(uA) VRSM (Volts) IRSM (Amps)
CD214C-T5.0A GDE CD214C-T5.0CA BDE 6.40 7.23 10 5.0 1000 9.2 163 SMC
CD214C-T6.0A GDG CD214C-T6.0CA BDG 6.67 7.67 10 6.0 1000 10.3 145.6 SMC
CD214C-T6.5A GDK CD214C-T6.5CA BDK 7.22 8.3 10 6.5 500 11.2 133.9 SMC
CD214C-T7.0A GDM CD214C-T7.0CA BDM 7.78 8.95 10 7.0 200 12.0 125 SMC
CD214C-T7.5A GDP CD214C-T7.5CA BDP 8.33 9.58 1.0 7.5 100 12.9 116.3 SMC
CD214C-T8.0A GDR CD214C-T8.0CA BDR 8.89 10.2 1.0 8.0 50 13.6 110.3 SMC
CD214C-T8.5A GDT CD214C-T8.5CA BDT 9.44 10.8 1.0 8.5 20 14.4 104.2 SMC
CD214C-T9.0A GDV CD214C-T9.0CA BDV 10.0 11.5 1.0 9.0 10 15.4 97.4 SMC
CD214C-T10A GDX CD214C-T10CA BDX 11.1 12.8 1.0 10 5.0 17.0 88.2 SMC
CD214C-T11A GDZ CD214C-T11CA BDZ 12.2 14.4 1.0 11 5.0 18.2 82.4 SMC
CD214C-T12A GEE CD214C-T12CA BEE 13.3 15.3 1.0 12 5.0 19.9 75.3 SMC
CD214C-T13A GEG CD214C-T13CA BEG 14.4 16.5 1.0 13 5.0 21.5 69.7 SMC
CD214C-T14A GEK CD214C-T14CA BEK 15.6 17.9 1.0 14 5.0 23.2 64.7 SMC
CD214C-T15A GEM CD214C-T15CA BEM 16.7 19.2 1.0 15 5.0 24.4 61.5 SMC
CD214C-T16A GEP CD214C-T16CA BEP 17.8 20.5 1.0 16 5.0 26.0 57.7 SMC
CD214C-T17A GER CD214C-T17CA BER 18.9 21.7 1.0 17 5.0 27.6 53.3 SMC
CD214C-T18A GET CD214C-T18CA BET 20.0 23.3 1.0 18 5.0 29.2 51.4 SMC
CD214C-T20A GEV CD214C-T20CA BEV 22.2 25.5 1.0 20 5.0 32.4 46.3 SMC
CD214C-T22A GEX CD214C-T22CA BEX 24.4 28 1.0 22 5.0 35.5 42.2 SMC
CD214C-T24A GEZ CD214C-T24CA BEZ 26.7 30.7 1.0 24 5.0 38.9 38.6 SMC
CD214C-T26A GFE CD214C-T26CA BFE 28.9 32.2 1.0 26 5.0 42.1 35.6 SMC
CD214C-T28A GFG CD214C-T28CA BFG 31.1 35.8 1.0 28 5.0 45.4 33 SMC
CD214C-T30A GFK CD214C-T30CA BFK 33.3 38.3 1.0 30 5.0 48.4 31 SMC
CD214C-T33A GFM CD214C-T33CA BFM 36.7 42.2 1.0 33 5.0 53.3 28.1 SMC
CD214C-T36A GFP CD214C-T36CA BFP 40 46 1.0 36 5.0 58.1 25.8 SMC
CD214C-T40A GFR CD214C-T40CA BFR 44.4 51.1 1.0 40 5.0 64.5 23.3 SMC
CD214C-T43A GFT CD214C-T43CA BFT 47.8 54.9 1.0 43 5.0 69.4 21.6 SMC
CD214C-T45A GFV CD214C-T45CA BFV 50 57.5 1.0 45 5.0 72.7 20.6 SMC
CD214C-T48A GFX CD214C-T48CA BFX 53.3 61.3 1.0 48 5.0 77.4 19.4 SMC
CD214C-T51A GFZ CD214C-T51CA BFZ 56.7 65.2 1.0 51 5.0 82.4 18.2 SMC
CD214C-T54A GGE CD214C-T54CA BGE 60 69 1.0 54 5.0 87.1 17.2 SMC
CD214C-T58A GGG CD214C-T58CA BGG 64.4 74.6 1.0 58 5.0 93.6 16 SMC
CD214C-T60A GGK CD214C-T60CA BGK 66.7 76.7 1.0 60 5.0 96.8 15.5 SMC
CD214C-T64A GGM CD214C-T64CA BGM 71.1 81.8 1.0 64 5.0 103 14.6 SMC
CD214C-T70A GGP CD214C-T70CA BGP 77.8 89.5 1.0 70 5.0 113 13.3 SMC
CD214C-T75A GGR CD214C-T75CA BGR 83.3 95.8 1.0 75 5.0 121 12.4 SMC
CD214C-T78A GGT CD214C-T78CA BGT 86.7 99.7 1.0 78 5.0 126 11.4 SMC
CD214C-T85A GGV CD214C-T85CA BGV 94.4 108.2 1.0 85 5.0 137 10.4 SMC
CD214C-T90A GGX CD214C-T90CA BGX 100 115.5 1.0 90 5.0 146 10.3 SMC
CD214C-T100A GGZ CD214C-T100CA BGZ 111 128 1.0 100 5.0 162 9.3 SMC
CD214C-T110A GHE CD214C-T110CA BHE 122 140 1.0 110 5.0 177 8.4 SMC
CD214C-T120A GHG CD214C-T120CA BHG 133 153 1.0 120 5.0 193 7.9 SMC
CD214C-T130A GHK CD214C-T130CA BHK 144 165 1.0 130 5.0 209 7.2 SMC
CD214C-T150A GHM CD214C-T150CA BHM 167 192 1.0 150 5.0 243 6.2 SMC
CD214C-T160A GHP CD214C-T160CA BHP 178 205 1.0 160 5.0 259 5.8 SMC
CD214C-T170A GHR CD214C-T170CA BHR 189 217.5 1.0 170 5.0 275 5.5 SMC
Notes:
1. Suffix A denotes 5 % tolerance device.
2. Suffix “C” denotes Bidirectional device.
3. Suffix “CA denotes 5 % tolerance Bidirectional device.
4. 10 % tolerance devices are available but not shown above.
5. For Bidirectional devices having VR= 10 Volts or under, the IRlimit is double.
6. For Unidirectional devices having VFMax = 3.5 V at IF= 35 A, 0.5 Sine Wave of 8.3 ms pulse width.
7. For RoHS compliant devices, add suffix "LF" to part number.
49
Bourns®Multifuse®Resettable Fuses
Selection Guide
The range of Bourns® Multifuse® Polymer PTC
resettable fuses is designed to limit overcurrents in
telecommunications equipment as well as many
other types of equipment. Adequate overcurrent
protection is needed to allow equipment to comply
with international standards. Overcurrents can be
caused by AC power or lightning flash disturbances
that are induced or conducted to the telephone line.
Our extensive range offers multiple voltage variants
to suit specific application requirements.
Features
Resettable Circuit Protection
Designed to Withstand Lightning Surge
Designed to Withstand AC Power Cross
Available in Matched Resistance “Bins
Agency Approvals - UL, CSA, TÜV
Popular Footprints and Packaging
•Low Resistance
•Lead Free Options
Custom Designs Available
Package Types: SM, R, Disk, Strap
Applications
CPE and Central Office
Access Equipment
Hybrid-Fiber Coax
Power over Ethernet
MF-R/90 Series – Radial Leaded, 90 Volts
Typical Applications: Hybrid-fiber coax, power passing taps, Power over Ethernet RoHS Compliant
Model
Ihold
(Amps @
23 °C)
V max.
(Volts)
I max.
(Amps)
Initial
Resistance
(Ohms @
23 °C Min.)
1 Hour (R1)
Post-Trip
Resistance
(Ohms @
23 °C Max.)
Dimensions [mm/(in)]
Style
A Max. B Max. C Nom.
MF-R055/90 0.55
90 10
0.45 2.0 10.9
(0.43)
14.0
(0.55)
5.1
(0.201) 1MF-R055/90U 0.55 0.45 2.0 10.3
(0.4)
10.3
(0.4)
MF-R075/90 0.75 0.37 1.65 11.9
(0.47)
15.5
(0.61)
A
B
C
Style 1 Style 2 Style 3
B
C
A
A
C
B
50
MF-RX/250 Series – Radial Leaded, 60 Volts, 250 Vrms Short Duration Interrupt
Fast Trip, Small Package. Applicable Standards: ITU-T K.20/21/45, GR-1089-CORE Intrabuilding RoHS Compliant
Model
Ihold
(Amps
@
23 °C)
V max.
(Volts)
I max.
(Amps)
Max. Interrupt
Ratings Initial
Resistance
(Ohms @
23 °C Min.)
1 Hour (R1)
Post-Trip
Resistance
(Ohms @
23 °C Max.)
Dimensions
[mm/(in)]
Style
Volts
(Vrms)
Amps
(A)
A
Max.
B
Max.
C
Nom.
MF-RX012/250 0.12
60
3.0
250
3 4.0 16.0 6.5
(0.256)
11.0
(0.433)
5.1
(0.201) 2
MF-RX012/250-A 0.12 3.0 3 7.0 16.0 6.5
(0.256)
11.0
(0.433)
MF-RX012/250-C 0.12 3.0 3 5.5 14.0 6.5
(0.256)
11.0
(0.433)
MF-RX012/250-F 0.12 3.0 3 6.0 16.0 6.5
(0.256)
11.0
(0.433)
MF-RX012/250-1 0.12 3.0 3 6.0 16.0 6.5
(0.256)
11.0
(0.433)
MF-RX012/250-2 0.12 3.0 3 8.0 16.0 6.5
(0.256)
11.0
(0.433)
MF-RX012/250-T 0.12 3.0 3 7.0 16.0 6.5
(0.256)
11.0
(0.433)
MF-RX012/250U 0.12 3.0 3 6.0 16.0 6.0
(0.236)
10.0
(0.394)
MF-RX014/250 0.145 3.0 3 3.0 14.0 6.5
(0.256)
11.0
(0.433)
MF-RX014/250-A 0.145 3.0 3 3.0 12.0 6.5
(0.256)
11.0
(0.433)
MF-RX014/250-B 0.145 3.0 3 4.5 14.0 6.5
(0.256)
11.0
(0.433)
MF-RX014/250-T 0.145 3.0 3 5.4 14.0 6.5
(0.256)
11.0
(0.433)
MF-RX014/250U 0.145 3.0 3 3.5 12.0 6.0
(0.236)
10.0
(0.394)
MF-RX018/250 0.18 10.0 10 0.8 4.0 11.0
(0.433)
13.6
(0.535)
MF-RX018/250U 0.18 10.0 10 0.8 4.0 10.4
(0.409)
12.6
(0.496)
RX012
24001K
MF-SM013/250 Series – Surface Mount, 60 Volts, 250 Vrms Short Duration Interrupt
Applicable Standards: ITU-T K.20/21/45, GR-1089-CORE Intrabuilding RoHS Compliant
Model
Ihold
(Amps
@
23 °C)
V max.
(Volts)
I max.
(Amps)
Max. Interrupt
Ratings Initial
Resistance
(Ohms @
23 °C Min.)
1 Hour (R1)
Post-Trip
Resistance
(Ohms @
23 °C Max.)
Dimensions
[mm/(in)]
Style
Volts
(Vrms)
Amps
(A)
A
Max.
B
Max.
C
Nom.
MF-SM013/250-2
0.13 60 3.0 250 3
6.5
20.0 9.4
(0.370)
3.4
(0.133)
7.4
(0.291) 3
MF-SM013/250-A-2 6.5
MF-SM013/250-B-2 9.0
MF-SM013/250-C-2 7.0
51
MF-R/600 Series – Radial Leaded, 60 Volts, 600 Vrms Short Duration Interrupt
Applicable Standards: UL60950, GR-1089-CORE, ITU-T K.20/21/45 RoHS Compliant
Model
Ihold
(Amps
@
23 °C)
V max.
(Volts)
I max.
(Amps)
Max. Interrupt
Ratings Initial
Resistance
(Ohms @
23 °C Min.)
1 Hour (R1)
Post-Trip
Resistance
(Ohms @
23 °C Max.)
Dimensions
[mm/(in)]
Style
Volts
(Vrms)
Amps
(A)
A
Max.
B
Max.
C
Nom.
MF-R015/600 0.15
60 3.0 600 3
6.0 22.0 13.5
(0.531)
12.6
(0.496)
6.0
(0.236) 2
MF-R015/600-A 0.15 7.0 20.0 13.5
(0.531)
MF-R015/600-B 0.15 9.0 22.0 13.5
(0.531)
MF-R015/600-F 0.15 7.0 22.0 13.5
(0.531)
MF-R016/600 0.16 4.0 18.0 16.0
(0.629)
MF-R016/600-A 0.16 4.0 16.0 16.0
(0.629)
MF-R016/600-1 0.16 4.0 17.0 16.0
(0.629)
R015
24001K
Device Options:
•Coated or Uncoated
Un-Tripped or Pre-Tripped
Narrow Resistance Bands
Custom Specified Resistance Bands
Resistance Sort to 0.5 Ohm Bins
Disks With and Without Solder Coating
Packaging Options:
•Bulk Packed
•Tape and Reel
Custom Lead Lengths
52
Features
•Industry Standard Sizes
Resettable Circuit Protection
Agency Approvals - UL, CSA, TÜV.
Popular Footprints and Packaging
•Low Resistance
•Lead Free Options
Custom Designs Available
Applications
•Computers and Peripherals
General Electronics
•Automotive
Set-top Boxes
Servers & Routers
Selection of Surface Mount Low Voltage Products
Style 2 Style 3Style 1
A
B
C
Top and Bottom View Side View Top and Bottom View Side ViewSide View End View
A
B
C
A
C
B
MF-SMDF Series – Surface Mount (Lead Free), 10-60 Volts
2018 Package. Typical Application: Power over Ethernet. Applicable Standard: IEEE 802.3AF. RoHS Compliant
MF-SM Series – Surface Mount, 15-33 Volts
3425 Package. Typical Application: Circuit Level Protection.
Model
Ihold
(Amps @
23 °C)
V max.
(Volts)
I max.
(Amps)
Initial
Resistance
(Ohms @
23 °C Min.)
1 Hour (R1)
Post-Trip
Resistance
(Ohms @
23 °C Max.)
Dimensions [mm/(in)]
Style
A Max. B Max. C Nom.
MF-SMDF050 0.50 60 10 0.20 0.95
5.44
(0.214)
4.93
(0.194)
1.09
(0.043)
3
MF-SMDF150 1.50 15 40 0.07 0.175 0.85
(0.033)
Model
Ihold
(Amps @
23 °C)
V max.
(Volts)
I max.
(Amps)
Initial
Resistance
(Ohms @
23 °C Min.)
1 Hour (R1)
Post-Trip
Resistance
(Ohms @
23 °C Max.)
Dimensions [mm/(in)]
Style
A Max. B Max. C Nom.
MF-SM150 1.50 15 100 0.06 0.25
9.50
(0.374)
3.00
(0.118)
6.71
(0.264) 1
MF-SM150/33 1.50 33 40 0.06 0.23
MF-SM200 2.00 15 100 0.045 0.125
MF-SM250 2.50 15 100 0.024 0.085
Note:
RoHS compliant by adding -99 at the end of the part number, i.e. MF-SM150-2-99.
53
MF-SM Series – Surface Mount, 6-60 Volts
2920 Package. Typical Application: Circuit Level Protection.
Model
Ihold
(Amps @
23 °C)
V max.
(Volts)
I max.
(Amps)
Initial
Resistance
(Ohms @
23 °C Min.)
1 Hour (R1)
Post-Trip
Resistance
(Ohms @
23 °C Max.)
Dimensions [mm/(in)]
Style
A Max. B Max. C Nom.
MF-SM030 0.30 60 40 0.90 4.80
7.98
(0.314)
3.18
(0.125)
5.44
(0.214) 1
MF-SM050 0.50 60 40 0.35 1.40
MF-SM075 0.75 30 80 0.23 1.00
MF-SM100 1.10 30 80 0.12 0.48
MF-SM100/33 1.10 33 40 0.12 0.41
MF-SM125 1.25 15 100 0.07 0.25
MF-SM260 2.60 6 100 0.025 0.075
MF-MSMF Series – Surface Mount (Lead Free), 6-60 Volts
1812 Package. Typical Application: USB 2.0. RoHS Compliant
Model
Ihold
(Amps @
23 °C)
V max.
(Volts)
I max.
(Amps)
Initial
Resistance
(Ohms @
23 °C Min.)
1 Hour (R1)
Post-Trip
Resistance
(Ohms @
23 °C Max.)
Dimensions [mm/(in)]
Style
A Max. B Max. C Nom.
