KSZ9031MNX
Gigabit Ethernet Transceiver
with GMII/MII Support
Revision 2.2
LinkMD is a registered trademark of Micrel, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
May
14, 2015
Revision 2.2
General Description
The KSZ9031MNX is a completely integrated triple-speed
(10Base-T/100Base-TX/1000Base-T) Ethernet physical-
la yer trans ceiver for trans mission and rec eption of data on
standard CAT -5 unshielded twisted pair (UTP) cable.
The KSZ9031MNX offers the industry-standard GMII/MII
(Gigabit Me dia Indepe ndent Inter face / Med ia Indepen dent
Interface) for connection to GMII/MII MACs in Gigabit
Ethernet processors and switches for data transfer at
1000Mbps or 10/100Mbps.
The KSZ9031MNX reduces board cost and simplifies
board layout by using on-chip termination resistors for the
four differential pairs and by integrating an LDO controller
to drive a low-cost MOSFET to supply the 1.2V core.
The KSZ9031MNX offers diagnostic features to facilitate
system bring-up and debugging in production testing and
in product deployment. Parametric NAND tree support
enables fault detection between KSZ9031MNX I/Os and
the board. The LinkMD® TDR-based cable diagnostic
identifies fault y copp er cabl ing. Remote an d l ocal loo pback
functions verify analog and dig ita l data paths .
The KSZ9031MNX is available in a 64-pin, lead-free QFN
package (see Ordering Information).
Data sheets and support documentation are available on
Micrel’s web site at: www.micrel.com.
Features
Single-chip 10/100/ 1000Mbps IEEE 802.3 compliant
Ethernet transceiver
GMII/MII standard interface with 3.3V/2.5V/1.8V tolerant
I/Os
Auto-negotiation to automatically select the highest link-
up speed (10/100/1000Mbps) and duplex (half/full)
On-chip termination resistors for the differential pairs
On-chip LDO controller to support single 3.3V supply
operation requires only one external FET to generate
1.2V for the core
Jumbo frame support up to 16KB
125MHz reference clock output
Energy-detect power-down m ode for reduced power
consumption when the cable is not attached
Energ y Efficient Ethernet (EEE) support with low-power
idle (LPI) mode and clock stoppage for 100Base-TX/
1000Base-T and transmit amplitude reduction with
10Base-Te option
Wake-On-LAN (WOL) support with robust custom-
packet detection
Functional Diagram
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Revision 2.2
Features (Continued)
Programmable LED outputs for link, activity, and
speed
Baseline wander correction
LinkMD TDR-based cable diagnostic to identify faulty
copper cabling
Parametric NAND tree support to detect faults
between chip I/Os and board.
Loopback modes for diagnostics
Automatic MDI/MDI-X crossover to detect and correct
pair swap at all speeds of operation
Automatic detection and correction of pair swaps, pair
skew, and pair polarity
MDC/MDIO management interface for PHY register
configuration
Interrupt pin option
Power-d o wn and pow er-saving modes
Operating voltages
Core (DVDDL, AVDDL, AVDDL_PLL):
1.2V (external FET or regulator)
VDD I/O (DVDDH):
3.3V, 2.5V, or 1.8V
Transceiver (AVDDH):
3.3V or 2.5V (commercial temp)
Available in a 64-pin QFN (8mm × 8mm) package
Applications
Laser/Network printer
Network attached storage (NAS)
Network server
Broadband gateway
Gigabit SOHO/SMB router
IPTV
IP set-top box
Game console
IP camera
Triple-play (data, voic e, vid eo) media center
Media converter
Ordering Information
Part Number Temperature
Range
Package Lead
Finish
Wire
Bonding
Description
KSZ9031MNXCA 0°C to 70°C 64-Pin QFN Pb-Free Gold GMII/MII, Commercial Temperature,
Gold Wir e Bonding
KSZ9031MNXCC(1) 0°C to 70°C 64-Pin QFN Pb-Free Copper GMII/MII, Commercial Temperature,
Copper Wire Bonding
KSZ9031MNXIA(1) 40°C to 85°C 64-Pin QFN Pb-Free Gold GMII/MII, Industrial Temperature,
Gold Wir e Bonding
KSZ9031MNXIC(1) 40°C to 85°C 64-Pin QFN Pb-Free Copper GMII/MII, Industrial Temperature,
Copper Wire Bonding
KSZ9031MNX-EVAL 0°C to 70°C 64-Pin QFN Pb-Free KSZ9031MNX Evaluation Board
(M ounted with KSZ9031MNX device in commercial
temperature)
Note:
1. Contact factory for availability
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KSZ9031MNX
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Revision 2.2
Revision History
Revision Date Summary of Changes
1.0 10/31/12 Data sheet created.
2.0 07/31/13
Updated Functional Diagram with “P ME_N” signal.
Indicated pin type is not an open-drain for PME_N1 (Pin 19) and INT_N/PME_N2 (Pin 53)
Deleted TSLP package height from Package Inform ation(10) and Recommended Landing Pattern.
Added typic al series resistance and load capacitance for crystal selection criteria.
Corrected register definition for override strap-in for LED_MODE in MMD Address 2h, Register
0h.
Clarified register description for software power-down bit (Register 0h, Bit [11]).
2.1 03/02/15
Clarified power cycling specification to have all supply voltages to the KSZ9031MNX reach less
than 0.4V before the next power-up cycle.
Corrected Package Information(10) and Recommended Landing Pattern for 64-pin (8mm × 8mm)
QFN. Thi s i s a datasheet correction. There is no change to the 64-pin (8mm × 8mm) QFN
package.
2.2 5/14/15
Added more details for XI (25MHz reference clock) input specification to Reference Clock
Connection and Selection section.
Added note in Standard Register 0h, Bit [12] to indicate when Auto-Negotiation is disabled, Auto
MDI-X is also automat ica lly dis able d.
Added note in 10Base-T Receive section that all 7 bytes of preamble are removed.
Added instruction in Regis ter 9h, Bits [15:13] to enable 1000Base-T Test Mode.
Added descri ption in Auto-Negotiat ion T iming section to change FLP timing from 8ms to 16ms.
Added MMD Address 0h, Registers 3h and 4h for FLP timing.
Specified m aximum frequenc y (minimum clock period) for MDC clock.
Updated input leakage current for the digital input pins in Electrical Characteristics(10) section.
Added minimum output currents for the digital output pins in Electrical Charac teristics(10) section.
Corrected output drive current for LED1 and LED2 pins in Electrical Characteristics(10) section.
Updated Reset Circui t section and added reset circuit with MIC826 Voltage Supervisor.
Clarified LED indication support for 1.8V DVDDH requires voltage level shifters.
Added 10/100Mbps Speeds only section.
Added section for MOSFET selection for optional on-chip LDO controller.
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Revision 2.2
Contents
General Description ................................................................................................................................................................ 1
Features .................................................................................................................................................................................. 1
Functional Diagram ................................................................................................................................................................. 1
Applications ............................................................................................................................................................................. 2
Ordering Inf ormation ............................................................................................................................................................... 2
Revision History ...................................................................................................................................................................... 3
Contents .................................................................................................................................................................................. 4
List of Figures .......................................................................................................................................................................... 7
List of Tables ........................................................................................................................................................................... 8
Pin Configuration ..................................................................................................................................................................... 9
Pin Description ...................................................................................................................................................................... 10
Strapping Options ................................................................................................................................................................. 17
Functional Overview .............................................................................................................................................................. 18
Functional Description: 10Base-T/100Base-TX Transceiver ................................................................................................ 19
100Base-TX Trans m i t 19
100Base-TX Receive 19
Scrambler/De-Scrambler (100Base-TX only) 19
10Base-T Transmit 19
10Base-T Receive 19
Functional Description: 1000Base-T Transceiver ................................................................................................................. 20
Analog Echo-Cancellation Circuit 20
Automatic Gain Control (AGC) 20
Analog-to-Digital Converter (ADC) 21
Timing Recovery Circuit 21
Adaptive Equalizer 21
Trellis Encoder and Decoder 21
Functional Description: Additional 10/100/1000 PHY Features ............................................................................................ 22
Pair-Swap, Alignment, and Polarity Check 22
Wave Shaping, Slew-Rate Control, and Partial Response 22
PLL Clock Synthesizer 22
Auto-Negotiation ................................................................................................................................................................... 23
10/100Mbps Speeds only ...................................................................................................................................................... 24
GMII Interface........................................................................................................................................................................ 25
GMII Signal Definition 26
GMII Signal Diagram 26
MII Interface .......................................................................................................................................................................... 27
MII Signal Definition 28
MII Signal Diagram 28
MII Management (MIIM) Interface ......................................................................................................................................... 29
Interrupt (INT_N) ................................................................................................................................................................... 30
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Revision 2.2
LED Mode ............................................................................................................................................................................. 30
Single-LED Mode 30
Tri-Color Dual-LED Mode 30
Loopback Mode ..................................................................................................................................................................... 31
Local (Digital) Loopback 31
Remote (Analog) Loop ba ck 32
LinkMD® Cab le Dia gnos t ic .................................................................................................................................................... 33
NAND Tree Support .............................................................................................................................................................. 33
Power Management .............................................................................................................................................................. 34
Energy-Detect Power-Down Mode 34
Software Power-Down Mode 34
Chip Power-Down Mode 34
Energy Efficient Ethernet (EEE) ............................................................................................................................................ 35
Transmit Direction Control (MAC-to-PHY) 36
Receive Direc tion Control (PHY-to-MAC) 37
Registers As sociated with EEE 37
Wake-On-LAN ....................................................................................................................................................................... 38
Magic-Packet Detection 38
Customized-Pac ket Detection 38
Link Status Change Detection 39
Typical Current/Power Consumption .................................................................................................................................... 40
Register Map ......................................................................................................................................................................... 42
IEEE-Defined Regis ters 42
Vendor-Specific R egisters 42
Standard Reg is ters ............................................................................................................................................................... 45
IEEE Defined Registers Descriptions 45
Vendor-Specific R egisters Descriptions 53
MMD Registers...................................................................................................................................................................... 56
MMD Registers Descriptions 57
Absolute Maximum Ratings .................................................................................................................................................. 66
