LM185WG-1.2/883 - Texas Instruments High-Performance Analog

LM185-1.2QML

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SNVS384A –OCTOBER 2005–REVISED MARCH 2013

LM185-1.2QML Micropower Voltage Reference Diode

Check for Samples: LM185-1.2QML

1FEATURES DESCRIPTION

The LM185-1.2 is a micropower 2-terminal band-gap

2• Operating Current of 10μA to 20mA voltage regulator diodes. Operating over a 10μA to

• 1ΩMaximum Dynamic Impedance (Typical) 20mA current range, it features exceptionally low

• Low Temperature Coefficient dynamic impedance and good temperature stability.

On-chip trimming is used to provide tight voltage

• Low Voltage Reference - 1.235V tolerance. Since the LM185-1.2 band-gap reference

uses only transistors and resistors, low noise and

good long term stability result.

Careful design of the LM185-1.2 has made the device

exceptionally tolerant of capacitive loading, making it

easy to use in almost any reference application. The

wide dynamic operating range allows its use with

widely varying supplies with excellent regulation.

The extremely low power drain of the LM185-1.2

makes it useful for micropower circuitry. This voltage

reference can be used to make portable meters,

regulators or general purpose analog circuitry with

battery life approaching shelf life.

Further, the wide operating current allows it to

replace older references with a tighter tolerance part.

Connection Diagrams

Figure 1. LCCC Package Figure 2. TO Package – Bottom View

See Package Number NAJ0020A See Package Number NDU0002A

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

5 6

+VREF

V-

LM185-1.2QML

SNVS384A –OCTOBER 2005–REVISED MARCH 2013

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Figure 3. CLGA Package

See Package Number NAC0010A

Schematic Diagram

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

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SNVS384A –OCTOBER 2005–REVISED MARCH 2013

Absolute Maximum Ratings(1)

Reverse Current 30mA

Forward Current 10mA

Operating Temperature Range −55°C ≤TA≤+125°C

Maximum Junction Temperature (TJmax)(2) +150°C

Storage Temperature −55°C ≤TA≤+150°C

Lead Temperature (Soldering 10 CLGA 260°C

Seconds) TO package 300°C

20LD LCCC package 300°C

Thermal Resistance θJA TO (Still Air) 300°C/W

TO (500LF / Min Air Flow) 139°C/W

20LD LCCC (Still Air) 100°C/W

20LD LCCC (500LF / Min Air 73°C/W

Flow)

CLGA (Still Air) 194°C/W

CLGA (500LF / Min Air Flow) 128°C/W

θJC TO 57°C/W

20LD LCCC 25°C/W

CLGA 23°C/W

Package Weight (Typical) TO TBD

20LD LCCC TBD

CLGA 210mg

ESD Tolerance(3) 4KV

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional. For specifications and test conditions, see the Electrical Characteristics. The specifications apply only for

the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test

conditions.

(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),

θJA (package junction to ambient thermal resistance), and TA(ambient temperature). The maximum allowable power dissipation at any

temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.

(3) Human body model, 1.5KΩin series with 100pF.

Quality Conformance Inspection

Table 1. Mil-Std-883, Method 5005 - Group A

Subgroup Description Temp °C

1 Static tests at 25

2 Static tests at 125

3 Static tests at -55

4 Dynamic tests at 25

5 Dynamic tests at 125

6 Dynamic tests at -55

7 Functional tests at 25

8A Functional tests at 125

8B Functional tests at -55

9 Switching tests at 25

10 Switching tests at 125

11 Switching tests at -55

12 Settling time at 25

13 Settling time at 125

14 Settling time at -55

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SNVS384A –OCTOBER 2005–REVISED MARCH 2013

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LM185–1.2 Electrical Characteristics DC Parameters Sub-

Symbol Parameter Conditions Notes Min Max Units groups

VRef Reverse Breakdown Voltage IR= 10µA 1.223 1.247 V 1

IR= 20µA 1.205 1.26 V 2, 3

IR= 1mA 1.223 1.247 V 1

1.205 1.26 V 2, 3

IR= 20mA 1.223 1.247 V 1

1.205 1.26 V 2, 3

ΔVRef /ΔIRReverse Breakdown Voltage 10µA ≤IR≤1mA -1.0 1.0 mV 1

Change with Current 20µA ≤IR≤1mA -1.5 1.5 mV 2, 3

1mA ≤IR≤20mA -10.0 10.0 mV 1

-20.0 20.0 mV 2, 3

VFForward Bias Voltage IF= 2mA -1.0 -0.4 V 1

LM185–1.2 Electrical Characteristics DC Drift Parameters

Delta calculations performed on QMLV devices at group B, subgroup 5, unless otherwise specified on the IPI. Sub-