MF-MSMF010 0.10 60 40 0.70 15.0
4.73
(0.186)
3.41
(0.134)
1.10
(0.043)
3
MF-MSMF014 0.14 60 40 0.40 6.50
MF-MSMF020 0.20 30 80 0.40 6.00
MF-MSMF030 0.30 30 10 0.30 3.00
MF-MSMF050 0.50 15 100 0.15 1.00
0.85
(0.033)
MF-MSMF075 0.75 13.2 100 0.11 0.45
MF-MSMF075/24 0.75 24 40 0.11 0.45
MF-MSMF110 1.10 6 100 0.04 0.21
MF-MSMF110/16 1.10 16 100 0.04 0.21
MF-MSMF125 1.25 6 100 0.035 0.14
MF-MSMF150 1.50 6 100 0.03 0.12
MF-MSMF160 1.60 8 100 0.035 0.099
MF-MSMF200 2.00 6 100 0.020 0.1
MF-MSMF250/16 2.50 16 100 0.015 0.1
MF-MSMF260 2.60 6 100 0.015 0.08
Note:
RoHS compliant by adding -99 at the end of the part number.
54
MF-MSMD Series – Surface Mount, 6-60 Volts
1812 Package. Typical Application: USB 2.0.
Model
Ihold
(Amps @
23 °C)
V max.
(Volts)
I max.
(Amps)
Initial
Resistance
(Ohms @
23 °C Min.)
1 Hour (R1)
Post-Trip
Resistance
(Ohms @
23 °C Max.)
Dimensions [mm/(in)]
Style
A Max. B Max. C Nom.
MF-MSMD010 0.10 60 40 0.70 15.000
4.73
(0.186)
3.41
(0.134)
0.81
(0.032)
2
MF-MSMD014 0.14 60 40 0.40 6.500 0.81
(0.032)
MF-MSMD020 0.20 30 80 0.40 6.000 0.81
(0.032)
MF-MSMD030 0.30 30 10 0.30 3.000 0.81
(0.032)
MF-MSMD050 0.50 15 100 0.15 1.000 0.62
(0.024)
MF-MSMD075 0.75 13.2 100 0.11 0.450 0.62
(0.024)
MF-MSMD110 1.10 6 100 0.04 0.210 0.62
(0.024)
MF-MSMD125 1.25 6 100 0.035 0.140 0.48
(0.019)
MF-MSMD150 1.50 6 100 0.03 0.120 0.48
(0.019)
MF-MSMD160 1.60 8 100 0.035 0.099 0.48
(0.019)
MF-MSMD200 2.00 6 100 0.020 0.100 0.48
(0.019)
MF-MSMD260 2.60 6 100 0.015 0.080 0.48
(0.019)
MF-USMD Series – Surface Mount, 6-30 Volts
1210 Package. Typical Application: USB 2.0.
Model
Ihold
(Amps @
23 °C)
V max.
(Volts)
I max.
(Amps)
Initial
Resistance
(Ohms @
23 °C Min.)
1 Hour (R1)
Post-Trip
Resistance
(Ohms @
23 °C Max.)
Dimensions [mm/(in)]
Style
A Max. B Max. C Nom.
MF-USMD005 0.05 30 10 2.80 50.0
3.43
(0.135)
2.80
(0.110)
0.85
(0.033)
2
MF-USMD010 0.10 30 10 0.80 15.0 0.85
(0.033)
MF-USMD020 0.20 30 10 0.40 5.00 0.85
(0.033)
MF-USMD035 0.35 6 40 0.20 1.30 0.62
(0.024)
MF-USMD050 0.50 13.2 40 0.18 0.90 0.62
(0.024)
MF-USMD075 0.75 6 40 0.07 0.45 0.62
(0.024)
MF-USMD110 1.10 6 40 0.05 0.21 0.48
(0.019)
075
55
MF-NSMF Series – Surface Mount (Lead Free), 6-30 Volts
1206 Package. Typical Application: USB On The Go RoHS Compliant
Model
Ihold
(Amps @
23 °C)
V max.
(Volts)
I max.
(Amps)
Initial
Resistance
(Ohms @
23 °C Min.)
1 Hour (R1)
Post-Trip
Resistance
(Ohms @
23 °C Max.)
Dimensions [mm/(in)]
Style
A Max. B Max. C Nom.
MF-NSMF012 0.12 30 10 1.50 6.0
3.4
(0.134)
1.8
(0.071)
1.10
(0.043)
3
MF-NSMF020 0.20 24 10 0.60 2.60 0.85
(0.033)
MF-NSMF035 0.35 6 100 0.30 1.20 0.85
(0.033)
MF-NSMF050 0.50 13.2 100 0.15 0.70 0.85
(0.033)
MF-NSMF075 0.75 6 100 0.10 0.29 0.70
(0.028)
MF-NSMF110 1.10 6 100 0.06 0.20 0.70
(0.028)
MF-NSMF150 1.50 6 100 0.03 0.13 0.70
(0.028)
56
Features
Bulk and Tape and Reel Packaging
Resettable Circuit Protection
Agency Approvals - UL, CSA, TÜV.
Popular Footprints and Packaging
•Low Resistance
•Lead Free Options
Custom Designs Available
Applications
•Computers and Peripherals
General Electronics
Selection of Radial Low Voltage Products
A
B B
C
Style 1
A
B
C
Style 2
A
C
Style 3 Style 4
A
B
C
A
B
C
Style 5
MF-RX/72 Series – Radial Leaded, 72 Volts
Typical Application: Transformer RoHS Compliant
Model
Ihold
(Amps @
23 °C)
V max.
(Volts)
I max.
(Amps)
Initial
Resistance
(Ohms @
23 °C Min.)
1 Hour (R1)
Post-Trip
Resistance
(Ohms @
23 °C Max.)
Dimensions [mm/(in)]
Style
A Max. B Max. C Nom.
MF-RX110/72 1.10
72.0 40
0.15 0.38 10.84
(0.427)
16.8
(0.663)
5.1
(0.021)
2
MF-RX135/72 1.35 0.12 0.30 12.26
(0.483)
18.3
(0.720)
5.1
(0.021)
MF-RX160/72 1.60 0.09 0.22 13.94
(0.549)
19.9
(0.785)
5.1
(0.021)
MF-RX185/72 1.85 0.08 0.19 15.18
(0.598)
21.2
(0.834)
5.1
(0.021)
MF-RX250/72 2.50 0.05 0.13 17.84
(0.702)
23.8
(0.939)
10.2
(0.402)
MF-RX300/72 3.00 0.04 0.10 20.67
(0.814)
26.7
(1.050)
10.2
(0.402)
MF-RX375/72 3.75 0.03 0.08 23.51
(0.926)
29.6
(1.162)
10.2
(0.402)
RX012
24001K
57
MF-R Series – Radial Leaded, 16-60 Volts
Typical Application: Transformer
Model
Ihold
(Amps @
23 °C)
V max.
(Volts)
I max.
(Amps)
Initial
Resistance
(Ohms @
23 °C Min.)
1 Hour (R1)
Post-Trip
Resistance
(Ohms @
23 °C Max.)
Dimensions [mm/(in)]
Style
A Max. B Max. C Nom.
MF-R005 0.05 60
40
7.3 22 8.0
(0.315)
8.3
(0.327)
5.1
(0.021) 4
MF-R010 0.1 60 2.5 7.5 7.4
(0.291)
12.7
(0.500)
5.1
(0.021) 1
MF-R017 0.17 60 2 8 7.4
(0.291)
12.7
(0.500)
5.1
(0.021) 1
MF-R020 0.2 60 1.5 4.4 7.4
(0.291)
12.7
(0.500)
5.1
(0.021) 1
MF-R025 0.25 60 1 3 7.4
(0.291)
12.7
(0.500)
5.1
(0.021) 1
MF-R030 0.3 60 0.76 2.1 7.4
(0.291)
13.4
(0.528)
5.1
(0.021) 1
MF-R040 0.4 60 0.52 1.29 7.4
(0.291)
13.7
(0.539)
5.1
(0.021) 1
MF-R050 0.5 60 0.41 1.17 7.9
(0.311)
13.7
(0.539)
5.1
(0.021) 1
MF-R065 0.65 60 0.27 0.72 9.7
(0.382)
15.2
(0.598)
5.1
(0.021) 1
MF-R075 0.75 60 0.18 0.6 10.4
(0.409)
16.0
(0.630)
5.1
(0.021) 1
MF-R090 0.9 60 0.14 0.47 11.7
(0.461)
16.7
(0.657)
5.1
(0.021) 1
MF-R090-0-9 0.9 30 0.07 0.22 7.4
(0.291)
12.2
(0.480)
5.1
(0.021) 3
MF-R110 1.1 30 0.1 0.27 8.9
(0.350)
14.0
(0.551)
5.1
(0.021) 1
MF-R135 1.35 30 0.065 0.17 8.9
(0.350)
18.9
(0.744)
5.1
(0.021) 1
MF-R160 1.6 30 0.055 0.15 10.2
(0.402)
16.8
(0.661)
5.1
(0.021) 1
MF-R185 1.85 30 0.04 0.11 12.0
(0.472)
18.4
(0.724)
5.1
(0.021) 1
MF-R250 2.5 30 0.025 0.07 12.0
(0.472)
18.3
(0.720)
5.1
(0.021) 2
MF-R250-0-10 2.5 30 0.025 0.07 11.4
(0.449)
18.3
(0.720)
5.1
(0.021) 3
MF-R300 3 30 0.02 0.08 12.0
(0.472)
18.3
(0.720)
5.1
(0.021) 2
MF-R400 4 30 0.01 0.05 14.4
(0.567)
24.8
(0.976)
5.1
(0.021) 2
MF-R500 5 30 0.01 0.05 17.4
(0.685)
24.9
(0.980)
10.2
(0.402) 2
MF-R600 6 30 0.005 0.04 19.3
(0.760)
31.9
(1.256)
10.2
(0.402) 2
MF-R700 7 30 0.005 0.03 22.1
(0.870)
29.8
(1.173)
10.2
(0.402) 2
MF-R800 8 30 0.005 0.03 24.2
(0.953)
32.9
(1.295)
10.2
(0.402) 2
MF-R900 9 30 0.005 0.02 24.2
(0.953)
32.9
(1.295)
10.2
(0.402) 2
MF-R1100 11 16 100 0.003 0.014 24.2
(0.953)
32.9
(1.295)
10.2
(0.402) 2
R005
R010
R250
R600
Note:
RoHS compliant by adding -99 at the end of the part number, i.e. MF-R010-2-99.
58
LPM – Line Protection Modules
Features
Precision Thick-film Technology
Withstands Lightning and AC Power Cross
Assists Compliance with Telecordia (Bellcore)
GR-1089
Assists Compliance with ITU-T K.20
Surface Mount Solution
Designed to Fail Safely under Fault Conditions
Optional One-shot Thermal Fuse
Optional Resettable PTC
UL 497A Recognized
Non-flammable
Standard Offerings
•Custom Designs
Full Qualification Test Capabilities
Central Office, Remote and Customer Premises
Equipment Applications Include:
- Analog Line Cards - xDSL Line Cards
- Pairgain - VoIP
- PBX systems - External and
- LCAS Protection Intra-buildings
Custom Designs
In addition to the various standard off-the-shelf
versions available, Bourns offers extensive custom
options. Examples include:
Variety of Packages, e.g. Vertical and Horizontal
SMD
Packaging Options, e.g. Trays, Tape and Reel, Bulk
Additional Resistors, e.g. Ringing Power Resistors
Additional Components, e.g. Fuses, PTCs,
Overvoltage Protection
Resistors from 5.6 Ω
Ratio Matching: Down to 0.3 %, or Less with
Special Limitations
For more information on custom packaging options
please see page 74 and 75 for our full capability. Please
contact your local representative to discuss custom
packaging options.
Model Schematic Dimensions Description
4B08B-511-500
• 2x 50 Ω, 1 %
• 0.5 % matching
• Thermal fuses
4B04B-502-RC
• 1x R Ω, 5 %
Values 5.6-100 Ω
• Thermal fuse
4B06B-512-RC
• 2x R Ω, 5 %
Values 5.6-100 Ω
• 0.5 % matching
• Thermal fuses
3
F1 R1 R2 F2
57812131517
12
Functional Schematic*
*User must short pins 9 & 10 on the circuit board.
123 111213
F2F1
R1
R2
51.05
(2.010)MAX.
MAX.
3 5 7 8 12 13 15 17
7.62
(.300)
10.16
(.400) 2.54
(.100)
.51
(.020)
5.08
(.200)
3.43 ± .38
(.135 ± .015)
11.30
(.445)
2.03
(.080)
MAX.
0.36
(.014)
12 9 10
2.54 ± .127
(.100 ± .005)
2.54 ± .127
(.100 ± .005)
17.78 ± .254
(.700 ± .010)
25.40 ± 0.50
(1.000 ± .020) 2.03
(.080)
MAX.
0.36
(.014)
MAX.
11.30 ± 0.50
(.450 ± .020)
1 2 3 11 12 13
1.27
(.050)
2.54
(.100)
20.32
(.800)
33.27
(1.310) 3.18
(.125)
MAX.
0.36
(.014)
MAX.
MAX.
MAX. 1.27
(.050) 2.29
(.090)
MAX.
11.43
(.450)
DIMENSIONS = MILLIMETERS
(INCHES)
59
Model Schematic Dimensions Description
4A08P-505-RC
• 2x R Ω, 5 %
Values 5.6-100 Ω
• 1 % matching
4A12P-516-500
• 4x 50 Ω, 1 %
• 0.5 % matching
• Thermal fuses
4B06B-514-500
• 2x 50 Ω, 1 %
• 1.0 % matching
• Resettable
Multifuse® PPTC
4B07B-530-400
• 2x 40 Ω, 2 %
• 0.5 % matching
• Integrated
overvoltage
TISP®
4B06B-540-125/219
• 2x 10 Ω, 5 %
• 2.0 % matching
• Integrated
overvoltage
TISP®
23
14
F1A
F2B
F2A
F1B
R1A
R1B
R2B
R2A
1 2 4 8 10 11
22 21 19 15 13 12
12 4
R1
R3
968
R2
R4
1211
F1
R1
R2
3
F2
12
6,7
4,5
1,8 13 14
2
1211
F1
R1 TISP V(B01) TISP V(B02)
R2
312 13
F2
22.35 ± .13
(0.880 ± .005)
12.70 ± .13
(0.500 ± .005)
5.10 ± .13
(0.200 ± .005)
0.51 ± .05
(0.020 ± .002)
2.54 ± .13
(0.100 ± .005)
2.54 ± .13
(0.100 ± .005)
2
1
3
4
.38
(.015)
MAX.
RADIUS
22.35 ± .05
(0.880 ± .002)
22.50 ± .38
(0.885 ± .015)
4.10 ± .25
(0.160 ± .010)
1.270 ± .127
(0.050 ± .005)
1.270 ± .127
(0.050 ± .005)
1.02 ± .05
(0.040 ± .002)
0.25 ± .05
(0.010 ± .002)
4
4A12P-516-500
DCODE
21 8 10 11
32.81
(1.292)
3.72
(.146)
MAX.
10.16 ± .13
(.400 ± .005) 5.08 ± .13
(.200 ± .005)
2.54 ± .13
(.100 ± .005)
12.70
(.500)
14.59
(.575)
MAX.
4.07 ± .25
(.160 ± .010)
2.80
(.110)
7.87
(.310)
1
2.54
(.100)
2 PLCS.
2.54
(.100)
2 PLCS.
5.08
(.200)
3 PLCS.
25.65
(1.010) 4.32
(.170)
MAX.
0.36
(.014)
MAX.
MAX.
4B06B-514-500
DCODE
MAX.
3.43 ± .38
(.135 ± .015)
12.32
(.485)
2 4 6 8 9
35.56
(1.400)MAX.
20.32
(.800)
APPROXIMATE
TISP® LOCATION
APPROXIMATE
FUSE LOCATIONS
4.57
(.180)
MAX.
MAX.
MAX.
1 2 3
4B07B-530-400
DCODE
11 12 13 14
2.54
(.100)
0.36
(.014)
1.91
(.075)
MAX.
1.27
(.050)
3.43 ± .38
(.135 ± .015)
12.70
(.500)
61089B
2 PLCS.
5 PLCS.
33.02
(1.300)MAX.
20.32
(.800)
APPROXIMATE
TISP® LOCATION
APPROXIMATE
FUSE LOCATIONS
4.57
(.180)
MAX.
MAX.
MAX.
1 2 3
4B06B-540-V /V
(B01) (B02)
DCODE
11 12 13
2.54
(.100) 0.36
(.014)
0.97
(.038)
1.91
(.075)
MAX.
1.27
(.050)
3.43 ± .38
(.135 ± .015)
11.43
(.450)
2 PLCS.
4 PLCS.
TISP
TISP
DIMENSIONS = MILLIMETERS
(INCHES)
60
Bourns®TelefuseTelecom Fuses
Selection Guide
Features
• For Use in Telecommunication Circuit Applications
Requiring Low Current Protection with High Surge
Tolerance
• Overcurrent Protection to Telcordia
GR-1089-CORE & UL 1950/60950
• Ideal for Protecting Central Office and Customer
Premises Equipment, including POTS, T1/E1,
ISDN and xDSL circuits
• Model B1250T Allows Overcurrent Compliance
with Telecom Specifications including Telcordia
GR-1089-CORE, UL 60950 and
ITU K.20, K.21 and K.44
• Model B0500T is a Lower Current Version for Use
in Applications where a Faster Opening Time May
be Required
• Bourns® TISP® Thyristor Surge Protector Products
are Recommended for the Overvoltage Section of
the Circuit
• Agency Recognition: File: E198545
Model
Number
Ampere
Rating
(A)
Voltage
Rating
(Vrms)
Typical Cold
Resistance
(ohms)
Peak Surge
Current*
(Amps)
Power Fault
2.2 A, 600 V
Clearing Time
Max. (minutes)
Maximum
Power
Dissipation
(W)
B0500T 0.500 600 0.350 25 2 0.25
B1250T 1.25 600 0.090 100 15 0.40
0.50
1.25
*50 pulses @ 1 kV 10/1000 µs
Body Material: Ceramic with tin plated brass caps
Solder: Lead free
Packaging: 2,000 pcs. per 13 ˝ reel
Product Dimensions
3.05 ± .127
(.120 ± .005)
3.05 ± .127
(.120 ± .005)
2.03 ± .102
(.080 ± .004)
9.65 ± .254
(.38 ± .01)
Recommended Pad Layout
3.81
(.15)
4.06
(.16)
5.08
(.20)
DIMENSIONS = MILLIMETERS
(INCHES)
61
ESD Components
ESD Overview
Electrostatic Discharge (ESD) is the transfer of
electric charge between bodies of different
electrostatic potential in proximity or through direct
contact. The most common ESD event occurs from
touching a metal doorknob or elevator button after
walking across a carpet. Walking across a carpet in
shoes with insulating soles causes the build up of
static electricity on a person. In effect, the person
becomes a charged capacitor which discharges to the
metal object.
