TDA7073A - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1994 July

File under Integrated Circuits, IC01

1999 Aug 30

INTEGRATED CIRCUITS

TDA7073A; TDA7073AT

Dual BTL power driver

1999 Aug 30 2

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

FEATURES

•No external components

•Very high slew rate

•Single power supply

•Short-circuit proof

•High output current (0.6 A)

•Wide supply voltage range

•Low output offset voltage

•Suited for handling PWM signals up to 176 kHz

•ESD protected on all pins.

GENERAL DESCRIPTION

The TDA7073A/AT are dual power driver circuits in a BTL

configuration, intended for use as a power driver for servo

systems with a single supply. They are specially designed

for compact disc players and are capable of driving focus,

tracking, sled functions and spindle motors.

Missing Current Limiter (MCL)

A MCL protection circuit is built-in. The MCL circuit is

activated when the difference in current between the

output terminal of each amplifier exceeds 100 mA (typical

300 mA). This level of 100 mA allows for headphone

applications (single-ended).

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPpositive supply voltage range 3.0 5.0 18 V

Gvvoltage gain 32.5 33.5 34.5 dB

IPtotal quiescent current VP=5V; R

L=∞−816mA

SR slew rate −12 −V/µs

IOoutput current −−0.6 A

Ibias input bias current −100 300 nA

fco cut-off frequency −3dB −1.5 −MHz

TYPE NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA7073A DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

TDA7073AT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

1999 Aug 30 3

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

positive input 1

16I + i

13I – i

negative input 1

positive output 1

negative output 1

MCD382 - 1

positive input 2 6

TDA7073A

TDA7073AT

9I + i

I – i

negative input 2

positive output 2

negative output 2

ground 1 n.c.

ground 2

3, 4, 8, 11, 15

ΙΙ

SHORT - CIRCUIT AND

THERMAL PROTECTION

1999 Aug 30 4

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

PINNING

SYMBOL PIN DESCRIPTION

IN1−1 negative input 1

IN1+2 positive input 1

n.c. 3 not connected

n.c. 4 not connected

VP5 positive supply voltage

IN2+6 positive input 2

IN2−7 negative input 2

n.c. 8 not connected

OUT2+9 positive output 2

GND2 10 ground 2

n.c. 11 not connected

OUT2−12 negative output 2

OUT1−13 negative output 1

GND1 14 ground 1

n.c. 15 not connected

OUT1+16 positive output 1 Fig.2 Pin configuration.

handbook, halfpage

TDA7073A

TDA7073AT

OUT1+

GND1

n.c.

IN1–

IN1+

n.c.

OUT1 –

OUT2 –

n.c.

GND2

OUT2 +

n.c.

IN2 –

IN2 +

MCD381

FUNCTIONAL DESCRIPTION

The TDA7073A/AT are dual power driver circuits in a BTL

configuration, intended for use as a power driver for servo

systemswithasinglesupply.Theyareparticulardesigned

for compact disc players and are capable of driving focus,

tracking, sled functions and spindle motors.

Because of the BTL configuration, the devices can supply

a bi-directional DC current in the load, with only a single

supply voltage. The voltage gain is fixed by internal

feedback at 33.5 dB and the devices operate in a wide

supply voltage range (3 to 18 V). The devices can supply

a maximum output current of 0.6 A. The outputs can be

short-circuited over the load, to the supply and to ground

at all input conditions. The differential inputs can handle

common mode input voltages from ground level up to

(VP−2.2 V with a maximum of 10 V). The devices have a

very high slew rate. Due to the large bandwidth, they can

handle PWM signals up to 176 kHz.

1999 Aug 30 5

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).

Note

1. The outputs can be short-circuited over the load, to the supply and to ground at all input conditions.

THERMAL CHARACTERISTICS

Notes

1. TDA7073A: VP= 5 V; RL=8Ω; The typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO= 0.36 A and

Ptot =2×0.76 W = 1.52 W; Tamb (max) = 150 −1.52 ×50 = 74 °C.

2. TDA7073AT: VP= 5 V; RL=16Ω; typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO= 0.18 A and

Ptot =2×0.38 W = 0.76 W; Tamb (max) = 150 −0.76 ×95 = 77 °C.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPpositive supply voltage range −18 V

IORM repetitive peak output current −1A

OSM non repetitive peak output current −1.5 A

Ptot total power dissipation

TDA7073A Tamb <25°C−2.5 W

TDA7073AT Tamb <25°C−1.32 W

Tstg storage temperature range −55 +150 °C

Tvj virtual junction temperature −150 °C

Tsc short-circuit time see note 1 −1hr

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth (j-a) from junction to ambient

TDA7073A in free air; note 1 50 K/W

TDA7073AT in free air; note 2 95 K/W

1999 Aug 30 6

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

CHARACTERISTICS

VP= 5 V; f = 1 kHz; Tamb =25°C; unless otherwise speciﬁed (see Fig.3). TDA7073A: RL=8Ω; TDA7073AT: RL=16Ω.