Operating Ratings ................................................................................................................................................................. 66
Electrical Characteristics ....................................................................................................................................................... 66
Timing Diagrams ................................................................................................................................................................... 70
GMII Transmit Timing 70
GMII Receive Timing 71
MII Transmit Timing 72
MII Receive Timing 73
Auto-Negotiation Timing 74
MDC/MDIO Timing 75
Power-Up/Power-Down/Reset T iming 76
Reset Circuit .......................................................................................................................................................................... 77
Reference Circuits LED S tr ap-In Pins ................................................................................................................................ 78
Reference Clock Connection and Selection ...................................................................................................................... 79
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Revision 2.2
On-chip LDO Contr ol ler MOSFET Selection ...................................................................................................................... 79
Magnetic Connection and Selection .................................................................................................................................. 80
Package Information and Recommended Landing Pattern .................................................................................................. 82
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Revision 2.2
List of Figures
Figure 1. KSZ9031MNX Bl oc k Diagram .............................................................................................................................. 18
Figure 2. KSZ9031MNX 1000Base-T Block Diagram Single Channel ............................................................................. 20
Figure 3. Auto-Negotiation Flow Chart ................................................................................................................................. 23
Figure 4. KSZ9031MNX GMII Interface ............................................................................................................................... 26
Figure 5. KSZ9031MNX MII Interface .................................................................................................................................. 28
Figure 6. Local (Digital) Loopback ....................................................................................................................................... 31
Figure 7. Remote (Analog) Loopback .................................................................................................................................. 32
Figure 8. LPI Mode (Refresh Transmissions and Quiet Periods) ........................................................................................ 35
Figure 9. LPI Transition GMII (1000Mbps) Transmit ........................................................................................................ 36
Figure 10. LPI Transition MII (100Mbps) Transmit ........................................................................................................... 36
Figure 11. LPI Transition GMII (1000Mbps) Receive ....................................................................................................... 37
Figure 12. LPI Transition MII (100Mbps) Receive ............................................................................................................ 37
Figure 13. GMII Transmit Timing Dat a Input to PH Y ........................................................................................................ 70
Figure 14. GMII Receive Timing Data Input to MAC ........................................................................................................ 71
Figure 15. MII Transmit Timing Data Input to PHY ........................................................................................................... 72
Figure 16. MII Receive Timing Data Input to MAC ........................................................................................................... 73
Figure 17. Auto-Negotiation Fast Link Pulse (FLP) Timing ................................................................................................. 74
Figure 18. MDC/MDIO Timing .............................................................................................................................................. 75
Figure 19. Power-Up/Power-Down/Reset Timing ................................................................................................................ 76
Figure 20. Reset Circuit for triggering by Power Supply ...................................................................................................... 77
Figure 21. Reset Circuit for Interfacing with CPU/FPGA Reset Output ............................................................................... 77
Figure 22. Rest Cir cuit with MIC 82 6 Voltage Supervisor ...................................................................................................... 78
Figure 23. Reference Circuits for LED Strapping Pins......................................................................................................... 78
Figure 24. 25MHz Crystal/Oscillator Reference Clock Connection ..................................................................................... 79
Figure 25. Typical Gigabit Magnetic Interface Circuit .......................................................................................................... 80
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Revision 2.2
List of Tables
Table 1. MDI/MDI-X Pin Mapping ........................................................................................................................................ 22
Table 2. Auto-Negoti ati on T im er s ........................................................................................................................................ 24
Table 3. GMII Signal Definition ............................................................................................................................................ 26
Table 4. MII Signal Definition ............................................................................................................................................... 28
Table 5. MII Management Frame Format for the KSZ9031MNX ......................................................................................... 29
Table 6. Single-LED Mode Pin Definition .......................................................................................................................... 30
Table 7. Tri-Color Dual-LED Mode Pin Definition ............................................................................................................. 30
Table 8. NAND Tree Test Pin Order for KSZ9031MNX ....................................................................................................... 33
Table 9. Typical Current/Power Consumption Transceiver (3.3V), Digital I/Os (3.3V) ..................................................... 40
Table 10. Typical Current/Power Consumption Transceiver (3.3V), Digital I/Os (1.8V) ................................................... 40
Table 11. Typical Current/Power Consumption Transceiver (2.5V), Digital I/Os (2.5V) ................................................... 41
Table 12. Typical Current/Power Consumption Transceiver (2.5V), Digital I/Os (1.8V) ................................................... 41
Table 13. Standard Registers Supported by KSZ9031MNX ................................................................................................ 42
Table 14. MMD Registers Supported by KSZ9031MNX ...................................................................................................... 43
Table 15. Portal Registers (Access to Indirect MMD Registers) .......................................................................................... 56
Table 16. GMII Transmit Timing Parameters ....................................................................................................................... 70
Table 17. GMII Receive Timing Parameters ........................................................................................................................ 71
Table 18. MII Transmit Timing Parameters .......................................................................................................................... 72
Table 19. MII Receive Timing Parameters ........................................................................................................................... 73
Table 20. Auto-Negotiation Fast Link Pulse (FLP) Timing Parameters ............................................................................... 74
Table 21. MDC/MDIO Timing Parameters ........................................................................................................................... 75
Table 22. Power-Up/Power-Down/Reset Timing Parameters ............................................................................................. 76
Table 23. Reference Crystal/Clock Selection Criteria .......................................................................................................... 79
Table 24. Magnetics Selection Criteria ................................................................................................................................ 81
Table 25. Compatible Single-Port 10/100/1000 Magnetics ................................................................................................. 81
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Revision 2.2
Pin Configuration
64-Pin QFN
(Top View)
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Revision 2.2
Pin Description
Pin Number Pin Name Type
(2)
Pin Function
1 AVDDH P 3.3V/2.5V (commerci al temp only) analog VDD
2 TXRXP_A I/O
Media Dependent Interface[0], positive signal of differential pair
1000Base-T mode:
TXRXP_A corresponds to BI_DA+ for MDI configuration and BI_DB+ for
MDI-X configuration, respectively.
10Base-T/100Base-TX mode:
TXRXP_A is the positive transmit signal (TX+) for MDI configuration and
the positive receive signal (RX+) for MDI-X configuration, respectively.
3 TXRXM_A I/O
Media Dependent Interface[0], negative signal of differential pair
1000Base-T mode:
TXRXM_A corresponds to BI_DAfor MDI configuration and BI_DB – for
MDI-X configuration, respectively.
10Base-T/100Base-TX mode:
TXRXM_A is the negative transm it signal (TX–) for MDI configuration and
the negative receive signal (RX) for MDI-X configuration, respectively.
4 AVDDL P 1.2V analog VDD
5 AVDDL P 1.2V analog VDD
6 NC No connect
7 TXRXP_B I/O
Media Dependent Interface[1], positive signal of differential pair
1000Base-T mode:
TXRXP_B corresponds to BI_DB+ for MDI configuration and BI_DA+ for
MDI-X configuration, respectively.
10Base-T/100Base-TX mode:
TXRXP_B is the positive receive signal (RX+) for MDI configuration and
the positive transmit signal (TX+) for MDI-X configuration, respectively.
8 TXRXM_B I/O
Media Dependent Interface[1], negative signal of differential pair
1000Base-T mode:
TXRXM_B corresponds to BI_DBfor MDI configuration and BI_DA– for
MDI-X configuration, respectively.
10Base-T/100Base-TX mode:
TXRXM_B is the negative receive signal (RX–) for MDI configuration and
the negative transmit signal (TX) for MDI-X configuration, respectivel y.
9 AGNDH GND Analog ground
Note:
2. P = Power supply.
GND = Ground.
I = Input.
O = Output.
I/O = Bi-directional.
Ipu = Input with internal pull-up (see Electrical Characteristic for value).
Ipu/O = Input with internal pull-up (see Electri cal Characteristic for value)/Output.
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Revision 2.2
Pin Description (Continued)
Pin Number Pin Name Type
(2)
Pin Function
10 TXRXP_C I/O
Media Dependent Interface[2], positive signal of differential pair
1000Base-T mode:
TXRXP_C corresponds to BI_DC+ for MDI configuration and BI_DD+ for
MDI-X configuration, respectively.
10Base-T/100Base-TX mode:
TXRXP_C is not used.
11 TXRXM_C I/O
Media Dependent Interface[2], negative signal of differential pair
1000Base-T mode:
TXRXM_C corresponds to BI_DCfor MDI configuration and BI_DD– for
MDI-X configuration, respectively.
10Base-T/100Base-TX mode:
TXRXM_C is not used.
12 AVDDL P 1.2V analog VDD
13 AVDDL P 1.2V analog VDD
14 TXRXP_D I/O
Media Dependent Interface[3], positive signal of differential pair
1000Base-T mode:
TXRXP_D corresponds to BI_DD+ for MDI configuration and BI_DC+ for
MDI-X configuration, respectively.
10Base-T/100Base-TX mode:
TXRXP_D is not used.
15 TXRXM_D I/O
Media Dependent Interface[3], negative signal of differential pair
1000Base-T mode:
TXRXM_D corresponds to BI_DD– for MDI configuration and BI_DC– for
MDI-X configuration, respectively.
10Base-T/100Base-TX mode:
TXRXM_D is not used.
16 AVDDH P 3.3V/2.5V (commercial temp only) analog VDD
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Revision 2.2
Pin Description (Continued)
Pin Number Pin Name Type
(2)
Pin Function
17 LED2/
PHYAD1 I/O
LED2 output: Programmable LED2 output
Config mode: The voltage on this pin is sampled and latched dur ing the po wer-
up/reset process to determine the value of PHYAD[1]. See the
Strapping Options section for detai ls.