The International Electrotechnical Commission
(IEC) developed a human model ESD test generator
which would allow designers to verify equipment
ESD performance. The IEC defines an ESD test
current impulse as having a rise time of less than 1
ns and decay time of 60 ns to 27 % as shown in the
graph. The IEC ESD standard is IEC 61000-4-2
(2001-04) and it specifies four standard peak test
generator voltages for air discharge and contact
discharge together with a higher user defined level.
Integrated Circuits (ICs) are ESD sensitive devices
and their manufacturers design protection elements
into the IC to increase its robustness. However, these
protection circuits can add cost to the design by
consuming silicon real estate. IC manufacturers
design ICs to withstand a minimum IEC 61000-4-2
2 kV contact discharge voltage to provide protection
during the board manufacturing process. Human
body ESD voltages are nature determined and can be
15 kV or more, which may damage an IC. The
highest standard air discharge voltage of IEC61000-
4-2 is 15 kV to take this into account. Therefore, it is
common practice to protect all “people interactive
data ports to a 15 kV level to avoid product damage
during installation, use and servicing. Therefore, an
external ESD protector provides the main level of
protection with IC protection elements providing
residual protection.
IEC61000-4-2
Level
Contact Voltage
(kV)
Air Discharge
Voltage
(kV)
Peak Contact
Current
(A)
Contact Current
@ 30 ns
(A)
Contact Current
@ 60 ns
(A)
Level 1 2 2 7.5 4 2
Level 2 4 4 15 8 4
Level 3 6 8 22.5 12 6
Level 4 8 15 30 16 8
62
Bourns®ChipGuard®ESD Clamp Protection Products
Selection Guide
Bourns® ChipGuard® electrostatic discharge (ESD)
protectors are based on a multilayer zinc oxide
varistor (MLV) technology. The MLV technology
provides excellent electrical performance with a
competitive solution for many ESD requirements.
Features
Designed to protect sensitive electronic circuits
from the threat of ESD to IEC 61000-4-2 level 4
0402 and 0603 type packages
MLA Series – General ESD Protection
IC Power Supplies, Low Frequency Signal & Control Line Protection
Model
Continuous Operating
Voltage
<50 µA
Clamping
Voltage
VC (V)
1 A @ 8/20 µs
Impulse
Current
ITM (Max.)
(A)
@ 8/20 µs
WTM
(Max.)
(J)
10/1000 µs
Capacitance
CP (pF) Typ.
1 Vrms @ 1
MHz
V rms (V) V DC (V)
CG0402MLA-5.5MG 4 5.5 19
20 0.05
300
CG0402MLA-14KG 11 14 38 100
CG0402MLA-18KG 14 18 45 95
CG0603MLA-5.5ME 4 5.5 19
30 0.1
300
CG0603MLA-14KE 11 14 35 160
CG0603MLA-18KE 14 18 40 140
CG0603MLA-26KE 20 26 58 120
MLC Series – High Speed Data and Communication Ports
USB 2.0, IEEE-1394, SCSI, DVI, Antenna and 1 Gb Ethernet
Continuous
Operating Voltage
VDC
(V)
Clamping Voltage
VC
(V)
Off-state
Current
IL Max.
nA
1 Vrms @ 1 MHz
Trigger
Voltage
VT
V
VDC = max. rating
Capacitance
Coff Max.
pF Max.
Typ. Max. Typ. Max.
CG0603MLC-05E 5 6 20 35
50 150 0.5
CG0603MLC-12E 12 30 50
63
MLD Series – High Speed Data Applications
USB 2.0, IEEE-1394, 10/100 Mb Ethernet
MLE Series – High Speed Protection Lines
Ethernet, RS232, RS485 ports
Model
Continuous
Operating
Voltage
V DC
(V) Max.
Breakdown
Voltage
VB @ 1 mA
(V) Typ.
Clamping
Voltage
VC @ 1 A
8/20 µs (V)
Max.
Off-state
Current
IL (µA)
Max.
Capacitance
COFF (pF)
Max.
CG0402MLD-12G
12 50 ~ 60 140 1 5
CG0603MLD-12E
Model
Continuous
Operating Voltage Clamping Voltage
VCLAMP (V)
Typ.
Off-state Current
IL (µA)
Max.
Capacitance
CP (pF)
Max.
Vrms
(V)
VDC
(V)
Max. Typ. Max. 8 kV ESD
Contact
15 kV
ESD Air
1 A @
8/20 µs 3.5 V 5.5 V 9 V 12 V 18 V 1 Vrms @ 1 MHz
CG0402MLE-18G
8.5 12 18
100 120 50
0.3 0.4 0.5 1 10
9
CG0603MLE-18E 40 60 60 50
Notes:
1. All electrical characteristics @ 25 °C unless otherwise stated.
2. Bourns® ChipGuard® electrostatic discharge (ESD) protectors are currently limited to a small range of voltage options. However, the MLV
process allows a wider range to be manufactured. Should a voltage that is not highlighted in the current selection be required, please
inquire with your local representative as Bourns plans to expand the family in the future.
64
Diode Arrays for ESD Protection
Selection Guide
Bourns offers a family of Diode Arrays for ESD
protection. The ESD protection is implemented
using Zener or TVS diodes in a Chip Scale Package
(CSP) connected directly to the I/O port, or
alternatively using Schottky diodes in a leaded QSOP
package connected in a rail-to-rail configuration.
Depending on the end application, the number of
ports for protection and maximum capacitance levels
can be selected from the table.
Features
Diode Array
Stable TFOS Technology
JEDEC Standard Packages
ESD Protection: IEC61000-4-2
Applications
Bidirectional Parallel Port Communications
•Computers & Peripherals
Instrumentation
2DEA ESD Diode Array – Package Schematic
18
7
17
8
16
9
15
10
14
11
13
12
23
24
21
22
3
21
4
20
5
19
6
VSS
VDD VSS
VDD
2DAA ESD Diode Array – Package Schematic
GNDGND
EXT1 EXT4
EXT2 EXT3
2DAD ESD Diode Array – Package Schematic
GND
EXT1 EXT2
EXT4 EXT3
2DAB ESD Diode Array – Package Schematic
EXT5 OR
GND
GND
EXT1 EXT4
EXT2 EXT3
2DAC ESD Diode Array – Package Schematic
16 10
1
GND
GND
GND
GND
7
9
8
15
2
14
3
13
4
12
5
11
6
65
Application I/O Ports Cap Value
(pF)
ESD Withstand
(IEC 61000-4-2)
Minimum
Part Numbers
Tape & Reel Tubes
ESD
Diode Array
4 150
±8 kV Contact
±15 kV Air
2DAA-F6R
4 or (5 Uni) 150 2DAB-F6R
12 10.5 2DAC-C16R
4 15 2DAD-C5R
20 5 2DEA-2-Q24R 2DEA-2-Q24T
.635
(.025)TYP.
3.81 - 3.99
(.150 - .157)
8.56 - 8.74
(.337 - .344)
PIN 1 .21 - .31
(.008 - .012)
1.35 - 1.75
(.053 - .069)
.10 - .25
(.004 - .010)
0-8 .19 - .25
(.007 - .010)
.41 - 1.27
(.016 - .050)
5.80 - 6.20
(.228 - .244)
DIMENSIONS = MILLIMETERS
(INCHES)
QSOP Package Dimensions
Note:
For Lead Free solution, add “LF” suffix to part number above.
B2
A1
A3 C3
C1
0.432 - 0.559
(0.017 - 0.022)
0.971 - 1.001
(0.038 - 0.039)
0.330 - 0.457
(0.013 - 0.018)
1.285 - 1.375
(0.051 - 0.054)
0.180 - 0.280
(0.007 - 0.011)
0.435
(0.017)
0.435
(0.017)
0.3
(0.012)
0.180 - 0.280
(0.007 - 0.011)
DIA.
0.50
(0.020)
CSP Package – 5 I/O
A2 B2
A1
A3 B3
B1
0.490 - 0.524
(0.019 - 0.021)
0.965 - 1.015
(0.038 - 0.040)
0.414 - 0.424
(0.016 - 0.017)
1.475 - 1.525
(0.058 - 0.060)
0.180 - 0.280
(0.007 - 0.011)
0.50
(0.020)
0.50
(0.020)
0.15 - 0.005
(0.006 - 0.0002)
0.180 - 0.280
(0.007 - 0.011)
DIA.
0.50
(0.020)
CSP Package – 6 I/O
A1
A2
A3
A4
B1
B2
B3
B4
C1
C2
C3
C4
D1
D2
D3
D4
858 ± 40
(33.78 ± 1.57)
225 ± 20
(8.86 ± 0.79)
1997 ± 45
(78.62 ± 1.78)
2177 ± 45
(85.71 ± 1.78)
500
(19.69)
300
(11.81)
500
(19.69)
BUMP A1/PIN 1
INDICATOR
BOURNS
LOGO
45 ± 45
(1.78 ± 1.78)
45 ± 45
(1.78 ± 1.78)
248.5 ± 45
(9.78 ± 1.78)
248.5 ± 45
(9.78 ± 1.78)
428.5 ± 45
(16.87 ± 1.78)
DIA.
CSP Package – 16 I/O
DIMENSIONS = MICRONS
(MILS)
DIMENSIONS = MICRONS
(MILS) DIMENSIONS = MICRONS
(MILS)
66
Outside Plant Products
Bourns offers a full line of Overvoltage Protectors
based on our Gas Discharge Tube (GDT) and
patented Multi-Stage Protection (MSP®) technology.
Products include 5-Pin Protectors for Central Office
and Building Entrance protection, as well as Station
Protectors and POTS splitters for Network Interface
Devices (NID) for customer premises protection.
Our 241x and 242x series 5-Pin Protectors are highly
reliable and cost effective solutions for Central Office
and Building Entrance protection. We offer a wide
variety of color coded modules with custom
configurations. Both series are available with GDT or
MSP® technology, offering long surge life, high surge
handling capability and low capacitance for
broadband applications.
For Customer Premises, we offer a complete line of
fully modular Network Interface Devices available
from one to one hundred lines. The NIDs are
available in fire retardant, ultraviolet resistant plastic
or zinc coated, rust resistant metal housings. All
NIDs are designed to provide maximum wire
management space and flexibility and are available in
many custom configurations, including our 1740
series protector addition for 75-Ohm Coax cable
protection.
Additionally, we offer a full line of Station Protectors,
ADSL and VDSL splitters with binding post or IDC
terminations and totally integrated protector-
subscriber bridge modules in a snap-in
configuration. Our 23xx series Station Protectors are
offered with GDT, MSP® or Solid State technology.
The 36xx series POTS splitters are designed to meet
all relevant ANSI specifications and all our protector
products and accessories are UL listed and
manufactured to RUS and Telcordia technical
requirements.
Residential Network Interface Devices
Commercial Multipair Network Interface Devices
NID Protector Terminals
NID Enclosures
67
Bourns®OSP Products – Continued
DigiGuard™ MSP® Broadband Protectors –
Balanced Capacitance (BC) versions available for VDSL
5-Pin Broadband Protectors
5-Pin Broadband Protectors
DSL Splitters – ADSL (left) and VDSL (right)
Well Protectors
Standard Station Protectors
68
Outside Plant – Signaling Systems Surge Protectors
Bourns® 1669 protectors are designed to protect
field-mounted 4-20 mA transmitters. The 1669 series
features a sealed stainless steel pipe for easy
connection to a field transmitter 1/2 inch NPT port.
A railmounted 1820-28-Ax is typically used to
protect the Digital Carrier System equipment at the
opposite end of the loop.
1669 Series – Transient Protector Selection Guide
Model
Max.
Signal
Voltage
DC Clamping
Voltage
Capacitance
1 MHz, Max. Series
Resistance
per Line
()
Inductance
per Line,
Max.
(µH)
DC
Leakage
V DC, Max.
(µA)
Impulse Clamping
1 kA (L+L)–G Surge Life
L/L
(V)
L/G
(V)
L/L
(pF)
L/G
(pF)
10/1000
µs
L/L (V)
500 V/µs
L/G
(V)
20 kA
8/20 µs
(times)
1 kA
10/100 µs
(times)
1669-01
1669-05 30 36
250 1200 40
22 1 1 50
750
20 1000
1669-02
1669-06 36 2000 2000 70
1669-06 Product Dimensions 1669-02 Product Dimensions
100.00
(3.94)
300
(11.81)TYP.
3/4-14 NPT,
2 PLCS.
115.00
(4.53)
300
(11.81)TYP.
3/4-14 NPT
DIMENSIONS = MILLIMETERS
(INCHES)
69
1800 Series – Signal and Dataline Protector Selection Guide
Mounting
Detail
Typical
App.
Interface Operating
Characteristics
Protective Characteristics
Peak Clamping Voltages Max. DC
Current
(mA)
Typical
Capacitance
Series
Resistance
Each Line
(input to output)
(Ohms)
Peak Signal
Voltage
Max.
Data
Rate
(MHz)
@ 5 kA, 8 x 20 µs
rate of rise
@ 1 kA, 8 x 20 µs
rate of rise
L/L (V) L/G (V) L/L (V) L/G (V) L/L (V) L/G (V) L/L (pF) L/G (pF)
1810-10-xx
RS-422
20 10 10 50 25 42 21 220 1200 2200 10
1820-10-xx 10 10 4 25 25 21 21 220 3300 3300 10
1811-10-xx 20 10 50 60 30 52 26 350 45 45 10
1821-10-xx 10 10 50 30 30 26 26 350 65 65 10
1810-15-xx RS-232 30 15 8 70 35 56 28 180 750 1500 15
1820-15-xx RS-485 15 15 3 35 35 28 28 180 2300 2300 15
1811-15-xx
4-20 mA
30 15 45 80 40 64 32 300 45 45 15
1821-15-xx 15 15 45 40 40 64 32 300 65 65 15
1810-28-xx 56 28 9 110 55 90 45 150 600 1100 22
1820-28-xx 28 28 4 55 55 45 45 150 1800 1800 22
1811-28-xx 56 28 40 120 60 45 45 250 45 45 22
1821-28-xx 28 28 40 60 60 45 45 250 65 65 22
1810-50-xx 100 50 10 178 89 156 89 100 30 5000 51
1820-50-xx 50 50 4 89 89 45 45 100 800 800 51
Surge Life:
> 100 operations 200 Amps, 10 x 1000 µsec
> 10 operations 10 kA, 8 x 20 µsec
1800 Series Signal/Data Attenuation at Maximum Data Rate: 3 db with 600 Ω Termination
Operating Temperature:
1669 Series -40 to +100 °C
1800 Series -40 to + 60 °C
1820-28-A1 Product Dimensions 1820-28-A3 Product Dimensions
(TS-32/EN50035)
DIN-1 RAIL
E3/L3 GROUNDING LINK
GROUNDING SCREW
FEED-THROUGH (E3/L3)
GND
EQPT
E2 E3 E1
LINE
L1 L3 L2
(49.02)
(28.96)
1.91
(48.51)
1.14
1.93
.74
(18.80)
3.28
(83.31)
(TS-35/EN50022)
DIN-3 RAIL
MOUNTING/GROUNDING SCREW
1.79
(45.47)
PIN
ALIGNMENT 8-32UNF-2A
.375
(9.53)
.125
(3.18) .093
(2.36)
.70
(17.80)
LG
DIMENSIONS = MILLIMETERS
(INCHES)
70
Other Related Products & Capabilities
Bourns offers a wide range of Transformers suitable
for use in Telecom, LAN and Ethernet applications.
These devices are available in a range of surface
mount and through-hole packages as well as some
low profile devices for PCMCIA applications. A
summary of part numbers by application is below.
