Page 2 Internet-of-Things Solutions
EXPERTISE
Internet-of-Things Solutions
Sensors
Wireless
Connectivity
Wired
Image
Touch
Temperature
Level
Moisture
Humidity
Pressure
•
•
•
•
•
•
•
Light
Motor
•
•
BLDC
Stepper
Brushed
■
■
■
Proprietary
Sub-GHz
SIGFOX™
BLE
Thread™
ZigBee®
KNX®
WM-Bus
PoE
PLC
HART®
EnOcean®
ISO 15693 RF/NFC
•
•
•
•
•
•
•
•
•
•
•
•
•
Processor / MCU
Actuation
Power Management
Protection Charging
• Seamlessly connected intelligent devices that sense, analyze and
control the environment
• Connected smart lighting, surveillance/security systems, HVAC
systems, home appliances, energy management systems, vehicles,
traffic control
• Key building blocks include sensors/actuators, ultra low power MCUs/
DSPs, connectivity, power management, security and software, chip
integration and micro-packaging
Page 3ON Semiconductor
EXPERTISE
Broad Packaging Portfolio
AYRE SA3291 - Wireless DSP SiP for Hearing Aids
Custom 3D packaging connects different silicon die and discrete components
together in the same package to dramatically save space and improve electrical
performance by decreasing signal distances.
ON Semiconductor offers advanced packaging and integration capabilities, ranging from chip scale packaging through multichip
modules. This extensive portfolio of packaging technology helps customers solve their unique design challenges related to thermal
performance, power density, and low profile. Shown below is a small sample from the company’s broad and deep package portfolio.
• Stacking with or without wirebonds
• Modular, scalable architectures with high
degree of manufacturing testability
• Mature, robust technologies and structures
• RoHS-compliant and ISO-certified
Die
Top Substrate
Interposer
Capacitors
Solder Pads
Flip Chip Connections
Main Substrate
Solder Connections
Advanced 3D Packaging
IPM
DPAK
6.0 x 6.5 mm
SO8-FL
5.0 x 6.0 x 1.0 mm
SOT-883
1.0 x 0.6 x 0.4 mm
XDFN-4
0.8 x 0.8 x 0.4 mm
PIM
Page 4 Internet-of-Things Solutions
EXPERTISE
IoT Development Kit
Features
• Comprehensive portfolio of sensors, connectivity and actuators
• ARM-Cortex® M3 Processor, ARM Mbed Operating System
• Eclipse based IDE with 40+ IoT use case examples
• Secure Cloud Connectivity (AWS, IBM, Azure, Google Cloud, etc.)
• Mobile Application for Bluetooth Low Energy use cases
• Detailed documentation of system hardware (BoM, schematics
and layout files) and software design
Markets & Applications
Modules
Smart Home Predictive Mainte-
nance
Smart Building Smart Lighting Smart Cities Asset Tracking Personal IoT
Connectivity
BLE (BLE-IoT-GEVB)
Sigfox EU (EU-Sigfox-GEVB)
Sigfox US (US-Sigfox-GEVB)
Power over Ethernet (POE-GEVB)
CAN bus (CAN-GEVB)
•
•
•
•
•
Sensors
Multi-Sensor (ALS, IMU, ENV)
(MULTI-SENSE-GEVB)
Proximity/Motion (PIR-GEVB)
Touch/Level (TS-GEVB)
Battery Free Sensors
(SPS-READER-GEVK)
•
•
•
•
Actuators
Dual LED Ballast (D-LED-B-GEVK)
Stepper Motor Control
(D-STPR-GEVK)
Brushless DC Motor (BLDC-GEVK)
•
•
•
Baseboard (BB–GEVK)
• Arm®-Cortex® M3
Energy Harvesting BLE Switch
BLE-SWITCH-001GEVB
Page 5ON Semiconductor
EXPERTISE
Bluetooth IoT Development Kit
Features
• Features Industry’s Lowest Power Bluetooth 5 radio
62.5 nW Deep Sleep
7 mW Peak Receiving
• Configurable mobile application supporting cloud connectivity
Compatible with AWS, Azure, Bluemix or custom cloud services
• Ready-to-Use Sample Code
• Easily Connect to Other IoT Development Kit Shield Boards
Complete range of options for sensing (proximity, motion, touch),
and control (dual LED, stepper motor, brushless DC)
Modules
Power
DC-DC adapter for connecting
higher power shields
(BDK-DCDC-GEVB)
•
Sensors
Multi-Sensor (ALS, IMU, ENV)
(MULTI-SENSE-GEVB)
Proximity/Motion (PIR-GEVB)
Touch/Level (TS-GEVB)
Battery Free Sensors
(SPS-READER-GEVK)
•
•
•
•
Actuators
Dual LED Ballast (D-LED-B-GEVK)
Stepper Motor Control
(D-STPR-GEVK)
Brushless DC Motor (BLDC-GEVK)
•
•
•
Baseboard (BDK-GEVK)
• Arm®-Cortex® M3
Energy Harvesting BLE Switch
BLE-SWITCH-001GEVB
Markets & Applications
ON
OFF
Environmental
Control
Security Smart Appliances Wearables Smart Lighting
Page 6 Internet-of-Things Solutions
EXPERTISE
Sensor Development Kit
N0A1305
Ambient Light Sensor
Provides response similar
to human eye
BME680
Integrated Environmental Sensor
for Wearables, Mobile Applications
RSL10
Industry’s Lowest Power
Bluetooth® Low Energy
Low-Power Smart Hub
For Motion Sensing and Data Processing
• 3 axis accelerator
• 3 axis gyroscope
• Programmable microcontroller
BMM150
Digital geomagnetic sensor
Ideal for augmented reality and
location-based services
Programmable RGB LED
3 Programmable Push-Buttons
Ultra-low Noise Digital Microphone
64kb EEPROM Memory
The RSL10 Sensor Development Kit combines cutting-edge sensor technology, Bluetooth 5 data rates, and optimized power consumption
to provide a ready-to-use prototyping platform for developing IoT applications with lasting battery life. Built around the RSL10 SIP, the
development kit is pre-loaded with a custom service protocol that requires no additional programming.
Products Description
RSL10-SENSE-GEVK RSL10 Sensor Development Kit
RSL10-SENSE-DB-GEVK RSL10 Sensor Development Kit with Debugger
Page 7ON Semiconductor
EXPERTISE
RSL10 Solar Cell Multi-Sensor Platform
The RSL10 Sensor Development Kit combines cutting-edge sensor technology, Bluetooth 5 data rates, and optimized power consumption
to provide a ready-to-use prototyping platform for developing IoT applications with lasting battery life. Built around the RSL10 SIP, the
development kit is pre-loaded with a custom service protocol that requires no additional programming.
Products Description
RSL10-SOLARSENS-GEVK RSL10 Solar Cell Multi-Sensor Platform
Page 8 Internet-of-Things Solutions
CONNECTIVITY
Product Features
• ON Semiconductor is a leading Sigfox device supplier
• Sigfox verified solution for all global Sigfox regions
• Reference designs are Sigfox verified and the design files are available
for hassle-free copy and paste replication
• Sigfox solution provided as a modem controlled by AT commands or as a
system on chip (SoC) controlled by software API
• Multi-protocol support
• New System-in-Package module for ultra-miniature applications; AT
version is fully CE certified out of the box
• Rich partner network of pre-certified modules
Comprehensive Sigfox™ Solutions
Device AT API Sigfox Region
Frequency
(MHz) GPIO Package
AX-SIP-SFEU-x-yy RC1 868 10 SIP-38
AX-SIP-SFEU-API-x-yy RC1 868 10 SIP-38
AX-SFEU-x-yy RC1 868 10 QFN-40
AX-SFEU-API-x-yy RC1 868 10 QFN-40
AX-SFUS-x-yy RC2 / RC4 (LATAM) 902 / 920 10 QFN-40
AX-SFUS-API-x-yy RC2 / RC4 (LATAM) 902 / 920 10 QFN-40
AX-SFJK-x-yy RC3 923 10 QFN-40
AX-SFJK-API-x-yy RC3 923 10 QFN-40
AX-SFAZ-x-yy RC4 920 10 QFN-40
AX-SFAZ-API-x-yy RC4 920 10 QFN-40
Page 9ON Semiconductor
CONNECTIVITY
Ultra Low Power Radio Solutions
RF Transceivers
Device
Protocol
Supported
Frequency
(MHz)
Data Rate
(kbps)
Voltage Supply
(V)
Power
Consumption
TX Power
(dBm)
RX Sensitivity
(dBm) Package
AX5043
EnOcean®, ZigBee,
KNX®, M-Bus,
802.15.4(g),
Proprietary
27 – 1050 0.1 – 125 1.8 – 3.6 RX 6.5 - 9.5 mA
TX 7.5 mA @ 0 dBm 16 -137 @ 0.1 kbps QFN-28
AX5243 27 – 1050 0.1 – 125 1.8 – 3.6 RX 6.5 - 9.5 mA
TX 7.5 mA @ 0 dBm 16 -137 @ 0.1 kbps QFN-20
AX5051 400 - 470
800 - 940 1 - 600 2.2 – 3.6 RX 16 - 21 mA
TX 13 mA @ 0 dBm 16 -116 QFN-28
AX5031 400 - 470
800 - 940 1 – 2000 2.2 – 3.6 RX 16 - 21 mA
TX 13 mA @ 0 dBm 16 —QFN-20
RF SoCs
Device
Protocol
Supported
Frequency
(MHz)
Data Rate
(kbps)
Peripheral
Interface
Flash
(kB)
RAM
(kB) GPIO Package
AX8052F131
EnOcean, ZigBee, KNX, M-Bus,
802.15.4(g), Proprietary
400 - 700
800 - 940 1 – 2000 Configurable 64 821 QFN-40
AX8052F143 27 - 1050 0.1 - 125 Configurable 64 819 QFN-40
AX8052F151 400 - 700
800 - 940 1 – 600 Configurable 64 821 QFN-40
AXM0F243 27 - 1050 0.1 – 125 Configurable 64 820 QFN-40
NCS36510 ZigBee, Thread,802.15.4,
Proprietary 2400 - 2483 250 Configurable 320 x 2
(FOTA) 48 18 QFN-40
Sub-GHz Radio Features
• Highly flexible software defined sub-GHz radios for proprietary or
standards based networking from 27 MHz to 1.05 GHz
• RadioLab – full featured radio configurator and code
generator GUI
• CodeBlocks – full featured software development environment and
toolchain with seamless integration of RadioLab and software stacks
• Available as either stand-alone transceivers or combined with MCU
(8052 or ARM Cortex M0+) in a SoC
• Multi-protocol support
2.4 GHz Radio Features
• Highly optimized for ultra low power consumption
• Hardware defined IEEE 802.15.4 Radio SoC
• Arm® Cortex®-M3 with 640 kB FLASH and 48 kB RAM
• Advanced power management and security hardware acceleration
• Industry leading receive current of 3.6 mA
• Supports ZigBee®, Thread™, and proprietary (any 802.15.4 software stack)
Page 10 Internet-of-Things Solutions
CONNECTIVITY
RSL10 Bluetooth® Low Energy Technology Radio SoCs
With so many options for wireless available, what sets the RSL10 radio SoC family apart? Simple. It offers the industry’s lowest power
Bluetooth low energy technology.
Supporting 2 Mbps data rates provided by Bluetooth 5 (twice the speed as with previous Bluetooth generations), RSL10 enables
advanced wireless functionality without compromising battery life. RSL10 can be easily integrated into any device.
Software Development Kit (SDK)
• Eclipse-based software with a C Development Toolkit (CDT)
• GNU toolchain for programming the Arm Cortex-M3 processor
• Bluetooth low energy protocols, precompiled sample code and
libraries, technical documentation
Features
• Industry’s lowest power (62 nW in Deep Sleep, 7 mW in Receive Mode)
• Supports Bluetooth low energy and 2.4 GHz proprietary protocols
• Flexible Voltage Supply Range (1.1 - 3.3 V)
• IP protection feature
• Available packages WLCSP-51, QFN-48, System-in-Package
Development Tools
Wakeup
(1x Direct, 2x Mapped to DIO)
GP Timers
(4x, 24-bit)
SYSTICK Timer
GPIO (16x)
SPI Interface (2x)
(Master/Slave)
A/D Converter
(4 Ext. Channels)
Sample Rate Converter
UART
PWM (2x)
DMA
AES128 Encryption
Engine
Bluetooth® Low Energy Radio
(Bluetooth 5)
32-Bit Dual-MAC DSP Core
(LPDSP32)
Arm® Cortex®-M3 Processor
Power Management Unit
DC-DC, LDO
Data Memory
88 kB RAM
Program Memory
384 kB Flash
32 kB RAM
4 kB ROM
2-Wire JTAG
Oscillators
32 kHz Xtal
48 MHz Xtal
RC Oscillator
Ext Clock I/O
DIO
Interface
Switch
MUX
Antenna
Interface
(No Ext. Balun)
Built-In Power
Management
Faster Data Rates
(2 Mbps)
Intensive
Signal
Processing
Support
Support for
2.4 GHz
Proprietary
Protocols
Enhanced
Data
Security
384 kB Flash
Memory
RSL10 Development Board
• Compliance with Arduino form factor
• Integrated PCB antenna
• On-board J-link adapter for easy debugging
RSL10 USB Dongle
• Provided with Bluetooth Low Energy Explorer
software to help verify or diagnose wireless
connections during development
Page 11ON Semiconductor
CONNECTIVITY
PLC Modems/Power Line Driver
Device Function Features Package(s)
Smart Grid
Modem
NCN49599 PLC S-FSK Modem;
A - D Band
• Arm Cortex M0
• Baud rate: 4800 Bauds
• S-FSK modulation
• Hardware embedded MAC + PHY
• Embedded 1.2 A, 2-stage power amplifier with
current limitation and thermal protection
QFN-56
NCN49597 PLC S-FSK Modem;
A - D Band
• Arm Cortex M0
• Baud rate: 4800 Bauds
• S-FSK modulation
• Hardware embedded MAC + PHY QFN-52
Power
Amplifier NCS5651 Power Line Driver;
Class AB
• Low distortion power line driver with
optimized interface for PLC modems
• Capability to drive 2.0 A peak into
reactive loads
• Current shutdown minimizes power
consumption during power down state
• Rail-to-Rail Drop of Only ±1 V with
Iout = 1.5 A
QFN-20 EP
OFDM
MCU(s) with Third Party SW StackNCS5651
NCS5651
Coupling PHY MAC
NCN49597
NCN49599
Communication Application
MCU
S-FSK
AC
Page 12 Internet-of-Things Solutions
CONNECTIVITY
KNX Transceivers
KNX is a standardized (EN 50090, ISO/IEC 14543), OSI-based network communications protocol for intelligent buildings. KNX is the
successor to, and convergence of, three previous standards: the European Home Systems Protocol (EHS), BatiBUS, and the European
Installation Bus (EIB or Instabus).