Symbol Parameter Conditions Notes Min Max Units groups

VRReverse Breakdown Voltage IR= 10µA -0.01 0.01 V 1

IR= 20mA -0.01 0.01 V 1

LM185BY–1.2 Electrical Characteristics DC Parameters Sub-

Symbol Parameter Conditions Notes Min Max Units groups

VRef Reverse Breakdown Voltage IR= 10µA 1.22 1.24 V 1

3 7

IR= 20µA 1.20 1.26 V 2, 3

IR= 1mA 1.22 1.24 V 1

3 7

1.20 1.26 V 2, 3

IR= 20mA 1.22 1.24 V 1

3 7

1.20 1.26 V 2, 3

ΔVRef /ΔIRReverse Breakdown Voltage 10µA ≤IR≤1mA -1.0 1.0 mV 1

Change with Current 20µA ≤IR≤1mA -1.5 1.5 mV 2, 3

1mA ≤IR≤20mA -10.0 10.0 mV 1

-20.0 20.0 mV 2, 3

VFForward Bias Voltage IF= 2mA -1.0 -0.4 V 1

TCTemperature Coefficient See(1) 50 PPM/°C 2, 3

(1) The average temperature coefficient is defined as the maximum deviation of reference voltage, at all measured temperatures between

the operating TMin & TMax, divided by (TMax −TMin). The measured temperatures (TMeasured) are −55°C, 25°C, & 125°C or ΔVRef / (TMax −

TMin)

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SNVS384A –OCTOBER 2005–REVISED MARCH 2013

Typical Performance Characteristics

Reverse Characteristics Reverse Characteristics

Figure 4. Figure 5.

Temperature Drift of 3

Forward Characteristics Representative Units

Figure 6. Figure 7.

Reverse Dynamic Impedance Reverse Dynamic Impedance

Figure 8. Figure 9.

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SNVS384A –OCTOBER 2005–REVISED MARCH 2013

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Typical Performance Characteristics (continued)

Noise Voltage Filtered Output Noise

Figure 10. Figure 11.

Response Time

Figure 12.

Typical Applications

Figure 13. Wide Input Range Reference

Figure 14. Micropower Reference from 9V Battery

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SNVS384A –OCTOBER 2005–REVISED MARCH 2013

Figure 15. Reference from 1.5V Battery

*IQ≃30μA

Figure 16. Micropower* 5V Regulator

*IQ≃20μA standby current

Figure 17. Micropower* 10V Reference

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SNVS384A –OCTOBER 2005–REVISED MARCH 2013

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Figure 18. Precision 1μA to 1mA Current Sources

METER THERMOMETERS

Calibration

1. Short LM385-1.2, adjust R3 for IOUT= temp at 1μA/°K

2. Remove short, adjust R2 for correct reading in centigrade

†IQat 1.3V≃500μA

IQat 1.6V≃2.4mA

Figure 19. 0°C−100°C Thermometer

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SNVS384A –OCTOBER 2005–REVISED MARCH 2013

*2N3638 or 2N2907 select for inverse HFE ≃5

†Select for operation at 1.3V

‡IQ≃600μA to 900μA

Figure 20. Lower Power Thermometer

Calibration

1. Short LM385-1.2, adjust R3 for IOUT= temp at 1.8μA/°K

2. Remove short, adjust R2 for correct reading in °F

Figure 21. 0°F−50°F Thermometer

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SNVS384A –OCTOBER 2005–REVISED MARCH 2013

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Calibration

1. Adjust R1 so that V1 = temp at 1mV/°K

2. Adjust V2 to 273.2mV

†IQfor 1.3V to 1.6V battery volt-

age = 50μA to 150μA

Typical supply current 50μA

Figure 22. Centigrade Thermometer

Adjustment Procedure

1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck

coefficient.

2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2.

Figure 23. Micropower Thermocouple Cold Junction Compensator

Seebeck Voltage Voltage

Thermocouple R1 R2

Coefficient Across R1 Across R2

Type (Ω) (Ω)

(μV/°C) @ 25°C (mV) (mV)

J 52.3 523 1.24k 15.60 14.32

T 42.8 432 1k 12.77 11.78

K 40.8 412 953 12.17 11.17

S 6.4 63.4 150 1.908 1.766

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SNVS384A –OCTOBER 2005–REVISED MARCH 2013

REVISION HISTORY SECTION

Released Revision Section Originator Changes

10/07/05 A New Release, Corporate format L. Lytle 2 MDS data sheets converted into one Corp.

data sheet format. MNLM185-1.2-X Rev 2A3

and MNLM185BY-1.2-X Rev 0B0 data sheets

will be archived.

03/27/13 A All Changed layout of National Data Sheet to TI

format

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PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

5962-8759401VXA ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759401VXA Q

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-1.2-QV Q

5962-87594

01VYA ACO

01VYA >T

5962-8759401XA ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759401XA Q

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-1.2/883 Q

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LM185BYH1.2-SMD ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759405XA Q

LM185H-1.2-QV ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759401VXA Q

LM185H-1.2-SMD ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759401XA Q

LM185H-1.2/883 ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 LM185-1.2 Q

LM185WG-1.2-QV ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG

-1.2-QV Q

5962-87594

01VYA ACO

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LM185WG-1.2/883 ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG

-1.2/883 Q

5962-87594

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01YA >T

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

Addendum-Page 2

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LM185-1.2QML, LM185-1.2QML-SP :

•Military: LM185-1.2QML

•Space: LM185-1.2QML-SP

NOTE: Qualified Version Definitions:

•Military - QML certified for Military and Defense Applications

•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

MECHANICAL DATA

NAC0010A

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WG10A (Rev H)

MECHANICAL DATA

NDU0002A

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H02A (Rev F)

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