PT60001 – LAN 10Base-T, 10Base-5, 10Base-2
1 2 4 5 7 8
16 15 13 12 10 9
PT60006 – LAN 100Base-TX
2
3
4
1
15
14
13
16
10
11
9
7
6
5
1:1
1:1
TX
RX
PT60003 – LAN 10Base-T/100Base-TX PCMCIA
2
3
13
1TX
RX
12
14
8
1:1
5
6
10
7
9
1:1
PT60007 – LAN 10Base-T/100Base-TX QUAD
1
3
2
5
4
6
7
8
9
10
20
18
19
16
17
15
14
13
11
12
1:1
1:1
1:1
1:1
PT60005 – LAN 10Base-T/100Base-TX
1
2
15
14
16
11
12
10
7
5
6
3
1:1
1:1
RX
TX
71
PT60010 – LAN 100Base-TX QUAD
PT61005 – LAN 10Base-T Filter Interface
1 37
36
2
40
4
39
5
38
3
35
6
34
7
33
9 32
31
10
11 27
26
12
14
13
16
17
18
19 22
23
24
25
28
15 29
30
21
20
8
PT60011 – LAN 10-100Base-TX QUAD
RD+ 1 40 RX+
39 RX-
RD- 2
37 TX+
TD+ 4
36 TX-
TD- 5
38 CT1
CT1 3
35 TX-
TD- 6
34 TX+
TD+ 7
33 CT2
RD- 9 32 RX-
31 RX+
RD+ 10
RD+ 11 30 RX+
29 RX-
RD- 12
CT3 13
TD- 16
TD+ 17
CT4 18
RD- 19 22 RX-
23 CT4
24 TX+
25 TX-
28 CT3
21 RX+
RD+ 20
CT2 8
TD+ 14
TD- 15 26 TX-
27 TX+
1:1
16
12
14
9
11
1
5
3
8
6
1:1
1:1
TRANSMIT
RECIEVE
LOW PASS
FILTER
LOW PASS
FILTER
LOW PASS
FILTER
LOW PASS
FILTER
PT60014 – LAN 10Base-T/100Base-TX PCMCIA
1
2
16
TRANSMIT
RECEIVE
15
14
3
1:1
1:1
7
8
10
11
6
9
72
PT61007 – LAN 10Base-T/100Base-TX QUAD
TD1 + 1 40 TX1 +
38 TX1 -
TD1 - 3
37 RX1 +
RD1 + 4
36 RX1 -
RD1- 5
35 TX2 +
TD2 + 6
33 TX2 -
TD2 - 8
34 TCT2
RD2 + 9 32 RX2 +
31 RX2 -
RD2 - 10
TD3 + 11 30 TX3 +
28 TX3 -
TD3 - 13
RD3 + 14
RD3 - 15
TD4 + 16
TD4 - 18
TCT4 17
RD4 + 19 22 RX4 +
24 TCT4
23 TX4 -
25 TX4 +
26 RX3 -
27 RX3 +
29 TCT3
21 RX4 -
RD4 - 20
TCT3 12
TCT2 7
39 TCT1
TCT1 2
1:1
1:1
1:1
1:1
1:1
1:1
1:1
1:1
PT61003 – LAN 10Base-T/100Base-TX High Speed
1
2
7
6
5
3
1:1
1:1
16
15
10
12
14
11
RX
TX
PT61010 – LAN 10Base-T
11
10
9
TRANSMIT
RECEIVE
1
2
3
16
15
14
Pri Sec
Pri Sec
613
12
7
8
PT61004 – LAN 10Base-T Filter Interface
16
12
14
9
100
11
1:1
1
5
4
8
100
6
1:1
TRANSMIT
RECIEVE
LOW PASS
FILTER
LOW PASS
FILTER
LOW PASS
FILTER
LOW PASS
FILTER
7
10
PT66001 – ISDN S-Interface Transformer Module
9
8
7
III
IV
core 1
n = 2/2:1/1
I
II
2
3
17
V
VI
1
18
11
10
12
core 2
n = 2/2:1/1
III
IV
I
II
4
16
15
VII
VIII
core 3
n = 1:1:1:1
5
14
73
PT66002 – T1 Transformer
Sec
4
5
1
2
3
III (CT)
I
II
Pri Sec
III
12
10
Pri
6
9
8
7
V
IV
PT66004 – ISDN S-Interface Transformer
1
Pri
III
3
II
I
6
5
4
Sec
PT66005 – T1/CEPT/ISDN-PRI Transformer
1
I
2
Pri
II
5
6
1:1 Sec
PT534-1 (1:1) – ADSL Line Transformer
Line
10
8
9
7
1
3
2
4
Chip
SM-LP-5001 – Series SM Line Matching Transformer
1
2
3
6
5
4
PT66003 – T1/CEPT Transformer
Pri
1
2
3
4
I
II
III
5
6
Sec
SM76299 – SHDSL Line Transformer
1
4
2
5
9
7
SM535-1 – ADSL Line Transformer
Chip
1
4
10
7
Line
1 : 1.95
74
Bourns®Microelectronic Modules Packaging Solutions
Device Mounting Technology
Surface Mount Technology
Surface mounting is still the most common and
economical approach for many applications. Bourns®
Microelectronic Module products offer the latest in
surface mount technology:
Chip sizes to 0201
•Inert reflow
SOIC, PLCC, TSOP, QFP to 0.012 ˝ (0.3 mm)
Lead free solder capability
•CSP, odd form components
•Passive component test
BGA: 0.5 mm pitch, underfill
Chip & Wire/COB (Chip on Board)
This proven technology provides an intermediate
level of miniaturization, the advantages of in-process
test and repair and is designed to withstand harsh
environments such as automotive applications.
Bourns® Microelectronic Module products offer the
latest in chip & wire technology:
Gold & Aluminum Wire Bonding – High speed,
automated, ball/wedge, wedge/wedge, ribbon
Gold Wire Bonding – 20-50 µm (0.8 to 2 mil)
wire to 100 µm (4 mil) pitch
Aluminum Wedge Bonding – 125-380 µm
(5 to 15 mil) wire for high current/power
applications
Die Attachment – Epoxy or Eutectic, 5 µm accuracy,
glob top, dam & fill
Flip Chip Mounting
This process provides the ultimate opportunity for
package miniaturization and minimization of
conductor lengths and size reduction in high speed,
high frequency applications.
Bourns® Microelectronic Module products offer a
choice of flip chip approaches:
Anisotropic Adhesive Attachment
(Z-axis conductive epoxy)
Ideal for PCB and flex circuits
High I/O
•Tight pitch
Cost-effective flip chip solution
Utilizes off-the-shelf wire bondable ICs
IC
Any Substrate
Gold Bump
Anisotropic Conductive Epoxy
Conductive Particles
IC
Ceramic Substrate
Gold Bump (stud bump)
Underfill (optional)
Thermal-Sonic Bonding (Gold-to-Gold Interconnect)
Ideal for high frequency applications and MEMs to
ceramic substrates
I/O limited to ~32 or less
Underfill optional
•Low temp process
•Lead free
Stud Bump bonding
Ideal for high I/O flip chip to ceramic substrate
Mid-process replacement of faulty chips
Underfill required
Proven technology with reliability data
Utilizes off-the-shelf wire bondable ICs
IC
Ceramic Substrate
Gold Bump (stud bump)
Conductive Adhesive
Underfill
IC
Any Substrate
Gold Bump (stud bump)
Conductive Adhesive
Underfill (optional)
Solder Mounting
Standard flip chip technology
Solder bumped devices
Optional underfill
Z-axis control for ultimate strength
High volume cost-effective solution
75
Full Process for Stud Bump Bonding
IC IC
IC IC
Press
Au Bumps
Substrate
IC
Substrate
Underfill
Bump
Formation Leveling
Height Transfer of
Conductive
Adhesive
Mounting
& Curing Inspection Sealing
& Curing
IC
Substrate
IC IC IC
Substrate
SIP (Single Inline Packaging) – 0.050 ˝, 0.100 ˝ and
1.8 mm
DIP (Dual Inline Packaging) – 0.100 ˝
BGA (Ball Grid Array)
QFP (Quad Flat Pack)
J-Leads in Dual or Quad configuration –
0.050 ˝, 0.075 ˝ and 0.100 ˝
Mini-DIL
TO-cans
•Butterfly
Hermetic Seal
Choice of Package Interconnects
CSP (Chip Scale Packaging) – smallest package for
surface mounting
MCM (Multichip modules) – smallest package for
multichip hybrid
76
Bourns®Switch Power DC/DC Converters
Bourns Switch Power has brought innovative
product solutions and ideas to the power conversion
market since 1995. Our emphasis on high
performance converters has given us a broad and
expanding selection of power solutions. Our focus
on the communications market gives us the
advantage of experience when developing high
reliability products. Our technological innovation
has produced patents covering all aspects of DC-DC
Converter development: from controller IC design
through power train layout, resulting in better
performance, higher density and higher reliability
products.
Non-Isolated Converters
Bourns® Switch Power's Non-Isolated Converters
provide the low voltages needed to support core
logic, ASICs, microcontrollers and microprocessors.
These high-efficiency converters provide improved
regulation and superior dynamic response. In many
cases this is thanks to Bourns Switch Power’s
patented V2TM architecture. High power density in
both SIP and surface mount module packages ensure
compatibility with most size requirements.
Input Voltages: 3.3 V, 5 V, 12 V
Output Currents: 2 A to 32 A
Output Voltages: 0.8 V to 5.0 V
Typical Applications for Point of Load
DC/DC Converters:
Low voltage, high density systems with
Intermediate Bus Architectures (IBA)
Workstations, servers, and desktop computers
Distributed power architectures
Telecommunications equipment
Latest generation ICs (DSP, FPGA, ASIC) and
microprocessor-powered applications
Data processing equipment
Broadband, networking, optical and
communications systems
SLIC Power
The SLIC Power series of products provides high-
performance power and low cost to Ringing SLIC
users. Rather than spending time designing and
testing specialized power circuits, the designer can
simply select the appropriate SLIC Power module.
Whether comparing cost, space or design time, the
SLIC Power modules can meet or exceed other
options.
Input
Voltage
VBAT1/2
-72 V / -24 V -63 V / -24 V -60 V / -24 V
5.0 V SPT5504C SPT5504CL SPT5504Q
12 V SPT5204Q SPT5204QL
77
48 Volt Power
Our M20W power module is an industrial
temperature range, dual-output device. The system
designer obtains flexibility in choosing 5 V and 3.3 V
components, based on the ability of the module to
supply either voltage over a wide power range to the
load. The output voltages are tightly and
independently regulated, thus eliminating the
common problem of cross regulation errors between
the outputs. The module is designed with Switch
Powers resonant primary and synchronous
secondary topology for enhanced reliability and high
efficiency, allowing high-temperature operation.
Custom Power
Bourns can design and produce Custom Power
solutions for your specific application. The standard
fixed product is available in output voltages not
specified in this catalog. Please contact application
support for more information.
78
Which Protection Technology is Right for the Equipment?
There are several individual technologies within each
of the core protection types listed in Table 1. No
single protection technology offers an ideal solution
for all requirements. Each technology has different
strengths and weaknesses, and only by
understanding their relative merits can protection be
optimized for a given installation. A quick review of
Table 2 demonstrates that no single ideal solution
exists for all locations within the telephone network
so cascaded protection is often deployed.
The Basics – Overvoltage and Overcurrent
Protection devices fall into two key types, overvoltage
and overcurrent. Overvoltage devices (see Figure 1)
divert surge current (such as lightning), while most
overcurrent devices (see Figures 2a-2c) increase in
resistance to limit the surge current flowing from
longer duration surge currents (50/60 Hz power
fault). There are two types of voltage limiting
protectors: switching devices (GDT and Thyristor)
that crowbar the line and clamping devices (MOV
and TVS). The inset waveforms of Figure 1
emphasize that switching devices results in lower
stress levels than clamping devices (shaded area) for
protected equipment during their operation.
Functionally, all voltage protectors reset after the
surge, while current protectors may or may not,
based on their technology. For example, PTC
thermistors are resettable; fuses are non-resettable as
shown in Table 3.
Protection Type Action Connection
Overcurrent Limit peak current Series (or parallel
for primary)
Overvoltage Limit peak voltage Parallel
Overcurrent and
Overvoltage
Coordinate voltage
and current
protection
Combination
Table 1. Protection falls into three basic types
Overvoltage
Speed Accuracy Current Rating
GDT Fair Fair Very high
Thyristor Fair Good High
MOV Fair Poor High
TVS Very fast Good Very low
Overcurrent
Speed Accuracy Current Rating
Polymer PTC
Thermistor Fair Good Low
Ceramic PTC
Thyristor Slow Good Low
Fuse Very slow Fair Medium/High
Heat Coil Very slow Poor Low
Thermal
Switch Very slow Poor High
Table 2. Summary of technology characteristics
Good protection design necessitates an
understanding of the performance trade-offs and
benefits of each device type, as well as the
terminology used in their specifications. Adequate
grounding and bonding, to reduce potential
differences and provide a low impedance current
path is a prerequisite for coordinated system
protection (GR-1089-CORE, Section 9).
Figure 1. Overvoltage protection provides a shunt path for surges
Overvoltage limiting - clamping and switching
Source
Impedance
Overvoltage
Protection
Protected Load
Surge Current
Overvoltage
Threshold Voltage
Source and load voltages
Clamping
Overvoltage
Protection
Switching
Overvoltage
Protection
Surge
ONLY
79
Overcurrent limiting - interrupting
Source
Impedance Overcurrent
Protection
Protected Load
Surge Current
Surge
Overcurrent
Interrupting
DO NOT
ENTER
Interrupting
Overcurrent limiting - reducing
Source
Impedance Overcurrent
Protection
Protected Load
Surge Current
Surge
Overcurrent
Reducing
REDUCED
CURRENT
AHEAD
Reducing
Figure 2a-2c. Overcurrent protection isolates the equipment by
presenting a high impedance
Overcurrent limiting - diverting
Source
Impedance
Protected Load
Surge Current
Surge
Overcurrent
Diverting
ONLY
Overcurrent
Protection
Diverting
What Happens After a Surge or if the Device Fails?
In addition to preventing a surge from destroying
equipment, resettable devices return the equipment
to pre-event operation, eliminating maintenance cost
and maximizing communications service. In
addition, lightning typically consists of multiple
strikes. It is, therefore, essential to consider
subsequent surges. Because lightning and power
cross standards are not intended to represent the
maximum surge amplitudes in the field, an
understanding of what happens under extreme
conditions is equally important.
Action Connection Examples
Voltage switching Shunt GDT, Thyristor
Voltage clamping Shunt MOV, TVS
Overvoltage
Overcurrent
Action Connection Examples
Resettable Series
PTC thermistor
– Ceramic
– Polymer
Non-resettable Series Fuse
Non-resettable Shunt or series Heat coil
Non-resettable Series LFR (Line Feed
Resistor)
Non-resettable Across voltage
limiter
Fail-short device for
thermal overload
Table 3. The basic classes of protection devices
A shunt device failing open circuit effectively offers
no follow-on protection, although under normal
conditions the telephone line will operate. If the
device fails to a short circuit, the line is out of
service, but further damage is prevented. In addition,
other issues such as exposed areas prone to heavy
surge events or remote installations where
maintenance access is difficult may strongly
influence selection of the most suitable protection
technology (see Table 4).
Reliability Tip
Complying with standards does not guarantee
field reliability.
80
Overvoltage
Suitable for Primary (P)
or Secondary (S)1,2
Normal Operation After Excess Stress3
After Operation Still Protecting? Line Operating?
GDT P or S
Reset to Normal
Yes/No No/Yes
GDT + Thermal Switch P Yes No
Thyristor P or S Yes No
Thyristor + Thermal Switch P Yes No
MOV S No Yes
TVS S Yes No
Overcurrent
Normal
Operation After Excess Stress3
After
Operation
Still
Protecting?
Line
Operating?
PTC Thermistor Reset to
Normal
Yes No
Fuse Line
Disconnected
Heat Coil Line Shorted
or Open
Thermal Switch Line Shorted
LFR Both Lines
Disconnected
1Primary protection applications typically require
specific fail-short protection.
2Secondary protection requires a fused line (USA).
3The failure mode depends on the extent of the excess stress.
Comments made for a typical condition that does not fuse
leads.
Table 4. The status after the protection has operated can be a
significant maintenance/quality of service issue
Speed and Accuracy are Major Control Factors in
Determining Equipment Stress Levels
The behavior of each technology during fast surge
events can have a substantial effect on maximum stress
as summarized in Table 5a and 5b. In addition to device
tolerance, each device requires a finite time to operate,
during which the equipment is still subjected to the
unlimited surge waveform. Before operation, some
technologies allow significant overshoot above the
operating’ level. The worst-case effects determine the
stress seen by the equipment and not just the nominal
protection” voltage or current (see Figure 3).
Overvoltage protection technologies may be
summarized as follows:
GDTs offer the best AC power and high surge
current capability. For high data rate systems
(>30 Mbs), the low capacitance makes GDTs the
preferred choice.
Thyristors provide better impulse protection, but at a
lower current.
MOVs are low cost components.
TVS offers better performance in low dissipation
applications.
Type Performance
Class
Technology
Voltage
Limiting
Speed
Voltage
Precision
Impulse
Current
Capability
Low
Capacitance
Switching
Gas Discharge Tube
Thyristor
Clamping
Metal-Oxide Varistor
TVS
BESTBEST
BESTBEST
Table 5a. No overvoltage technology offers an ideal solution for all applications
Overvoltage Limiters
81
Type Performance
Class
Technology
Fast
Operation
Resistance
Stability
Low
Operating
Current
Low
Series
Resistance
Reducing
Polymer PTC Thermistor
Ceramic PTC Thermistor
Interrupting
Fuse
Line Feed Resistor
Diverting
Heat Coil
Thermal Switch
Overcurrent Limiters
BEST
BEST
BEST
BEST
BEST
BEST
BEST
BEST
BEST
Table 5b. No overcurrent technology offers an ideal solution for all applications
Overcurrent protection technologies may be
summarized as follows:
PTC thermistors provide self-resetting protection.
