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SCOTTSDALE DIVISION
IN4099UR-1 thru 1N4135UR-1
(or MLL4099-1 thru MLL4135-1)
and
1N4614UR-1 thru 1N4627UR-1
or MLL4614-1 thru MLL4627-1
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 0.5 WATT ZENERS
DESCRIPTION APPEARANCE
The 1N4099UR-1 thru 1N4135UR-1 and 1N4 614UR-1 thru 1N4627UR-1
series of 0.5 watt glass surface mount DO-213AA Zen er voltage reg ulators
provides a selection from 1.8 to 100 volts in stan dard 5% tolerances as well
as tighter tolerances identified by different suffix letters on the pa rt number.
These have an internal-metallurgical-bond option as identified with the “-1”
suffix. This type of internally bonded Zener package construction is also
available in JAN, JANTX, and JANTXV military qualifications. Microsemi
also offers numerous other Zener produ cts to meet higher and lower power
applications.
DO-213AA
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES APPLIC ATIONS / BENEFITS
• Surface mount equivalent to JEDEC registered 1N4099
thru 1N4135 and 1N4614 thru 1N4627 series
• Internal metallurgical bond with the “-1” suffix
• Nonbonded types also available without the “-1” suffix
for both the axial and surface mount packages (see
separate data sheets)
• DO-7 or DO-35 glass body axial-leaded Zener
equivalents also availab le per JEDEC registration with
part numbers 1N4099 thru 1N413 5 and 1N4614 thru
1N4627 on separate data she ets
• RoHS Compliant devices avai lable by adding “e3” suffix
• Regulates voltage over a broad op erating current and
temperature range
• Extensive selection from 1.8 to 100 V
• Standard voltage tolerances are plus/minus 5% with
no suffix
• Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
• Hermetically sealed surface mount package
• Nonsensitive to ESD per MIL-STD-750 Method 1020
• Minimal capacitance (see Figure 3)
• Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RAT ING S MECHANICAL AND PACKAGING
• Operating and Storage temperature: -65ºC to +175ºC
• Thermal Resistance: 100 ºC/W junction to e nd cap, or
250ºC/W junction to ambient when mounted on FR4 PC
board (1 oz Cu) with recommended footprint (see last
page)
• Steady-State Power: 0.5 watts at end cap temperature
TEC < 125oC or at ambient TA < 50ºC when mounted on
FR4 PC board as described for thermal resistance
above (see Figure 2 for derating)
• Forward voltage @200 mA: 1.1 volts
• Solder Temperatures: 260 ºC for 10 s (max)
• CASE: Hermetically sealed glass DO-213AA (SOD80
or MLL34) MELF style package
• FINISH: End caps Tin-lead (Sn/Pb) or RoHS
Compliant annealed matte-Tin plating solderable per
MIL-STD-750, method 2026
• POLARITY: Cathode indicated b y band where diode
is to be operated with the banded e nd positive with
respect to the opposite end for Zener regulation
• MARKING: cathode band only
• TAPE & REEL option: Standard per EIA-481-1-A with
12 mm tape, 2000 per 7 inch reel or 5000 per 13 inch
reel (add “TR” suffix to part number)
• WEIGHT: 0.04 grams
• See package dimensions on l ast page
1N4099UR-1–1N4135UR-1
1N4614UR-1
1N4627UR-1
e3
Microsemi
Scottsdale Division Page 1
Copyright © 2006
3-30-06 REV D 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503