Applications
• Connects appliances and sensors, especially for climate
and light control – wired or wireless – to the 9600 Baud
KNX twisted pair (TP) bus inside a building
KNX Open Standards
• EN 50090: European Standard
• ISO/IEC 14543-3: International Standard
• GB/Z 20965: Chinese Standard
• ANSI/ASHRAE 135: US Standard
Twisted Pair NCN5121 NCN5110 NCN5130
Efficiency Increase
10/20 mA Bus Current Consumption
5 to 40 mA Bus Current Consumption
KNX Bus Current Limitation
PHY + MAC Layer (TPUART Compatible)
PHY Layer (Analog Only)
3.3 V Fixed DC/DC
Adjustable DC/DC
20 V LDO
Analog Monitor Output
RF AX8052F143
Multi/Ready
High Sensitivity
Ultra Low Receive and Standby Current
PHY + MAC
RFTP
Power
Data
Application
TP bus provides data communication
and power supply
Seamless KNX radio connectivity
between application and target
Page 13ON Semiconductor
CONNECTIVITY
M-Bus Transceivers
Device
Frequency
(MHz)
Data Rate
(kbps)
Voltage Supply
(V) Power Consumption
TX Power
(dBm)
RX Sensitivity
(dBm) Package
AX5043 27 – 1050 0.1 – 125 1.8 – 3.6 RX 6.5 - 9.5 mA; TX 7.5 mA @ 0 dBm 0 to 16 -133 @ 0.2 kbps; -126 @ 1 kbps; -106 @ 100 kbps QFN-28
AX5243 27 – 1050 0.1 – 125 1.8 – 3.6 RX 6.5 - 9.5 mA; TX 7.5 mA @ 0 dBm 0 to 16 -135 @ 0.1 kbps; -126 @ 1 kbps; -107 @ 100 kbps QFN-20
General Application Diagram
M-BUS Transceivers
Wired M-Bus Features
• Satisfies physical requirements for M-BUS, described in EN 13757-2 and EN 1434-3
• UART communication speeds up to 38400 baud
• Integrated 3.3 V VDD LDO regulator (extended peak current of 15 mA)
• Supports powering slave device from the bus or from external power supply
• SOIC-16 and QFN-20 packages
AX8052F143 Wireless M-Bus System on Chip
• Ultra-low-power AX8052 MCU
• CPU active mode 150 µA/MHz
• Low-power sleep modes with RAM retention
• High performance narrow-band RF transceiver
• Wide frequency range
• Large amount of memory
Wireless M-Bus Transceivers
• Ultra-low-power
• 50 nA deep sleep current
• 500 nA power-down current
• High sensitivity & selectivity
• -126 dBm @ 1 kbps, 868 MHz, FSK
• Constant Tx output power over VDD = 1.8 – 3.6 V
RIS
RIS
PFb
SC
CSC
CVDD
RIDD
TVS1MBUS
RBUS1
RBUS2
RIDD STCGND
CSTC
RXI
RX
TX
TXI
VDD
μC
VIO
VS
BUSL2
VB
BUSL1
NCN5150
M-Bus System on Chip
Device
Protocol
Supported
Frequency
(MHz)
Data Rate
(kbps)
Peripheral
Interface
Flash
(kB)
RAM
(kB) GPIO Package
AX8052F143 EnOcean, KNX, M-Bus, Proprietary 27-1050 0.1 - 125 AT command via UART 64 819 QFN-40
Page 14 Internet-of-Things Solutions
CONNECTIVITY
Modems
AMIS-49200 & AMIS-49250 Fieldbus Physical Layer Medium Access Units
• Compatible to both FOUNDATION Fieldbus H1 (Type 111 and Type 112
per FF-816) and PROFIBUS PA standards
• Enables Fieldbus to completely power field devices using the
integrated power supply block
• Data rate: 31.25 kbps voltage mode
• Low current consumption 500 μA typ
• LQFP-44 and NQFP-44 packages
Process
Sensor
Microprocessor
with RAM and ROM
Link
Controller
Fieldbus
MAU
Fieldbus
Segment
Industrial HART Protocol Modems
• Single-chip, half-duplex 1200 bps FSK modem
• Bell 202 shift frequencies of 1200 Hz and 2200 Hz
• Transmit-signal wave shaping
• Receive band-pass filter
HART Modems
Device
Input
Frequency DAC
Temp Range
(°C) Package
NCN5193
460.8 kHz,
920 kHz,or
1.8 MHz
Integrated 16-bit
Sigma-Delta –40 to +85 QFN-32
NCN5192
460.8 kHz,
920 kHz,or
1.8 MHz
Integrated 16-bit
Sigma-Delta –40 to +85 QFN-32
A5191HRT 460.8 kHz External –40 to +85
QFN-32,
LQFP-32,
PLCC-28
NCN5193
XOUT
XIN
3.6864 MHz
CBIAS VSS MODE
μC
VDDA
HART &
4 – 20 mA OUT
HART IN
1.8 V − 3.5 V
TxA
CDREF
AREF
RxAN
RxAFRxAFIVDDAVDD
RxD
CD
TxD
RTS
RESET
VPOR
CS
DATA
SCLK
KICK
DAC
VDDA
JUMP
DACREF
CLK2
CLK1
VDDA
TEST1
TEST2
RxAP
Page 15ON Semiconductor
CONNECTIVITY
CAN Transceivers for Long Networks, >500 m
Features
• ISO 11898-2 compliant
• Up to 1 Mb/s communication speed
• Delivers low transmit data rate in networks
exceeding 1 km
• Functional in 12 V and 24 V systems
Text
Rx0
Tx0
Rint
CANH2
CANL1
GND
Vref
VCC
CANL2
CANH1
CAN
BUS 2
CAN
BUS 1
100 nF
VBAT
5 V−reg
RLT
60
RLT
60
CD
EN1
EN2
AMIS–42770
7
9
2
3
10
4
18
13
12
19
14
8
56 15 16 17
CAN Transceivers
Device Type Description Package
AMIS42770 Dual High-Speed CAN Repeater SOIC-20
AMIS42670 Single High-Speed CAN Transceiver for Long Networks SOIC-8
Page 16 Internet-of-Things Solutions
CONNECTIVITY
Power-Over-Ethernet (PoE) Controllers
Device Description Topology
Control
Mode
VCC Min
(V)
VCC Max
(V)
Pd Typ
(W)
Ron Typ
(Ω)Package
NCP1080 PoE PD Controller and DC-DC Converter Flyback Current 057 15 0.6 TSSOP-20
NCP1081 PoE PD Controller and DC-DC Converter Flyback Current 057 40 0.6 TSSOP-20
NCP1082 PoE PD Controller and DC-DC Converter, with Auxiliary Supply Support Flyback Current 057 15 0.6 TSSOP-20
NCP1083 PoE PD Controller and DC-DC Converter, with Auxiliary Supply Support Flyback Current 057 40 0.6 TSSOP-20
NCP1090 PoE PD Interface Controller — — 0 57 15 0.5 SOIC-8, TSSOP-8
NCP1091 PoE PD Interface Controller with Programmable UVLO — — 0 57 15 0.5 SOIC-8, TSSOP-8
NCP1092 PoE PD Interface Controller with Vaux Support — — 0 57 15 0.5 SOIC-8, TSSOP-8
NCP1093 PoE PD Interface Controller — — 0 57 25 0.5 DFN-10
NCP1094 PoE PD Interface Controller with Vaux Support — — 0 57 25 0.5 DFN-10
NCP1095 802.3bt PoE PD Interface Controller with External Hot Swap Transistor — — 0 57 100 — TSSOP-16
NCP1096 802.3bt PoE PD Interface Controller with Internal Hot Swap Transistor — — 0 57 100 0.07 TSSOP-16 EP
Features – NCP1095, NCP1096
• Fully compliant with new IEEE 802.3bt for high power
up to 90 W PoE
• Supports Autoclass
• Integrated low RDS(ON) pass-switch (NCP1096)
• Support for Short MPS
• Pass Switch disabling input for rear auxiliary supply
operation
• 135 mA typical inrush current limiting
• Full backward compatibility with IEEE 802.3af/at
Complete building blocks for a highly efficient PoE
Powered Device
• PoE-PD Interface controller – NCP1095, NCP1096
• Active MOSFET bridge – Greenbridge™2 FDMQ8205A
• Downstream DC-DC controller – NCP1566 Active Clamp
Forward Converter
• Supplementary discrete components
ON Semiconductor offers a complete portfolio of interface controllers for emerging PoE applications. The front-end PD device is
compliant with IEEE802.3af, IEEE802.3at, and the new IEEE802.3bt standards, and power is provided using two-pair and four-pair
configurations to meet all requirements. The portfolio includes ASSPs PD chips with (NCP108x) and without (NCP109x) integrated
PWM controllers, which can convert PoE input power to one or more output voltages in a Powered Device.
GDC
G2
IN2
OUTP
OUTN
IN1
G1
G3
G4
Vpd,A
GDC
G2
IN2
OUTP
OUTN
IN1
G1
G3
G4
Vpd,B Vport
FDMQ8205A
FDMQ8205A
DA+
RJ45
DATA +
BS Termination
DA–
DB+
DC+
DC–
DB–
DD+
DD–
1
2
3
4
5
6
7
8
14
To DC/DC
Controller
To μC
15
16
13
11
128
41
7
5
2
3
6
PGO
NCM
NCL
LCF
GBR
VPP AUX
VPN RTN
DET
COSC
CLA
CLB
ACS
NCP1096
for Wireless Access Points, Small Cells, Surveillance Cameras, PoS Terminals, Digital Signage
Page 17ON Semiconductor
SENSING
Motion Detector Passive Infrared Controller (PIR) — NCS36000
• Passive infrared controller circuit for the lighting and occupancy sensing market
• Amplifies and conditions signal from PIR sensor
NCS36000
Digital
Control
Circuit
2
Window
Comparator
OUT
VSS VDD
LED
Amplifier
Circuit
System
Oscillator
LDO &
Voltage
References
xLED_EN
MODEOP1_P
OP1_N
OP1_O
VREF
OP2_N
OSC
OP2_O
2
Old Solution NCS36000 Solution
Features
• 3.0 – 5.75 V operation
• Integrated low noise 2-stage amplifiers
• Internal voltage reference to drive sensor
• Internal oscillator with external RC
• Single or dual pulse detection
• Digital filter to minimize false alarms
• Direct drive of LED and relay
Benefits
• Lower BOM cost than comparable discrete solutions
• Extremely flexible solution
• Customer can customize digital filtering
• Customer can customize analog processing
• Designed for wide range of occupancy sensors
Page 18 Internet-of-Things Solutions
SENSING
Mainstream CMOS Image Sensors
Device
Sensor/
SOC
Resolution
(MP)
Optical
Format Frame Rate
Pixel Size
(
μ
m) Shutter Type1 CFA
Operating
Temp
(°C)
MT9V115 SOC VGA 1/13" 30 fps 1.8 ERS Color -30 to +70
ASX340CS SOC VGA 1/4" 60fps 5.6 ERS Color -30 to +70
ASX370CS SOC VGA 1/7" 30fps 3.0 ERS Color -30 to +70
MT9V024 Sensor WVGA 1/3" 60fps 6.0 GS Color, Mono -40 to +105
MT9V034 Sensor WVGA 1/3" 60fps 6.0 GS Color, Mono -30 to +70
AR0141CS Sensor 1.2 1/4" 1.2 45fps, 720P 60fps 3.0 ERS Color -30 to +85
AR0144CS Sensor 11/4" 60fps 3.0 GS Color, Mono -40 to +85
AR0130CS Sensor 1.2 1/3" 1.2 45fps, 720P 60fps 3.8 ERS Color, Mono -30 to +70
AR0134CS Sensor 1.2 1/3" 1.2 54fps, 720 60 fps 3.8 GS Color, Mono -30 to +70
AR0135CS Sensor 1.2 1/3" 1.2 60fps, 720 60 fps 3.8 GS Color, Mono -30 to +70
MT9M114 SOC 1.3 1/6" 1.3 30fps, VGA 75 fps 1.9 ERS Color -30 to +70
AR0237CS Sensor 2.1 1/2.7" 1080P 60 fps 3ERS Color -30 to +85
AR0237IR Sensor 2.1 1/2.7" 1080P 60 fps 3ERS RGB-IR -30 to +85
AR0238 Sensor 2.1 1/2.7" 1080P 60 fps 3ERS Color -30 to +85
AR0239 Sensor 2.1 1/2.7" 1080P 90 fps 3ERS Color -30 to +85
AR0261 Sensor 2.1 1/6" 1080p 60 fps 1.4 ERS Color -30 to +70
AS0260 SOC 2.1 1/6" 30 fps 1.4 ERS Color -30 to +70
AR0221 Sensor 2.1 1/1.8" 60 fps 4.2 ERS Color -30 to +85
AR0330 Sensor 3.5 1/3" 1080P 60 fps 2.2 ERS, GRR Color -30 to +70
AR0430 Sensor 41/3" 120fps 2ERS Color -30 to +85
AR0431 Sensor 41/3" 120fps 2ERS Color -30 to +85
AR0521 Sensor 51/2.5" 60fps 2.2 ERS Color, Mono -30 to +85
AR0522 Sensor 51/2.5" 60fps 2.2 ERS Color, Mono -30 to +85
AR01011HS Sensor 10 1" 60fps 3.4 ERS Color -30 to +70
AR1335 Sensor 13 1/3.2" 13 30 fps, 1080P 60 fps 1.1 ERS, GRR Color -30 to +70
AR1337 Sensor 13 1/3.2" 13 30 fps, 1080P 60 fps 1.1 ERS, GRR Color -30 to +70
AR1820HS Sensor 18 1/2.3" 18 24 fps, 1080P 120 fps 1.25 ERS, GRR Color -30 to +70
1. ERS = Electronic Rolling Shutter, GRR = Global Reset Release, GS = Global Shutter. NOTE: Some products available with extended temperature ranges.