Fuses provide good overload capability and low
resistance.
Heat coils protect against lower level ‘sneak
currents.
LFRs provide the most fundamental level of
protection, combined with the precision resistance
values needed for balanced lines and are often
combined with other devices.
Voltage
Voltage impulse
Difference between
typical and impulse
voltage
Maximum Overshoot
Maximum AC
protection voltage
Typical AC protection
voltage
Device operating delay - Voltage effect
depends on impulse rate of rise
Technology Selection - Overvoltage Protectors
Voltage limiting devices reduce voltages that exceed
the protector threshold voltage level. The two basic
types of surge protective devices are clamping and
switching, Figure 8. Clamping type protectors have a
continuous voltage-current characteristic (MOV and
TVS), while the voltage-current characteristic of the
switching type protector is discontinuous (GDT and
Thyristor). A series or shunt combination of
clamping and switching type devices may provide a
better solution than a single technology. Utilize the
decision trees in Figures 4-7 to aid in the election of a
suitable circuit protection solution. Comparative
performance indicators and individual device
descriptions beneath each decision tree allow
designers to evaluate the relative merits for each
individual or combination of technologies. The lower
density and increased exposure of rural sites suggests
that heavier surges can be expected for these
Reliability Tip
Check worst-case protection values, not just
nominal figures.
applications (Figure 4), while the cost and type of the
protected equipment has an influence on the
selection of secondary protection (Figure 5, 6, & 7).
During the operation of overvoltage protectors, surge
currents can be very high and PCB tracks and system
grounding regimes must be properly dimensioned.
It is important that protectors do not interfere with
normal operation. Although traditional telecom
systems typically run at –48 V battery voltage plus
100 V rms ringing voltage (i.e. approximately 200 V
peak), designers should consider worst-case battery
voltage, device temperature and power induction
Figure 3. Systems must survive more than the nominal protection
voltage
82
voltages when specifying minimum protection
voltage. Some digital services operate at much higher
span voltages, requiring further consideration for
equipment designed for broadband applications (see
Table 2). The capacitance of overvoltage protectors
connected across these lines is important - especially
for digital connections such as ISDN and xDSL.
Matched and stable devices are necessary to avoid
introducing imbalance in the system.
Lower impulse voltage
Lower capacitance Lower capacitance
Long impulse life Long impulse life
Lower capacitance
Lower impulse voltage
Lowest
Impulse
Voltage
Highest Intrinsic Impulse Capability
CLAMP?
Uncontrolled
environment?
GDTThyristor
Thyristor GDT
No YesHybrid?
YesNo
MOV TVS
Thyristor
Diode
GDT +
TVS
GDT +
MOV
GDT +
MOV
GDT +
TVS
TVS MOV
Solution?
Hybrid?
CLAMP?
Note: The overvoltage protector may require the addition of AC overcurrent protection.
Figure 4. Primary overvoltage technology selection
Figure 5. Secondary overvoltage protection depends on the type of
component to be protected
What component
type is being
protected?
Passive Active/
Semiconductor
See Figure 6 See Figure 7
Reliability Tip
Ensure that PCB tracks and wiring are dimensioned
for surge currents.
Smaller
Lower cost
Smaller
Lower cost
Component type?
Inductive
Solution?
ComponentProtection Protection
Thyristor GDT Increased
rating
Solution?
Passive
ComponentProtection Protection
Thyristor GDT Increased
rating
ComponentProtection Protection
Thyristor GDT Increased
rating
Solution?
ComponentProtection Protection
Thyristor TVS Increased
rating
Solution?
Resistor Capacitor
Class?
Inductor Transformer
Note: The overvoltage protector may require the addition of AC
overcurrent protection.
Figure 6. Secondary protection of passive components
Datasheet Tip
When protecting digital lines, check the tolerance
and variation of protection capacitance (i.e. voltage
dependance), not just nominal values.
83
Gas Discharge Tubes (GDTs)
GDTs apply a short circuit under
surge conditions, returning to a high
impedance state after the surge.
These robust devices with negligible
capacitance are attractive for
protecting digital lines. GDTs are
able to handle significant currents,
but their internal design can
significantly affect their operating
life under large surges (see Figure 9).
The sparkover voltage of GDTs
increases at high rates of voltage rise
(dv/dt). The level of increase
depends on the actual rate of rise
and the nominal DC sparkover
voltage. For example at 100 V/µs, the
impulse sparkover voltage of a 75 V GDT increases
to approx. 250 V and the impulse sparkover of a
350 V GDT increases to approximately 600 V.
Their ability to handle very high surge currents for
hundreds of microseconds and high AC for many
seconds matches the primary protection needs of
exposed and remote sites. During prolonged AC
events, GDTs can develop very high temperatures,
and should be combined with a thermal overload
switch that mechanically shorts the line (Switch-
Grade Fail-Short mechanism).
AC Capability AC Capability AC Capability
Protection level
Lower cost
Protection level
Component type?
Xpoint Switch
LCAS, SSR
Thyristor Diode
Bridge
Solution?
ThyristorThyristorThyristorHybrid TVS
Solution?
Active/
Semiconductor
SLIC PSU
MOV
Xpoint Switch: Cross-point Switch
LCAS: Line Card Access Switch
PSU: Power Supply Unit
SSR: Solid State Relay
SLIC: Subscribe Line Interface Circuit
Note: The overvoltage protector may require the addition of AC
overcurrent protection, such as a LFM, PTC thermistor or fuse.
Figure 7. Secondary protection of active components
Standards Tip
UL Recognized GDTs are
now available,
requiring no BUG.
Datasheet Tip
GDTs are available with
Switch-Grade Fail-Short
Device.
Bourns® Products
Gas Discharge Tubes
Bourns offers the subminiature 3-electrode
Mini-TRIGARD®GDT and the 2-electrode Mini-GDT.
Combining small size with the industry’s best
impulse life, these products are ideal for high-density
primary applications.
Current AmA
Voltage - V
GDT
0 100 200 300 400 500
100
10
1
100
10
1GDT
GDT
Thyristor
Switching
Clamping
MOV
TVS
Thyristor
Figure 8. Overvoltage protectors feature very different V/I characteristics
84
Figure 9. GDT behavior may deteriorate under real-world field conditions
DC Sparkover Voltage @ 100 V/s
Number of 500 A, 10/1000 impulses
Bourns
Supplier A
Supplier B
Supplier C
Supplier D
0 50 100 150 200 250 300 350 400
450
400
350
300
250
200
150
100
50
GDT DC Sparkover Voltage Variation over Impulse Life
(350 V GDTs)
Certain GDTs can suffer
from venting or gas loss.
To ensure protection
under these circum-
stances, an air Back Up
Gap (BUG) has been
used. BUGs themselves
can be subject to
moisture ingress or
contamination, reducing
their operating voltage, and leading to nuisance
tripping. BUGs are also more sensitive to fast rising
voltage surges, causing the BUG to operate instead of
the GDT. All Bourns® GDTs are now UL approved
for use without the need of a BUG, eliminating extra
cost and improving reliability (see Figure 10).
Reliability
GDT UL
Recognized
GDT +
BUG GDT
GDT Selected
No Yes
GDTs approved to UL497 optional test program for use without
a back-up device are no longer required to use a BUG
Figure 10. Traditional GDT venting has required back-up protection
Surge
Current
Power
Cross
dv/dt
Sensitivity
di/dt
Sensitivity Typical Application
Several kA
for 100 µs
Several amps
for seconds
Poor None Primary and secondary
protection
Exposed sites
Sensitive equipment needs
additional secondary
protection
Particularly suited to high
speed digital lines
GDT protection capabilities
Thyristor-Based Devices
Thyristor-based devices initially clamp the line
voltage, then switch to a low-voltage “On” state. After
the surge, when the current drops below the
“holding current,” the protector returns to its original
high impedance state. The main benefits of thyristor
protectors are lower voltage overshoot and an ability
to handle moderate currents without a wear-out
mechanism. The disadvantages of thyristor
protectors are higher capacitance, which is a
limitation in high-speed digital applications, and less
tolerance of excessive current. Thyristor protectors
can act either as secondary protection in conjunction
with GDTs, or as primary protection for more
controlled environments/ lower surge amplitudes.
For protection in both voltage polarities, either a
power diode or second thyristor may be integrated in
85
inverse parallel, creating
versatile protection
functions that may be
used singly or in various
combinations. The
clamping voltage level of
fixed voltage thyristors is
set during the
manufacturing process.
Gated thyristors have their protective level set by the
voltage applied to the gate terminal.
Surge
Current
Power
Cross
dv/dt
Sensitivity
di/dt
Sensitivity Typical Application
Several 100 A
for 100 µs
Several amps
for seconds
Good Poor Primary or secondary
protection
Urban and some exposed
sites
Can protect sensitive
equipment
Thyristor protection capabilities
Bourns® Products
TISP® Thyristor Surge Protectors
The TISP®family of thyristor-based devices includes
an extensive range of single and multiple
configurations in unidirectional and bidirectional
formats, with fixed or gated operation.
Metal Oxide Varistors (MOVs)
A Metal Oxide Varistor (variable resistor) is a voltage
dependent resistor whose current predominantly
increases exponentially with increasing voltage. In
clamping surges, the MOV absorbs a substantial
amount of the surge energy. With a high thermal
capacity, MOVs have high energy and current
capability in a relatively small size. MOVs are
extremely fast and low cost, but have high capacitance,
a high, current-dependant clamping voltage, and are
susceptible to wear. Typical MOV applications include
general-purpose AC protection or low-cost analog
telecom equipment such as basic telephones. When
combined with a GDT, the speed of the MOV enables
it to clamp the initial overshoot while the GDT begins
to operate. Once the GDT fires, it limits the energy in
the MOV, reducing the size of MOV required. Devices
are available which integrate an MOV and GDT in a
single package to simplify assembly and save space.
Surge
Current
Power
Cross
dv/dt
Sensitivity
Typical
Application
Several kA
for 100 µs
Dissipation
limited
Good Secondary
protection
Can protect
non-sensitive
equipment
MOV protection capabilities
Surge
Current
Power
Cross
dv/dt
Sensitivity
Typical
Application
Low Poor None Secondary
protection
Can protect
sensitive
equipment
TVS protection capabilities
Datasheet Tip
When selecting operating voltage, remember that
MOV residual voltage increases considerably at
higher current.
Transient Voltage Suppressors
Transient Voltage Suppressor (TVS) diodes are
sometimes called Zeners, Avalanche or Breakdown
Diodes, and operate by rapidly moving from high
impedance to a non-linear resistance characteristic
that clamps surge voltages. TVS diodes provide a
fast-acting and well-controlled clamping voltage
which is much more precise than in an MOV, but
they exhibit high capacitance and low energy
capability, restricting the maximum surge current.
Typically used for low power applications, their well-
controlled voltage clamp enables the selection of
protection voltages closer to the system voltage,
providing tighter protection.
86
Technology Selection - Overcurrent Protectors
Current limiting devices (See Figures 11, 12) provide
a slow response, and are primarily aimed at
protection from surges lasting hundreds of
milliseconds or more, including power induction or
contact with AC power. By combining a fixed
resistor in series with a resettable protector, an
optimum balance of nominal resistance and
operating time is obtained. The inherent resistance
of certain overcurrent protectors can also be useful
in coordination between primary and secondary
overvoltage protection.
Lower cost
High current impulse
Lower on resistance
Lower fire risk
Lower cost
Primary overvoltage
technology?
Mechanical
compression
Solder
melt
Solution?
Mechanical
switch*
Insulation
melt
Solution?
AC Overcurrent
Thyristor GDT
Solder
melt
*Switch-Grade Fail-Short
Note: Protection against sneak currents requires the additional
components
Figure 11. Selection of fail-short technology for Primary
overvoltage protection
Lower signal loss
Better line balance
Use with
ADSL?
Sneak current
protection needed? No
No
No
Yes
Yes
Heat coil Polymer Ceramic Straight-
through
Resettable
PTC thermistor
type?
Figure 12. Sneak current technology selection
Reliability Tip
Hybrid devices incorporating resistors
can improve performance.
Positive Temperature Coefficient (PTC) Thermistors
Heat generated by current flowing in a PTC
thermistor causes a step function increase in
resistance towards an
open circuit, gradually
returning close to its
original value once the
current drops below a
threshold value. The
stability of resistance
value after surges over
time is a key issue for preserving line balance. PTCs
are commonly referred to as resettable fuses, and
since low-level current faults are very common,
automatically resettable protection can be
particularly important. There are two types of PTC
thermistors based on different underlying materials:
Polymer and Ceramic. Generally the device cross-
sectional area determines the surge current
capability, and the device thickness determines the
surge voltage capability.
Polymer PTC devices typically have a lower resistance
than ceramic and are stable with respect to voltage
and temperature. After experiencing a fault condition,
a change in initial resistance may occur. (Resistance is
measured one hour after the fault condition is
removed and the resulting change in resistance
compared to initial resistance is termed the R1 jump.)
Reliability Tip
The stability of PTC thermistor resistance after
operation can be critical for line balance.
Nominal
Ohms
Resistance Stability
(with V and
Temperature)
Change After
Surge
Typical
Application
Polymer PTC
Thermistor 0.01 - 20 Good 10 - 20 % CPE Equipment,
e.g. Modem
Ceramic PTC
Thermistor
10 - 50 R decreases with
temperature and
under impulse
Small Balanced line, e.g.
Line Card SLIC
Table 6. The two types of PTC thermistors have important differences
87
In balanced systems with a PTC thermistor in each
conductor, resistance change may degrade line
balance. Including additional series resistance such
as an LFR can reduce the effect of the R1 jump. In
addition, some PTC thermistors are available in
resistance bands to minimize R1 effects. Polymer
types are also commonly used singly to protect CPE
equipment.
Ceramic PTC devices do not exhibit an R1 jump,
and their higher resistance avoids the need for
installing an additional LFR. While this reduces
component count, the resistance does vary with
applied voltage.
Since this change can be substantial (e.g. a decrease
by a factor of about 3 at 1 kV), it is essential that any
secondary overvoltage protection be correctly rated
to handle the resulting surge current, which can be
three times larger than predicted by the nominal
resistance of the ceramic PTC. In a typical line card
application, line balance is critical.
Datasheet Tip
PTC thermistor and resistor hybrids can improve
speed and line balance.
Bourns® Products
Multifuse® Resettable Fuses
Bourns offers an extensive range of polymer PTC devices
in the Multifuse®resettable fuse product family,
providing resettable overcurrent protection solutions.
Fuses
A fuse heats up during surges, and once the
temperature of the element exceeds its melting point,
the normal low resistance is converted to an open
circuit. The low resistance of fuses is attractive for
xDSL applications, but their operation is relatively
imprecise and time-dependant. Once operated, they
do not reset. Fuses also require additional resistance
for primary coordination (see Application section).
Since overvoltage protection usually consists of
establishing a low impedance path across the
equipment input, overvoltage protection itself will
cause high currents to flow. Although relatively slow
Safety Tip
Fuses offer a simple way to remove long-term faults,
and potentially dangerous heat generation,
but I-t coordination with other protection is vital.
acting, fuses can play a major safety role in removing
longer term faults that would damage protection
circuitry, thus reducing the size and cost of other
protection elements. It is important to consider the I-
t performance of the selected fuse, since even
multiples of the rated current may not cause a fuse to
rupture except after a significant delay. Coordination
of this fuse behavior with the I-t performance of
other protection is critical to ensuring that there is
no combination of current-level and duration for
which the protection is ineffective. By including
structures intended to rupture under excess current
conditions or separate components, it is also possible
to produce hybrid fusible resistors.
Bourns® Products
Telefuse™ Telecom Fuses
Bourns has recently launched the B1250T/B0500T
range of SMT power fault protection fuses.
Heat Coils
Heat coils are thermally activated mechanical devices
connected in series with the line being protected,
which divert current to ground. A series coil
operates a parallel shunt contact, typically by melting
a solder joint that is restraining a spring-loaded
contact. When a current generates enough heat to
melt the joint, the spring mechanically forces two
contacts together, short-circuiting the line. Heat coils
are ideal to protect against “sneak currents” that are
too small to be caught by other methods. Their high
inductance makes them unsuitable for digital lines. It
is also possible to construct current interrupting heat
coils which open the circuit as a result of
overcurrent.
88
Bourns® Products
LPM Line Protection Modules
Bourns offers Line Feed Resistors combining matched
resistor pairs plus thermal link fuses.
Line Feed Resistors
A Line Feed Resistor (LFR) is the most fundamental
form of current protection, normally fabricated as a
thick-film device on a ceramic substrate. With the
ability to withstand high voltage impulses without
breaking down, AC current interruption occurs when
the high temperature developed by the resistor causes
mechanical expansion stresses that result in the
ceramic breaking open.
Low current power induction may not break the LFR
open, creating long-term surface temperatures of more
than 300 °C. To avoid heat damage to the PCB and
adjacent components, maximum surface temperature
can be limited to about 250 °C by incorporating a
series thermal fuse link on the LFR. The link consists
of a solder alloy that melts when high temperatures
occur for periods of 10 seconds or more.
Along with the high precision needed for balanced
lines, LFRs have significant flexibility to integrate
additional resistors, multiple devices, or even different
protection technology within a single component. One
possible limitation is the need to dimension the LFR
to handle the resistive dissipation under surge
conditions. Along with combining multiple
noninductive thick-film resistors on a single substrate
to achieve matching to <1 %, a resistor can be
combined with other devices to optimize their
interaction with the overall protection design.
