F-219 (02APR19) BSE-020-01-F-D-A 10 YEAR MFG WITH 50 " GOLD EXTENDED LIFE PRODUCT HIGH MATING CYCLES BTE-060-02-F-D-A BTE-040-02-L-D-A (0.80 mm) .0315" BTE, BSE SERIES BASIC BLADE & BEAM HEADER & SOCKET SPECIFICATIONS NO. OF POSITIONS PER ROW BTE For complete specifications and recommended PCB layouts see www.samtec.com?BTE or www.samtec.com?BSE Mates with: BSE Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50 " (1.27 m) Ni Current Rating: 2 A per pin (2 pins powered) Operating Temp Range: -55 C to +125 C Voltage Rating: 225 VAC with 5 mm Stack Height Max Cycles: 100 RoHS Compliant: Yes Specify LEAD STYLE from chart -020, -040, -060, -080, -100, -120 No. of positions x (0.80) .0315 + (4.00) .1575 01 (5.97) .235 (3.94) .155 02 A (0.20) .008 = Tape & Reel (80 positions maximum) -C* = Electro-Polished Selective 50 " (1.27 m) min Au over 150 " (3.81 m) Ni on Signal Pins in contact area, Matte Tin over 50 " (1.27 m) min Ni on all solder tails (7.11) .280 (0.89) .035 DIA MATED HEIGHT -01 -02 POWER/SIGNAL APPLICATION *Note: -C Plating passes 10 year MFG testing (5.00) .197 Compatible with UMPT/UMPS for flexible two-piece power/signal solutions (8.00) .315 *Processing conditions will affect mated height. NO. OF POSITIONS PER ROW BSE For complete scope of recognitions see www.samtec.com/quality PLATING OPTION 01 Mates with: BTE FILE NO. E111594 A = Gold Flash on contact, Matte Tin on tail -020, -040, -060, -080, -100, -120 (MOQ Required) 30 " (0.76 m) Gold Edge Mount Capability Friction Lock option 11 mm, 14 mm, 16.10 mm, 19.10 mm, 22 mm, 25 mm and 30 mm Stack Height (Caution: Some automatic placement/inspection machines may have component height restrictions. Please consult machinery specifications.) D -F ALSO AVAILABLE Note: Some lengths, styles and options are non-standard, non-returnable. (4.27) .168 (7.21) .284 -TR = 10 " (0.25 m) Gold on contact, Matte Tin on tail LEAD STYLE MATED HEIGHT* RECOGNITIONS * * * * -01 (0.76) .030 = (7.00 mm) .275" DIA Polyimide Film Pick & Place Pad -L A OTHER OPTION -K -F LEAD STYLE -02 A D = Gold Flash on contact, Matte Tin on tail (0.80) .0315 PROCESSING Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (020-080) (0.15 mm) .006" max (100-120)* *(.004" stencil solution may be available; contact IPG@samtec.com) Board Stacking: For applications requiring more than two connectors per board or 80 positions or higher, contact ipg@samtec.com PLATING OPTION LEAD STYLE -L = 10 " (0.25 m) Gold on contact, Matte Tin on tail -C* No. of positions x (0.80) .0315 + (5.27) .2075 02 (6.22) .245 (3.81) (7.24) .150 .285 01 (3.05) .120 (0.80) .0315 *Note: -C Plating passes 10 year MFG testing (3.25) .128 (0.15) .006 = Electro-Polished Selective 50 " (1.27 m) min Au over 150 " (3.81 m) Ni on Signal Pins in contact area, Matte Tin over 50 " (1.27 m) min Ni on all solder tails (7.49) .295 (1.78) .070 (0.76) .030 (0.89) .035 DIA Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM All parts within this catalog are built to Samtec's specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply. OTHER OPTION -TR = Tape & Reel (80 positions maximum)