Device
Resoution
(MP)
Frame Rate
(fps) Video Output Format Package
AP0100CS 145 1.2 MP/45 fps; 720p/60 fps NTSC/PAL; YUV VFBGA-100
AP0101CS 145 1.2 MP/45 fps; 720p/60 fps SMPTE 296M; YUV VFBGA-81
AP1302 13 30 13 MP/30 fps; 1080p/120 fps JPEG; RAW; RGB565; RGB888; YUV VFBGA-120
Co-Processors for Mainstream CMOS Image Sensors
From security and IP cameras around your home, business and factory; to smart lighting with
intelligent sensors; to connected doorbells, appliances, robots, and 2D scanners; the need for image
sensing is only growing. Mainstream image sensors from ON Semiconductor provide a wide range of
performance, size, power, and resolution options which meet the needs of the growing IoT ecosystem
and use models. Using advanced CMOS manufacturing processes allow for great imaging, whether
it is a vibrant color image for human viewing or a detailed monochromatic image used in machine
vision and light industrial use. The ON Semiconductor mainstream image sensor portfolio has the
performance and resolution needed for emerging and established applications.
Page 19ON Semiconductor
SENSING
PYTHON CMOS Image Sensors
With resolutions from VGA to 25 megapixels, the PYTHON family of image sensors addresses the needs of general purpose industrial
imaging applications such as machine vision inspection and motion monitoring, security, surveillance, and intelligent transportation
systems (ITS). Combining flexibility in configuration and resolution with high speed and high sensitivity, these devices capture fast
moving scenes without distortion by combining low read noise and high sensitivity with frame rates up to 815 fps.
1. CFA Options – Bayer Color (C), Monochrome (M), Enhanced NIR (NIR).
Device
Resolution
(MPix)
Pixel Count
(H x V)
Pixel
(μm)
Diagonal
(mm) Lens CFA1FPS Max
Evaluation
Kit
PYTHON 300 0.3 640 x 480 4.8 3.8 1/4” C/M/NIR 815
PYTHON 480 0.5 800 x 600 4.8 4.8 1/3.6” C/M 120
PYTHON 500 0.5 800 x 600 4.8 4.8 1/3.6” C/M/NIR 545
PYTHON 1300 1.3 1280 x 1024 4.8 7.9 1/2” C/M/NIR 210
PYTHON 2000 2.3 1920 x 1200 4.8 10.9 2/3” C/M/NIR 225
PYTHON 5000 5.3 2592 x 2048 4.8 15.9 1” C/M/NIR 100
PYTHON 12K 12.5 4096 x 3072 4.5 23.0 4/3 C/M/NIR 160
PYTHON 16K 16.8 4096 x 4096 4.5 26.1 APS-H C/M/NIR 120
PYTHON 25K 26.2 5120 x 5120 4.5 32.6 APS-H C/M/NIR 80
Features
• CDS global shutter technology with low noise performance
• True HW scalable family concept
• High configurability and fast adaptability
• Quadratic speed increase with ROI windowing
• Multiple regions of interest
• High dynamic range
• Color, Monochrome, and Enhanced
NIR configurations
• Standard and protective tape configurations
• Low power, cost-effective configurations
X-Class CMOS Image Sensors
The X-Class image sensor platform supports multiple CMOS pixel architectures within the same image sensor frame, allowing a single
camera design to support not only multiple product resolutions but also different pixel functionality. The initial devices in this platform
are based on an advanced 3.2 µm global shutter CMOS pixel that features superior imaging performance, high image uniformity, and
low noise – providing high-performance imaging in a small camera footprint.
1. CFA Options – Bayer Color (C), Monochrome (M).
Device
Resolution
(MPix)
Pixel Count
(H x V)
Pixel
(μm)
Diagonal
(mm) Lens CFA1FPS Max
Evaluation
Kit
XGS 8000 8.8 4096 x 2160 3.2 14.8 1/1.1” C/M 130
XGS 12000 12.6 4096 x 2160 3.2 16.4 1” C/M 87
X-Class Features
• One camera design for multiple resolutions and pixel functionality
• High bandwidth, low power HiSPi digital interface
• Speed grades available to match performance to application
XGS Pixel Features
• Advanced 3.2 µm Global Shutter
• High performance, low noise design
Page 20 Internet-of-Things Solutions
SENSING
Versatile CMOS Image Sensors
VITA image sensors combine flexibility in configuration and resolution with high speed and high sensitivity, addressing a wide range of
customer requirements in a cost-effective family of rolling/global shutter CMOS image sensors. A flexible read-out architecture makes
them well suited for machine vision, intelligent transportation systems and surveillance, and other applications that demand high
functionality, while delivering excellent image quality.
Features
• 1.3 to 25 Megapixels
• Pipelined and triggered global shutter
with dual readout
• Rolling shutter with CDS
• Quadratic speed increase with ROI
windowing
• Multiple regions of interest
1. CFA Options – Bayer Color (C), Monochrome (M).
Device
Resolution
(MPix)
Pixel Count
(H x V)
Pixel
(μm)
Diagonal
(mm) Lens CFA1FPS Max
Evaluation
Kit
VITA 1300 1.3 1280 x 1024 4.8 7.9 1/2” C/M 150
VITA 2000 2.3 1920 x 1200 4.8 10.9 2/3” C/M 90
VITA 5000 5.3 2592 x 2048 4.8 15.9 1” C/M 75
VITA 12K 12.6 4096 x 3072 4.5 23.0 4/3” C/M 160
VITA 16K 16.8 4096 x 4096 4.5 26.1 APS-H C/M 125
VITA 25K 26.2 5120 x 5120 4.5 32.6 APS-H C/M 80
KAC image sensors provide both global shutter and low noise rolling shutter modes, combined with programmable bit depth (8 to 14
bit) with a flexible readout architecture that supports interspersed video streams. These features enable the use of multiple regions of
interest that can simultaneously monitor both wide areas and local regions, making these devices ideal for machine vision, surveillance,
ITS, and analytical microscopy.
1. CFA Options – Bayer Color (C), Monochrome (M).
Device
Resolution
(MPix)
Pixel Count
(H x V)
Pixel
(μm)
Diagonal
(mm) Lens CFA1FPS Max
Evaluation
Kit
KAC-06040 62832 x 2128 4.7 16.7 1” C/M 160
KAC-12040 12 4000 x 3000 4.7 23.5 4/3” C/M 70
Features
• Global shutter, low noise rolling shutter
• Programmable bit depth
• Interspersed video streams
• Multiple regions of interest
• High frame rates
• High NIR sensitivity
VITA 5000
VITA 25K
KAC-12040
KAC-06040
Page 21ON Semiconductor
SENSING
High Speed CMOS Image Sensors
LUPA devices offer resolution as high as 2048 x 2048 and frame rates up to 500 fps. These features, combined with a power consumption
as low as 150 mW with absolutely no blooming or lag, create a perfect foundation for highly reliable, high sensitivity image sensors.
Features
• Frame rates up to 500 fps at several
megapixel resolutions
• Unprecedented sensitivity
• Pipelined global shutter
• Low power dissipation
• High resolution
• No blooming or image lag
• Mono and color variants
1. CFA Options – Bayer Color (C), Monochrome (M).
Device
Resolution
(MPix)
Pixel Count
(H x V)
Pixel
(μm)
Diagonal
(mm) Lens CFA1FPS Max
Evaluation
Kit
LUPA 300 0.3 640 x 480 9.9 7.9 1/2” C/M 250
LUPA 1300-2 1.3 1280 x 1024 14 22.9 1” C/M 500
LUPA 3000 3 1696 x 1710 8 19.3 1” C/M 485
LUPA 3000
Page 22 Internet-of-Things Solutions
SENSING
Full Frame CCD Image Sensors
From the intricacies of microscopy to the far reaches of astrophotography, Full Frame CCD image sensors deliver high performance
results. With high quantum efficiency across the entire visible spectrum, these sensors are ideal for demanding imaging applications
that can accommodate a mechanical shutter or strobe illumination, such as electronic still photography, medical X-ray, and inspection.
Features
• High resolution
• Support for large sensor formats
• Simple, two-phase clocking
• Very low dark current for long exposures
• Vertical and horizontal binning
Full Frame CCD Image Sensors
1. CFA Options – Bayer Color (C), Monochrome (M).
Device
Resolution
(MPix) Pixel Count
Pixel
(μm)
Diagonal
(mm) Lens CFA1FPS Max
Evaluation
Kit
KAF-0261 VGA 512 x 512 20.0 14.5 1” M15.0
KAF-0402 WVGA 768 x 512 9.0 8.3 1/2" M20.0
KAF-1001 1.0 1024 x 1024 24.0 34.8 APS-H M3.0
KAF-1603 1.6 1536 x 1024 9.0 16.6 1” M2.2
KAF-3200 3.3 2184 x 1510 6.8 18.0 4/3” M2.5
KAF-4320 4.3 2084 x 2084 24.0 70.7 645 M2.0
KAF-6303 6.3 3088 x 2056 9.0 33.4 APS-H M0.6
KAF-8300 8.3 3326 x 2504 5.4 22.5 4/3” M2.9
KAF-09000 9.3 3056 x 3056 12.0 51.9 645 1.3x M0.4
KAF-09001 9.1 3024 x 3024 12.0 51.3 645 1.3x M5.0
KAF-16200 16.2 4500 x 3600 6.0 34.6 APS-H C/M 1.5
KAF-16801 16.8 4096 x 4096 9.0 52.1 645 1.3x M0.4
KAF-16803 16.8 4096 x 4096 9.0 52.1 645 1.3x M0.2
KAF-40000 40.0 7304 x 5478 6.0 54.8 645 1.3x C1.3
KAF-50100 50.1 8176 x 6132 6.0 61.3 645 1.1x M1.0
Page 23ON Semiconductor
SENSING
Interline Transfer CCD Image Sensors
With an integrated electronic shutter, Interline Transfer CCD image sensors provide real time imaging in applications where a mechanical
shutter or strobe illumination is either not required or desired. With progressive scan readouts, they are particularly well suited for
machine vision, microscopy, fluoroscopy, and other applications that demand the highest imaging performance. Most 5.5 μm and
7.4 μm devices share common pin-out and electrical connections, allowing a single camera design to support a full family of products.