Notes

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being

equal to the DC output offset voltage divided by RL.

2. The output voltage swing is typically limited to 2 ×(VP−2.1 V) (see Fig.4).

3. The noise output voltage (RMS value), unweighted (20 Hz to 20 kHz) is measured with RS= 500 Ω.

4. The ripple rejection is measured with RS=0Ωand f = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)

is applied to the positive supply rail.

5. The DC common mode voltage range is limited to (VP−2.2 V with a maximum of 10 V).

6. The common mode rejection ratio is measured at Vref = 1.4 V, VI(CM) = 200 mV and f = 1 kHz.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPpositive supply voltage range 3.0 5.0 18 V

IORM repetitive peak output current −−0.6 A

IPtotal quiescent current VP=5V; R

L=∞;

note 1 −816mA

∆V

OUT output voltage swing note 2 5.2 5.8 −V

THD total harmonic distortion

TDA7073A VOUT = 1 V (RMS) −0.3 −%

TDA7073AT VOUT = 1 V (RMS) −0.1 −%

Gvvoltage gain 32.5 33.5 34.5 dB

Vno(rms) noise output voltage (RMS value) note 3 −75 150 µV

B bandwidth −−1.5 MHz

SVRR supply voltage ripple rejection note 4 38 55 −dB

∆V16-13,12-9DC output offset voltage RS= 500 Ω−−100 mV

VI(CM) DC common mode voltage range note 5 0 −2.8 V

CMRR DC common mode rejection ratio note 6 −100 −dB

ZIinput impedance −100 −kΩ

Ibias input bias current −100 300 nA

αchannel separation 40 50 −dB

∆GVchannel unbalance −−1dB

SR slew rate −12 −V/µs

1999 Aug 30 7

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

APPLICATION INFORMATION

(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 5.

(2) RL can be: focus, tracking, sled function or spindle motor.

handbook, full pagewidth

500 Ω

driver signal 1

500 Ω

Vref

driver signal 2

SERVO SYSTEM

ground

MCD383

100 nF 220 µF

V = 5 V

(1)

(2)

I + i

I – i

TDA7073A

TDA7073AT

I + i

I – i

10 14

n.c.

3, 4, 8, 11, 15

ΙΙ

Fig.3 Test and application diagram.

1999 Aug 30 8

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

Fig.4 Typical output voltage swing over RL.

handbook, full pagewidth

+ (V – 2.1) V

– (V – 2.1) V

0 V

MCD380

1999 Aug 30 9

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

PACKAGE OUTLINES

UNIT A

max. 1 2 b1cEe M

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1 92-10-02

95-01-19

min. A

max. bmax.

1.40

1.14

0.055

0.045

0.53

0.38 0.32

0.23 21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

3.9

3.4

0.15

0.13

0.2542.54 7.62

0.30

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

2.2

0.087

4.7 0.51 3.7

0.15 0.021

0.015 0.013

0.009 0.010.100.0200.19

050G09 MO-001AE

(e )

seating plane

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1) (1)

D(1)

DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

1999 Aug 30 10

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

2.65 0.30

0.10 2.45

2.25 0.49

0.36 0.32

0.23 10.5

10.1 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT162-1

detail X

0.25

075E03 MS-013AA

pin 1 index

0.10 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.41

0.40 0.30

0.29 0.050

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

vMA

(A )

0 5 10 mm

scale

SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

95-01-24

97-05-22

1999 Aug 30 11

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

SOLDERING

Introduction

Thistextgivesaverybriefinsighttoacomplex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-holeandsurfacemountcomponentsaremixedon

one printed-circuit board. However, wave soldering is not

always suitable for surface mount ICs, or for printed-circuit

boards with high population densities. In these situations

reflow soldering is often used.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joints for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg(max)). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

MANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

tothe printed-circuit boardbyscreen printing, stencillingor

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

WAVE SOLDERING

Conventional single wave soldering is not recommended

forsurfacemount devices(SMDs) orprinted-circuitboards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackageswith leadson foursides,the footprintmust

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

MANUAL SOLDERING

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

1999 Aug 30 12

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

Suitability of IC packages for wave, reﬂow and dipping soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

MOUNTING PACKAGE SOLDERING METHOD

WAVE REFLOW(1) DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable(2) −suitable

Surface mount BGA, LFBGA, SQFP, TFBGA not suitable suitable −

HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,

SMS not suitable(3) suitable −

PLCC(4), SO, SOJ suitable suitable −

LQFP, QFP, TQFP not recommended(4)(5) suitable −

SSOP, TSSOP, VSO not recommended(6) suitable −

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

1999 Aug 30 13

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

NOTES

1999 Aug 30 14

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

NOTES

1999 Aug 30 15

Philips Semiconductors Product speciﬁcation

Dual BTL power driver TDA7073A; TDA7073AT

NOTES

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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999 67

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Printed in The Netherlands 545002/03/pp16 Date of release: 1999 Aug 30 Document order number: 9397 750 06375