DS36277
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SNLS086E –JULY 1998–REVISED APRIL 2013
Dominant Mode Multipoint Transceiver
Check for Samples: DS36277
1FEATURES DESCRIPTION
The DS36277 Dominant Mode Multipoint Transceiver
2• FAILSAFE Receiver, RO = HIGH for: is designed for use on bi-directional differential
– OPEN Inputs busses. It is optimal for use on Interfaces that utilize
– Terminated Inputs Society of Automotive Engineers (SAE) J1708
Electrical Standard.
– SHORTED Inputs
• Optimal for Use in SAE J1708 Interfaces The device is similar to standard TIA/EIA-485
transceivers, but differs in enabling scheme. The
• Compatible with Popular Interface Standards: Driver's Input is normally externally tied LOW, thus
– TIA/EIA-485 and TIA/EIA-422-A providing only two states: Active (LOW), or Disabled
– CCITT Recommendation V.11 (OFF). When the driver is active, the dominant mode
is LOW, conversely, when the driver is disabled, the
• Bi-Directional Transceiver bus is pulled HIGH by external bias resistors.
– Designed for Multipoint Transmission The receiver provides a FAILSAFE feature that
• Wide Bus Common Mode Range ensures a known output state when the Interface is in
– (−7V to +12V) the following conditions: Floating Line, Idle Line (no
• Available in PDIP and SOIC Packages active drivers), and Line Fault Conditions (open or
short). The receiver output is HIGH for the following
conditions: Open Inputs, Terminated Inputs (50Ω), or
Shorted Inputs. FAILSAFE is a highly desirable
feature when the transceivers are used with
Asynchronous Controllers such as UARTs.
Connection and Logic Diagram
See Package Number D (R-PDSO-G8)
or
P (R-PDIP-T8)
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1998–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DS36277
SNLS086E –JULY 1998–REVISED APRIL 2013
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Truth Table
Driver
Inputs Outputs
DE DI DO/RI DO /RI
L L L H
L H H L
H X Z Z
Receiver
Inputs Output
RE DO/RI–DO /RI RO
L≥0 mV H
L≤ −500 mV L
L SHORTED H
L OPEN H
H X Z
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Value Unit
Supply Voltage (VCC) 7 V
Input Voltage (DE , RE , and DI) 5.5 V
Driver Output Voltage/Receiver Input Voltage −10V to +15 V
Receiver Output Voltage (RO) 5.5 V
Maximum Package Power Dissipation @ +25°C P Package
(derate 9.3 mW/°C above +25°C) 1168 mW
D Package
(derate 5.8 mW/°C above +25°C) 726 mW
Storage Temperature Range −65°C to +150 °C
Lead Temperature (Soldering 4 sec.) 260 °C
ESD Rating (HBM, 1.5 kΩ, 100 pF) 7.0 kV
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be specified. They are not meant to imply
that the devices should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Recommended Operating Conditions Min Max Units
Supply Voltage, VCC 4.75 5.25 V
Bus Voltage −7 +12 V
Operating Temperature (TA) DS36277T −40 +85 °C
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Electrical Characteristics(1)(2)
Over recommended Supply Voltage and Operating Temperature ranges, unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
DRIVER CHARACTERISTICS
VOD Differential Output Voltage IO= 0 mA (No Load) 1.5 3.6 6 V
VoDO Output Voltage IO= 0 mA (Output to GND) 0 6 V
VoDO Output Voltage 0 6 V
VT1 Differential Output Voltage RL= 54Ω(485) (Figure 1) 1.3 2.2 5.0 V