Features
• Progressive scan with electronic
shutter and anti-blooming support
• High resolution
• High sensitivity
• Low image lag and smear
5.5 μm Interline Transfer CCD Image Sensors
1. CFA Options – Bayer Color (C), Monochrome (M), and Sparse CFA (S). 2. Pin and Electrically Compatible.
Device
Resolution
(MPix) Pixel Count
Pixel
(μm)
Diagonal
(mm) Lens CFA1FPS Max
Evaluation
Kit
KAI-0330 VGA 648 x 484 9 7.3 1/2” C/M 120
KAI-0340 VGA 640 x 480 7.4 5.9 1/3” C/M 210
KAI-0373 WVGA 768 x 484 11.6 x 13.6 11.1 2/3” M30
KAI-0115020.9 1280 x 720 5.5 8.1 1/2” C/M/S 138
KAI-1003 11024 x 1024 12.8 18.5 4/3” M30
KAI-1010 11008 x 1018 912.9 1” M30
KAI-1020 11000 x 1000 7.4 10.5 2/3” C/M 50
KAI-01050211024 x 1024 5.5 81/2” C/M 120
KAI-2020 1.9 1600 x 1200 7.4 14.8 1” C/M 30
KAI-0205021.9 1600 x 1200 5.5 11.1 2/3” C/M 68
K AI- 0217022.1 1920 x 1080 7.4 16.3 1” C/M/S 60
KAI-0215022.1 1920 x 1080 5.5 12.1 2/3” C/M/S 64
KAI-0407024.2 2048 x 2048 7.4 21.4 4/3” C/M/S 28
KAI-0405024.1 2336 x 1752 5.5 16.1 1” C/M/S 32
KAI-0805128.1 3296 x 2472 5.5 22.7 4/3” C/M/S 16
KAI-0805228.1 3296 x 2472 5.5 22.7 4/3” C/M/S 16
KAI-08670 8.6 3600 x 2400 7.4 32.0 APS-H C/M/S 12
KAI-11002 10.7 4008 x 2672 9 43.4 35 mm C/M 5
KAI-16000 15.8 4872 x 3248 7.4 43.3 35 mm C/M 3
KAI-16050216 4896 x 3264 5.5 32.4 APS-H C/M/S 8
KAI-16070215.7 4864 x 3232 7.4 43.2 35 mm C/M/S 8
KAI-29050228.8 6576 x 4384 5.5 43.5 35 mm C/M/S 4
KAI-29052228.8 6576 x 4384 5.5 43.5 35 mm C/M/S 4
KAI-43140 43.1 8040 x 5360 4.5 43.5 35 mm C/M/S 4
KAI-47051 46.8 8856 x 5280 5.5 56.7 645 1.1x C/M/S 7
Page 24 Internet-of-Things Solutions
SENSING
Linear CCD Image Sensors
Interline Transfer EMCCD Image Sensors
Linear CCD image sensors combine high resolution with high dynamic range, making them ideal for use in applications such as flatbed
scanners, high-speed document scanners and copiers, machine vision cameras, and satellite imaging.
Features
• High dynamic range
• Pinned photodiodes for low lag and low dark current
• Channel independent electronic exposure control
• Single output per color, including multi-readout register architectures
• High data rates Linear CCD Image Sensors
1. CFA Options – Bayer Color (C), Monochrome (M).
Device Pixel Count
Pixel
(μm)
Diagonal
(mm) CFA1Evaluation Kit
KLI-2113 2098 x 3 14 29.4 C/M
KLI-4104 8160 x 1, 4080 x 3 5.0, 10.0 40.8 Luma+C/M
KLI-8023 8002 x 3 9 72 C/M
Combining the high sensitivity of an electron-multiplied output register with the pixel uniformity and resolution scalability available from
Interline Transfer CCDs, KAE devices enable the capture of scenes with widely varying lighting conditions – from sunlight to starlight – in
a single image and from a single camera. This flexibility makes them ideal for light starved applications such as surveillance, scientific
imaging, medical imaging, and intelligent transportation systems.
Features
• High dynamic range with sub-electron read
• High sensitivity, low noise architecture
• Excellent smear performance
• Available with integrated thermoelectric cooler
KAE-02150 Image SensorKAE-08151 Image Sensor
US export controls currently apply to all shipments of KAE devices designated for destinations outside of the US and Canada, requiring
ON Semiconductor to obtain an export license from the US Department of Commerce before image sensors or evaluation kits can be
exported.
Device
Resolution
(MPix) Pixel Count
Pixel
(μm)
Diagonal
(mm) Lens CFA FPS Max
Evaluation
Kit
KAE-02150 2.1 1920 x 1080 5.5 12.1 2/3” C/M 30
KAE-02152 2.1 1920 x 1080 5.5 12.1 2/3” C/M 30
KAE-04471 4.4 2096 x 2096 7.4 21.9 4/3” C/M 15
KAE-08151 8.2 2856 x 2856 5.5 22.2 4/3” C/M 8
KAE-08152 8.2 2856 x 2856 5.5 22.2 4/3” C/M 8
Page 25ON Semiconductor
SENSING
Image Sensor Evaluation Support
ON Semiconductor provides supporting hardware and software to qualified engineering teams to accelerate product development.
These kits contain everything necessary to build a working prototype with test functionality.
Page 26 Internet-of-Things Solutions
SENSING
Capacitive Touch Sensors
Design-Friendly, Low-Cost Operation, High Reliability
• Adhesive free • Reduce manufacturing cost and improve reliability by
eliminating existing adhesive process
• Long sensor trace • Provide flexible PCB design
• Wide range operational temperature • Available in high-temperature environment
• No extra components • Reduce BOM
• High noise immunity • Improve stability and reliability
Light Switch
Door Phone
Control Panel
Page 27ON Semiconductor
SENSING
Features
• Differential capacitive detection using mutual capacitance
• Capacitance detection down to femtofarad level
• High sensibility performance
• High adaptability — calibration function, noise reduction, wide range temperature operation
• Design friendly — adhesive free, various circuit board design, minimal external components
Device
Proximity/Gesture Sensing
(cm) Sensing Inputs Sensing Outputs Interface Control
VDD
(V) Package
LC717A00AJ 0-10 8 8 SPI / I2C 2.6 - 5.5 SSOP-30
LC717A00AR 0-10 8 8 SPI / I2C 2.6 - 5.5 VCT-28
LC717A10A J/PJ 0-10 16 0 SPI / I2C 2.6 - 5.5 SSOP-30
LC717A10AR 0-10 16 0 SPI / I2C 2.6 - 5.5 VCT-28
LC717A30UJ 0-20 8 0 SPI / I2C 2.6 - 5.5 SSOP-30
LC717A30UR 0-20 8 0 SPI / I2C 2.6 - 5.5 VCT-28
LC717A devices are high performance, cost-effective, and highly usable capacitance converters, for use in touch switch
applications. They have 8 or 16 channel capacitance-sensor inputs, and can replace mechanical switches. In particular, the
LC717A30 devices have superior sensitivity performance, so it can detect both hands wearing multiple layers of gloves and
hands with 15 cm of distance. In addition, it can perform gesture detection.
LC717A30URGEVK Available 1Q19
Evaluation Kits
LC717A30UJGEVKLC717A00ARGEVK
Capacitive Touch Sensors
Page 28 Internet-of-Things Solutions
SENSING
1
VDD 3.0 V To 5.5 V
2
5
6
7
4
3
OS/ALERT
GND
SDA
SCL
A2
A1
A0
CBYPASS
ADDRESS
(SET AS DESIRED)
SERIAL INTERFACE
NOTE: SDA, SCL AND OS/ALERT PINS
REQUIRE PULL-UP RESISTORS TO VDD
NCT75
Device Sensor Type EEPROM
Data
Transmission
Standard
ICC Max
(mA)
VCC Max
(V)
VCC Min
(V)
T Min
(°C)
T Max
(°C)
Temperature
Error
(°C) Package
NCT75 Local —SMBus 0.575 3 5.5 -55 125 ±1 DFN-8, Micro8, SOIC-8
NCT218 Remote —I2C — 1.6 2.75 — — — WDFN-8, WLCSP-8
NCT214 Local & Remote — SMBus 0.35 3 3.6 -40 125 ±1 WDFN-10
NCT72 Local & Remote — I2C 0.35 2.8 3.6 -40 125 ±1 DFN-8, WDFN-8
CAT34TS00 Local —SMBus/I2C 0.5 1.9 1.7 -20 125 ±1 UDFN-8
CAT34TS02 Local 2 kb SMBus/I2C 0.5 3.63 2.97 -20 125 ±1 UDFN-8, TDFN-8
N34TS04 Local 4 kb SMBus/I2C 1.0 5.5 1.7 -20 125 ±1 UDFN-8, TDFN-8
SCL
EVENT
Alarm
SDA
A2A1A0
I2C Block
Threshold
Registers
Serial
Presence
Detect
Memory Lock
VREF
EEPROM
12-Bit ADC
Temp Sensor
VSS
VCC
NCT75 Application Diagram Temperature Sensor + EEPROM Block Diagram
Temperature Sensors
RF JFETs for Infrared (IR) Sensing
Device
VGDO Min
(V)
IDSS Min
(mA)
IDSS Max
(mA)
|yfs| Typ
(mS)
Ciss Typ
(pF)
Crss Typ
(pF) Package
TF412S 30 1.2 3541.1 SOT-883
TF414 40 0.05 0.13 0.11 0.7 0.3 SOT-883
2SK545 40 0.055 0.095 0.13 1.7 0.7 CP (SOT-23)
2SK3666 30 0.6 36.5 41.1 CP (SOT-23)
Infrared Sensor for White Goods, Security, and Lighting
Thermal
Energy
RF JFET
R
1
2
D
S
G
3
Page 29ON Semiconductor
SENSING
SPSPRDR1-8 UHF Reader Hub
Battery-Free Wireless Sensors
Device Sensing Functions Sensor Reading Sensitivity Surface Placement Form Factor
SPS1M001FOM Moisture Low Sensitivity Metal Flexible PET
SPS1M002PET Moisture Low Sensitivity Non-Metal Flexible PET
SPS1F001PET Fluid Level High Sensitivity Non-Metal Flexible PET
SPS1T001PET Temperature 0 to +50°C (±0.3°C) or -40 to 85°C (±1°C) Non-Metal Flexible PET
SPS1T001PCB Temperature 0 to +50°C (±0.3°C) or -40 to 85°C (±1°C) Metal Hard Tag PCB
• High performance, 8 port reader
• USB, Ethernet, and WiFi connectivity
• Fully certified for regulatory compliance
• Options for different geographic regions
Introducing the World’s First Battery-Free, µC-Free Sensor Tag
Breakthrough Sensor Technology Implemented on RFID
Features Benefits
• Battery-free and wireless Ideal for locations with limited access
• underground, within walls, intrusive to body, within boxes, toxic or dangerous locations
• Ultra-thin Ideal for space-constrained applications
• Within doorways, within RFID tags, peel and stick, bandages
• Low cost to scale Effective where multiple sensors are required
• Disposable products, multiple data points, increasing needs over time
Smart Passive Sensors
Single chip; µC free;
adaptable RF front end
No batteries;
energy harvesting
Temperature, Pressure,
Moisture, Proximity
Page 30 Internet-of-Things Solutions
PROCESSING
General and LCD MCUs
MCUs for USB
MCU Features
• Pins: 10 – 100
• ROM: 4 – 768 KBytes
• RAM: 256 – 48,640 Bytes
• ADC: 3 – 16 channels
• Operation Voltage: 1.8 – 5.5 (V)
• Stand-by IDD: 0.02 µA
• RTC (Clock) IDD: 0.45 µA
(with low power model)
Device Type
ROM
(kByte)
RAM
(Byte) I/Os PWMs UARTs ADC LVD POR Features Package
LC87FBG08A 8-bit General 8256 21 2 1 12/8-bit x 9ch High accuracy internal OSC (±2.0%); all operation is minimum 1.8 V SSOP-24, VCT-24
LC87FBK08A 8-bit General 8256 21 2 — 12/8-bit x 8ch High accuracy internal OSC (±3.0%); Support Mask Type SSOP-24
LC87FBL08A 8-bit General 8256 26 2 — 12/8-bit x 11ch High accuracy internal OSC (±3.0%) QFP-36
LC87FBH08A 8-bit General 8256 26 2 1 12/8-bit x 11ch High accuracy internal OSC (±3.0%) QFP-36
LC87F2R04A 8-bit General 4128 21 — — 12/8-bit x 8ch Small scale 8bit MCU; Remote Control Receiver Circuit SSOP-24
LC87BK08A* 8-bit General 8256 21 2 — 12/8-bit x 8ch Mask ROM edition of LC87FBK08A SSOP-24
LC87F2416A 8-bit General 16 512 26 2 1 12/8-bit x 10ch — — — QFP-36
LC87F2J32A 8-bit General 32 1024 41 2 1 12/8-bit x 14ch —SQFP-48, QIP-48
LC87F2W48A 8-bit General 50 1536 40 2 1 12/8-bit x 14ch — — SQFP-48
LC87F2C64A 8-bit General 64 2048 73 4 2 12/8-bit x 16ch RTC; low power consumption QFP-80
LC87FC096A 8-bit General 96 4096 55 6 2 12/8-bit x 11ch 12-bit PWM x 6 QIP-64E
LC87F2608A 8-bit General 8512 7 1 — 12/8-bit x 3ch High speed 12-bit PWM; Analog Comparator MFP-10SK
LC87F0808A 8-bit General 8256 30 6 1 10/8-bit x 10ch MCPWM; High speed ADC (10-bit); Analog Comparator/Amplifier x 2 QFP-36
LC87F0N04A 8-bit General 4.5 128 12 4 — 10/8-bit x 6ch MCPWM; High speed ADC (10-bit); Analog Comparator x 2 SSOP-16
LC87F0G08A 8-bit General 8256 18 3 — 12/8-bit x 7ch — — MCPWM, OP-AMP, Analog comparator SSOP-24
LC87F0A08A 8-bit General 8256 30 2 — 12/8-bit x 8ch OP-AMP, Analog comparator, Constant current output port QFP-36
LC87F5VP6A 8-bit General 256 10240 89 4 2 8-bit x 15ch — — Large scale memory QIP-100E
LC88F58B0A 16-bit General 128 6144 54 2 2 12/8-bit x 11ch — Motor control signal generator SQFP-64
LC88FC3K0A 16-bit General 768 49152 90 4 3 12/8-bit x 16ch 2 x SMIC, SLIIC; RTC; CRC calculation circuit TQFP-100
LC87F7932B 8-bit LCD 32 2048 49 2 1 12/8-bit x 7ch — 32 x 4 segment driver; RTC; low power consumption SQFP-64
LC87F7J32A 8-bit LCD 32 1024 51 2 1 12/8-bit x 12ch 24 x 4 segment driver; support 5 V/3 V for LCD-panel TQFP-64
LC87F76C8A 8-bit LCD 128 4096 71 2 1 12/8-bit x 12ch — — 32 x 4 segment driver QFP-80
LC87F7DC8A 8-bit LCD 128 4096 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; many segment drivers QIP-100E
LC87F7NC8A 8-bit LCD 128 4096 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; large scale memory QIP-100E
LC87F7NJ2A 8-bit LCD 192 8192 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; large scale memory QIP-100E
LC87F7NP6A 8-bit LCD 256 8192 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; large scale memory QIP-100E
Device Type
ROM
(kByte)
RAM
(Byte) I/Os PWMs UARTs ADC LVD POR Features Package
LC87F1A32A 8-bit USB 32 2048 39 2 1 12/8-bit x 12ch — — IR reciever SQFP-48
LC87F1M16A 8-bit USB 16 1024 38 2 1 12/8-bit x 20ch UART & SCUART; high current driver SQFP-48
LC87F1K64A 8-bit USB 64 8192 39 2 1 12-bit x 12ch USB I/F x 2; USB Host; Audio I/F SQFP-48
LC87F17C8A 8-bit USB 128 8192 39 2 1 12/8-bit x 12ch USB 2.0 full speed host/device controller x2; audio IF SQFP-48
LC87F1HC8A 8-bit USB 128 16384 39 2 1 8-bit x 12ch — — USB Host; Audio I/F SQFP-48
LC87F1JJ2A 8-bit USB 192 16384 39 2 1 8-bit x 12ch — — USB Host; Audio I/F SQFP-48
LC87F1JJ4A 8-bit USB 192 20480 39 2 1 8-bit x 12ch — — USB Host; Audio I/F SQFP-48
LC87F1JJ8A 8-bit USB 192 24576 39 2 1 8-bit x 12ch — — USB Host; Audio I/F SQFP-48
* Mask ROM Device; Contact ON Semiconductor for additional information.