The LED2 pin is programmed by the LED_MODE strapping option (Pin 55), and is
defined as follows:
Single-LED Mode
Link
Pin State
LED Definition
Link off H OFF
Link on (any speed) L ON
Tri-Color Dual-LED Mode
Link/Activity Pin State LED Definition
LED2 LED1 LED2 LED1
Link off H H OFF OFF
1000 Link / No activity L H ON OFF
1000 Link / Activity (RX, TX) Toggle H Blinking OFF
100 Link / No activity H L OFF ON
100 Link / Activity (RX, T X) H Toggle OFF Blinking
10 Link / No activity L L ON ON
10 Link / Activity (RX, TX) Toggle Toggle Blinking Blinking
For tri-color dual-LED mode, LED2 works in conjunction with LED1 (Pin 19) to
indicate 10Mbps link and activity.
18 DVDDH P 3.3V, 2.5V, or 1.8V digital VDD_IO
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Pin Description (Continued)
Pin Number Pin Name Type
(2)
Pin Function
19 LED1/
PHYAD0/
PME_N1 I/O
LED1 output: Programmable LED1 output
Config mode: The voltage on this pin is sampled and latched during the
power-up/reset process to determine the value of
PHYAD[0]. See the Strapping Options section for details.
PME_N output: Programm able PME_N output (pin option 1). This pin
function requ ire s an ex ternal pull-up resistor to DVDDH
(digital VDD_I/O) in a range fr om 1.0kΩ to 4.7kΩ. When
asserted low, this pin signal s that a WOL event has
occurred.
This pin is not an open-drain for all operating modes.
The LED1 pin is programmed by the LED_MODE strapping option (Pin 55),
and is defined as follows:
Single-LED Mode
Activity Pin State LED Definition
No activity H OFF
Activity (RX, TX) Toggle Blinking
Tri-Color Dual-LED Mode
Link/Activity Pin State LED Definition
LED2 LED1 LED2 LED1
Link off H H OFF OFF
1000 Link / No activity L H ON OFF
1000 Link / Activity (RX, TX) Toggle H Blinking OFF
100 Link / No activity H L OFF ON
100 Link / Activity (RX, T X) H Toggle OFF Blinking
10 Link / No activity L L ON ON
10 Link / Activity (RX, TX) Toggle Toggle Blinking Blinking
For tri-color dual-LED mode, LED1 works in conjunction with LED2 (Pin 17)
to indicate 10Mbps link and activity.
20 DVDDL P 1.2V digital VDD
21 TXD0 I GMII mode: GMII TXD0 (Transmit Data 0) input
MII mode: MII TXD0 (Transmit Data 0) input
22 TXD1 I GMII mode: GMII TXD1 (Transmit Data 1) input
MII mode: MII TXD1 (Transmit Data 1) input
23 TXD2 I GMII mode: GMII TXD2 (Transmit Data 2) input
MII mode: MII TXD2 (Transmit Data 2) Input
24 TXD3 I GMII mode: GMII TXD3 (Transmit Data 3) input
MII mode: MII TXD3 (Transmit Data 3) input
25 DVDDL P 1.2V digital VDD
26 TXD4 I GMII mode: GMII TXD4 (Transmit Data 4) input
MII mode: This pin is not used and can be driven high or low.
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Pin Description (Continued)
Pin Number Pin Name Type
(2)
Pin Function
27 TXD5 I GMII mode: GMII TXD5 (Transmit Data 5) input
MII mode: This pin is not used and can be driven high or low.
28 TXD6 I GMII mode: GMII TXD6 (Transmit Data 6) input
MII Mode: This pin is not used and can be driven high or low.
29 TXD7 I GMII mode: GMII TXD7 (Transmit Data 7) input
MII mode: This pin is not used and can be driven high or low.
30 DVDDH P 3.3V, 2.5V, or 1.8V digital V DD_IO
31 TX_ER I
GMII mode: GMII TX_ER (Transmit Error) input
MII mode: MII TX_ER (Transmit Error) input
If the GMII/ MII MAC does not provide the TX_ER output signal, this pin should be
tied low.
32 GTX_CLK I GMII mode: GMII GTX_CLK (Transmit Reference Cloc k ) input
33 TX_EN I GMII mode: GMII TX_EN (Transmit Enable) input
MII mode: MII TX_EN (Transmit Enable) input
34 RXD7 O GMII mode: GMII RXD7 (Receive Data 7) output
MII mode: This pin is not used and is driven low.
35 RXD6 O GMII mode: GMII RXD6 (Receive Data 6) output
MII mode: This pin is not used and is driven low.
36 DVDDL P 1.2V digital VDD
37 RXD5 O GMII mode: GMII RXD5 (Receive Data 5) output
MII mode: This pin is not used and is driven low.
38 RXD4 O GMII mode: GMII RXD4 (Receive Data 4) output
MII mode: This pin is not used and is driven low.
39 RXD3/
MODE3 I/O
GMII mode: GMII RXD3 (Receive Data 3) output
MII mode: MII RXD3 (Receive Data 3) output
Config mode: T he voltage on this pin is sampled and lat che d dur ing the po wer-
up/reset process to determine the value of MODE3. See the
Strapping Options s ect ion for detai ls.
40 DVDDH P 3.3V, 2.5V, or 1.8V digital V DD_IO
41 RXD2/
MODE2 I/O
GMII mode: GMII RXD2 (Receive Data 2) output
MII mode: MII RXD2 (Receive Data 2) output
Config mode: T he voltage on this pin is sampled and lat che d dur ing the power-
up/reset process to determine the value of MODE2. See the
Strapping Options section for detai ls.
42 DVDDL P 1.2V digital VDD
43 RXD1/
MODE1 I/O
GMII mode: GMII RXD1 (Receive Data 1) output
MII mode: MII RXD1 (Receive Data 1) output
Config mode: The voltage on this pin is sampled and latched dur ing the po wer-
up/reset process to determine the value of MODE1. See the
Strapping Options section for detai ls.
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Revision 2.2
Pin Description (Continued)
Pin Number Pin Name Type
(2)
Pin Function
44 RXD0/
MODE0 I/O
GMII mode: GMII RXD0 (Receive Data 0) output
MII mode: MII RXD0 (Receive Data 0) output
Config mode: T he voltage on this pin is sampled and lat che d dur ing the po wer-
up/reset process to determine the value of MODE0. See the
Strapping Options section for detai ls.
45 RX_DV/
CLK125_EN I/O
GMII mode: GMII RX_DV (Receive Data Valid) output
MII mode: MII RX_DV (Receive Data Valid) output
Config mode: The voltage on this pin is sampled and latched dur ing the po wer-
up/reset process to establ ish the value of CLK125_EN. See the
Strapping Options section for detai ls.
46 DVDDH P 3.3V, 2.5V, or 1.8V digital VDD_IO
47 RX_ER O GMII mode: GMII RX_ER (Receive Error) output
MII mode: MII RX_ER (Receive Error) output
48 RX_CLK/
PHYAD2 I/O
GMII mode: GMII RX_CLK (Receive Reference Clock) output
MII mode: MII RX_CLK (Receive Reference Clock) output
Config mode: T he voltage on this pin is sampled and lat che d dur ing the
power-up/reset process to determine the value of PHYAD[2]. See
the Strapping Options secti on for det ail s.
49 CRS O GMII mode: GMII CRS (Carrier Sense) output
MII mode: MII CRS (Carrier Sense) output
50 MDC Ipu Management data clock input
This pin is the input reference clock for MDIO (Pin 51).
51 MDIO Ipu/O Management data input/output
This pin is synchronous to MDC (Pin 50) and requires an external pull-up res ist or to
DVDDH (digital VDD) in a range from 1.0kΩ to 4.7kΩ.
52 COL O GMII mode: G MII COL (Collisi on Detected) output
MII mode: MII COL (Collision Detected) output
53
INT_N/
PME_N2
O
Interrupt output: Programma ble interrupt output, with Register 1Bh as th e Interrupt
Control/Status Register, for programming the interrupt conditions
and reading the interrupt status. Regis ter 1Fh, Bit [14] set s the
interrupt output to active low (default) or active high.
PME_N output: Programm able PME_N output (pin option 2). When asserted low,
this pin signals that a WOL event has occurred.
For Interrupt (when active low) and PME functions, this pin requires an external pull-
up resisto r to DVDDH (digital VDD_I/O) in a range from 1.0kΩ to 4.7kΩ.
This pin is not an open-drain for all operating modes.
54 DVDDL P 1.2V digital VDD
55 CLK125_NDO/
LED_MODE I/O
125MHz clock output
This pin provides a 125MHz reference clock output option for us e by the MAC.
Config mode: The voltage on this pin i s sampled during the power-up/reset
process to determine the value of LED_MODE. See the Strapping
Options section for details.
56 RESET_N Ipu
Chip reset (active low)
Hardw are pin configur ations are strapped-in (sampled and latched) at the de-
assertion (rising edge) of RESET_N. See the Strapping Options section for more
details.
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Pin Description (Continued)
Pin Number Pin Name Type
(2)
Pin Function
57 TX_CLK O MII mode: MII TX_CLK (Transmit Reference Clock) output
58 LDO_O O
On-chip 1.2V LDO controller output
This pin drives the input gate of a P-channel MOSFET to generate 1.2V for the
chip’s core voltages. If the system prov ide s 1.2V and this pin is not used, it can be
left floating.
59 AVDDL_PLL P 1.2V analog VDD for PLL
60 XO O
25MHz crystal feedback
This pin connects to one end of an external 25MHz crystal.
This pin is a no connect if an oscillator or other external (non-crystal) cloc k source is
used.
61 XI I
Crystal / Oscillator/ External Clock input
This pin connects to one end of an external 25MHz crystal or to the output of an
oscillator or other external (non-crystal) clock sour ce.
25MHz ±50ppm tolerance
62 NC - No connect
This pin is not bonded and ca n be connected to AVDDH power for footprint
compatibili ty with the Micrel KSZ9021GN Gigabit PHY.
63 ISET I/O Set the transmit output level.
Connect a 12.1kΩ 1% resist or to ground on this pin .
64 AGNDH GND Analog ground.
PADDLE P_GND GND Exposed paddle on botto m of chip.
Connect P_GND to ground.