(Termination Load) RL= 100Ω(422) 1.7 2.6 5.0 V
ΔVT1 Balance of VT1 RL= 54ΩSee(3) −0.2 0.2 V
|VT1 −VT1 |RL= 100Ω −0.2 0.2 V
VOS Driver Common Mode RL= 54Ω(Figure 1) 0 2.5 3.0 V
Output Voltage RL= 100Ω0 2.5 3.0 V
ΔVOS Balance of VOS RL= 54ΩSee(3) −0.2 0.2 V
|VOS −VOS |RL= 100Ω −0.2 0.2 V
VOH Output Voltage High IOH =−22 mA (Figure 2) 2.7 3.7 V
VOL Output Voltage Low IOL = +22 mA 1.3 2 V
IOSD Driver Short-Circuit VO= +12V (Figure 3) 92 290 mA
Output Current VO=−7V −187 −290 mA
RECEIVER CHARACTERISTICS
VTH Differential Input High VO= VOH, IO=−0.4 mA −0.150 0 V
Threshold Voltage(4) −7V ≤VCM ≤+12V
VTL Differential Input Low VO= VOL, IO= 8.0 mA −0.5 −0.230 V
Threshold Voltage(4) −7V ≤VCM ≤+12V
VHST Hysteresis(5) VCM = 0V 80 mV
IIN Line Input Current Other Input = 0V VI= +12V 0.5 1.5 mA
(VCC = 4.75V, 5.25V, 0V) DE = VIH(6) VI=−7V −0.5 −1.5 mA
IOSR Short Circuit Current VO= 0V RO −15 −32 −85 mA
IOZ TRI-STATE Leakage Current VO= 0.4 to 2.4V −20 1.4 +20 μA
VOH Output High Voltage VID = 0V, IOH =−0.4 mA 2.3 3.7 V
(Figure 12)VID = OPEN, IOH =−0.4 mA 2.3 3.7 V
VOL Output Low Voltage VID =−0.5V, IOL = +8 mA 0.3 0.7 V
(Figure 12)VID =−0.5V, IOL = +16 mA 0.3 0.8 V
RIN Input Resistance 10 20 kΩ
DEVICE CHARACTERISTICS
VIH High Level Input Voltage DE , 2.0 VCC V
RE ,
VIL Low Level Input Voltage GND 0.8 V
or
IIH High Level Input Current VIH = 2.4V 20 μA
DI
IIL Low Level Input Current VIL = 0.4V −100 μA
VCL Input Clamp Voltage ICL =−18 mA −0.7 −1.5 V
ICC Output Low Voltage DE = 0V, RE = 0V, DI = 0V 39 60 mA
Supply Current
ICCR DE = 3V, RE = 0V, DI = 0V 24 50 mA
(No Load)
ICCD DE = 0V, RE = 3V, DI = 0V 40 75 mA
ICCX DE = 3V, RE = 3V, DI = 0V 27 45 mA
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
unless otherwise specified.
(2) All typicals are given for VCC = 5.0V and TA= +25°C.
(3) Δ|VT1| and Δ|VOS| are changes in magnitude of VT1 and VOS, respectively, that occur when the input changes state.
(4) Threshold parameter limits specified as an algebraic value rather than by magnitude.
(5) Hysteresis defined as VHST = VTH −VTL.
(6) IIN includes the receiver input current and driver TRI-STATE leakage current.
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Switching Characteristics(1)
Over recommended Supply Voltage and Operating Temperature ranges, unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
DRIVER CHARACTERISTICS
tPLHD Diff. Prop. Delay Low to High RL= 54Ω8 17 60 ns
tPHLD Diff. Prop. Delay High to Low CL= 50 pF 8 19 60 ns
tSKD Diff. Skew (|tPLHD–tPHLD|) CD= 50 pF 2 10 ns
trDiff. Rise Time (Figure 4 and Figure 5) 11 60 ns
tfDiff. Fall Time 11 60 ns
tPLH Prop. Delay Low to High RL= 27Ω, CL= 15 pF 22 85 ns
(Figure 6 and Figure 7)
tPHL Prop. Delay High to Low 25 85 ns
tPZH Enable Time Z to High RL= 110Ω25 60 ns
CL= 50 pF
tPZL Enable Time Z to Low 30 60 ns
(Figure 8 –Figure 11 )
tPHZ Disable Time High to Z 16 60 ns
tPLZ Disable Time Low to Z 11 60 ns
RECEIVER CHARACTERISTICS
tPLH Prop. Delay Low to High VID =−1.5V to +1.5V 15 37 90 ns
CL= 15 pF
tPHL Prop. Delay High to Low 15 43 90 ns
(Figure 13 and Figure 14)
tSK Skew (|tPLH–tPHL|) 6 15 ns
tPZH Enable Time Z to High CL= 15 pF 12 60 ns
(Figure 15 and Figure 16)
tPZL Enable Time Z to Low 28 60 ns
tPHZ Disable Time High to Z 20 60 ns
tPLZ Disable Time Low to Z 10 60 ns
(1) All typicals are given for VCC = 5.0V and TA= +25°C.
