S15DLW - S15MLW
Taiwan Semiconductor
1 Version:A1610
1.5A, 200V - 1000V Surface Mount Rectifiers
FEATURES
Ideal for automated placement
Compact package size
High surge current capability
Low power loss, high efficiency
Compliant to RoHS Directive 2011/65/EU and in
accordance to WEEE 2002/96/EC
Halogen-free according to IEC 61249-2-21 definition
APPLICATIONS
High frequency rectification
Freewheeling application
Switching mode converters and inverters in
computer,automotive and telecommunication.
MECHANICAL DATA
Case: SOD-123W
Molding compound meets UL 94V-0 flammability rating
Moisture sensitivity level: level 1, per J-STD-020
Part no. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound
(halogen-free)
Terminal: Matte tin plated leads, solderable per J-STD-
002
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 19mg (approximately)
KEY PARAMETERS
PARAMETER
VALUE
UNIT
IF(AV)
1.5
A
VRRM
200 - 1000
V
IFSM
50
A
TJ MAX
175
°C
Package
SOD-123W
Configuration
Single die
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
SYMBOL
S15
DLW
S15
GLW
S15
JLW
S15
KLW
S15
MLW
UNIT
15
DLW
15
GLW
15
JLW
15
KLW
15
MLW
VRRM
200
400
600
800
1000
V
VR(RMS)
140
280
420
560
700
V
VDC
200
400
600
800
1000
V
IF(AV)
1.5
A
IFSM
50
A
TJ
-55 to +175
°C
TSTG
-55 to +175
°C
SOD-123W
S15DLW - S15MLW
Taiwan Semiconductor
2 Version:A1610
THERMAL PERFORMANCE
PARAMETER
SYMBOL
LIMIT
UNIT
Junction-to-lead thermal resistance
RӨJL
29
°C/W
Junction-to-ambient thermal resistance
RӨJA
85
°C/W
Junction-to-case thermal resistance
RӨJC
31
°C/W
Thermal Performance Note: Units mounted on recommended PCB (5mm*5mm Cu pad test board)
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
CONDITIONS
SYMBOL
TYP
MAX
UNIT
Forward voltage per diode (1)
IF = 1A, TJ = 25°C
VF
0.94
1.05
V
IF = 1.5A, TJ = 25°C
0.98
1.1
V
IF = 1A, TJ = 125°C
0.81
1
V
IF = 1.5A, TJ = 125°C
0.87
1.05
V
Reverse current @ rated VR per diode (2)
TJ = 25°C
IR
0.06
1
µA
TJ = 125°C
6.06
100
µA
Junction Capacitance
1 MHz, VR=4.0V
CJ
10
-
ρF
Notes:
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms
ORDERING INFORMATION
PART NO.
PART NO.
SUFFIX
PACKING
CODE
PACKING CODE
SUFFIX
PACKAGE
PACKING
S15xLW
(Note 1,2)
H
RV
G
SOD-123W
3,000 / 7" Reel
RQ
SOD-123W
10,000 / 13" Reel
Notes:
1. "x" defines voltage from 200V (S15DLW) to 1000V (S15MLW)
2. Whole series with green compound (halogen-free)
EXAMPLE P/N
EXAMPLE P/N
PART NO.
PART NO.
SUFFIX
PACKING
CODE
PACKING CODE
SUFFIX
DESCRIPTION
S15MLWHRVG
S15MLW
H
RV
G
AEC-Q101 qualified
Green compound
S15DLW - S15MLW
Taiwan Semiconductor
3 Version:A1610
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
Fig.2 Typical Junction Capacitance
Fig.3 Typical Reverse Characteristics
Fig.4 Typical Forward Characteristics
0
0.5
1
1.5
2
30 60 90 120 150
AVERAGE FORWARD CURRENT (A)
CASE TEMPERATURE (°C)
Resistive or
inductive load
with heat sink
0.1
1
10
100
110 100
CAPACITANCE (pF) A
REVERSE VOLTAGE (V)
f=1.0MHz
Vsig=50mVp-p
0.001
0.01
0.1
1
10
100
10 20 30 40 50 60 70 80 90 100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
TJ=25°C
TJ=125°C
0.1
1
10
100
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
Pulse width 300μs
1% duty cycle
TJ=25°C
TJ=125°C
INSTANTANEOUS REVERSE CURRENT (μA)
S15DLW - S15MLW
Taiwan Semiconductor
4 Version:A1610
PACKAGE OUTLINE DIMENSIONS
SOD-123W
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
B
1.70
1.90
0.067
0.075
C
2.60
2.90
0.102
0.114
D
0.10
0.22
0.004
0.009
E
0.90
1.02
0.035
0.040
F
0.90
1.05
0.035
0.041
G
3.60
3.80
0.142
0.150
H
0.50
0.85
0.020
0.033
I
0.00
0.10
0.000
0.004
Symbol
Unit (mm)
Unit (inch)
A
1.4
0.055
B
1.2
0.047
C
3.1
0.122
D
1.9
0.075
E
4.3
0.169
P/N
= Marking Code
G
= Green Compound
YW
= Date Code
F
= Factory Code
S15DLW - S15MLW
Taiwan Semiconductor
5 Version:A1610
Notice
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assumes no responsibility or liability for any errors or inaccuracies.
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