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KSZ9031MNX
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Strapping Options
Pin Number Pin Name Type
(
3
)
Pin Function
48
17
19
PHYAD2
PHYAD1
PHYAD0
I/O
I/O
I/O
The PHY address, PHYAD[2:0], is sampled and latched at power-up/reset and is
configurable to any value from 0 to 7. Each PHY address bit is configured as follows:
Pull-up = 1
Pull-down = 0
PHY Address Bits [4:3] are always set to ‘00’.
39
41
43
44
MODE3
MODE2
MODE1
MODE0
I/O
I/O
I/O
I/O
The MODE[3:0] strap-in pins are sampled and latched at power-up/reset and are
defined as follows:
MODE[3:0] Mode
0000 Reserved not used
0001 GMII/MII mode
0010 Reserved not used
0011 Reserved not used
0100 NAND tree mode
0101 Reserved not used
0110 Reserved not used
0111 Chip power-down mode
1000 Reserved not used
1001 Reserved not used
1010 Reserved not used
1011 Reserved not used
1100 Reserved not used
1101 Reserved not used
1110 Reserved not used
1111 Reserved not used
45 CLK125_EN I/O
CLK125_EN is sampl ed and la t che d at power -up/r e set and is defined as foll ow s:
Pull-up (1) = Enable 125MHz clock output
Pull-down (0) = Disable 125MHz clock output
Pin 55 (CLK125_NDO) provides the 125MHz reference clock output option for use by
the MAC.
55 LED_MODE I/O LED_M ODE is sampled and lat che d at power -up/r e set and is defined as foll ows:
Pull-up (1) = Single-LED mode
Pull-down (0) = Tri-color dual-LED mode
Note:
3. I/O = Bi-directional.
Pin str a p-ins are latched d u r ing p o wer-up or res et. In som e s ystems, the MAC receive input pins ma y be driven during the
power-up or reset process, and consequently cause the PHY strap-in pins on the GMII/MII signals to be latched to the
incorrect conf igur at ion . In this c as e, Micrel recommends adding externa l pu ll-up or pull-do wn resist ors on th e PH Y strap-in
pins to ensure the PHY is configured to the correct pin strap-in mode.
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Functional Overview
The KSZ9031MNX is a completely integrated triple-speed (10Base-T/100Base-TX/1000Base-T) Ethernet physical layer
transceiv er solut ion f or transm iss ion and recept ion of d ata over a s tandard CAT-5 uns hielded t wisted p air (UT P) cable. Its
on-chip proprietary 1000Base-T transceiver and Manchester/MLT-3 signaling-based 10Base-T/100Base-TX transceivers
are all IEEE 802.3 compliant.
The KSZ9031MNX reduces board cost and simplifies board layout by using on-chip termination resistors for the four
differential pairs and by integrating an LDO controller to drive a low-cost MOSFET to supply the 1.2V core.
On the c opper m edia inter face, t he KSZ903 1MNX c an autom aticall y det ect a nd cor rect f or dif ferentia l pair mis placem ents
and polarity reversals, and correct propagation delays and re-sync timing between the f our differential pairs, as specified
in the IEEE 802.3 standard for 1000Base-T operation.
The KSZ 9031MNX pr ovide s the GMII/ MII int erf ace for connecti on to GMA Cs i n Gigab it Eth ernet process ors and switches
for data transfer at 10/100/1000Mbps.
Figure 1 shows a high-level block diagram of the KSZ9031MNX.
Figure 1. KSZ9031MNX Block Diagram
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KSZ9031MNX
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Revision 2.2
Functional Description: 10Base-T/100Base-TX Trans cei ver
100Base-TX Transmit
The 100Base-TX transmit function performs parallel-to-serial conversion, 4B/5B coding, scrambling, NRZ-to-NRZI
conversion, and MLT-3 encoding and transmission.
The cir cuitry starts with a p arallel-to-serial convers ion, which c onverts the MII dat a from the MAC into a 125MH z serial bit
stream . The data and control st ream is then converte d into 4B/5B codi ng, followed b y a s crambler. The s erialized data is
further convert ed f rom N RZ-to-NRZI f orm at, and th en t ransmitted in MLT -3 c urren t output. T he output curr ent is set by an
external 12.1 1% resistor for the 1:1 transformer ratio.
The output signal has a typical rise/fall time of 4ns and complies with the ANSI TP-PMD standard regarding amplitude
balance, overshoot, and timing jitter. The wave-shaped 10Base-T output is also incorporated into the 100Base-TX
transmitter.
100Base-TX Receive
The 100BASE-TX receiver function perf orm s adaptive equalization, DC restoration, MLT -3-to-NRZI conversion, data and
clock recovery, NRZI-to-NRZ conversion, de-scrambling, 4B/5B decoding, and serial-to-parallel conversion.
The rec eiving side star ts with the equali zation filter to com pensate for inter -symbol int erference (ISI) over the twis ted pair
cable. Because the amplitude loss and phase distortion are a function of the cable length, the equalizer must adjust its
characteristics to optimize performance. In this design, the variable equalizer makes an initial estimation based on
compar isons of incom ing si gnal str ength a gainst s om e k nown cable charac teris tics , then tun es itse lf f or opti m ization. T his
is an ongoing process and self-adjusts against environmental changes such as temperature variations.
Next, the equalized signal goes through a DC-restoration and data-conversion block. The DC-restoration circuit
compensates for the effect of baseline wander and improves the dynamic range. The differential data conversion circuit
converts the MLT-3 format back to NRZI. The slicing threshold is also adaptive.
The clock-recovery circuit extracts the 125MHz clock from the edges of the NRZI signal. This recovered clock is then used
to convert the NRZI signal into the NRZ format. This signal is sent through the de-scrambler followed by the 4B/5B
decoder. Finally, the NRZ serial data is converted to the GMII/MII format and provided as the input data to the MAC.
Scrambler/De-Scramble r (100Ba se-TX only)
The purpos e of the scram bler is to s pread th e power s pectrum of the s ignal to reduce e lectrom agnetic inter ference ( EMI)
and baseline wander. Transmitted data is scrambled using an 11-bit wide linear feedback shift register (LFSR). The
scrambler generates a 2047-bit non-repet itive sequence, then the receiver de-scrambles the incoming data stream using
the same sequence as at the transmitter.
10Base-T Transmit
The 10Base-T output drivers are incorporated into the 100Base-TX drivers to allow for transmission with the same
magnetic . The drivers perform internal wave-s haping and pre-em phasis, and o utput sign als with typical amplitude of 2.5V
peak for standard 10Base-T mode and 1.75V peak for energy-efficient 10Base-Te mode. The 10Base-T/10Base-Te
signals have harmonic contents that are at least 31dB below the fundamental frequency when driven by an all-ones
Manchester-encoded signal.
10Base-T Receive
On the receive side, input buffer and level-detecting squelch circuits are used. A differential input receiver circuit and a
phase-locked loop (PLL) perform the decoding function. The Manchester-encoded data stream is separated into clock
signal and NRZ data. A squelch circuit rejects signals with levels less than 300mV or with short pulse widths to prevent
noises at t he receive inputs from falsely triggering the decoder. W hen the input exceeds the squelch limit, the PLL locks
onto the inc om ing signal an d the KSZ9 031MN X decod es a data f ram e. The r eceiver clock is m aintained act ive durin g idle
periods between receiving data frames.
The KSZ9031MNX removes all 7 bytes of the preamble and presents the received frame starting with the SFD (start of
frame delimiter) to the MAC.
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KSZ9031MNX
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Auto-polarity correction is provided for the receive differential pair to automatically swap and fix the incorrect +/polarity
wiring in the cabling.
Functional Description: 1000Base-T Transceiver
The 1000Base-T transceiver is based-on a mixed-signal/digital-signal processing (DSP) architecture, which includes the
analog front-end, digital channel equalizers, trellis encoders/decoders, echo cancellers, cross-talk cancellers, precision
clock recovery scheme, and power-efficient line drivers.
Figure 2 shows a high-level block diagram of a single channel of the 1000Base-T transceiver for one of the four
differential pairs.
Figure 2. KSZ9031MNX 1000Base-T Block Diagram Single Channel
Analog Echo-Cancellation Circuit
In 1000Base-T mode, the analog echo-cancellation circuit helps to reduce the near-end echo. This analog hybrid circuit
relieves the burden of the ADC and the adaptive equalizer.
This circuit is disabled in 10Base-T/100Base-TX mode.
Automatic Gain Control (AGC)
In 1000Base-T m ode, the autom atic gain contro l (AGC ) circ uit provides ini tial ga in adjus tment to boos t up the s ignal level.
This pre-conditioning circuit is used to improve the signal-to-noise ratio of the receive signal.
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Analog-to-Digital Converte r (ADC)
In 1000Base-T m ode, t h e a nal og-to-d igita l c on vert er (ADC ) d ig iti zes t he inc oming s ignal. A D C p erformanc e is ess ent ia l to
the overall performance of the transceiver.
This circuit is disabled in 10Base-T/100Base-TX mode.
Timing Recovery Circuit
In 1000Bas e-T mode, the m ix ed-s ignal clock recover y circ uit to get her with th e di gita l ph ase-loc ked loop is u s ed to rec ov er
and track the incoming timing information from the received data. The digital phase-locked loop has very low long-term
jitter to maximize the signal-to-noise ratio of the receive signal.
The 1000B ase-T slave PHY must transmit the exact r ecei ve c lock frequenc y rec over e d f rom t he rec eived d ata bac k to the
1000Base-T master PHY. Otherwise, the master and slave will not be synchronized after long transmission. This also
helps to facilitate echo cancellation and NEXT removal.
Adaptive Equalizer
In 1000Base-T mode, the adaptive equalizer provides the following functions:
Detection for partial response signaling
Removal of NEXT and ECHO noise
Channel equalization
Signal quality is degraded by residual echo that is not removed by the analog hybrid because of impedance mismatch.
The KSZ9031MNX uses a digital echo canceller to further reduce echo components on the receive signal.
In 1000Base-T mode, data transmission and reception occurs simultaneously on all four pairs of wires (four channels).
This results in high-f requency cross-talk coming from adjacent wires. The KSZ9031MNX uses three NEXT cancellers on
each receive channel to minimize the cross-talk induced by the other three channels.
