4-97
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified
RFD15P05, RFD15P05SM,
RFP15P05 UNITS
Drain Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS -50 V
Drain Gate Voltage (RG = 20KΩ) (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR -50 V
Gate Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS ±20 V
Drain Current Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
D
Pulsed (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM -15
Refer to Peak Current Curve A
Single Pulse Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS Refer to UIS Curve
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD80 W
Derate above 25oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.533 W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ,T
STG -55 to 175 oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg 300
260
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ= 25oC to 150oC.
Electrical Specifications TC = 25oC, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BVDSS ID = 250µA, VGS = 0V (Figure 11) -50 - - V
Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 250µA -2.0 - -4.0 V
Zero Gate Voltage Drain Current IDSS VDS = Rated BVDSS ---1µA
VDS = 0.8 x Rated BVDSS, TC = 150oC--25µA
Gate to Source Leakage Current IGSS VGS = ±20V - - ±100 nA
Drain to Source On Resistance rDS(ON) ID = 15A, VGS = -10V (Figure 9) - - 0.150 Ω
Turn-On Time tON VDD = -25V, ID≈ 7.5A, RG = 12.5Ω,
RL = 3.3Ω, VGS = -10V
(Figures 16, 17)
- - 60 ns
Turn-On Delay Time tD(ON) -16 - ns
Rise Time tR-30 - ns
Turn-Off Delay Time tD(OFF) -50 - ns
Fall Time tF-20 - ns
Turn-Off Time tOFF - - 100 ns
Total Gate Charge QG(TOT) VGS = 0V to -20V VDD = -40V, ID = 15A,
RL = 2.67Ω,
IG(REF) = -0.65mA
(Figures 18, 19)
- - 150 nC
Gate Charge at -10V QG(-10) VGS = 0V to -10V - - 75 nC
Threshold Gate Charge QG(TH) VGS = 0V to -2V - - 3.5 nC
Input Capacitance CISS VDS = -25V, VGS = 0V
f = 1MHz (Figure 12) - 1150 - pF
Output Capacitance COSS - 300 - pF
Reverse Transfer Capacitance CRSS -56 - pF
Thermal Resistance Junction to Case RθJC TO-220AB, TO-251AA, TO-252AA - - 1.875 oC/W
Thermal Resistance Junction to Ambient RθJA TO-251AA, TO-252AA - - 100 oC/W
TO-220AB - - 62.5 oC/W
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage VSD ISD = -15A - - -1.5 V
Reverse Recovery Time tRR ISD = -15A, dISD/dt = -100A/µs - - 125 ns
NOTES:
2. Pulse test: pulse duration ≤ 300ms, duty cycle ≤ 2%.
3. Repetitive rating: pulse width limited by maximum junction temperature. See Transient Thermal Impedance curve (Figure 3).
RFD15P05, RFD15P05SM, RFP15P05