MCU Features
• USB 2.0 full-speed/low speed functions
• USB device function/USB host function
• Integrated voltage regulator
• USB D+ line pull-up function
μA
Page 31ON Semiconductor
PROCESSING
MCU Starter Kit for Software Development
Trial kit includes Main Board, Sub Board, and Development Environment CD. With Main Board as a base, it is possible to connect
different Sub Boards with different pin numbers.
• 8 bit Easy Micon Development Tool
Sub Board Line Up: 16-pin, 24-pin, 36-pin, 48-pin
• 16 bit Xstromy16 Development Tool
Sub Board Line Up: 48-pin, 64-pin, 100-pin
Real Time Display Function
Displays program running
situation in real time
Debugger
(1 Wire)
LEDs
Connects to PC via
Standard USB Cable
Switch
MCU On-Chip Debugger System
• Software development with 1 wire communication
• Reduction of development time with Real Time Display
function, Break function, and Trace function
Page 32 Internet-of-Things Solutions
PROCESSING
Portable Sound Solution ASSP
LC823450 series high resolution, ultra-low power portable audio system solution
Features
• Ultra low power consumption
• Integrated 1656 KByte SRAM
• Arm® Cortex®-M3 Dual Core
• Proprietary 32-bit DSP Core (LPDSP32)
• DSP audio code available for MP3 codec, FLAC
codec, Noise Cancel, Zoom Mic
• High resolution 32-bit & 192 KHz audio processing
capability
• Integrated analog blocks for low-power Class D HP amplifier,
system PLL, dedicated audio PLL
• Hard wired audio functions for MP3 encoder and decoder, EQ
(6-band equalizer), ASRC (Asynchronous Sample Rate Converter)
• Integrated interfaces for USB2.0 HS device or host (not OTG),
eMMC, SD card I/F
• ASRC with jitter hiding function, DSP code for SBC/AAC, UART
with DMA & FIFO support for low power Bluetooth® audio
Device Design Focus
Frequency
(MHz)
RAM
(KByte)
Arm Cortex-M3
Cores
SD Card I/F
Channels Features Package
LC823450TA Voice Recorder 160 @ 1.2 V Typ 1656 Single 3 Class D HP Amplifier TQFP-128L
100 @ 1.0 V Typ
LC823450XC Wearable 160 @ 1.2 V Typ 1656 Single 2 External LCD I/F (8-bit) WLCSP-154
100 @ 1.0 V Typ
LC823450XD High End
160 @ 1.2 V Typ
1656 Dual 3
Class D HP Amplifier;
External LCD I/F (8-bit);
HW MP3 Encoder
WLCSP-154
100 @ 1.0 V Typ
10-bit
ADC
6ch
XMC(2CS)
and
LCD
eMMC
SD/MS
SD
JTAG
(LPDSP)
SWD or SWV
(M3)
8/16bit
8bit
w/ CTS,
RTS
SDRAMC
(1CS)
UART
2ch
GPcIO
90ch
RC OSC
RAM
1.5 MByte
ROM
258 KByte
H/W
Audio Engine
• MP3 Encoder
• MP3 Decoder
SSRC, ASRC, EQ, etc.
S/W (LPDSP32)
• WMA Decoder
• AAC Decoder
• Noise Cancel, etc.
USB2.0
Host
or
Device
Arm®
Cortex®-M3
Arm®
Cortex®-M3
DMA
8ch
Multiple
Timer
2ch * 4
Plain Timer
(w/ WDT)
1ch * 3
ADDA
2ch/2ch
NOR
SRAM
Color
LCD
ADDA
2ch/2ch
Battery
Key
OSC
20 MHz
(1-50 MHz)
32.768 kHz RTC
D-AMP
2ch
SF(QSPI)
w/ Cache
PCM
2ch
PCM
2ch
Sys PLL
SPI
Aud PLL
I2C
UART
I2C
S-Flash
(Quad)
Small LCD
SDRAM
eMMC
SD/MS
SW
etc
WiFi Module, etc.
Bluetooth
HCI Module
or
Page 33ON Semiconductor
PROCESSING
Portable Sound Solution ASSP
Ultra Low Power
Small Footprint
Turn Key Software Support
• Over 120 hours playback with 2 x AAA battery (70% longer than
popular portable music players)
• Advanced power management technology
• 4.8 mA @ 128 Kbps by MP3 hardware decoding
• 0.11 mW/MHz @ 1.0 V while Cortex®-M3 Single Core operation
• Integrated low power D class amplifier
• 5.52 mm x 5.33 mm WLCSP-154 suitable for
portable, wearable audio
• Highly integrated SoC (CPU+DSP+AUDIO)
• Hi-Resolution Recording/Playback capability
• Cortex®-M3 dual core
• Proprietary 32-bit DSP (LPDSP32)
• 1656 Kbyte internal SRAM
• Suitable for portable, wearable digital music
• Support wireless synchronized stereo playback
10-bit
ADC
6ch
XMC(2CS)
and
LCD
eMMC
SD/MS
SD
JTAG
(LPDSP)
SWD or SWV
(M3)
8/16bit
8bit
w/ CTS,
RTS
SDRAMC
(1CS)
UART
2ch
GPcIO
90ch
RC OSC
RAM
1.5 MByte
ROM
258 KByte
H/W
Audio Engine
• MP3 Encoder
• MP3 Decoder
SSRC, ASRC, EQ, etc.
S/W (LPDSP32)
• WMA Decoder
• AAC Decoder
• Noise Cancel, etc.
USB2.0
Host
or
Device
Arm®
Cortex®-M3
Arm®
Cortex®-M3
DMA
8ch
Multiple
Timer
2ch * 4
Plain Timer
(w/ WDT)
1ch * 3
ADDA
2ch/2ch
NOR
SRAM
Color
LCD
ADDA
2ch/2ch
Battery
Key
OSC
20 MHz
(1-50 MHz)
32.768 kHz RTC
D-AMP
2ch
SF(QSPI)
w/ Cache
PCM
2ch
PCM
2ch
Sys PLL
SPI
Aud PLL
I2C
UART
I2C
S-Flash
(Quad)
Small LCD
SDRAM
eMMC
SD/MS
SW
etc
WiFi Module, etc.
Bluetooth
HCI Module
or
5.33 mm
5.52 mm
System APF ✘IPL2APP ✘IPL ✔
EVT MD ✔STG MD ✔AUD MD ✔SYS MD ✔USB MD ✔✔
Common
Reference Code
Internal ROM
Further Discussion Needed
✔APL DR ✘File System ✔DSP Lib ✔
BT Protocol
Stack
✘
SD/eMMC
Driver ✔Timer Driver ✔MTM Driver ✔AD Converter
Driver ✔RTC Driver
OS
✔
SFC Driver ✔INTC Driver ✔UARTDR ✔USB Driver ✔I2C Driver ✔
SPI Driver ✔Audio Driver ✔DSP Loader ✔IO EXP ✘
SDIO Driver ✘
MP Ready
User Depending
✔
✘
CODEC Driver✘Power Driver✔
H/W
Provide C Source Code
Provide Library or Binary Code
Sample Application May Not Use
Driver
Library
Middleware
Layer
Application
Layer
Page 34 Internet-of-Things Solutions
PROCESSING
The LC823450XGEVK is an audio processing system Evaluation Kit used to demonstrate the LC823450. This part can record and playback, and
offers high-resolution 32-bit & 192 kHz audio processing capability. It is possible to cover most of the functions necessary for portable audio with
only this LSI. It has Dual CPU and DSP with high processing capability, and internal 1656K-Byte SRAM, which make it possible to implement large
scale program. And it has integrated analog functions (low-power Class D HP amplifier, PLL, ADC etc.) so that PCB space and cost can be reduced,
and it has various interface (USB, SD, SPI, UART, etc.) to make extensibility high. Also it is provided with various function including SBC/AAC codec by
DSP and UART and ASRC (Asynchronous Sample Rate Converter) for Bluetooth audio. Low power consumption makes it suitable for portable audio
devices, such as wireless headsets.
Portable Sound Solution ASSP Evaluation Kit
UARTSWD−IFLCDUSBSwitch
I/O
Power
Supply
Control
Measurement
Radio
Frequency
Bluetooth
Memory
Serial
Flash microSD eMMC
Audio
Line
IN
Head
Phone
Digital-Mic
IN
24-bit
CODEC
D-class AMP Output
LC823450
1
2
3
45
6
7
8
9
10
11
12
13
14
15 16 16
1LC823450
2Audio CODEC
3USB Connector
4Serial Flash
5eMMC
6Switches
7microSD
8LCD
9Bluetooth
10 UART Connector
11 Power Supply Control
12 Digital Mic
13 ICE Connector
14 Headphone
15 Line Input
16 LEDs
LC823450XGEVK Evaluation Board
LC823450XGEVK Block Diagram
Features
• File Transfer Connecting to PC with USB
• MP3 Recording with USB Bus Power Supply
• MP3 Playback with USB Bus Power Supply
• Measurement of Current Consumption
Page 35ON Semiconductor
PROCESSING
ASIC
• Microcontroller
• DSP
• Coil Driver
• Class-D Amp
• DAC
• Display Driver
• Magnetic Flux
• Temperature
• Light
• Sound
• Pressure
• Acceleration
• Angular Rate
Example:
Example:
Analog
Signals
Sensor:
• Stepper Motors
• Transducers
• MOSFETs & BJTs
• Relays
• Speakers
• Lamps
• LCD/LED Displays
Mechanical or
Electrical System:
• EEPROM
• OTP
• SRAM
• ROM
High Voltage (40 to 80 V)
Low Voltage (<3.3 V)
• CAN, LIN
• I2C-bus
• USB
• KNX
• M-BUS
• RF
Low or
High
Voltage
Low or
High
Voltage
Filtering
Amplification
Sensor Interface
Signal
Processing Actuator
Wireless
Radio
Wired
Communications
Power/
Battery
Management
Supporting
Logic
Analog/
Digital
Conversion
Memory
Value Proposition
• Experienced resources and assets to bring customers’ design objectives successfully to market
• Ability to integrate customers’ IP into single-chip solution, thereby protecting the IP
• Flexible cost models to reduce customers’ total cost
IP & Fab Processes
•
≥
55 nm, analog-focused CMOS/BCDMOS process technologies
utilizing internal fabs and external foundry partners
• Low, medium, high voltages —
≤
1 V to 90 V
• Low current optimization — active & standby
• Low noise design — “count the electrons”
• High temperature —
≤
200°C (profile, for selected technologies)
• Integrated low power wireless
• Non-Volatile Memory (EEPROM, OTP), RAM & ROM
• Embedded digital IP
• Robust ESD protection
• Extensive building block ‘starting points’ consisting of amplifiers,
references, DACs, ADCs, linear & switching regulators, power
management, etc.