In 10Base-T/100Base-TX mode, the adaptive equalizer needs only to remove the inter-symbol interference and recover
the channel loss from the incoming data.
Trellis Encoder and Decoder
In 1000Base-T mode, the transmitted 8-bit data is scrambled into 9-bit symbols and further encoded into 4D-PAM5
symbols. The initial scrambler seed is determined by the specific PHY address to reduce EMI when more than one
KSZ9031MNX is used on the same board. On the receiving side, the idle stream is examined first. The scrambler seed,
pair sk ew, pair order, an d polar ity must be res olved thr ough the logic. T he incom ing 4D-PA M5 dat a is then conv erted into
9-bit symbols and de-scrambled into 8-bit data.
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Functional Description: Additional 10/100/1000 PHY Features
The Autom atic MDI/MDI-X feature eliminates the need to determine whether to use a straight cable or a crossover cable
between the KSZ9031MNX and its link partner. This auto-sense function detects the MDI/MDI-X pair mapping from the
link partner, and assigns the MDI/MDI-X pair mapping of the KSZ9031MNX accordingly.
Table 1 shows the KSZ9031MNX 10/100/1000 pin configuration assignments for MDI/MDI-X pin mapping.
Table 1. MDI/MDI-X Pin Mapping
Pin
(RJ-45 pair) MDI MDI-X
1000Base-T 100Base-TX 10Base-T 1000Base-T 100Base-TX 10Base-T
TXRXP/M_A (1,2) A+/ TX+/ TX+/ B+/ RX+/ RX+/
TXRXP/M_B (3,6) B+/ RX+/ RX+/ A+/ TX+/ TX+/
TXRXP/M_C (4,5) C+/ Not used Not used D+/ Not used Not used
TXRXP/M_D (7,8) D+/ Not used Not used C+/ Not used Not used
Auto MDI/MDI-X is enabled b y defaul t. It is disable d by writing a one to Register 1Ch, Bit [6]. MD I and MDI-X m ode is set
by Register 1Ch, Bit [7] if Auto MDI/MDI-X is disabled.
An isolation transformer with symmetrical transmit and receive data paths is recommended to support Auto MDI/MDI-X.
Pair-Swap, Alignment, and Polarity Check
In 1000Base-T mode, the KSZ9031MNX
Detects incorrect channel order and automatically restores the pair order for the A, B, C, D pairs (four
channels)
Supports 50±10ns difference in propagation delay between pairs of channels in accordance with the IEEE
802.3 standard, and automatically corrects the data skew so the corrected four pairs of data symbols are
synchronized
Incorrect pair polarities of the differential signals are automatically corrected for all speeds.
Wave Shaping, Slew-Rate Control, and Partial Response
In communication systems, signal transmission encoding methods are used to provide the noise-shaping feature and to
minimize distortion and error in the transmission channel.
For 1000Base-T, a special partial-response signaling method is used to provide the band-limiting feature for
the transmission path.
For 100Base-TX, a simple slew-rate control method is used to minimize EMI.
For 10Base-T, pre-emphasis is used to extend the signal quality through the cable.
PLL Clock Synthesizer
The KSZ9031MNX generates 125MHz, 25MHz, and 10MHz clocks for system tim ing. Internal clocks are generated f rom
the external 25MHz crystal or reference clock.
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Auto-Negotiation
The KSZ9031MNX conforms to the auto-negotiation protocol, defined in Clause 28 of the IEEE 802.3 Specification.
Auto-negotiation allows UTP (unshielded twisted pair) link partners to select the highest common mode of operation.
During auto-negotiation, link partners advertise capabilities across the UTP link to each other, and then compare their own
capabil ities with those the y received from their link partners. T he highest speed and dup lex setting that is common to the
two link partners is selected as the operating mode.
The following list shows the speed and duplex operation mode from highest-to-lowest:
Priorit y 1: 1000Base-T, full-duplex
Priorit y 2: 1000Base-T, half-duplex
Priorit y 3: 100Base-TX, full-duplex
Priorit y 4: 100Base-TX, half-duplex
Priorit y 5: 10Base-T, full-duplex
Priorit y 6: 10Base-T, half-duplex
If auto-negotiation is not supported or the KSZ9031MNX link partner is forced to bypass auto-negotiation for 10Base-T
and 100Base-TX modes, the KSZ9031MNX sets its operating mode by observing the input signal at its receiver. This is
known as parallel detect ion, and allows the KSZ9031 MNX to establ ish a link by listening f or a fixed signa l protocol in th e
absence of the auto-negotiation advertisement protocol.
The auto-negotiation link-up process is shown in Figure 3.
Figure 3. Auto-Negotiation Flow Chart
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Revision 2.2
For 1000Base-T mode, auto-negotiation is required and always used to establish a link. During 1000Base-T auto-
negotiatio n, th e master and s lav e configurati on is first res ol ved bet ween li nk partners . Then the link is es tab lis hed with t he
highest common capabilities between link partners.
Auto-negotiation is enabled by default after power-up or hardware reset. After that, auto-negotiation can be enabled or
disabled through Register 0h, Bit [1 2]. If auto-negotiat ion is dis abled, t he speed i s set b y Register 0h, Bits [ 6, 13] and the
duplex is set by Register 0h, Bit [8].
If the speed is changed on the fly, the link goes down and either auto-negotiation or parallel detection initiates until a
common speed between KSZ9031MNX and its link partner is re-established for a link.
If the link is already establis hed and there is no chang e of speed on the fl y, the c hanges ( for example, duplex and pause
capabilities) will not take effect unless either auto-negotiation is restarted through Register 0h, Bit [9], or a link-down to
link-up transition occurs (that is, dis c onn ectin g and reconnecting the cable).
After auto-negotiation is com pleted, the link status is updated in Register 1h, Bit [2], and the link partner capabilities are
updated in Registers 5h, 6h, and Ah.
The auto-negotiation finite state machines use interval timers to manage the auto-negotiation process. The duration of
these timers under normal operating conditions is summarized in T able 2.
Table 2. Auto-Negotiation Timers
Auto-Negotiation Interval Timers
Time Duration
Transmit burst interval 16ms
Transmit pulse inter v a l 68µs
FLP detect minimum tim e 17.2µs
FLP detect maximum time 185µs
Receive minim um burst interval 6.8ms
Receive max imum burst interval 112ms
Data detect m inimum interval 35.4µs
Data detect m aximum interval 95µs
NLP test minimum interval 4.5ms
NLP test maximum interval 30ms
Link loss t im e 52ms
Break link tim e 1480ms
Parallel detection wait time 830ms
Link enable wait time 1000ms
10/100Mbps Speeds only
Some applications require link-up to be limited to 10/100Mbps speeds only.
After power-up/reset, the KSZ9031MNX can be restricted to auto-negotiate and link-up to 10/100Mbps speeds only by
programming the following register settings:
1. Set Register 0h, Bit [6] = ‘0’ to remove 1000Mbps speed.
2. Set Register 9h, Bits [9:8] = ‘00’ to remove Auto-Negotiation Advertisements for 1000Mbps full/half duplex.
3. Write a ‘1’ to Register 0h, Bit [9], a self-clearing bit, to force a restart of Auto-Negotiation.
Auto-Nego tiation and 10Ba se-T/100Base-T X speeds use only differ ential pairs A (pins 2, 3) and B (pins 7, 8). Differentia l
pairs C (pins 10, 11) and D (pins 14, 15) can be left as no connects.
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GMII Interface
The Gigabit Media Independent Interface (GMII) is compliant to the IEEE 802.3 Specification. It provides a common
interface between GMII PHYs and MACs, and has the following key characteristics:
Pin count is 24 pins (11 pins for data transmission, 11 pins for data reception, and 2 pins for carrier and
collision indication).
1000Mbps is supported at both half and full duplex.
Data transmission and reception are independent and belong to separate signal groups.
Transmit data and receive data are each 8 bits wide, a byte.
In GMII operation, the GMII pins function as follows:
The MAC sources the transmit reference clock, GTX_CLK, at 125MHz for 1000Mbps.
The PHY recovers and sources the receive reference clock, RX_CLK, at 125MHz for 1000Mbps.
TX_EN, TXD[7:0], and TX_ER are sampled by the KSZ9031MNX on the rising edge of GTX_CLK.
RX_DV, RXD[7:0], and RX_ER are sampled by the MAC on the rising edge of RX_CLK.
CRS and COL are driven by the KSZ9031MNX and do not have to transition synchronously with respect to
either GTX_CLK or RX_CLK.
The KSZ9031MNX combines GMII mode with MII mode to form GMII/MII mode to support data transfer at
10/100/1000Mbps. After power-up or reset, the KSZ9031MNX is configured to GMII/MII mode if the MODE[3:0] strap-in
pins are set to ‘0001. See the Strapping Options section.
The KSZ9031MNX has the option to output a 125MHz reference clock on CLK125_NDO ( Pin 55). This clock provides a
lower-cost reference clock alternative for GMII/MII MACs that require a 125MHz crystal or oscillator. The 125MHz clock
output is enabled after power-up or reset if the CLK125_EN strap-in pin is pulled high.
The KSZ9031MNX provides a dedicated transmit clock input pin for GMII mode, defined as follows:
GTX_CLK (input, Pin 32): Sourced by MAC in GMII mode for 1000Mbps speed
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GMII Signal Definition
Table 3 describes the GMII signals. Refer to Clause 35 of the IEEE 802.3 Specification for more detailed information.
Table 3. GMII Signal Definition
GMII
Signal Name
(per spec)
GMII
Signal Name
(per KSZ9031MNX)
Pin Type
(with respect to
PHY)
Pin Type
(with respect to
MAC) Description
GTX_CLK GTX_CLK Input Output Transmit Reference Clock
(125MHz for 1000Mbps)
TX_EN TX_EN Input Output Transmit Enable
TXD[7:0] TXD[7:0] Input Output Transmit Data[7:0]
TX_ER TX_ER Input Output Trans mit Error
RX_CLK RX_CLK Output Input Receive Reference Clock
(125MHz for 1000Mbps)
RX_DV RX_DV Output Input Receive Data Valid
RXD[7:0] RXD[7:0] Output Input Receive Data[7:0]
RX_ER RX_ER Output Input Receive Error
CRS CRS Output Input Carri er Sense
COL COL Output Input Collision Detected
GMII Signal Diagram
The KSZ9031MNX GMII pin connections to the MAC are shown in Figure 4.
