T4-LDS-0175-1, Rev. 1 (8/30/13) ©2013 Microsemi Corporation Page 1 of 4
2N3866(A)UB
Compliant
NPN Silicon High-Frequency Transistor
Qualified per MIL-PRF-19500/398
Quali f i ed Lev els:
JAN, JANT X, JANTXV
and JANS
DESCRIPTION
This 2N3866(A) silicon VHF-UHF am plifier transistor is military qualified up to the JANS level
for high-reliability applications. It is also available in a t op hat l eaded TO -205A D packag e.
UB Package
Also available in:
TO-205AD (T O-39)
package
(leaded)
2N3866(A)
Important: For the latest information, vis it our web site http://www.microsemi.com.
FEATURES
JEDEC registered 2N3866 number
JAN, JANTX, JANTXV and JANS qualifications also available per MIL-PRF-19500/398
RoHS com pliant
APPL ICAT IONS / BENEFITS
Ceramic UB package
Lightweight
Military and other high-reliability applications
MAXIMUM RATINGS @ TA = +25 °C unless otherwise noted
Parameter s / Tes t Conditions Symbol Value Unit
Junction & Stor age Temperature
TJ, Tstg
-65 to +200
°C
Thermal Resistance Junction-to-Case
RӨJC
60
ºC/W
Thermal Resistance Junction-to-Ambient
RӨJA
325
ºC/W
Collector Emitter Voltage
VCEO
30
V
Collector Base Voltage
VCBO
60
V
Emitter - Base Voltage
VEBO
3.5
V
Total P ower Dissipation (1)
PT
0.5
W
Collector Current
IC
0.4
A
Notes: 1. Derated linearly 3.08 mW/°C for TA > +25 °C
MSC Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
T4-LDS-0175-1, Rev. 1 (8/30/13) ©2013 Microsemi Corporation Page 2 of 4
2N3866(A)UB
M ECHANI CAL and PACKAGING
CASE: Ceramic.
TERMINALS: Gold plating over nickel under plate.
MARKING: Part number, date code, manufacturer’s ID.
TAPE & REEL opti on: Standard per EIA-418D. Cons ult factory for quantities.
WEIGHT: Less than 0.04 grams.
See Package Dimensions on last page.
PART NOME NCLAT URE
JAN 2N3866 (A) UB
Reliability Level
JAN = JAN lev el
JANTX = JANTX level
JANTXV = JANTXV level
JANS = JANS level
Blank = Commercial
Surface Mount package
Forward Cur rent Tr ansfer
Ratio selection option
JEDEC type number
SYMBOLS & DEFINITIONS
Symbol
Definition
I
B
Base cur rent: The val ue of the dc current into the base term inal.
IC
Collector current: The value of the dc c urrent into the coll ector terminal.
VBE
Base-emitter voltage: The dc voltage between the base and the emitter.
V
CB
Collector-base vol tage: The dc vol tage between the collector and the base.
VCBO Collector-base voltage, base open: The vol tage between the collec tor and base terminals when the emitter terminal is
open-circuited.
VCE
Collector-emitter voltage: The dc voltage between the collector and the emitter.
VCEO Collector-emitter voltage, base open: The voltage between the collector and the emitter terminal s when the base
terminal is open-circuited.
VCC
Collector-suppl y voltage: The supply voltage appl ied to a circuit connected to the col lector.
VEBO
Emitter-base voltage, collector open: The voltage between the emitter and base termi nals with the collector terminal
open-circuited.
T4-LDS-0175-1, Rev. 1 (8/30/13) ©2013 Microsemi Corporation Page 3 of 4
2N3866(A)UB
ELECTRICAL CHARACTE RISTICS @ TA = +2 5 °C, unles s otherwis e not ed
Characteristics
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Collector-Emit ter Breakdown Voltage
IC = 5 mA
V(BR)CEO
30
V
Collector-Base Breakdown Vol tage
IC = 10 0 µA
V(BR)CBO
60
V
Emitter-Base Break down Volt age
IE = 10 0 µA
V(BR)EBO
3.5
V
Collector-Emit ter Cut off Current
VCE = 28 V
ICEO
20 µA
Collector-Emit ter Cut off Current
VCE = 55 V
ICES1 100 µA
ON CHARACTERISTICS (1)
Forward-Current Transfer Ratio
IC = 50 mA, VCE = 5.0 V
IC = 360 mA, VCE = 5.0 V
2N3866UB
2N3866AUB
2N3866UB
2N3866AUB
hFE
15
25
5
8
200
200
Collector-Emitter Saturation Voltage
IC = 100 mA, IB = 10 mA
VCE(sat) 1.0 V
Collector-Emit ter Cut off CurrentHigh Tem p Operation
VCE = 55 V, TA = +150 ºC ICES2 2.0 mA
Forward-Current Transfer Ratio
L ow Tem perat ure Op er ation
VCE = 5. 0 V, IC = 50 mA,
TA
= -55
ºC
2N3866UB
2N3866AUB
hFE3
7
12
DYNAMIC CHARACTERISTICS
Magn itude of Common Emitter Small-
Si gna l Sho r t-Circuit Forward Current
Trans fer Ratio
IC = 50 mA, VCE = 15 V, f = 200 MHz
2N3866UB
2N3866AUB |hFE|
2.5
4.0
8.0
7.5
O utput Capac itance
VCB = 28 V, IE = 0, 100 kHzf 1.0 MHz
Cobo 3.5 pF
POWER OUTPUT CHARACTERISTICS
Power Output
VCC = 28 V; Pin = 0.15 W; f = 400 MH z *
VCC = 28 V; Pin = 0.07 5 W; f = 40 0 MHz *
* See Figur e 4 on MIL-PRF-19500/398
P1out
P2out 1.0
0.5 2.0
W
Collector Efficiency
VCC = 28 V; Pin = 0.15 W; f = 4 00 MHz
VCC = 28 V; Pin = 0.07 5 W; f = 40 0 MHz
n1
n2 45
40 %
Clamp In du c tive
Collector-Emit ter Breakdown Voltage
VBE = -1.5 V, IC = 40 mA V(BR)CEX 55 Vdc
(1) Pulse Test: pulse width = 300 µs, duty cycle 2.0%
T4-LDS-0175-1, Rev. 1 (8/30/13) ©2013 Microsemi Corporation Page 4 of 4
2N3866(A)UB
PACKAGE DIM ENSIONS
Symbol
Dimensions
Note Symbol
Dimensions
Note
inch
millimeters
inch
millimeters
Min
Max
Min
Max
Min
Max
Min
Max
BH
0.046
0.056
1.17
1.42
LS1
0.035
0.040
0.89
1.02
BL
0.115
0.128
2.92
3.25
LS2
0.071
0.079
1.80
2.01
BW
0.085
0.108
2.16
2.74
LW
0.016
0.024
0.41
0.61
CL
-
0.128
-
3.25
r
-
0.008
-
0.20
CW
-
0.108
-
2.74
r1
-
0.012
-
0.31
LL1
0.022
0.038
0.56
0.96
r2
-
0.022
-
0.56
LL2
0.017
0.035
0.43
0.89
NOTES:
1. Dimensions are in inches. Millimeters are given for information only.
2. Hatched areas on package denote metallized areas.
3. Lid material: Kovar.
4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid.
5. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.