For example, a simple resistor is not ideal for
protecting a wire, but combining a low value resistor
with another overcurrent protector provides closer
protection and less dissipation than either device can
offer alone. Both functions can be integrated onto a
single thick-film component using fusible elements,
PTC thermistors, or thermal fuses. Similarly, more
complex hybrids are available, adding surface mount
components such as thyristor protectors, to produce
coordinated sub-systems.
Thermal Switches
These switches are thermally activated, non-resetting
mechanical devices mounted on a voltage-limiting
device (normally a GDT). There are three common
activation technologies: melting plastic insulator,
melting solder pellet or a disconnect device.
Melting occurs as a result of the temperature rise of
the voltage-limiting devices thermal overload
condition when exposed to a continuous current
flow. When the switch operates, it shorts out the
voltage-limiting device, typically to ground,
conducting the surge current previously flowing
through the voltage limiting device.
A plastic-melting based switch consists of a spring
with a plastic insulator that separates the spring
contact from the metallic conductors of the voltage
limiting device. When the plastic melts, the spring
contacts both conductors and shorts out the voltage
limiting device.
A solder–pellet-melting based switch consists of a
spring mechanism that separates the line
conductor(s) from the ground conductor by a solder
pellet. In the event of a thermal overload condition,
the solder pellet melts and allows the spring contacts
to short the line and ground terminals of the voltage-
limiting device.
A “Snap Action” switch typically uses a spring
assembly that is held in the open position by a
soldered standoff and will short out the voltage
limiting device when its switching temperature is
reached. When the soldered connection melts, the
switch is released and shorts out the line and ground
terminals of the voltage limited (Bourns US Patent
#6,327,129).
4B06B-540-125/219
0205
Figure 15. Photo of hybrid
89
Modes of Overvoltage Protection
Insufficient protection reduces reliability, while
excessive protection wastes money, making it vital to
match the required protection level to the equipment
or component being protected. One important aspect
is the “modes” of protection.
Figure 13 illustrates that, for two wire systems, a
single mode of operation protects against transverse
(differential/metallic) voltages, but for three wire
systems, the ground terminal provides opportunities
to protect against both transverse and longitudinal
(common-mode) surges. This offers a trade-off for
items such as modems, where the provision of
adequate insulation to ground for longitudinal
voltages enables simple single mode/single device
protection to be used.
Ground-referenced SLICs and LCAS ICs, however,
require three-mode protection. Figure 14 illustrates
how devices may be combined and coordinated to
offer three-mode protection. The three-terminal
GDT offers two modes of robust primary protection,
while two PTC devices provide decoupling and
coordination. The bidirectional thyristor provides the
third mode of precise secondary voltage protection.
Technology Selection - Integrated Solutions
As emphasized earlier, no single technology provides
ideal protection for all requirements. Combining
more than one technology can often provide an
attractive practical solution. Clearly the convenience
PA
PC PB
1
2
1
2
PC
PA
PB
1
2
Pa
Pb Pc
1
2
Protection
Modes
Protection
Modes
Protection
Modes
Protection
Modes
Three Protectors
Three Modes
Wye (Y) Connected
Three Protectors
Three Modes
Delta () Connected
Two Protectors
Two Modes
One Protector
One Mode
Figure 13. Matching the modes of protection to the application optimizes protection and cost
R1
+t
+t
GDT1
R2
Th1
Wire to Ground
GDT
Inter-Wire
Thyristor
Figure 14. The modes of protection may be split between primary
and secondary devices,with PTC thermistors ensuring
coordination
of a single component/module combining multiple
devices saves space and assembly cost while
simplifying the design task (see Figure 15). In
addition, some integrated modules provide
performance and capabilities that cannot be achieved
with separate discrete devices. In the next sections,
multi-stage overvoltage protectors and a broader
combination of overvoltage and overcurrent
protection integrated line protection modules are
presented.
Multi-Stage Protectors
When considering overvoltage protection (see Figure
4), combining a GDT with either a TVS or MOV
clamping device can reduce the impulse voltage
stress seen by downstream components. Although
TVS devices are attractive, they often introduce too
much capacitance. Typically, a GDT/MOV
combination offers a better solution. Figure 16
illustrates the different behavior of GDTs,
GDT/MOV hybrids and thyristor overvoltage
protection for both 100 V/µs and 1000 V/µs impulse
90
waveforms. The GDT/MOV hybrid provides more
consistent protection than a simple GDT, irrespective
of the environment.
The low capacitance of the GDT/MOV hybrid also
provides valuable characteristics for high frequency
applications, enabling the protection of a wide range
of copper-pair lines from POTS to VDSL and CAT5
100 Mb/s networks. All Bourns® GDT and
GDT/MOV hybrid families are UL Recognized for
use without a BUG, making them simple to use and
saving valuable space.
In addition to its superior clamping of fast rising
transients, the MOV of the GDT/MOV assembly
provides the function of a back up device without the
well-known negative side effects of BUGs. Figure 11
demonstrates that a thermally operated current
diverter is useful to protect the GDT from excessive
heat dissipation under prolonged power cross
conditions.
The best performance and lowest fire risk are
provided by the thermal switch or switch-grade fail-
short mechanism. GDT/MOV/fail-short overvoltage
protectors effectively replace three components,
providing maximum surge current capability from
the GDT, low transient clamping characteristics and
back up function from the MOV, and maximum
safety from the switch-grade fail-short device.
Integrated Line Protection Modules
Integrating multiple protection elements on a single
FR4 or ceramic substrate SIP reduces the PCB area
used and increases the number of lines that can be
fitted to each line card. Figure 17 outlines the key
technologies available for such integrated assemblies
Figure 16. Each protection technology behaves differently under
Impulse conditions
Impulse and Ramp % Voltage Increase
vs
Maximum System Voltage
Maximum System Voltage – V
(GDT – Minimum Sparkover)
(Thyristor VDRM)
8 mm GDT
8 mm GDT Hybrid
Thyristor
Normalized Impulse or Ramp Protection Voltage Increase – %
1000 V/µs
1000 V/µs
100 V/µs
50
1000
500
400
300
200
150
100
70
50
40
30
20
15
10
700
100 150 200 250 300 350 400 450 500
Bourns® Products
GDT Gas Discharge Tubes
The Bourns® MSP®Multi-Stage Protector assembly
combines MOV responsiveness with GDT robustness.
Combined with our patented switch-grade fail-short
device, it provides the optimum broadband network
primary protection solution.
Figure 17. Multiple technologies may be integrated into a single,
space-saving Line Protection Module
SIP LPM
SMT Fuse 2-point
3-point “V
3-point “Y”
3-point Gated
3-point “Delta”
Line 1 circuit
Overcurrent
Protection
Overcurrent
Protection
Overvoltage
Protection
Resistor
Array
Resistor Array
Overvoltage Protection
LFR
LFR +
Thermal Link Fuse
+t
PTC Thermistor
+t
LFR +
PTC Thermistor
Line n circuit
91
SLICs powered from
negative supplies need
only a uni-directional
3-point “V”. Three-
mode “Y” or “Delta” 3-
point protection is
used where protection
is needed both to
ground and interwire.
Figure 18 illustrates
an LCAS protection
module, with ±125 V
Tip protection, and
±219 V Ring protection in a 3-point “V”
configuration, complete with LFRs and thermal
link fuses.
As with discrete device solutions, gated thyristor
protectors can be used to significantly reduce voltage
stress for sensitive SLICs and current stress on
downstream protection circuits. Once again the
thermal coupling between a PTC thermistor and a
heating element is beneficial. Heat from the thyristor
speeds up thermistor tripping under power
induction conditions. Further, the thyristor long-
term temperature rise is constrained to the trip
temperature of the thermistor, thereby limiting the
maximum protection voltage under low AC
conditions.
Each module can provide multiple circuits,
protecting 2, 4 or 6 lines with a single module. The
use of UL recognized components greatly eases both
consistency of performance and UL recognition of
the module. System-level design is simplified,
because individual component variations are handled
during the module design, enabling the module to be
considered as a network specified to withstand
defined stress levels at the input, while passing
known stresses to downstream components.
and introduces one new form of overcurrent
protection. Thermal fuse link uses the heat from the
LFR under continuous power induction to desolder a
series link, which interrupts the induced current,
avoiding thermal damage to the module, the line
card or surrounding components. They are not
practical as discrete devices because they use special
structures built into the substrate. These integrated
modules tend to be customized for each application,
rather than off-the-shelf components.
Although PTC thermistors may be used alone, series
connection with an LFR reduces peak currents and
thereby allows smaller cross-section PTC thermistors
to be used. The thermal coupling of an integrated
module also ensures that the LFR heating further
increases the rate of PTC thermistor temperature rise
during AC faults causing faster low current tripping.
The series LFR resistance will reduce the impulse
current increase of ceramic thermistors and reduce
the relative trip resistance change of polymer types.
It is worth noting that 10 mm SMT micro fuses are
now available (e.g. Bourns® Telefuse™ fuse) with 600
V ratings to meet GR-1089-CORE, and UL 60950
safety requirements, and, dependent on the
application, these may be fitted in either one or both
signal lines. LFR technology can also be used to
fabricate precision high voltage resistors on the same
substrate for non-protection use, such as power ring
feed resistors and bridges for off-hook detection,
giving further cost and PCB space savings.
As seen in “Modes of overvoltage protection, it is
important to match the protection topology
(typically thyristor based) to the equipment being
protected, with simple single-mode, 2-point
protection being suitable for Tip to Ring protection
applications such as modem coupling capacitor
protection. The two mode bidirectional 3-point “V”
is a common configuration, protecting components
connected between Tip or Ring and Ground, while
R1F1
F2
Th1 Th2
R2
R1 = 10
R2 = 10
F1 = Thermal Link Fuse
F2 = Thermal Link Fuse
Th1 = TISP125H3BJ
Th2 = TISP219H3BJ
4B06B-540-125/219 LPM
for LCAS Protection
Figure 18. An example of an LPM
integrated LCAS
protection module
Bourns® Products
LPM Line Protection Modules
Bourns offers a variety of Line Protection Module (LPM)
products, including custom options.
92
Telecommunication Standards
and Recommendations Summary
M J Maytum, August 2004, rev 9
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95
1.1 Test Circuits and Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95
1.2 Hazard indicators and wiring simulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96
2 Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97
2.1 Telcordia GR-1089-CORE, Issue 3, October 2002,
Electromagnetic Compatibility and Electrical Safety -
Generic Criteria for Network Telecommunications Equipment . . . . . . . . . . . . . . . . . . . . .97
2.2 Telcordia GR–3108–CORE, Issue 1 (in development),
Generic Requirements for Network Equipment in the Outside Plant (OSP)
Telcordia Technologies Generic Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .98
2.3 TIA-968-A-2002 with Addendums TIA-968-A-1 2003 and TIA-968-A-2 2004,
Telecommunications Telephone Terminal Equipment:
Technical Requirements for Connection of Terminal Equipment
to the Telephone Network (Formally known as “FCC Part 68”) . . . . . . . . . . . . . . . . . . . .98
2.4 UL 60950-1, April 2003,
Safety for Information Technology Equipment – Safety –
Part 1: General Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .98
2.5 UL 60950-21, November 2003,
Safety for Information Technology Equipment – Safety –
Part 21: Remote Power Feeding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
2.6 UL 1459, 1999, Standard for Telephone Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
2.7 UL 2444, (in development), Network Equipment Standard . . . . . . . . . . . . . . . . . . . . . . .99
2.8 ITU-T Recommendation K.20 (07-2003),
Resistibility of telecommunication equipment installed
in a telecommunications centre to overvoltages and overcurrents . . . . . . . . . . . . . . . . . . .99
2.9 ITU-T Recommendation K.21 (07-2003),
Resistibility of telecommunication equipment installed
in customer premises to overvoltages and overcurrents . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
2.10 ITU-T Recommendation K.44 (07-2003),
Resistibility tests for telecommunication equipment
exposed to overvoltages and overcurrents – Basic Recommendation . . . . . . . . . . . . . . . . .99
2.11 ITU-T Recommendation K.45 (07-2003),
Resistibility of telecommunication equipment installed
in the access and trunk networks to overvoltages and overcurrents . . . . . . . . . . . . . . . .103
2.12 ITU-T Recommendation K.50 (02/2000),
Safe limits of operating voltages and currents
for telecommunication systems powered over the network . . . . . . . . . . . . . . . . . . . . . . . .103
2.13 ITU-T Recommendation K.51 (02/2000),
Safety criteria for telecommunication equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103
93
2.14 IEC 61000-4-5 (2001-04), Ed. 1.1,
Electromagnetic compatibility (EMC)- Part 4-5:
Testing and measurement techniques - Surge immunity test . . . . . . . . . . . . . . . . . . . . . .103
2.15 ETSI EN 300 386-1, (2003-05),
Electromagnetic compatibility and Radio spectrum Matters (ERM);
Telecommunication network equipment;
ElectroMagnetic Compatibility (EMC) requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . .103
2.16 ETSI EN 300 386-2, (1997-12),
Electromagnetic compatibility and Radio spectrum Matters (ERM);
Telecommunication network equipment;
ElectroMagnetic Compatibility (EMC) requirements; Part 2:
Product family standard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103
3 Surge Protective Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103
3.1 GR-1361, Issue 2, September 1998,
Generic Requirements for Gas Tube Protector Units (GTPUS) . . . . . . . . . . . . . . . . . . . .103
3.2 GR-974-CORE, Issue 3,
Generic Requirements for Telecommunications Line Protector Units (TLPUs) . . . . . . .104
3.3 UL 497, Edition 7 (April 2001),
Standard for Protectors for Paired Conductor Communications Circuits . . . . . . . . . . . .104
3.4 UL 497A, Edition 3 (March 2001)
Standard for Secondary Protectors for Communications Circuits . . . . . . . . . . . . . . . . . .104
3.5 UL 497B, Edition 4 (June 2004)
Standard for Protectors for Data Communication and Fire Alarm Circuits . . . . . . . . .104
3.6 UL 497C Edition 2 (August 2001)
Standard for Protectors for Coaxial Communications Circuits . . . . . . . . . . . . . . . . . . . .104
3.7 IEEE Std C62.36-2000,
IEEE Standard Test Methods for Surge Protectors
Used in Low-Voltage Data, Communications, and Signalling Circuits . . . . . . . . . . . . . .104
3.8 IEEE Std C62.64-1997,
IEEE Standard Specifications for Surge Protectors
Used in Low-Voltage Data, Communications, and Signalling Circuits . . . . . . . . . . . . . .104
3.9 ITU-T Recommendation K.28 (03/1993),
Characteristics of semiconductor arrester assemblies
for the protection of telecommunications installations . . . . . . . . . . . . . . . . . . . . . . . . . . .104
3.10 IEC 61643-21 (2000-09),
Low voltage surge protective devices -
Part 21: Surge protective devices connected to telecommunications
and signalling networks - Performance requirements and testing methods . . . . . . . . . .104
3.11 ATIS T1.337-2004,
Requirements for Maximum Voltage, Current, and Power Levels
in Network-Powered Transport Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .104
3.12 ATIS T1.338-2004,
Electrical Coordination of Primary and Secondary
Surge Protective Devices for Use in Telecommunications Circuits . . . . . . . . . . . . . . . . . .105
94
4 Surge Protective Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
4.1 REA Bulletin 345-83,
Specification for Gas Tube Surge Arrestor, RUS PE-80 . . . . . . . . . . . . . . . . . . . . . . . . . . .105
4.2 ITU-T Recommendation K.12 (02/2000),
Characteristics of gas discharge tubes
for the protection of telecommunications installations . . . . . . . . . . . . . . . . . . . . . . . . . . .105
4.3 IEEE Std C62.3x
Series of Test Specifications For Surge Protective Components . . . . . . . . . . . . . . . . . . . . .105
4.3.1 IEEE Std C62.31-1987 (under revision),
IEEE Standard Test Specifications For Gas-Tube Surge-protective Devices . . . .105
4.3.2 IEEE Std C62.32-2004
IEEE standard test specifications for low-voltage air gap
surge-protective devices (excluding valve and expulsion type devices) . . . . . . . .105
4.3.3 IEEE Std C62.33-1982
IEEE standard test specifications for varistor surge-protective devices . . . . . . . .105
4.3.4 IEEE Std C62.35-1987
IEEE standard test specifications for avalanche junction
semiconductor surge protective devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
4.3.5 IEEE Std C62.37-1996
IEEE standard test specification for thyristor diode surge protective devices . . .105
4.4 IEC 61643-3x1
Series of test specifications for low-voltage surge protective components . . . . . . . . . .105
4.4.1 IEC 61643-311 (2001-10), Ed. 1.0,
Components for low voltage surge protective devices -
Part 311: Specification for gas discharge tubes (GDT) . . . . . . . . . . . . . . . . . . . . .105
4.4.2 IEC 61643-321 (2001-12) Ed. 1.0,
Components for low voltage surge protective devices -
Part 321: Specifications for avalanche breakdown diode (ABD) . . . . . . . . . . . .105
4.4.3 IEC 61643-331 (2003-05) Ed. 1.0,
Components for low voltage surge protective devices -
Part 331: Specification for metal oxide varistors (MOV) . . . . . . . . . . . . . . . . . . .105
4.4.4 IEC 61643-341 (2001-11) Ed. 1.0,
Components for low voltage surge protective devices -
Part 341: Specification for thyristor surge suppressors (TSS) . . . . . . . . . . . . . . .105
95
1.1 Test Circuits and Levels
Lightning and power fault events can induce
longitudinal surges in the telecommunication line
and Figure 1 shows how longitudinal (port to
ground) surge testing is done. Depending on the test
intent additional items such as primary protection,
wiring simulation and the decoupling of other ports
may be added in these test circuits.