Figure 4. KSZ9031MNX GMII Interface
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KSZ9031MNX
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MII Interface
The Media Independent Interface (MII) is compliant with the IEEE 802.3 Specification. It provides a common interface
between MII PHYs and MACs, and has the following key characteristics:
Pin count is 16 pins (7 pins for data transmission, 7 pins for data reception, and 2 pins for carrier and collision
indication).
10Mbps and 100Mbps are supported at both half- and full-duplex.
Data transmission and reception are independent and belong to separate signal groups.
Transmit data and receive data are each 4 bits wide, a nibble.
In MII operation, the MII pins function as follows:
The PHY sources the transmit reference clock, TX_CLK, at 25MHz for 100Mbps and 2.5MHz for 10Mbps.
The PHY recovers and sources the receive reference clock, RX_CLK, at 25MHz for 100Mbps and 2.5MHz for
10Mbps.
TX_EN, TXD[3:0], and TX_ER are driven by the MAC and transition synchronously with respect to TX_CLK.
RX_DV, RXD[3:0], and RX_ER are driven by the KSZ9031MNX and transition synchronously with respect to
RX_CLK.
CRS and COL are driven by the KSZ9031MNX and do not have to transition synchronously with respect to
either TX_CLK or RX_CLK.
The KSZ9031MNX combines GMII mode with MII mode to form GMII/MII mode to support data transfer at
10/100/1000Mbps. After the power-up or reset, the KSZ9031MNX is then configured to GMII/MII mode if the MODE[3:0]
strap-in pins are set to 0001. See the Strapping Options section.
The KSZ9031MNX has the option to output a 125MHz reference clock on CLK125_NDO (Pin 55). This clock provides a
lower-cost reference clock alternative for GMII/MII MACs that require a 125MHz crystal or oscillator. The 125MHz clock
output is enabled after power-up or reset if the CLK125_EN strap-in pin is pulled high.
The KSZ9031MNX provides a dedicated transmit clock output pin for MII mode, defined as follows:
TX_CLK (output, Pin 57) : Sourced by KSZ9031MNX in MII mode for 10/100Mbps speed
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MII Signal Definition
Table 4 describes the MII signals. Refer to Clause 22 of the IEEE 802.3 Specification for detailed information.
Table 4. MII Signa l Definition
MII
Signal Name
(per spec.)
MII
Signal Name
(per KSZ9031MNX)
Pin Type
(with respect
to PHY)
Pin Type
(with respect
to MAC) Description
TX_CLK TX_CLK Output Input Transmit Reference Clock
(25MHz for 100Mbps, 2.5MHz for 10Mbps)
TX_EN TX_EN Input Output Transmit Enable
TXD[3:0] TXD[3:0] Input Output Transmit Data[3:0]
TX_ER TX_ER Input Output Transmit Error
RX_CLK RX_CLK Output Input Receive Reference Clock
(25MHz for 100Mbps, 2.5MHz for 10Mbps)
RX_DV RX_DV Output Input Receive Data Valid
RXD[3:0] RXD[3:0] Output Input Receive Data[3:0]
RX_ER RX_ER Output Input Receive Error
CRS CRS Output Input Carrier Sense
COL COL Output Input Collision Detected
MII Signal Diagram
The KSZ9031MNX MII pin connections to the MAC are shown in Figure 5.
Figure 5. KSZ9031MNX MII I nt erf ace
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Revision 2.2
MII Management (MIIM) Interface
The KSZ9031MNX supports the IEEE 802.3 MII management interface, also known as the Management Data Input/
Output (MDIO) interface. This interface allows upper-layer devices to m onitor and control the state of the KSZ90 31MNX.
An external device with MIIM capability is used to read the PHY status and/or configure the PHY settings. More details
about the MIIM interface can be found in Clause 22.2.4 of the IEEE 802.3 Specification.
The MIIM interface consists of the following:
A physical connection that incorporates the clock line (MDC) and the data line (MDIO).
A specific protocol that operates across the physical connection mentioned earlier, which allows an external
controller to communicate with one or more KSZ9031MNX devices. Each KSZ 90 31MNX dev ice is assign ed a
unique PHY address between 0h and 7h by the PHYAD[2:0] strapping pins.
A 32-register address space for direct access to IEEE-defined registers and vendor-specific registers, and for
indirect access to MMD addresses and registers . See the R egis t er Map section.
PHY Address 0h is sup ported as the un ique PHY addr ess only; it is not su pporte d as the broadcast PHY address , which
allows f or a single writ e command to s imultaneousl y program an ident ical PHY regist er for two or m ore PHY dev ices (for
example, using PHY Address 0h to set Register 0h to a value of 0x1940 to set Bit [11] to a value of one to enable
software power-down). Instead, separate write commands are used to program each PHY device.
Table 5 shows the MII management frame format for the KSZ9031MNX.
Table 5. MII Management Frame Format for the KSZ9031MNX
Preamble Start of
Frame Read/Write
OP Code
PHY
Address
Bits [4:0]
REG
Address
Bits [4:0] TA Data
Bits [15:0] Idle
Read 32 1’s 01 10 00AAA RRRRR Z0 DDDDDDDD_DDDDDDDD Z
Write
32 1’s 01 01 00AAA RRRRR 10 DDDDDDDD_DDDDDDDD Z
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Interrupt (INT_N)
The INT_N pin is an optional interrupt signal that is used to inform the external controller that there has been a status
update in the K SZ9031 MN X PH Y register. Bits [15:8] of Register 1Bh ar e the inte rrupt cont rol bits that enabl e and dis able
the conditions for asserting the INT_N signal. Bits [7:0] of Register 1Bh are the interrupt status bits that indicate which
interrupt conditions have occurred. The interrupt status bits are cleared after reading Register 1Bh.
Bit [14] of Register 1Fh sets the interrupt level to active high or active low. The default is active low.
The MII management bus option gives the MAC processor complete access to the KSZ9031MNX control and status
registers. Additionally, an interrupt pin eliminates the need for the processor to poll the PHY for status change.
LED Mode
The KSZ90 31MNX provide s two programm able LED output pins , LED2 and LED1, which are configura ble to support t wo
LED modes. The LED mode is configured by the LED_MODE strap-in (Pin 55). It is latched at power-up/reset and is
defined as follows:
Pull-up: Single-LED mode
Pull-down: Tri-color dual-LED mode
Single-LED Mode
In single-LED mode, the LED2 pin indicates the link status while the LED1 pin indicates the activity status, as shown in
Table 6.
Table 6. Single-LE D Mode Pin Definition
Tri-Color Dual-LED Mode
In tri-color dua l-LED m ode, the link and activit y status are indicat ed b y the LED2 pin for 1000Base-T ; by the LED1 pin for
100Base-TX; and by both LED2 and LED1 pins, working in conjunction, for 10Base-T. This is summarized in Table 7.
Table 7. Tri-Color Dual-LED Mode – Pin Definition
Each LED output pin can directly drive an LED with a series resistor (typically 220 to 470).
LED Pin Pin State LED Definition Link/Activity
LED2 H OFF Link off
L ON Link on (any speed)
LED1 H OFF No activity
Toggle Blinking Activity (RX, TX)
LED Pin
(State)
LED Pin
(Definition) Link/Activity
LED2 LED1 LED2 LED1
H H OFF OFF Link off
L H ON OFF 1000 Link / No activity
Toggle H Blinking OFF 1000 Link / Activity (RX, TX)
H L OFF ON 100 Link / No activity
H Toggle OFF Blinking 100 Link / Activity (RX, TX)
L L ON ON 10 Link / No activity
Toggle Toggle Blinking Blinking 10 Link / Activity (RX, TX)
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Loopback Mode
The KSZ9031MNX supports the following loopback operations to verify analog and/or digital data paths.
Local (digital) loopback
Remote (analog) loopback
Local (Digital) Loopback
This loop back mode c heck s the GM II/MII t rans m it and rec eive dat a p aths b et ween K SZ9031 MNX an d ext ernal M AC, and
is supported for all three speeds (10/100/1000Mbps) at full-duplex.
The loopback data path is shown in Figure 6.
1. GMII/MII MAC transmits frames to KSZ9031MNX.
2. Frames are wrapped around inside KSZ9031MNX.
3. KSZ9031MNX transmits frames back to GMII/MII MAC.
Figure 6. Local (Digital) Loopback
The following programming steps and register settings are used for local loopback mode.
For 1000Mbps loopback,
1. Set Register 0h,
- Bit [14] = 1 // Enable local loopback mode
- Bits [6, 13] = 10 // Select 1000Mbps speed
- Bit [12] = 0 // Disable auto-negotiation
- Bit [8] = 1 // Select full-duplex mode
2. Set Register 9h,
- Bit [12] = 1 // Enable master-slave manual configuration
- Bit [11] = 0 // Select slave configuration (required for loopback mode)
For 10/100Mbps loopback,
1. Set Register 0h,
- Bit [14] = 1 // Enable local loopback mode
- Bits [6, 13] = 00 / 01 // Select 10M bps /1 00M bps s peed
- Bit [12] = 0 // Disable auto-negotiation
- Bit [8] = 1 // Select full-duplex mode
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KSZ9031MNX
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Remote (Analog) Loopback
This loopb ack mode c hecks the li ne (diff erenti al pairs, trans form er, RJ -45 c onnector, Eth ernet ca ble) tra nsm it and rece ive
data paths between KSZ9031MNX and its link partner, and is supported for 1000Base-T full-duplex mode only.
The loopback data path is shown in Figure 7.