Design Engineering
• Approximately 200 expert mixed-signal
designers with extensive SoC and SiP
experience
• Robust custom development process
• Dedicated project managers track & report
development progress
• Flexible customer development engagement
— from full turnkey to subcontractor
production services
• Design expertise in:
» Sensor interface
» Wireless systems
» Medical imaging
» Energy management
» Building & home control
Mixed-Signal Custom Solutions
Category Mixed Signal Intellectual Property (IP)
Serial Interfaces USB 3.0/2.0/1.1, HDMI, MIPI, I2C, SPI, CAN, UART
Microprocessors Arm, RCore DSP, R8051, AMBA/AHB/APB Peripherals
Memory SRAM, DPRAM, ROM, EEPROM, OTP, FLASH
Clocking Oscillators, PLLs, DLLs
Communication Wireless (Proprietary & Standards), Wired (KNX, PLC
and others)
Encryption ECC, AES, 3-DES, DES, RSA
Data Converters DAC, ADC (8 - 20 bits, 1 KSPS – 120 MSPS)
Wireless IP PGA, LNA, PLLs, Correlators, DSP
Power Management Efficient Switching Regulators, LDOs, Charge Pumps,
Thermal Protection
References Precision Bandgaps, Current References, Temperature
Sensors
Analog and High Voltage
Interfaces
High-Voltage Drivers, Display and LCD Drivers, Class D
Amplifiers
Signal Conditioning PGA, Instrumentation Amps, Digital and Analog Filters
Page 36 Internet-of-Things Solutions
MOTOR CONTROL
Motor Drive for Small Motor Control
Device Motor
VM Max
(V)
VCC Max
(V)
Motor
Current
Max
(A)
Step
Resolution Control Type
PWM Constant
Current Protection Package(s)
LV8413GP Stepper / 2 x Brush DC 6 6 0.4 Half Parallel None TSD, UVLO VCT-16
LV8411GR 2 x Stepper / 4 x Brush DC 6 6 0.4 Half Parallel None TSD, UVLO VCT-24
LV8414CS 2 x Stepper 6 6 0.4 1/64 Clock Included TSD, UVLO WLP-32K
LB1935FA Stepper 8 — 0.4 Full Step Parallel None TSD Micro10
LB1938FA Brush DC 10.5 — 0.8 — Parallel None TSD, UVLO Micro8
LB1940T Stepper 10.5 — 0.4 Half Parallel None TSD TSSOP-20
LV8417CS Brush DC 12.6 6 1 — Parallel None TSD, UVLO WLP-9
LV8716QA Stepper / 2 x Brush DC 12.6 — 1 Half Parallel Included TSD, UVLO QFN-16
LV8402GP Stepper / 2 x Brush DC 16 6 1.4 Half Parallel None TSD, UVLO VCT-24
LV8711T Stepper / 2 x Brush DC 18 6 0.8 Half Parallel Included OCP, TSD, UVLO TSSOP-24
LV8712T Stepper 18 6 0.8 1/8 Clock Included TSD, UVLO TSSOP-24
LV8713T Stepper 18 6 0.8 1/32 Clock Included TSD, UVLO TSSOP-24
LV8714TA 2 x Stepper 18 — 1.5 Free Parallel Included OCP, TSD, UVLO TQFP-48 EP
LV8548MC Stepper / 2 x Brush DC 20 — 1 Half Parallel None TSD, UVLO SOIC-10
LV8549MC Stepper 20 — 1 Full Step Parallel None TSD, UVLO SOIC-10
LV8702V Stepper 36 — 2.5 Quarter Clock Included Stall, OCP, TSD, UVLO SSOP-44J EP
LV8729V Stepper 36 — 1.8 1/128 Clock Included OCP, TSD, UVLO SSOP-44K EP
LV8731V Stepper / 2 x Brush DC 36 — 2 1/16 Clock/Parallel Included OCP, TSD, UVLO SSOP-44K EP
Stepper Motor Driver for Paper Feed – DC 3~12 V
LV8716QA, LV8711T, LV8712T, LV8713T,
LB1935FA, LB1940T, LV8548MC, LV8549MC
DC Motor Driver for Paper Cut – DC 3~12 V
LB1938FA, LV8417CS
Stepper Motor Driver for Zoom/Focus – DC 5 V
LV8414CS, LV8411GR, LV8413GP, LV8716QA
Stepper Motor Driver for Panning/Tilt - DC 12 V
LV8714TA, LV8711T, LV8712T, LV8713T,
LV8402GP, LV8548MC
Stepper Motor Driver for Panning/Tilt - DC 24 V
LV8729V, LV8731V
Hand Terminal (POS) Printer
Security Camera
Page 37ON Semiconductor
MOTOR CONTROL
Power MOSFETs for Motor Control
N-Channel Power MOSFETs
Device Type
VDSS
(V)
RDS(ON)
(mΩ)
QG(TOT)
(nC) Package
FDBL0065N40 Single 40 0.65 220 TO-LL (H-PSOF)
FDBL0110N60 Single 60 1.1 170 TO-LL (H-PSOF)
FDBL0150N80 Single 80 1.4 172 TO-LL (H-PSOF)
FDBL0200N100 Single 100 295 TO-LL (H-PSOF)
FDBL0630N150 Single 150 6.3 70 TO-LL (H-PSOF)
FDB0105N407L Single 40 0.8 208 D2-PAK 7L (TO-263)
FDB0170N607L Single 60 1.4 173 D2-PAK 7L (TO-263)
FDB0165N807L Single 80 1.6 217 D2-PAK 7L (TO-263)
FDB1D7N10CL7 Single 100 1.7 116 D2-PAK 7L (TO-263)
FDB0630N1507L Single 150 6.4 97 D2-PAK 7L (TO-263)
FDMD85100 Half Bridge 100 9.9 22 PQFN-8
FDMD8580 Half Bridge 80 4.6 57 PQFN-8
FDMD8560L Half Bridge 60 3.2 92 PQFN-8
FDMD8540L Half Bridge 40 1.5 81 PQFN-8
FDMD82100 Half Bridge 100 19 12 PQFN-12
FDMD8280 Half Bridge 80 8.2 31 PQFN-12
FDMD8260L Half Bridge 60 5.8 49 PQFN-12
FDMD8240L Half Bridge 40 2.6 40 PQFN-12
Device Type
VDSS
(V)
RDS(ON)
(mΩ)
QG(TOT)
(nC) Package
NTMFS5C404NLT Single 40 0.67 181 SO-8FL (DFN-5)
NTMFS5C604NL Single 60 1.2 52 SO-8FL (DFN-5)
NTMFS6H800N Single 80 2.2 82 SO-8FL (DFN-5)
FDMS86180 Single 100 3.2 60 Power56
FDMC8360L Single 40 2.1 57 Power33
NTTFS5C453NL Single 40 335 u8FL
FDMC86570L Single 60 4.3 63 Power33
FDMC86340 Single 80 6.5 38 Power33
FDMC86184 Single 100 8.5 21 Power33
FDMT80040DC Single 40 0.56 241 PQFN-8 (Power88)
FDMT80060DC Single 60 1.1 170 PQFN-8 (Power88)
FDMT80080DC Single 80 1.35 195 PQFN-8 (Power88)
FDMT800100DC Single 100 2.95 79 PQFN-8 (Power88)
FDMT800120DC Single 120 4.2 76 PQFN-8 (Power88)
FDMT800150DC Single 150 6.5 77 PQFN-8 (Power88)
ON Semiconductor offers an expansive portfolio of power MOSFETs, utilizing advanced Trench technology. Devices that enable increased
system level efficiency through low conduction losses, and low switching losses, are available in a range of standard and innovative
packages.
40 V
100 V
60 V
80 V
VDSS
RDS(ON) (mΩ)
100
80
60
40
0.1 1 10 100
μ
8FLSO-8 FLTO-Leadless D2PAK 7L DualCool®
Power88
Page 38 Internet-of-Things Solutions
POWER MANAGEMENT
Power Supply/Management, Voltage Regulation
POWER SUPPLY/MANAGEMENT
N L
High Voltage
AC-DC
Switching
Regulator
DC-DC
Converters
LDO Voltage
Regulators
Device Function Features Package
AC-DC
FSL3276A/306LR/336LR High Voltage Rugged Buck Switcher • 650 V, RDS(ON) = 30/18/4 Ω, 50 kHz, with enhanced protection PDIP-7,
LSOP-7
NCP1010~15
NCP1070~77
Self-Supply High Voltage Monolithic Switching
Regulator for Low Power Offline Power Supplies
• Dynamic self-supply, no need of an auxiliary winding
• Current-mode fixed frequency (options of 65 kHz, 100 kHz, 130 kHz)
PDIP-7,
SOT-223
NCP1075~79A/B Enhanced Switcher for Robust, Highly Efficient Power
Supplies • 700 V, 2.9 to 13.5 Ω with enhanced protection PDIP-7
NCP1124/26/29 High Voltage Monolithic Switching Regulator for
Medium Power Offline Power Supplies
• 650 V, 9/6/2 Ω rugged FET current-mode fixed frequency (65 kHz,
100 kHz) PDIP-7
DC-DC
NCP3170 3 A Switching Regulator • Output voltage adjustable to 0.8 V
• 500 kHz or 1 MHz switching frequency SOIC-8
NCP3063/4 1.5 A Switching Regulator or utilize as controller
for up to 5 A
• Capable of 40 V input
• Up to 250 kHz switching frequency SOIC-8
LM2594/5/6 0.5 A/1.0 A/3 A Switching Regulators • Capable of 40 V input
• Fixed 150 kHz switching frequency
TO-220,
DPAK,
SOIC-8,
PDIP-8
NCP3020/11 PWM Controller
• 4.7-28 V input voltage range
• EN/PG/SYNC features
• Fixed 300/400/600 kHz switching frequency
SOIC-8,
TSSOP-14
NCP1034 PWM Controller • Capable of up to 100 V input
• Adjustable switching frequency (50-500 kHz) SOIC-16
Page 39ON Semiconductor
POWER MANAGEMENT
LDO Regulators
Device
Iout
(mA)
Dropout Typ
@ 3.3 V
(mV)
Iq
(
μ
A)
PSRR
@ 1 kHz
(dB)
Vin Max
(V)
Vout
(V) Package(s)
NCP785A 10 —12 80 450 3.3, 5.0, 12, 15 SOT-89-3
NCP786A 10 —10 65 450 1.275 DFN-6
NCP508 50 180 145 70 13 1.5, 1.8, 2.5, 2.8, 3.0, 3.3 SC-70-5, WDFN-6
NCP715 50 350 4.7 52 24 1.2, 1.5, 1.8, 2.5, 3.0, 3.3, 5.0 SC-70-5, XDFN6
NCP716 80 350 4.7 52 24 1.2, 1.5, 1.8, 2.5, 3.0, 3.3, 5.0 SC-70-5, XDFN6
NCP171* 80 41 0.05/50 65 6 0.8, 1.0, 1.2, 1.65, 1.8, 2.5, 2.8, 3.0, 3.3 XDFN-4
NCP781 100 —2.5 80 150 Adj., 1.5, 3.3, 5.0, 12.0, 15.0 DFN-6
NCP120 150 30 80 72 6 0.8, 1.05, 1.1, 1.15, 1.2, 1.5, 1.8, 2.1 XDFN-6
NCP571 150 450 40 —12 0.8, 0.9, 1.0, 1.2 TSOP-5, DFN-6
NCP170 150 240 0.5 40 5.5 1.2, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3 SOT-563, XDFN-4, TSOP-5
NCP716B 150 70 3.2 55 24 3.0, 3.3, 5.0 TSOP-5
NCP700B 200 118 70 82 5.5 1.8, 2.8, 3.0, 3.3 WDFN-6, TSOP-5
NCP702 200 140 10 68 6 1.8, 2.8, 3.0, 3.3 XDFN-6, TSOP-5
NCP752 200 130 12 68 6 1.8, 2.8, 3.0, 3.3 SOT-23-5, XDFN-6
NCP160 250 120 20 100 6 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14 XDFN-4, WLCSP-4
NCP163 250 80 12 92 61.8, 2.6, 2.8, 2.85, 2.9, 2.925 XDFN-4, WLCSP-4
NCP703 300 180 12 68 6 1.8, 2.8, 3.0, 3.3 XDFN-6, TSOP-5
NCP130 300 60 80 75 6 0.8, 1.05, 1.1, 1.15, 1.2, 1.5, 1.8, 2.1 XDFN-6
NCP718 300 300 460 24 1.2, 1.5, 1.8 TSOT-23, WDFN-6
NCP161 450 120 20 100 6 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14 XDFN-4, WLCSP-4
NCP3335A 500 250 190 75 18 Adj., 1.5, 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 5.0 Micro8, DFN-10
NCP3334 500 250 190 75 18 Adj. SOIC-8
NCP705 500 250 12 70 6 0.8, 1.8, 2.8, 3.0, 3.3 SOT-223-6, WDFN-6
NCP5500 500 230 300 75 18 Adj., 1.5, 5.0 DPAK-5, SOIC-8
NCP133 500 140 80 72 6 Adj, 0.9, 1.0, 1.05, 1.1, 1.15, 1.2, 1.25, 1.3, 1.8 XDFN-6
NCP137 700 40 35 85 6Adj. WLCSP-6
NCP186 1 A 100 90 75 6 1.2, 1.75, 1.8, 1.85, 2.5, 2.8, 3.0, 3.3, 3.5, 3.9 XDFN-8
NCP187* 1.2 A 180 30 75 61.2, 1.8, 3.3 DFN-6
NCP59748 1.5 A 60 —70 6Adj. DFN-10, QFN-20
NCP59744 3 A 100 —70 6Adj. QFN-20
Receiver
Crystal
PWM
Controller
Bridge
L
N
MCU
LDO
NCP715
NCP716
Smart LED Dimming Controller
* Pending 2Q19.