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PARAMETER MEASUREMENT INFORMATION
Figure 1. Driver VT1 and VOS Test Circuit
Figure 2. Driver VOH and VOL Test Circuit
Figure 3. Driver Short Circuit Test Circuit
CLincludes probe and stray capacitance
The input pulse is supplied by a generator having the following characteristics: f=1.0 MHz, 50% duty cycle, Trand
tf<6.0 ns, Zo=50Ω
Figure 4. Driver Differential Propagation Delay and Transition Time Test Circuit
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Figure 5. Driver Differential Propagation Delays and Transition Times
CLincludes probe and stray capacitance
The input pulse is supplied by a generator having the following characteristics: f=1.0 MHz, 50% duty cycle, Trand
tf<6.0 ns, Zo=50Ω
Figure 6. Driver Propagation Delay Test Circuit
Figure 7. Driver Propagation Delays
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S1 to DO for DI = 3V
S1 to DO for DI = 0V
CLincludes probe and stray capacitance
The input pulse is supplied by a generator having the following characteristics: f=1.0 MHz, 50% duty cycle, Trand
tf<6.0 ns, Zo=50Ω
Figure 8. Driver TRl-STATE Test Circuit (tPZH, tPHZ)
Figure 9. Driver TRI-STATE Delays (tPZH, tPHZ)
S1 to DO for DI = 0V
S1 to DO for DI = 3V
CLincludes probe and stray capacitance
The input pulse is supplied by a generator having the following characteristics: f=1.0 MHz, 50% duty cycle, Trand
tf<6.0 ns, Zo=50Ω
Figure 10. Driver TRI-STATE Test Circuit (tPZL, tPLZ)
Figure 11. Driver TRl-STATE Delays (tPZL, tPLZ)
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Figure 12. Receiver VOH and VOL
CL includes probe and stray capacitance
The input pulse is supplied by a generator having the following characteristics: f=1.0 MHz, 50% duty cycle, Trand
tf<6.0 ns, Zo=50Ω
Figure 13. Receiver Propagation Delay Test Circuit
Figure 14. Receiver Propagation Delays
CLincludes probe and stray capacitance
The input pulse is supplied by a generator having the following characteristics: f=1.0 MHz, 50% duty cycle, Trand
tf<6.0 ns, Zo=50Ω
Diodes are 1N916 or equivalent.
Figure 15. Receiver TRI-STATE Delay Test Circuit
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S1 1.5V
S2 OPEN
S3 CLOSED
S1 1.5V
S2 CLOSED
S3 CLOSED
S1 −1.5V
S2 CLOSED
S3 OPEN
S1 −1.5V
S2 CLOSED
S3 CLOSED
Figure 16. Receiver Enable and Disable Timing
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Typical Performance Characteristics
Differential Output Voltage Differential Output Voltage
vs Output Current vs Output Current
Figure 17. Figure 18.
Driver VOH Driver VOH
vs vs
IOH IOH
vs vs
VCC Temperature
Figure 19. Figure 20.
Driver VOL Driver VOL
vs vs
IOL IOL
vs vs
VCC Temperature
Figure 21. Figure 22.
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Typical Performance Characteristics (continued)
Receiver VOH Receiver VOH
vs vs
IOH IOH
vs vs
VCC Temperature
Figure 23. Figure 24.
Receiver VOL Receiver VOL
vs vs
IOL IOL
vs vs
VCC Temperature
Figure 25. Figure 26.
Supply Current Supply Current
vs vs
Supply Voltage Temperature
Figure 27. Figure 28.
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Typical Performance Characteristics (continued)
Voltage Output
vs
Voltage Input (Hysteresis)
Figure 29.
TYPICAL APPLICATIONS INFORMATION
Figure 30. SAE J1708 Node with External Bias Resistors and Filters
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REVISION HISTORY
Changes from Revision D (April 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 12
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PACKAGE OPTION ADDENDUM
www.ti.com 7-Oct-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DS36277TMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS362
77TM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS36277TMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Oct-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS36277TMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
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