1. The G igabit PH Y link partner transmits frames to KSZ9031MNX.
2. Frames are wrapped around inside KSZ9031MNX.
3. KSZ9031MNX transmits frames back to the Gigabit PHY link partner.
Figure 7. Remote (Analog) Loopback
The following programming steps and register settings are used for remote loopback mode.
1. Set Register 0h,
Bits [6, 13] = 10 // Select 1000Mbps speed
Bit [12] = 0 // Disable auto-negotiation
Bit [8] = 1 // Select full-duplex mode
Or just auto-negotiate and link up at 1000Base-T full-duplex mode with the link partner.
2. Set Register 11h,
Bit [8] = 1 // Enable remote loopback mode
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Revision 2.2
LinkMD® Cable Diagnostic
The LinkMD function uses time domain reflectometry (TDR) to analyze the cabling plant for common cabling problems,
such as open circuits, short circuits, and impedance mismatches.
LinkMD operat es by sending a pulse of k nown amplitude and duration down the selected differential pair, then analyzing
the polarity and shape of the reflected signal to determine the type of fault: open circuit for a positive/non-inverted
amplitude ref lection a nd sh ort circ uit f or a n egative/ inv erted am plitud e ref lection. T he tim e durati on for the re f lected sig nal
to retur n prov ides the appr ox im ate distanc e to t he ca bling f ault. The L ink MD fun ction process es th is T DR inf orm ation and
presents it as a numerical value that can be translated to a cable distance.
LinkMD is initiated b y access ing Register 12 h, the Lin kMD Cab le Diagnos tic register, in conjunction with Register 1Ch,
the Auto MDI/MDI-X register. The latter register is needed to disable the Auto MDI/MDI-X function before running the
LinkMD test. Additionally, a software reset (Reg. 0h, Bit [15] = 1) should be performed before and after running the
LinkMD test. The reset helps to ensure the KSZ9031MNX is in the normal operating state before and after the test.
NAND Tree Support
The KSZ9031MNX provides parametric NAND tree support for fault detection between chip I/Os and board. NAND tree
mode is enabled at power-up/reset with the MODE[3:0] strap-in pins set to ‘0100’. Table 8 lists the NAND tree pin order.
Table 8. NAND Tree Test Pin Order for KSZ9031MNX
Pin
Description
LED2 Input
LED1/PME_N1 Input
TXD0 Input
TXD1 Input
TXD2 Input
TXD3 Input
TX_ER Input
GTX_CLK Input
TX_EN Input
RX_DV Input
RX_ER Input
RX_CLK Input
CRS Input
COL Input
INT_N/PME_N2 Input
MDC Input
MDIO Input
CLK125_NDO Output
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KSZ9031MNX
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Revision 2.2
Power Management
The KSZ9031MNX incorporates a num ber of power-management modes and features that provide m ethods to consum e
less energy. These are discussed in the following sections.
Energy-Detect Power-Down Mode
Energy-detect power-down (EDPD) mode is used to f urther reduce the tr ansceiver po wer consum ption when the c able is
unplugged. It is enabled by writing a one to MMD Address 1Ch, Register 23h, Bit [0], and is in effect when auto-
negotiation mode is enabled and the cable is disconnected (no link).
In EDPD M ode, th e KSZ 90 31MN X sh ut s d o wn al l tr an s c eiver bloc ks, ex cept for the tra ns mitter and en erg y detec t circuits.
Power can be reduced further by extending the time interval between the transmissions of link pulses to check for the
presence of a link partner. The periodic transmission of link pulses is needed to ensure the KSZ9031MNX and its link
partner, when operating in the same low-pow er state and with Auto M DI/MDI-X disab led, can wak e up when th e cable is
connected between them. By default, EDPD mode is disabled after power-up.
Software Power-D own Mode
This mode is used to power down the KSZ9031MNX device when it is not in use after power-up. Software power-down
(SPD) m ode is enabled by writing a one t o Register 0h, Bit [11]. In the SPD state, the KSZ9031MNX d isables all int ernal
functions, except for the MII management interface. The KSZ9031MNX exits the SPD state after a zero is written to
Register 0h, Bit [11].
Chip Power-Down Mode
This m ode provides the lowest power state for the KSZ9031MNX device when i t is mounted on the board but not in use.
Chip power-down (CPD) mode is enabled after power-up/reset with the MODE[3:0] strap-in pins set to ‘0111’. The
KSZ9031MN X exits CPD mode af ter a hard ware res et is appli ed to the R ESET_N p in ( Pin 56) w ith the M ODE[3:0] str ap-
in pins set to an operating mode other than CPD.
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Energy Efficient Ethernet (EEE)
The KSZ90 31MNX im plements Energy Efficient Et her net (EEE), as desc ribed in IEEE Stand ard 80 2.3a z. The Sta ndard is
defined around an EEE-compliant MAC on the host side and an EEE-compliant link partner on the line side that support
the special signaling associated with EEE. EEE saves power by keeping the AC signal on the copper Ethernet cable at
approximately 0V peak-to-peak as often as possible during periods of no traffic activity, while maintaining the link-up
status. This is referred to as low-power idle (LPI) mode or state.
During LPI mode, the copper link responds automatically when it receives traffic and resumes normal PHY operation
immediately, without blockage of traffic or loss of packet. This involves exiting LPI mode and returning to normal
100/1000Mbps operating mode. Wake-up times are <16µs for 1000Base-T and <30µs for 100Base-TX.
The LPI state is controlled independently for transmit and receive paths, allowing the LPI state to be active (enabled) for:
Transmit cable path only
Receive cable path only
Both transmit and receive cable paths
The KSZ9031MNX has the EEE funct ion disa bled as the po wer-u p default sett ing . T he EEE function is enabled b y setting
the f ollowin g EEE adver tisem ent bits at MMD Address 7h, Register 3Ch, f ollowed b y restarting auto-ne gotiation ( writing a
‘1’ to Register 0h, Bit [9]):
Bit [2] = 1 // Enable 1000Mbps EEE mode
Bit [1] = 1 // Enable 100Mbps EEE mode
For standard (non-EEE) 10Base-T mode, normal link pulses (NLPs) with long periods of no AC signal transmission are
used to maintain the link during the idle period when there is no traffic activity. To save more power, the KSZ9031MNX
provides the option to enable 10Base-Te mode, which saves additional power by reducing the transmitted signal
amplitude from 2.5V to 1.75V. To enable 10Base-Te mode, write a ‘1’ to MMD Address 1Ch, Register 4h, Bit [10].
During LPI mode, refresh transmissions are used to maintain the link; power savings occur in quiet periods. Approx imately
every 20 to 22 milliseconds, a refresh transmission of 200 to 220 microseconds is sent to the link partner. The refresh
transmissions and quiet periods are shown in Figure 8.
Figure 8. LPI Mode (Refresh Transmissions and Quiet Periods)
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Transmit Direction Control (MAC-to-PHY)
The KSZ9031MNX ent ers LPI mode for the transmit direction when its attached EEE-compliant MAC de-asserts TX_EN,
asserts TX_ER, and sets TXD[7:0] to 0000_0001 for GMII (1000Mbps) or TXD[3:0] to 0001for MII (100Mbps). The
KSZ9031MNX remains in the transmit LPI state while the MAC maintains the states of these signals. When the MAC
changes any of the TX_EN, TX_ER, or TX data signals from their LPI state values, the KSZ9031MNX exits the LPI
transmit state.
For GMII (1000Mbps), the GTX_CLK clock can be stopped by the MAC to save additional power, after the GMII signals
for the LPI state have been asserted for nine or more GTX_CLK clock cycles.
Figure 9 shows the LPI transition for GMII transmit.
Figure 9. LPI Transition GMII (1000Mbps) Transmit
For MII (100Mbps), the TX_CLK is not stopped, because it is sourced from the PHY and is used by the MAC for MII
transmit.
Figure 10 shows the LPI transition for MII trans mit.
Figure 10. LPI Transition MII (100Mbps) Transmit
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Revision 2.2
Recei ve Direction Control (PH Y-to-MAC)
The KSZ9031MNX enters LPI mode for the receive direction when it receives the /P/ code bit pattern (Sleep/Refresh)
from its EEE-compliant link partner. It then de-asserts RX_DV, asserts RX_ER, and drives RXD[7:0] to 0000_0001 for
GMII (1000Mbps) or RXD[3:0] to 0001 for MII (100Mbps). The KSZ9031MNX remains in the receive LPI state while it
continues to receive the r efresh fr om its link partner , so it will cont inue to m aintain and drive the L PI output st ates for the
GMII/MII receive signals to inform the attached EEE-compliant MAC that it is in the receive LPI state. When the
KSZ9031MNX receives a non /P/ code bit pattern (non-refresh), it exits the receive LPI state and sets the RX_DV,
RX_ER, and RX data signals to set a normal frame or normal idle.
For GMII (1000Mbps), the KSZ9031MNX stops the RX_CLK clock output to the MAC after nine or more RX_CLK clock
cycles have occurred in the receive LPI state, to save more power.
Figure 11 shows the LPI transition for GMII receive.
Figure 11. LPI Transition GMII (1000Mbps) Receive
Similarly, for MII (100Mbps), the KSZ9031MNX stops the RX_CLK clock output to the MAC after nine or more RX_CLK
clock cycles have occurred in the receive LPI state, to save more power.
Figure 12 shows the LPI transition for MII receive.
Figure 12. LPI Transition MII (100Mbps) Receive
Registers Associated with EEE
The following MMD registers are provided for EEE configuration and management:
MMD Address 3h, Register 0h - PCS EEE Control Register
MMD Address 3h, Register 1h - PCS EEE Status Register
MMD Address 7h, Register 3Ch - EEE Advert is ement Register
MMD Address 7h, Register 3Dh - EEE Link Partner Advertisement Register
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Wake-On-LAN
Wake-On-LAN (W OL) is normall y a MAC-based f unction to wak e up a host s yste m (for ex ample, an Etherne t end device,
such as a PC) that is in standby power mode. Wake-up is triggered by receiving and detecting a special packet
(comm only referred to as the “m agic packet”) that is sent by the rem ote link partner. The KSZ903 1MNX can perform the
same W O L function if the MAC addr ess of its assoc iated MAC d evice is e ntere d into t he KSZ 9031MNX PH Y regis ters f or
magic-packet detection. When the KSZ9031MNX detects the magic packet, it wakes up the host by driving its power
management event (PME) output pin low.