Page 40 Internet-of-Things Solutions
POWER MANAGEMENT
Power Source
Voltage Device
VDDS
(V)
ID
(A)
RDS(ON) (Ω) @ 10 V Ciss
(pF)
Qg
(nC)
G-S Protection
DiodeTyp Max Package
≤AC 240 V
BFL4004 800 6.5 1.9 2.5 710 36 —TO-220F
BFL4026 900 52.8 3.6 650 33 —TO-220F
BFL4001 900 6.5 2.1 2.7 850 44 —TO-220F
AC 380 V to 480 V
2SK4177 1500 210 13 380 37.5 Built in TO-263 (D2PAK)
2SK3748 1500 4 5 7 790 80 Built in TO-3PF
NDFPD1N150C 1500 0.1 100 150 80 4.2 — TO-220F
NDFP03N150C 1500 2.5 810.5 650 34 —TO-220F
NDTL03N150C 1500 2.5 810.5 650 34 —TO-3P
NDUL03N150C 1500 2.5 810.5 650 34 —TO-3PF
NDUL09N150C 1500 92.2 32025 114 —TO-3PF
AC 590 V to 690 V WPH4003 1700 38.2 10.5 850 48 —TO-3PF
Power MOSFETs for Circuit Breakers and Metering Power Supplies
Features
• High reliability
• Low power dissipation
• Avalanche ruggedness
• High-speed switching
Transformer/
Primary Side
Clamper Circuit
Feedback
Circuit
Output 1
Output 2
Rectifier
Bridge
Driver
AC Input
Voltage DC Output 1
DC Output 2
Low Saturation Voltage BJT for
Over Current Sensing Circuit
2SC6144SG: 50 V/10 A TO-220F-3FS
2SC5707: 50 V/8 A TP, TP-FA
Page 41ON Semiconductor
POWER MANAGEMENT
MOSFET Drivers
Device Function Type No of Drivers Package
NCP5104 Single Input High and Low Side Power MOSFET Driver Half-Bridge 2SOIC-8, PDIP-8
NCP5111 Single Input Half-Bridge Power MOSFET or IGBT Driver Half-Bridge 2SOIC-8, PDIP-8
NCP5106A/B Dual Input High Voltage High and Low-Side MOSFET or IGBT Driver Half-Bridge 2SOIC-8, PDIP-8
NCP5304 Dual Input High Voltage High and Low-Side MOSFET or IGBT Driver Half-Bridge 2SOIC-8, PDIP-8
NCP5181 Dual Input High Voltage High and Low-Side MOSFET or IGBT Driver Half-Bridge 2SOIC-8, PDIP-8
NCP5183 Dual Input High Voltage High and Low-Side MOSFET or IGBT Driver Half-Bridge 2SOIC-8
NCP81075 Dual Input High Voltage High and Low-Side MOSFET Driver Half-Bridge 2SOIC-8, DFN-8, WDFN-10
NCP80180 Dual Input High Voltage High and Low-Side MOSFET Driver Half-Bridge 2SOIC-8, DFN-8
Features
• Drives high voltage power MOSFETs and IGBTs,
provides two outputs
• Suitable for multiple topologies like half-bridge,
asymmetrical half-bridge, active clamp, full bridge
• High voltage range, up to 600 V
• Robust devices with dV/dt immunity of ±50 V/ns
• Pin to pin compatible with industry standards
Page 42 Internet-of-Things Solutions
POWER MANAGEMENT
LC709203F High Accuracy Fuel Gauge LSI
Fuel Gauge for 1 Cell Li+ with Low Power and with No Sense Register
Features
• Accuracy of remaining capacity ±2.8% (0 ~ +50°C)
• Active mode current of 15 µA
• Hibernate mode current of 2 µA
• Standby mode current (RAM retention) of 0.1 µA
• No need for sense resistor for current detection
Conventional Display
Detailed Display of
Remaining Capacity
Correct
Operating Time
With
LC709203F
Standby Time
120 h
Call Time
75 min 77%
5 mΩ
Sense
Resistor
Conventional
System
Main
Board
Fuel
Gauge
Battery
No Sense Resistor
ON Semiconductor
System
Main
Board
Fuel
Gauge
Battery
5 mΩ
Sense
Resistor
Conventional
System
Main
Board
Fuel
Gauge
Battery
No Sense Resistor
ON Semiconductor
System
Main
Board
Fuel
Gauge
Battery
ON Semiconductor Solution
(No Sense Resistor)
• No power loss
• No heat generation
Page 43ON Semiconductor
POWER MANAGEMENT
USB Wall Receptacle
Wall receptacles that include direct USB cable connections are becoming increasing popular for charging mobile devices.
ON Semiconductor offers high performance, high density USB-C (Type-C) power supplies for the USB wall receptacle solutions.
Block Diagram
System Devices
Voltage
Regulation
Protection
Sensors
Port Power
Power
Regulation
Power MUX
Power
Switch
Control
Controllers
Port
Control
Policy
Engine
System Devices
Function Device Description
Protection
NIS5135 Electronic Fuse, 5 V
ESD5581 ESD Protection, Bidirectional, 5 V, 10 pF
NSPM2052 ESD and Surge Protection Device, Vbat and Vbus Applications, 5 V
NSPM0061 ESD and Surge Protection, 6.3 V
NSPM0101 ESD and Surge Protection, 10 V, 60 A
NSPM5131 ESD and Surge Protection Device, Unidirectional, 13.5 V
Power Port
Function Device Description
Power
Regulation
NCP1342 Quasi-Resonant Flyback Controller with Valley Lock-Out Switching
NCP4305 Secondary Side Synchronous Rectification Driver for High Efficiency SMPS Topologies
NCP4306 Secondary Side Synchronous Rectification Driver for High Efficiency SMPS Topologies
NCP43080 Synchronous Rectifier Controller with LLD Function
Control
Function Device Description
Port Control FUSB302TMPX Programmable USB Type-C Controller with PD (Default SRC)
FUSB3301MPX USB Type-C Source-Only Controller
Page 44 Internet-of-Things Solutions
PROTECTION
USB 2.0
One High Speed Pair, VCC, Low Capacitance ESD Protection
Key Requirement
• Cap < 5 pF
Features
• 0.35 - 3.0 pF
• Multi-part solutions available
• Industry leading low clamping voltage
Device Data Lines
Capacitance
(pF) Package
Size
(mm)
NUP2114UPX 1 Pair (D+/-) + Vbus 0.8 SOT-553 1.2 x 1.6
NUP2114UCM 1 Pair (D+/-) + Vbus 0.8
TSOP-6 3.0 x 2.75
ESDL3552 1 Pair (Tx, Rx, D+/-) 0.25 X4DFN-3 0.62 x 0.32
NUP4114UPX 2 Pair (D+/-) + Vbus 0.5
SOT-563 1.6 x 1.6
NUP4114UCL 2 Pair (D+/-) + Vbus 0.5
SC-88 2.0 x 2.1
NUP4114H 2 Pair (D+/-) + Vbus 0.5
TSOP-6 3.0 x 2.75
ESDL2031 Single Line (Tx, Rx, D+/-) 0.4 X4DFN-2 0.6 x 0.3
ESDL1531* Single Line (Tx, Rx, D+/-) 0.2 X4DFN-2 0.445 x 0.24
ESD7L5.0 20.5
SOT-723 1.2 x 1.2
ESD8351MUT 1
0.37
X3DFN-2 0.6 x 0.3
ESD8351P2T 1
0.37
SOD-923 1.0 x 0.6
ESD9L5.0 1
0.5
SOD-923 1.0 x 0.6
I/O 1 I/O 2
=
I/O 3 I/O 4
One High Speed Pair, VCC, Common Mode Filter + ESD Protection
Key Requirement
• Cap < 5 pF
• Common Mode Filtering
Features
• 0.5 - 0.8 pF
• Integrated EMI suppression with ESD protection
• Industry leading low clamping voltage
Device Pairs
Capacitance
@ 2.5 V (pF)
CM Attenuation
@ 800 MHz (–dB)
DM Bandwidth
F3dB (GHz) Package
Size
(mm)
EMI2121 1
0.9 –25 2.5
WQFN-8 2.2 x 2.0 x 0.75
USB 2.0 @ 480 Mb/s
D+
D-
VBUS
Top layer
Other layer
ID
GND
Micro USB
Connector
EMI2121
-35
-30
-25
-20
-15
-10
-5
0
1.E+06 1.E+07 1.E+08 1.E+09
dB
Frequency
Common
Mode
Differential
Mode
Suppresses Common Mode Noise
Deeper than Competing Passive Solution
VBUS
D+
D-
Gnd
VBUS
D+
D-
Gnd
NUP4114
USB
Host
Controller
VBUS
D+
D-
Gnd
NUP2114
USB
Host
Controller
* Pending 2Q19.
Page 45ON Semiconductor
PROTECTION
Ethernet: 10/100BASE-T, 1000BASE-TX, and Gigabit
Four Pairs, Low Capacitance Surge and ESD Protection
Line-to-Line Surge
Line Side : LC03-6 (optional)
Transformer Side: NSP8818
Protection against metallic (transverse) strikes
Typical Application
Features
• Line-to-line capacitance < 3 pF
• Vclamp (25 A surge) < 11 V
• IEC 61000-4-2 rating > 30 kV
• No latching danger
• Surge rating maintained to 125°C
Benefits
• Compatible with Gb Ethernet and beyond
• Enhanced protection for downstream electronics
• Accommodates operating transients above 3.3 V
• Small form-factor allows integration into connectors
The 1000BASE-T or Gigabit Ethernet interface operating at higher bitrates is susceptible to ESD strikes, cable-discharge events and
lightning-induced transients. Our products help meet IEC 61000-4-5, GR-1089-CORE and other Standards.
C5VDD
C1
C2
NSP8818
LC03
C3
C4
C6VDD
LC03
C7VDD
LC03
C8VDD
LC03
TPOPA
TPONA
TPOPB
TPONB
TPOPC
TPONC
TPOPD
TPOND
A+
A-
B+
B-
C+
C-
D+
D-
1000BASE-T
ETHERNET TRANSCEIVER
TRANSFORMER
RJ45
1
8
1
8
1
8
1
8
-10 0
0
5
10
15
20
25
30
10 20 30
Time (μs)
Voltage (V), Current (A)
40 50 60
8/20 μs
Surge Current
ON Semiconductor
Voltage
Competitor
Voltage
1
2
3
4
5
6
7
8
RJ-45 Connector
Flow Through
Routing
NSP8818
Surge Protection
Device
VDC Max
(V)
Line
Transient
Max
(V)
Surge IPP,
8/20 μs
(A)
Typical
Line-Line
Capacitance
(pF)
ESD
Contact
Rating
(kV) Package
LC03-6 6.7 7.0 100 8.0 ±30 SOIC-8
NSP4201 5.0 6.0 25 1.5 ±30 TSOP-6
NSP8814 3.0 3.2 35 1.5 ±30 UDFN-8
NSP8818 3.0 3.2 35 1.5 ±30 UDFN-10
NUP4114H 5.0 5.0 12* 0.4 ±13 TSOP-6
SRDA3.3 3.3 5.0 25 4.0 ±8 SOIC-8
SRDA05 5.0 7.0 23 5.0 ±8 SOIC-8
* On Pin 5.
Page 46 Internet-of-Things Solutions
COMPONENTS
EEPROMs for Configuration and Calibration
EasyPRO™ is a user-friendly, portable
programming tool for ON Semiconductor
serial EEPROMs (I2C, SPI, Microwire)
Features
• Broad density range: 1 kb to 2 Mb
• Wide operating Vcc range: 1.7 V to 5.5 V
• High endurance: 1 million program/erase cycles
• Wide temperature range: industrial and extended
EEPROMs
Data
Transmission
Standard Density Organization*
VCC Min
(V)
VCC Max
(V)
fCLK Max
(MHz) Package(s)
I2C
1 Mb 128k x 8
1.7, 1.8 5.5 0.4, 1 US8, SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5, WLCSP-8
512 kb 64k x 8
256 kb 32k x 8
128 kb 16k x 8
64 kb 8k x 8
32 kb 4k x 8
16 kb 2k x 8
8 kb 1k x 8
4 kb 512 x 8
2 kb 256 x 8
SPI
2 Mb 256k x 8
1.7, 1.8 5.5 10, 20 SOIC-8, TSSOP-8, UDFN-8
1 Mb 128k x 8
512 kb 64k x 8
256 kb 32k x 8
128 kb 16k x 8
64 kb 8k x 8
32 kb 4k x 8
16 kb 2k x 8
8 kb 1k x 8
4 kb 512 x 8
2 kb 256 x 8
1 kb 128 x 8
Microwire
16 kb 2k x 8 / 1k x 16
1.65, 1.8 5.5 2, 3, 4 SOIC-8, TSSOP-8, UDFN-8
16 kb 2k x 8 / 1k x 16
8 kb 1k x 8 / 512 x 16
8 kb 1k x 8 / 512 x 16
4 kb 512 x 8 / 256 x 16
2 kb 256 x 8 / 128 x 16
1 kb 128 x 8 / 64 x 16
1 kb 128 x 8 / 64 x 16
* Organization for Microwire devices is selectable.