Asynchronous operation of upstream protection
grounds one line conductor and converts a
longitudinal surge into a transverse surge. Figure 2
shows the transverse (metallic or differential) surge
test circuit. The number of transverse test
configurations is the same as the number of wires. A
twisted-pair should have two tests, one applied to the
Ring conductor and the other applied to the Tip
conductor. However, if the circuit is symmetrical,
only one proving test needs be done.
When the ground has high resistance or is not
connected, the incoming surge enters the equipment
on one port and exits at another port – a port-to-
port surge. Figure 3 shows how port-to-port testing
is done.
The surge threats are higher for
the exposed external cables than
cables just internal to the
building. Figure 4 shows port
testing for shielded and
unshielded internal cables. GR-
1089-CORE excludes internal
port testing, if the shielded cable
is grounded at both ends.
The maximum test levels applied
are typically in three areas; basic withstand, a higher
(enhanced) level withstand for adverse environments
and an excessive level to investigate possible safety
hazards. Step testing is done at levels up to the
maximum specified to verify there are no blind spots
in the equipment performance. The equipment must
be functional after withstand testing (criterion A or
first level”) and shall not create hazard from safety
testing (criterion B or “second level”).
1 Introduction
This document summarises the common
telecommunication protection device and equipment
standards. To minimise service loss and user safety
hazards, service providers and regulators mandate
that equipment and devices comply with specific
standards or recommendations. This section
summarises telecommunications component and
port surge tests in the North American documents
from Telcordia (GR), Underwriters Laboratories
(UL), Institute of Electrical and Electronics
Engineers (IEEE) and Telecommunications Industry
Association (TIA). International documents covered
come from the International Telecommunication
Union Telecommunication Standardization Sector
(ITU-T) and the International Electrotechnical
Commission (IEC). As international trade, travel and
communications increase, international standards
enable products to be sold and work worldwide.
Standards are constantly evolving, so it is important
to verify the material here against the latest copies of
the relevant documents. The European documents
covered are either EN versions of IEC standards or
from the European Telecommunications Standards
Institute (ETSI).
Test
Generator
EUT
R
Decoupling
Element
Coupling
Element
RInternal/
external
port
Internal
port
External
port
Powering/
auxilary
equipment or
terminations
Primary
test protector
when required
EEE
E
Return
Output
Powering/
auxilary
equipment or
terminations
Powering/
auxilary
equipment or
terminations
Figure 1. Longitudinal surge test circuit
Figure 2. Transverse surge test circuit
Test
Generator
EUT
R
Decoupling
Element
Coupling
Element
RInternal/
external
port
External
port
Primary
test protector
when required
EE
E
Return
Output
Powering/
auxilary
equipment or
terminations
Powering/
auxilary
equipment or
terminations
Unused
ports
96
Test
Generator
EUT
R
Decoupling
Element
Coupling
Element
RInternal/
external
port
External
port
External
port
Primary
test protector
when required
Appropriate primary
test protector
when required
EEE
E
Return
Output
Powering/
auxilary
equipment or
terminations
Powering/
auxilary
equipment or
terminations
Powering/
auxilary
equipment or
terminations
Figure 3. Port to port surge test circuit
Test
Generator
EUT
R
Decoupling
Element
Coupling
Element
RInternal/
external
port
Internal
port
Powering/
auxilary
equipment or
terminations
EE
E
Return
Output
Powering/
auxilary
equipment or
terminations
Unused
ports
Test
Generator
R
EUT
Internal
ports
E
Return
Output
20 m shielded cable
Internal line unshielded cable test circuit Internal line shielded cable test circuit
Figure 4. Internal cable port test circuits
1.2 Hazard indicators and wiring simulators
The condition of cheesecloth wrapped around the
item under test checks for potential user hazards.
After safety testing, hazards are indicated by
cheesecloth that is charred burnt or perforated (GR-
1089-CORE only). Wiring simulations in a test circuit
check that the equipment feed cable will overheated.
The equipment must interrupt or reduce the AC fault
current before the simulator operates or is judged to
overheat. Because of different cabling practices and
simulation options, there are more wiring simulator
options than standards that use them. Figure 5 shows
a selection of simulators; graphical, mathematical, fuse
(shown at 80 % of typical) and single wire, together
with their referenced standards.
2 Equipment
2.1 Telcordia GR-1089-CORE, Issue 3, October 2002
Electromagnetic Compatibility and Electrical Safety -
Generic Criteria for Network Telecommunications
Equipment
AC and lightning surge test circuits and performance
levels for the external and internal line ports of
network equipment. External port feed cable
MDQ 1 6/10 Fuse '1089/UL 1459
MDL 2 Fuse '1089/UL 60950
100A2s, 1.3 A DC UL 60950
Fig. 4-5 GR-1089-CORE
26 AWG GR-1089-CORE
Fig. 59.2 UL 1459
Current – A rms
100
10
1
0.1
0.01 0.1 1
Duration – s
10 100 1000
Figure 5. Wiring simulators
overheating and primary-equipment coordination
tests are included. Test summaries for twisted-pair
cables are shown in tables one through three. Further
material on GR-1089-CORE, Issue 3 is in the article
“The New GR-1089-CORE” Compliance Engineering,
2003 Annual Reference Guide: pp 103-113.
97
Table 1. GR-1089-CORE impulse tests
GR-1089-
CORE
Table #
Test #
Min. Peak
Open Circuit
Conductor
Voltage (V)
Min. Peak
Short-Circuit
Conductor
Current (A)
Waveshape Repetitions
Each Polarity
Test
Connection
Test
Type Port Primary
4-23
1 600 100 <10/>1000 25
Longitudinal
& Transverse
First Level
Withstand
External
Removed
2 1000 100 <10/>360 25
311000 100 <10/>1000 25
4 2500 500 <2/>10210 Longitudinal
551000 25 <10/>360 5 Longitudinal
up to 12 pairs
4-341 400-2000 0-100 <10/>1000 10 Longitudinal
& Transverse Coordination
4-431 5000 500 <2/>1021 Longitudinal Second Level
Safety
4-56
1 800 100 <2/>1021 Transverse First Level
Withstand
Intra-
building
2 1500 100 <2/>1021 Longitudinal
Notes:
1. Test 3 replaces tests 1 and 2.
2. A 1.2/50, 8/20 combination waveshape of the same peak current (but increased duration) may be used as an alternative.
3. For equipment with voltage limiters, tests must also be done at a voltage level just below the limiter threshold.
4. Becomes an objective January 2005 and a requirement in January 2006. Besides GR-1089-CORE, Issue 3, further information on this test
is contained in “Electrical Coordination of Primary and Secondary Surge Protective Devices for Use in Telecommunications Circuits”
T1.333-2004 and The New GR-1089-CORE” Compliance Engineering, 2003 Annual Reference Guide: pp 103-113.
5. Not applicable for single port equipment.
6. Not applied to ports with shielded cables that have the shield grounded at both ends.
GR-1089-
CORE
Table #1
Test #
Open-Circuit
Conductor
Voltage
(V rms)
Short-Circuit
Conductor
Current
(A rms)
Duration
(s) Applications Test
Connection
Test
Type Port Primary
4-6
1250 0.33 900 1
Longitudinal
& Transverse
First Level
Withstand External
Removed22100 0.17 900 1
32200, 400 & 600 1 @ 600 V rms 1 60
4 1000 1 1 60
Longitudinal
Fitted
5Inductively coup led test circuit
1089 Fig. 4-4 560
Removed
6 600 0.5 30 1
Longitudinal
& Transverse
7 440 2.2 2 5
8 600 3 1.1 5
9 1000 5 0.4 5 Longitudinal Fitted
4-72, 3
4-82, 4
1 120, 277 25 900 1
Longitudinal
& Transverse Second Level
Safety External Removed
2 600 60 5 1
3 600 7 5 1
4 100-600 2.2 @ 600 V rms 900 1
5Inductively coup led test circuit
1089 Fig. 4-4 900 1 Longitudinal
Table 2. GR-1089-CORE AC power fault tests
Notes:
1. AC sources are 50 Hz or 60 Hz, sinusoidal.
2. For equipment with a voltage limiter or current limiter, tests must also be done at a level just below the limiter threshold.
3. For non-customer-premise equipment the wiring simulation used for all tests may be GR-1089-CORE Figure 4-5, an MDL 2 fuse or an
MDQ 1 6/10 fuse.
4. For customer-premise equipment the wiring simulation used for all tests may be GR-1089-CORE Figure 4-5, an MDL 2 fuse, an MDQ 1 6/10
fuse or a 26 AWG wire, if such wire or coarser is specified for installation.
98
Table 3. GR-1089-CORE AC current-limiter and fusing tests
Notes:
1. AC sources are 50 Hz or 60 Hz, sinusoidal.
2. For current-limiting protector tests of non-customer-premise equipment, the wiring simulation used may be GR-1089-CORE Figure 4-5,
and MDL fuse or an MDQ 1 6/10 fuse.
3. For fusing coordination tests of network equipment to be located at the customer premises, the wiring simulation used may be
GR-1089-CORE Figure 4-5, and MDL 2 fuse or a 26 AWG wire, if such wire or coarser is specified for installation.
4. Only for network equipment to be located at the customer premises.
5. For second-level intra-building port testing of customer premise equipment, the wiring simulation used may be GR-1089-CORE Figure 4-5,
an MDL 2 fuse or a MDQ 1 6/10 fuse.
Table 4. TIA-968-A-2002 Lightning surge tests
Notes:
1. Equipment may fail, but not in a Ring-Tip short-circuit mode.
2. Equipment must be operational after these withstand tests.
3. These values are for both Ring and Tip outputs grounded. T1-968-A quotes for only one conductor grounded, giving 37.5 A and 5/320.
GR-1089-
CORE
Clause #
Open-Circuit
Conductor
Voltage
(V rms)
Short-Circuit
Conductor Current
(A rms)
Duration
(s) Applications Test
Connection Test Type Port Primary
4.6.112
4.6.143600 30, 25, 20, 12.5, 10, 7, 5,
3.75, 3, 2.6 & 2.2
900 1 Longitudinal
& Transverse
Second Level
Safety
External Removed
4.6.174, 5 120 25 Internal N/A
Surge Type
Minimum Peak
Open-Circuit
Conductor Voltage
(V)
Voltage
Waveshape
Minimum Peak
Short-Circuit
Conductor Current
(A)
Current
Waveshape
Test
Connection Port
A1
800 <10/>560 100 <10/>560 Transverse
External
1500 <10/>160 200 <10/>160 Longitudinal
B2
1000 9/720 25 5/320 Transverse
1500 9/720 27.334/2453Longitudinal
2.2 Telcordia GR–3108–CORE, Issue 1
(in development),
Generic Requirements for Network Equipment in
the Outside Plant (OSP) Telcordia Technologies
Generic Requirements
Defines OSP environmental performance
requirements which can be used during GR-1089-
CORE testing.
2.3 TIA-968-A-2002 with Addendums TIA-968-A-1
2003 and TIA-968-A-2 2004,
Telecommunications Telephone Terminal
Equipment: Technical Requirements for Connection
of Terminal Equipment to the Telephone Network
(Formally known as “FCC Part 68”)
Lightning surge test circuits and performance levels
for the external line ports of equipment installed at
the customer premise. Power fault and safety
requirements will come from UL 60950-1
compliance. Table 4 summaries the impulse test
conditions of this standard.
2.4 UL 60950-1, April 2003
Safety for Information Technology Equipment –
Safety – Part 1: General Requirements
AC and lightning surge test circuits and safety
performance for the external line ports of network
equipment. External port feed cable-overheating tests
are included. Table 6 summaries the AC power fault
tests and Figure 6 shows the overvoltage flow chart
for product approval.
99
UL 60950-1
Clause #1Test #
Open-Circuit
Conductor
Voltage
(V rms)
Short-Circuit
Conductor
Current
(A rms)
Duration
(s)
Test
Connection
Test
Type Port Wiring
Simulation
NAC.3.32
M-1, L-1
and F1 600 40 1.5
Longitudinal
& Transverse
Safety, No
Ignition or
Charring of the
Equipment
Cheesecloth
Indicator
External
Y3
M-2, L-2
and F2 600 7 5
N
M-3, L-3
and F3 600 2.2 1800
M-3A, L-3A
and F3A 600 <2.241800
M-4, L-4
and F4 <6005<2.251800
L-5 120 25 1800 Longitudinal Y3
Table 6. UL 60950-1 AC power fault tests
Notes:
1. AC sources are 50 Hz or 60 Hz, sinusoidal.
2. “M” tests are differential (metallic or transverse) mode tests. “L tests are common (longitudinal) mode tests. “F” tests are 4-wire tests, one
pair is longitudinally tested and one port terminal of the other pair is grounded.
3. Used when a minimum 26 AWG telecommunications line cord is not provided or specified. Simulator may be a 50 mm length of 0.2 mm
(No. 32 AWG) solid copper wire or an MDL-2 fuse. For M-1, L-1 and F-4 an i2t measurement of less than 100 A2s can be used.
4. Test 3A is done when the current in test 3 is interrupted. The applied circuit current must be set to be just below the operating current
level of the equipment current limiter for the test duration.
5. Test 4A is done when the equipment voltage limiter, rated at 285 V peak or more, operated during tests 3 or 3A. The equipment voltage
and current levels are set at a level just below the voltage and current limiter threshold levels.
2.5 UL 60950-21, November 2003
Safety for Information Technology Equipment –
Safety – Part 21: Remote Power Feeding
Sets the safety performance levels of remote voltage
(RFT-V) or current (RFT-C) power feeds to
equipment.
2.6 UL 1459, 1999
Standard for Telephone Equipment
AC surge test circuits and safety performance for the
external line ports of equipment connected to the
network. External port feed cable-overheating tests
are included (NB maximum current levels are lower
than UL-60950-1).
2.7 UL 2444, (in development)
Network Equipment Standard
This is a safety-listing standard based on GR-1089-
CORE, UL 1459 and UL 60950-1.
2.8 ITU-T Recommendation K.20 (07-2003)
Resistibility of telecommunication equipment
installed in a telecommunications centre to
overvoltages and overcurrents
AC and lightning surge performance levels for the
external and internal line ports of equipment
installed at telecommunications centres. Two surge
withstand levels are specified, basic and enhanced.
Primary-equipment coordination tests are included.
2.9 ITU-T Recommendation K.21 (07-2003)
Resistibility of telecommunication equipment
installed in customer premises to overvoltages and
overcurrents
AC and lightning surge performance levels for the
external and internal line ports of equipment
installed at the customer premise. Two surge
withstand levels are specified, basic and enhanced.
Primary-equipment coordination tests are included.
2.10 ITU-T Recommendation K.44 (07-2003)
Resistibility tests for telecommunication equipment
exposed to overvoltages and overcurrents—Basic
Recommendation
AC and lightning surge test circuits to be used for
K.20, K.21 and K.45 performance evaluations. Tables
7 through to 9 summarise the tests and levels for
paired conductor ports in K.20, K.21 and K.45.
Copyright for these tables belongs to Canon Communications LCC and
they originally appeared in “The 2004 ITU-T Telecommunication
Equipment Resistibility Recommendations” Compliance Engineering, 2004
Annual Reference Guide: 117-124. A further article on ITU-T testing is
“The New ITU-T Telecommunication Equipment Resistibility
Recommendations” Compliance Engineering 19, no. 1 (2002): 30-37.
100
IT
Equipment
parameters
Connects to
outside cable?
Has 100 A2s
@ 600 V?1
Has minimum
26 AWG cord?
No
No
Yes
No
No
Pass Test 1?No
Yes
Has 1.3 A
DC limiting?2
Yes
Has
fire enclosure?
Yes
A
BEI
C
D
Pass 6.3.3
ground/line
separation?3
No No
Yes
Has fire enclosure
and spacings?
Yes
Pass test 2
pass tests 3, 4?