Page 47ON Semiconductor
COMPONENTS
RF/NFC EEPROM
Tablet/Phone
RF
Reader/Writer
Motor Trim
from EEPROM
TV Trim
from EEPROM
Adjustable
Current
Regulator
LED
MCU
LED TV
N24RF64
EEPROM
I2C Bus
Trim parameters,
diagnostic data,
remote maintenance
Sample Application
Device
Memory Density
(kb)
Energy Harvesting
Output Temperature Range Package(s)
N24RF64E 64 Yes -40 to +105°C SOIC-8, TSSOP-8
N24RF64 64 No -40 to +105°C SOIC-8, TSSOP-8
N24RF16E 16 Yes -40 to +105°C SOIC-8, TSSOP-8
N24RF16 16 No -40 to +105°C SOIC-8, TSSOP-8
N24RF04E 4Yes -40 to +105°C SOIC-8, TSSOP-8
N24RF04 4No -40 to +105°C SOIC-8, TSSOP-8
Features
• RF/NFC interface for contactless transmission of data up to 150 cm
• ISO 15693 / ISO 18000-3 Mode 1 Compliant RF/NFC at 13.56 MHz
• 2,000,000 Program / Erase Cycles
• 200 year data retention
• 64-bit Unique Identifier (UID)
• Multiple 32-bit passwords and Lock Feature
• I2C Interface
• 4 selectable slave addresses using pins A0 ad A1
• 1 MHz bus speeds
• Energy harvesting output pin; able to power small peripheral or MCU
RF EEPROMs
MCU
Batteries Not Required
Vcc Vcc
SCL
SDA
Vout
Vss Vss
N24RFxxE
RF/NFC
Page 48 Internet-of-Things Solutions
COMPONENTS
Features
• Faster data rewrite (Sector Erase/Page Program)
• Lower power consumption with efficient rewrite operation
• 20-year data retention with no data deterioration
• Consistent Sector Erase operation time (tSE) over device lifetime
• Industry’s fastest WRITE performance minimizes system risk
during field firmware upgrades
Device Density
Power Supply
(V)
Sector Erase Time
(ms)
Page Program Time
(ms)
Read/Write Current
(mA) Package
LE25S20 2 Mb 1.65 - 1.95 80 3 6 Read; 15 Write SOIC-8, VSOIC-8
LE25U20A 2 Mb 2.3 - 3.6 80 4 6 Read; 15 Write SOIC-8, VSOIC-8, WDFN-8
LE25U40C 4 Mb 2.3 - 3.6 80 4 6 Read; 15 Write SOIC-8, VSON-8, VDFN-8
LE25S40 4 Mb 1.65 - 1.95 80 6 6 Read; 15 Write SOIC-8, VSOIC-8, VDFN-8, VSON-8
LE25W81 8 Mb 2.45 - 3.6 100 0.3 6 Read; 15 Write VSON-8, VDFN-8
LE25S81A 8 Mb 1.65 - 1.95 15 0.3 5 Read; 4.5 Erase SOIC-8, VSOIC-8
LE25S161 16 Mb 1.65 - 1.95 15 0.4 4.5 Read; 4.5 Erase SOIC-8, VSOIC-8, UDFN-8, WLCSP-8
VCC
SCK
SI
Serial
Flash
HOLD
CS
W
VCC
VCC
SCK
SI
SOGND
P
SO
Wireless
SoC
LED
Driver
CS
Smart LED Block Diagram
Serial NOR Flash
Page 49ON Semiconductor
COMPONENTS
ON Semiconductor offers a range of discrete RF devices for Internet-of-Things products. These efficient, micro-packaged devices provide capabilities
for tuning, low-noise amplification, and sensor interface.
RF Discretes
Device Type Key Features Functions Package(s)
RF BJTs Low noise figure (≤1.5 dB), high gain (9 to 18 dB), high cut-off frequency, low operation voltage FM LNA, Buffer, IF Amp TSOP-6, SOT-343
RF Schottky
Diodes
Small interterminal capacitance (0.15 to 0.69 pF), small forward voltage (≤0.32 V),
fewer parasitic components Level Detection X2DFN-2
PIN Diodes Small interterminal capacitance (≤0.23 dB), small forward series resistance (≤4.5 Ω), auto gain control Gain Control SC-70, SC-59
RF MMIC Wide band response (up to 3.6 GHz), high gain (up to 33 dB), low current, high output power Buffer, IF Amp SC-88FL
RF JFETs High |yfs| (up to 50 mS), low noise figure (≤1.5 dB), low capacitance (Ciss ≤10 pF), low IDSS, low IGSS AM LNA SC-59, SOT-883 (XDFN)
Varactors Capacitance ratio range (1.65 to 6.0), high Q factor (up to 150), low reverse current FM Tuning SC-59, SC-70
Power Detector
Coupler
WiFi
Transceiver
2.4 GHz
RF-SBD
IR Sensor
Thermal
Energy
TF412S, TF414
R
1
2
D
S
G
3
Consumer Industrial Communications
Set-Top Box Satellite LNB Smart Meters Drones Wireless LAN Walkie-Talkie
RF BJT
2SCxx, 15NGNxx, CPHxx, MCHxx
RF Schottky
1SSxx, NSRxx, SBXxx
PIN Diode
1SVxx
JEFT
2SKxx, CPHxx, MCHxx, MMBFxx, TFxx
MMIC
SMAxx
Page 50 Internet-of-Things Solutions
COMPONENTS
MiniGate
Family
Number
of Gates Device Prefix
VCC
tPD
(nS)
IOUT
(mA) Input Logic Level Packages
Min
(V)
Max
(V)
HC 1 MC74HC1G/NC7S 2 6 6.5 @ VCC = 5 V ±5.2 @ VCC = 6 V CMOS
TSOP, SC-88, SC-74, SOT-553,
SOT-953, US8, UDFN, UQFN,
MicroPak
HCT 1NC7ST 4.5 5.5 6.5 @ VCC = 5 V ±2 @ VCC = 6 V TTL
VHC
1MC74VHC1G/NLU1G/NL17SH
1.65 5.5 3.8 @ VCC = 4.5 V ±8 @ VCC = 4.5 V CMOS2NLU2G
3NLU3G
VHCT
1MC74VHCT1G/NLU1GT/NL17SHT
4.5 5.5 3.6 @ VCC = 4.5 V ±8 @ VCC = 4.5 V TTL2NLU2GT
3NLU3GT
LCX
1NL17SZ/NC7SZ/NLX1G
1.65 5.5 2.4 @ VCC = 3 V ±24 @ VCC = 3 V CMOS2NC27WZ/NC7WZ/NLX2G
3NL37WZ/NC7NZ/NLX3G
VCX 1 NL17SV/NC7SV 0.9 3.6 1.0 @ VCC = 3 V ±24 @ VCC = 3 V LVTTL
SG 1NL17SGxx 0.9 3.6 2.2 @ VCC = 3 V ±8 @ VCC = 3 V LVTTL
SP
1NC7SP
0.9 3.6 3.0 @ VCC = 3 V ±2.6 @ VCC = 3 V LVTTL2NC7WP
3NC7NP
AUP 174AUP1G 0.8 3.6 2.9 @ VCC = 3 V ±4 @ VCC = 3 V Schmitt
174AUP1T 2.3 3.6 3.3 @ VCC = 3 V ±4 @ VCC = 3 V Schmitt
Standard
Logic Family Device Prefix
VCC
tPD
(nS)
IOUT
(mA) Input Logic Level Packages
Min
(V)
Max
(V)
Metal Gate MC14 3 18 50 @ VCC = 15 V ±4.2 @ VCC = 15 V CMOS
SOIC, TSSOP, QFN
AC MC74AC/74AC 2 6 6 @ VCC = 5 V ±24 @ VCC = 4.5 V CMOS
ACT MC74ACT/74ACT 4.5 5.5 5.5 @ VCC = 5 V ±24 @ VCC = 4.5 V TTL
HC MC74HC/MM74HC 2 6 13 @ VCC = 6 V ±5.2 @ VCC = 6 V (Std) CMOS
±7.8 @ VCC = 6 V (Bus Driver)
HCT MC74HCT/MM74HCT 4.5 5.5 15 @ VCC = 5 V ±4.0 @ VCC = 4.5 V (Std) TTL
±6.0 @ VCC = 4.5 V (Bus Driver)
LCX MC74LCX/74LCX 2.3 3.6 5.5 @ VCC = 3 V ±24 @ VCC = 3 V LVTTL
LVX MC74LV X/74LV X 2 3.6 6.6 @ VCC = 3 V ±4 @ VCC = 3 V LVTTL
VCX MC74VCX/74VCX 1.65 3.6 3.5 @ VCC = 3 V ±24 @ VCC = 3 V LVTTL
VHC MC74VHC/74VHC 2 5.5 5.2 @ VCC = 4.5 V ±8 @ VCC = 4.5 V CMOS
VHCT MC74VHCT/74VHCT 4.5 5.5 3.6 @ VCC = 4.5 V ±8 @ VCC = 4.5 V TTL
LVT 74LV T 2.7 3.6 3.6 @ VCC = 3.0 V -32/64 @ VCC = 3.0 V TTL
Standard Logic and MiniGate™
Available logic functions
• Logic Gates, Buffers, Flip-Flops
• Arithmetic Functions
• Bus Transceivers
• Latches and Registers
• Multiplexers and Analog Switches
• Logic Level Translators
Page 51ON Semiconductor
COMPONENTS
Integrated Passive Devices (IPD)
Efficient RF System-in-Package Solutions
Integrating passive devices into our HighQ™ copper platform gives a
cost-effective, space-saving solution for all RF needs.
IPD Technology (R, L, C)
IPD Technology Characteristics
• Target frequency: 500 MHz to
40 GHz
• Low profile, minimal footprint
• Tight tolerance
Typical Applications
• Antenna Switch
• WiFi®/Bluetooth
• Power Amplifier
• Zigbee
Typical IPD Designs
• Baluns
• Couplers
• Diplexers
• Balanced Filters
• Splitters
• Matching networks
Performance
• Guaranteed ±5.0% capacitor
tolerance
• Typical < 1% variance between
capacitors on common IPD
• Dual Cu stack up of 12 µm for
high Q inductors
MIM (SiN)
High Resistivity Silicon Substrate
Insulating Oxide
Thickest Inductors in the Industry
Optional Resistors
High Tolerance Caps
Al–Pad
Dual Copper Stackup with Full Length Stitched Via
BRD8075/D
BRD8075-10 PRINTED IN USA 05/19 IRONWOOD XXXX 2K
EasyPRO, IntelliMax, MiniGate and ThermalTrak are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. Apple, and the Apple logo are trademarks of Apple Inc., registered in the U.S. and other
countries and regions. App Store is a service mark of Apple Inc. Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the EU and/or elsewhere. Bluetooth is a registered trademark of Bluetooth SIG. EnOcean and the EnOcean logo are registered
trademarks of EnOcean GmbH. Google Play and the Google Play logo are trademarks of Google LLC. KNX is a registered trademark of KNX and its suppliers or licensors. POWERMITE is a registered trademarks of Microsemi Corporation. Quick Charge is a trademark of
Qualcomm Incorporated. SIGFOX and the SIGFOX logo are trademarks of SIGFOX. Thread is a trademark of Thread Group Inc. ZigBee is a registered trademark of ZigBee Alliance. All other brand names and product names appearing in this document are trademarks of their
respective holders.
ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents,
trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further
notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product
or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations
and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended
for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor
was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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Serial Microelectronics, HK www.serialsys.com.hk (852) 2790 8220
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WT Microelectronics Co. www.wtmec.com (852) 2950 0820
Yosun Electronics www.yosun.com.tw (886) 2 2659 8168
ON SEMICONDUCTOR INTERNATIONAL SALES OFFICES
GREATER CHINA Beijing 86-10-8577-8200
Hong Kong 852-2689-0088
Shenzhen 86-755-8209-1128
Shanghai 86-21-5131-7168
Taipei, Taiwan 886-2-2377-9911
FRANCE Paris 33 (0)1 39-26-41-00
GERMANY Munich 49 (0) 89-93-0808-0
INDIA Bangalore 91-98-808-86706
ISRAEL Raanana 972 (0) 9-9609-111
ITALY Milan 39 02 9239311
JAPAN Tokyo 81-3-6880-1777
KOREA Seoul 82-31-786-3700
MALAYSIA Penang 60-4-6463877
SINGAPORE Singapore 65-6484-8603
SLOVAKIA Piestany 421 33 790 2450
UNITED KINGDOM Maidenhead 44 (0) 1628 244326
www.onsemi.com/support
ON Semiconductor Technical Support For a comprehensive listing of
ON Semiconductor Sales Offices, Distributors,
and Rep Firms, please visit:
Americas & EMEA: www.onsemi.com/sales
China: www.onsemi.cn/sales
Japan: www.onsemi.jp/sales
Dec-17