No
Yes
Yes
Yes
No
Yes
F
G
H
J
No overvoltage
testing
Test 1
600 V, 40 A
1.5 s
Test 5
120 V, 25 A,
30 min. or
open circuit
Test 24
600 V, 7 A, 5 s
Test 35
600 V, 2.2 A
Test 3A5
600 V, <2.2 A, 30 min.,
no open circuit
Test 45
<limiting voltage, <2.2 A,
30 min. , no open circuit,
no overvoltage protector
voltage limiting
Pass Test 5? Fail
Pass
Figure 6. UL 60950-1 Overvoltage flow chart
UL 60950-1 (04/2003)
Information Technology Equipment – Safety – Part 1: General Requirements
Clause 6.4 – Protection against overvoltage from power line crosses
Figure 6C – Overvoltage flowchart
Annex NAC (normative) – Power line crosses
Notes:
1. Overcurrent protector I2t must be lower than any other equipment element which carries the same current.
2. UL states a fuse with a 1 A or less rating meets the 1.3 A criterion.
3. Pass for 120 V A.C. between telecommunications line and ground current <10 mA.
4. Test 2 not required if the equipment D.C. breaking is 1.3 A or less. See Note 2.
5. Tests 3 and 4 not required for equipment with less than 1000 m of outside cable.
Pass Criteria Test 1 Test 2 Test 3 Test 3A Test 4 Test 5
No equipment cheesecloth charring 
Insulation OK 
50 mm of 32 AWG wire or MDL-2 A fuse OK 
I2t < 100 A2s @ 600 V rms AC
101
Ports
Waveshape
(Notes)
No. of Tests
Test #
Lighting
Test
Description
Basic Test Levels Enhanced Test Levels Primary
Protection
Acceptance
Criteria
K.20 K.45 K.21 K.20 K.45 K.21
Single
10/700 Voltage
(Note 1)
+5, -5
2.1.1.a Inherent
Transverse
1.0 kV,
R = 25 Ω
1.5 kV,
R = 25 Ω
None A2.1.1.b Inherent
Port to Earth
1.0 kV,
R = 25 Ω
1.5 kV,
R = 25 Ω 6 kV,
R = 25 Ω
(Note 2)
2.1.1.c Inherent Port
to External Port 1.5 kV,
R = 25 Ω (Note 7) 1.5 kV,
R = 25 Ω
Single
10/700 Voltage
(Notes 3 & 4)
+5, -5
2.1.2.a Coordination
Transverse
4 kV,
R = 25 Ω
6 kV,
R = 25 Ω
Yes
Special
Protector
A
If Fitted,
Special
Protector
Must Operate
at Maximum
Test Level
2.1.2.b Coordination
Port to Earth
4 kV,
R = 25 Ω
2.1.2.c Coordination Port
to External Port 4 kV,
R = 25 Ω (Note 7) 4 kV,
R = 25 Ω
Multiple
10/700 Voltage
(Notes 1 & 5)
+5, -5
2.1.3a Inherent Port
to Earth
1.5 kV,
R = 25 Ω
None A
2.1.3b Inherent Port
to External Port 1.5 kV,
R = 25 Ω (Note 7) 1.5 kV,
R = 25 Ω
Multiple
10/700 Voltage
(Notes 3, 4 & 5)
+5, -5
2.1.4a Coordination
Port to Earth
4 kV,
R = 25 Ω
6 kV,
R = 25 Ω Yes
Agreed
Protector
A
2.1.4b Coordination Port
to External Port 4 kV,
R = 25 Ω (Note 7) 6 kV,
R = 25 Ω
Single
8/20 Current
(Note 6)
+5, -5
2.1.5a Port to Earth 1 kA/wire,
R = 0
5 kA/wire,
R = 0
None A
2.1.5b Port to
External Port 1 kA/wire,
R = 0 (Note 7) 5 kA/wire,
R = 0
Multiple
8/20 Current
(Note 5 and 6)
+5, -5
2.1.6a Port to Earth 1 kA/wire, R = 0,
6 kA Max. Return
5 kA/wire, R = 0,
30 kA Max. Return
None A
2.1.6b Port to
External Port 1 kA/wire, R = 0,
6 kA Max. Return (Note 7) 5 kA/wire, R = 0,
30 kA Max. Return
Table 7. Lightning tests for ports connected to external symmetric-pair cables
Test levels are given as the maximum D.C. charge voltage of the surge generator or current delivered to a tested equipment terminal and R
is the value of current limit resistor. The current limit resistor, R, may be internal or external to the generator.
Notes
1. Not applied to equipment designed to be always used with primary protection. For K.20, K.21 and Test 2.1.1 there must be operator
agreement and the an appropriate internal port test applied (see Table III).
2 Equipment with conductor to ground SPDs shall be tested at 1.5 kV instead of 6 kV. Insulated case equipment has 6 kV insulation test.
3. With network operator and manufacturer agreement, equipment containing high current carrying components which eliminate the
need for primary protection shall be tested without primary protection. Testing shall done with highest voltage high current carrying
components.
4. Equipment, which agreed not to use primary protection, shall be tested without primary protection. K.44, 3.1.4
5. Simultaneously applied to all ports. When the equipment has more than 8 ports, only 8 of the ports are tested.
6. Only for equipment, which contains high current carrying components that eliminate the need for primary protection.
7. Apply K.45 port to external port test at the K.20 enhanced level for small telecommunication centres with less than 250 lines.
102
Ports
Frequency
(Notes)
No. of Tests
Test #
Power
Test
Description
Basic Test Levels Enhanced Test Levels Primary
Protection
Acceptance
Criteria
K.20 K.45 K.21 K.20 K.45 K.21
Single
16-2/3 Hz,
or 50 Hz
or 60 Hz
(Note 1)
5
2.2.1.a
Induction
Inherent
Transverse
I2t = 0.2 A2s;
V = 600 V rms max.;
R = 600 Ω; t = 0.2 s
None A2.2.1.b
Induction
Inherent
Port to Earth
I2t = 0.2 A2s;
V = 600 V rms max.;
R = 600 Ω; t = 0.2 s
2.2.1.c
Induction
Inherent Port
to External Port
I2t = 0.2 A2s;
V = 600 V rms max.;
R = 600 Ω; t = 0.2 s
(Note 6)
I2t = 0.2 A2s;
V = 600 V rms max.;
R = 600 Ω; t = 0.2 s
Single
16-2/3 Hz,
or 50 Hz
or 60 Hz
(Note 2)
5 at each
test level
2.2.2.a
Induction
Coordination
Transverse
I2t = 1.0 A2s;
V = 600 V rms max.;
R = 600 Ω; t = 1.0 s; (Note 3)
I2t = 10 A2s;
450 V rms ≤ v ≤ 1500 V rms;
R = 200 Ω; 0.18 s ≤ t ≤ 2.0 s;
t = (400 000)/(v)2; (Note 4)
Yes
Special
(Agreed
Primary)
Test
Protector
A
2.2.2.b
Induction
Coordination
Port to Earth
I2t = 1.0 A2s;
V = 600 V rms max.;
R = 600 Ω; t = 1.0 s; (Note 3)
I2t = 10 A2s;
450 V ≤ v ≤ 1500 V rms;
R = 200 Ω; 0.18 s ≤ t ≤ 2.0 s;
t = (400 000)/(v)2; (Note 4)
2.2.2.c
Induction
Coordination
Port to
External Port
I2t = 1.0 A2s;
V = 600 V rms max.;
R = 600 Ω; t = 1.0 s;
(Note 3)
(Note 6)
I2t = 10 A2s;
450 V ≤ v ≤ 1500 V rms;
R = 200 Ω;
0.18 s ≤ t ≤ 2.0 s;
t = (400 000)/(v)2;
(Note 4)
Single
50 Hz
or 60 Hz
(Note 5)
1 set
2.3.1.a
Contact
Inherent
Transverse
V = 230 V rms;
R = 10 Ω, 20 Ω, 40 Ω, 80 Ω, 160 Ω, 300 Ω, 600 Ω, and 1000 Ω;
t = 900 s for each resistor value
None
B,
Except A for
Enhanced
Level Testing
using
R = 160 Ω,
300 Ω and
600 Ω
2.3.1.b
Contact
Inherent
Port to Earth
V = 230 V rms;
R = 10 Ω, 20 Ω, 40 Ω, 80 Ω, 160 Ω, 300 Ω, 600 Ω, and 1000 Ω;
t = 900 s for each resistor value
2.3.1.c
Contact
Inherent Port
to External Port
V = 230 V rms;
R = 10 Ω, 20 Ω, 40 Ω,
80 Ω, 160 Ω, 300 Ω,
600 Ω, and 1000 Ω;
t = 900 s for each
resistor value
(Note 6)
V = 230 V rms;
R = 10 Ω, 20 Ω, 40 Ω,
80 Ω, 160 Ω, 300 Ω,
600 Ω, and 1000 Ω;
t = 900 s for each
resistor value
Table 8. AC tests for ports connected to external symmetric-pair cables
Test levels are given as the maximum or range of generator open circuit A.C. voltages, A.C. frequency, test time and R is the value or values
of current limit resistor.
Notes
1. Not applied to equipment designs to be always used with primary protection. K.20 and K.21 equipment also needs operator agreement.
2. Equipment, containing high current carrying components, which eliminate the need for primary protection shall be tested without
primary protection. Equipment shall use special worst-case high current carrying components.
3. To suit local conditions a voltage of 300 V rms ≤ V ≤ 600 V rms and time t ≤ 1.0 s may be specified. The series current limit resistance shall
then be R = V(t)0.5
4. All voltage-time combinations shall be tested as defined by the time equation.
5. Equipment, which is always used with primary protection, shall be tested with special agreed primary protector.
6. Apply K.45 port to external port test at the K.20 enhanced level for small telecommunication centres with less than 250 lines.
103
Ports
Generator
(Notes)
No. of Tests
Test #
Lighting
Test
Description
Basic Test Levels Enhanced Test Levels Primary
Protection
Acceptance
Criteria
K.20 K.45 K.21 K.20 K.45 K.21
Single
8/20, 1.2/50
+5, -5
7.1
Unshielded Cable
Inherent
Longitudinal
500 V,
R = 10 Ω 1.0 kV,
R = 10 Ω
1.0 kV,
R = 10 Ω 1.5 kV,
R = 10 Ω
None A
Multiple
8/20, 1.2/50
(Note 1)
+5, -5
7.2
Shielded Cable
Inherent
Longitudinal
500 V,
R = 0 1.0 kV,
R = 0
1.0 kV,
R = 0 1.5 kV,
R = 0
Table 9. Lighning tests for ports connected to internal symmetric-pair cables.
Test levels are given as the maximum DC charge voltage of the surge generator delivered to a tested equipment terminal and R is the value
of current limit resistor. The current limit resistor, R, may be internal or external to the generator.
Note:
1. Cable screen is returned the port wires at the generator feed end see Figure 6.
2.11 ITU-T Recommendation K.45 (07-2003)
Resistibility of telecommunication equipment
installed in the access and trunk networks to
overvoltages and overcurrents
AC and lightning surge performance levels for the
external line ports of access (OSP) equipment. Two
surge withstand levels are specified, basic and
enhanced. Primaryequipment coordination tests are
included.
2.12 ITU-T Recommendation K.50 (02/2000)
Safe limits of operating voltages and currents for
telecommunication systems powered over the
network
Provides guidance on voltages and currents that may
be safely used to power telecommunication systems
that are part of the network. Content is similar to
UL 60950-21.
2.13 ITU-T Recommendation K.51 (02/2000)
Safety criteria for telecommunication equipment
Recommendation uses ITU-T recommendation K.50
and parts of IEC 60950.
2.14 IEC 61000-4-5 (2001-04), Ed. 1.1
Electromagnetic compatibility (EMC)- Part 4-5:
Testing and measurement techniques - Surge
immunity test
Lightning surge test circuits and levels for the
external and internal line ports of networked
equipment
2.15 ETSI EN 300 386-1, (2003-05)
Electromagnetic compatibility and Radio spectrum
Matters (ERM); Telecommunication network
equipment; ElectroMagnetic Compatibility (EMC)
requirements
Lightning surge test circuits and performance level
overview for the external and internal line ports of
network equipment referencing IEC 61000-4-5.
2.16 ETSI EN 300 386-2, (1997-12)
Electromagnetic compatibility and Radio spectrum
Matters (ERM); Telecommunication network
equipment; ElectroMagnetic Compatibility (EMC)
requirements; Part 2: Product family standard
Consolidated product test and performance standard
for the external and internal line ports of network
equipment. Internal port lightning surge testing
references EN 61000- 4-5 (1995) tests. External line
power induction testing references ITU-T
Recommendation K.20 (1993) and lightning surge
references ITU-T Recommendation K.20 (1993) or
K.21 (1988).
3 Surge Protective Devices
3.1 GR-1361, Issue 2, September 1998
Generic Requirements for Gas Tube Protector Units
(GTPUS)
AC and lightning surge test circuits and performance
levels for primary protectors using Gas Discharge
Tubes, GDTs with and without current-limiting
components.
104
3.2 GR-974-CORE, Issue 3
Generic Requirements for Telecommunications Line
Protector Units (TLPUs)
AC and lightning surge test circuits and performance
levels for primary protectors using GDTs or solid-
state overvoltage protectors or hybrid combinations
with and without current-limiting components.
3.3 UL 497, Edition 7 (April 2001)
Standard for Protectors for Paired Conductor
Communications Circuits
AC and impulse surge test circuits and performance
levels for voltage-limiting paired-conductor primary
protectors with and without current-limiting
components. These devices are to be used in
accordance with the applicable requirements of the
National Electrical Code, ANSI/NFPA 70.
3.4 UL 497A, Edition 3 (March 2001)
Standard for Secondary Protectors for
Communications Circuits
AC and impulse surge test circuits and performance
levels for current-limiting pairedconductor
secondary protectors with and without voltage-
limiting components. Test conditions are similar to
those in UL 60950-1. These devices are to be used in
accordance with the applicable requirements of the
National Electrical Code, ANSI/NFPA 70.
3.5 UL 497B, Edition 4 (June 2004)
Standard for Protectors for Data Communication
and Fire Alarm Circuits
AC and impulse surge test circuits and performance
levels for voltage-limiting pairedconductor
secondary protectors with and without current-
limiting components.
3.6 UL 497C Edition 2 (August 2001)
Standard for Protectors for Coaxial
Communications Circuits
AC and impulse surge test circuits and performance
levels for voltage-limiting coaxial cable protectors
with and without current-limiting components.
These devices are to be used in accordance with the
applicable requirements of the National Electrical
Code, ANSI/NFPA 70.
3.7 IEEE Std C62.36-2000
IEEE Standard Test Methods for Surge Protectors
Used in Low-Voltage Data, Communications, and
Signalling Circuits.
Sets of AC and impulse surge tests for surge
protectors with and without current-limiting
components.
3.8 IEEE Std C62.64-1997
IEEE Standard Specifications for Surge Protectors
Used in Low-Voltage Data, Communications, and
Signalling Circuits
Sets of AC and impulse surge preferred performance
levels for surge protectors with and without current-
limiting components.
3.9 ITU-T Recommendation K.28 (03/1993)
Characteristics of semi-conductor arrester
assemblies for the protection of telecommunications
installations
AC and impulse surge tests and preferred
performance levels for semi-conductor voltage-
limiting paired-conductor primary protectors.
3.10 IEC 61643-21 (2000-09)
Low voltage surge protective devices - Part 21: Surge
protective devices connected to telecommunications
and signalling networks - Performance
requirements and testing methods
Sets of AC and impulse surge tests for surge
protectors with and without current-limiting
components.
3.11 ATIS T1.337-2004
Requirements for Maximum Voltage, Current, and
Power Levels in Network-Powered Transport
Systems
This document provides maximum dc steady state
and duration limited voltage, current, and power
limits to be observed when powering transport
systems over conventional network
telecommunications twisted-pair conductors. The
technical requirements contained herein are based
on industry-recognized safety and design standards,
addresses both the network and customer premises
environments, and are independent of the transport
system technology employed. Signalling levels and
transients are not covered, but should be considered
when evaluating a transport system for conformance
105
to these requirements if they will impact voltage,
current, or power levels.
3.12 ATIS T1.338-2004
Electrical Coordination of Primary and Secondary
Surge Protective Devices for Use in
Telecommunications Circuits
This document covers the electrical coordination
between primary and secondary surge protection
devices that are both connected to ground. Proper
coordination is essential to ensure that both primary
and secondary protectors operate in a manner that
provides the protected equipment with the most
effective protection from AC power or lightning
surges. This document does not address protection
of the AC power service.
4 Surge Protective Components
4.1 REA Bulletin 345-83
Specification for Gas Tube Surge Arrestor,
RUS PE- 80
AC and impulse surge tests and performance levels
for heavy duty GDTs in rural service.
4.2 ITU-T Recommendation K.12 (02/2000)
Characteristics of gas discharge tubes for the
protection of telecommunications installations
Sets of AC and impulse surge tests and preferred
performance levels for GDTs
4.3 IEEE Std C62.3x
Series of Test Specifications For Surge Protective
Components
4.3.1 IEEE Std C62.31-1987
IEEE Standard Test Specifications For Gas-Tube
Surge-protective Devices
4.3.2 IEEE Std C62.32-1981
IEEE standard test specifications for low-voltage air
gap surge-protective devices (excluding valve and
expulsion type devices)
4.3.3 IEEE Std C62.33-1982
IEEE standard test specifications for varistor surge-
protective devices
4.3.4 IEEE Std C62.35-1987
IEEE standard test specifications for avalanche
junction semiconductor surge protective devices
4.3.5 IEEE Std C62.37-1996
IEEE standard test specification for thyristor diode
surge protective devices
4.4 IEC 61643-3x1
Series of test specifications for low-voltage surge
protective components
4.4.1 IEC 61643-311 (2001-10), Ed. 1.0
Components for low-voltage surge protective devices
- Part 311: Specification for gas discharge tubes
(GDT)
4.4.2 IEC 61643-321 (2001-12) Ed. 1.0
Components for low-voltage surge protective devices
- Part 321: Specifications for avalanche breakdown
diode (ABD)
4.4.3 IEC 61643-331 (2003-05) Ed. 1.0
Components for low-voltage surge protective devices
- Part 331: Specification for metal oxide varistors
(MOV)
4.4.4 IEC 61643-341 (2001-11) Ed. 1.0
Components for low-voltage surge protective devices
- Part 341: Specification for thyristor surge
suppressors (TSS)
© 2004 Bourns, Ltd. Certain parts of this document are in joint copyright
with Canon Communications LLC and ATIS. Personal use of this material
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