By defau lt, the W OL f unction is d isabled. It is ena bled by s etting th e enabl ing bit and c onfiguri ng the as sociated register s
for the selected PME wake-up detection method.
The KSZ9031MNX provides three methods to trigger a PME wake-up:
Magic-packet detection
Customized-packet detection
Link status change detection
Magic-Packet Detection
The m agic packet’s fram e for mat starts with 6 b ytes of 0xFFh and is f ollowed b y 16 repetitions of the MAC addres s of its
associated MAC device (local MAC device).
When the magic packet is detected from its link partner, the KSZ9031MNX asserts its PME output pin low.
The following MMD Address 2h registers are provided for magic-packet detection:
Magic-pac k et detecti on is enab led by writ ing a ‘1’ to MMD Address 2h, Register 10h, Bit [6]
The MAC address (for the local MAC device) is written to and stored in MMD Address 2h, Registers 11h
13h
The KSZ9031MNX does not generate the magic packet. The magic packet must be provided by the external system.
Customized-Packet Detection
The c ustomized pac k et has ass ociated r egister /bit m asks to s elect which b yte, or bytes, of the fir st 64 bytes of the pac k et
to use in the C RC calcu lation. Af ter the K SZ9031MNX receiv es the pack et fr om its link partner , the selec ted b ytes for the
received packet are used to calculate the CRC. The calculated CRC is compared to the expected CRC value that was
previously written to and stored in the KSZ9031MNX PHY registers. If there is a match, the KSZ9031MNX asserts its
PME output pin low.
Four customized packets are provided t o suppor t four types of wak e-up scenar ios. A ded icated s et of regis ters is used to
configure and enable each customized packet.
The following MMD registers are provided for customized-packet detection:
Each of the four customized packets is enabled via MMD Address 2h, Register 10h,
- Bit [2] // For customized packets, type 0
- Bit [3] // For customized packets, type 1
- Bit [4] // For customized packets, type 2
- Bit [5] // For customized packets, type 3
32-bit expected CRCs are written to and stored in:
- MMD Address 2h, Registers 14h 15h // For customized packets, type 0
- MMD Address 2h, Registers 16h 17h // For customized packets, type 1
- MMD Address 2h, Registers 18h 19h // For customized packets, type 2
- MMD Address 2h, Registers 1Ah 1Bh // For customized packets, type 3
Masks to indicate which of the first 64-bytes to use in the CRC calculation are set in:
- MMD Address 2h, Registers 1Ch 1Fh // For customized packets, type 0
- MMD Address 2h, Registers 20h 23h // For customized packets, type 1
- MMD Address 2h, Registers 24h 27h // For customized packets, type 2
- MMD Address 2h, Registers 28h 2Bh // For customized packets, type 3
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Link Status Change Detection
If link status change detection is enabled, the KSZ9031MNX asserts its PME output pin low whenever there is a link
status change using the following MMD Address 2h registers bits and their enabled (1) or disabled (0) settings:
MMD Address 2h, Register 10h, Bit [0] // For link-up detection
MMD Address 2h, Register 10h, Bit [1] // For link-down detection
The PME output signal is available on either LED1/PME_N1 (Pin 19) or INT_N/PME_N2 (Pin 53), and is selected and
enabled using MMD Address 2h, Register 2h, Bits [8] and [10], r especti vel y. Addition ally, MMD Address 2h, Register 10h,
Bits [15:14] defines the output functions for Pins 19 and 53.
The PME out put is ac tive low and r equires a 1kΩ pull-up to the VDDIO suppl y. When ass erted , the PME o utput is c leared
by disabling the re gister bit that enabled the PME trigger source (magic packet, customized packet, link status change).
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Typical Current/Power Consumption
Table 9, Table 10, Table 11, and Table 12 show the typical current consumption by the core (DVDDL, AVDDL,
AVDDL_PLL), transceiver (AVDDH) and digital I/O (DVDDH) supply pins, and the total typical power for the entire
KSZ9031MNX device for various nominal operating voltage combinations.
Table 9. Typical Current/Power Consumption Tra ns ceiver (3.3V), Digital I/Os (3.3V)
Condition
1.2V Core
(DVDDL, AVDDL,
AVDDL_PLL)
3.3V Transceiver
(AVDDH) 3.3V Digital I/Os
(DVDDH) Total Chip Power
mA mA mA mW
1000Base-T link-up (no traffic ) 211 66.6 26.0 560
1000Base-T full-duplex @ 100% utilization 221 65.6 53.8 660
100Base-TX link-up (no traffic) 60.6 28.7 13.3 211
100Base-TX full-duplex @ 100% util ization 61.2 28.7 18.0 228
10Base-T link-up (no traffic) 7.0 17.0 5.7 83
10Base-T full-duplex @ 100% utilizati on 7.7 29.3 11.1 143
EEE Mode 1000Mbps 41.6 5.5 3.7 80
EEE Mode 100Mbps (TX and RX in LPI) 25.3 5.2 7.0 71
Software power-down mode (Reg. 0h.11 = 1) 0.9 4.1 7.1 38
Table 10. Typ ical Current/Pow er Consumption Transce iver (3.3V), Digital I/Os (1.8V)
Condition
1.2V Core
(DVDDL, AVDDL,
AVDDL_PLL)
3.3V Transceiver
(AVDDH) 1.8V Digital I/Os
(DVDDH) Total Chip Power
mA
mA
mA
mW
1000Base-T link-up (no traffic ) 211 66.6 14.2 498
1000Base-T full-duplex @ 100% utilization 221 65.6 29.3 534
100Base-TX link-up (no traffic) 60.6 28.7 7.3 181
100Base-TX full-duplex @ 100% utilization 61.2 28.7 10.0 186
10Base-T link-up (no traffic) 7.0 17.0 3.1 70
10Base-T full-duplex @ 100% utilization 7.7 29.3 6.0 117
EEE Mode 1000Mbps 41.6 5.5 2.4 72
EEE Mode 100Mbps (TX and RX in LPI) 25.3 5.2 3.8 54
Software power-down mode (Reg. 0h.11 = 1) 0.9 4.1 3.7 21
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Table 11. Typical Current/Power Consumption Transceiver (2.5V), Digital I/Os (2.5V)
Condition
1.2V Core
(DVDDL, AVDDL,
AVDDL_PLL)
2.5V
Transceiver(4)
(AVDDH
commercial
temp. only)
2.5V Digital I/Os
(DVDDH) Total Chip Power
mA mA mA mW
1000Base-T link-up (no traffic) 211 58.6 19.3 448
1000Base-T full-duplex @ 100% utilization 221 57.6 40.5 510
100Base-TX link-up (no traffic) 60.6 24.8 10.0 160
100Base-TX full-duplex @ 100% util ization 61.2 24.8 13.7 170
10Base-T link-up (no traffic) 7.0 12.5 4.3 50
10Base-T full-duplex @ 100% utilization 7.7 25.8 8.3 94
EEE Mode 1000Mbps 41.6 4.4 2.9 68
EEE Mode 100Mbps (TX and RX in LPI) 25.3 4.0 5.2 53
Software power-down mode (Reg. 0h.11 = 1) 0.9 3.0 5.3 22
Note:
4. 2.5V AVDDH i s rec ommended for comm ercial temperature range (0°C to +70° C) operation only.
Table 12. Typical Current/Power Consumption Transceiver (2.5V), Digital I/Os (1.8V)
Condition
1.2V Core
(DVDDL, AVDDL,
AVDDL_PLL)
2.5V
Transceiver(4)
(AVDDH
commercial
temp. only)*
1.8V Digital I/Os
(DVDDH) Total Chip Power
mA mA mA mW
1000Base-T link-up (no traffic) 211 58.6 14.2 425
1000Base-T full-duplex @ 100% utilization 221 57.6 29.3 462
100Base-TX link-up (no traffic) 60.6 24.8 7.3 148
100Base-TX full-duplex @ 100% util ization 61.2 24.8 10.0 153
10Base-T link-up (no traffic) 7.0 12.5 3.1 45
10Base-T full-duplex @ 100% utilizati on 7.7 25.8 6.0 85
EEE Mode 1000Mbps 41.6 4.4 2.4 65
EEE Mode 100Mbps (TX and RX in LPI) 25.3 4.0 3.8 47
Software power-down mode (Reg. 0h.11 = 1) 0.9 3.0 3.7 15
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Register Map
The register space within the KSZ9031MNX consists of two distinct areas.
Standard registers // Direct register access
MDIO manageable device (MMD) registers // Indirect register access
The KSZ9031MNX supports the following standard registers.
Table 13. Standard Registers Supported by KSZ9031MNX
Register Number (Hex) Description
IEEE-Defined Registers
0h Basic Control
1h Basic Status
2h PHY Identifier 1
3h PHY Identifier 2
4h Auto-Negotiation Advertisement
5h Auto-Negotiation Link Partner Ability
6h Auto-Negotiation Expansion
7h Auto-Negotiation Next Page
8h Auto-Negotiation Link Partner Next Page Ability
9h 1000Base-T Control
Ah 1000Base-T Status
Bh – Ch Reserved
Dh MMD Access Control
Eh MMD Access Register/Data
Fh Extended Status
Vendor-Specific Registers
10h Reserved
11h Remote Loopback
12h LinkMD Cable Diagnostic
13h Digital PMA/PCS Status
14h Reserved
15h RXER Counter
16h – 1Ah Reserved
1Bh Interrupt Control/Status
1Ch Auto MDI/MDI-X
1Dh 1Eh Reserved
1Fh PHY Control
The KSZ9031MNX supports the following MMD device addresses and their associated register addresses, which make
up the indirect MMD registers. These can be seen in Table 14.
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Revision 2.2
Table 14. MMD Registers Supported by KSZ9031MNX
Device Address (Hex)
Register Address (Hex)
Description
0h 3h AN FLP Burst Transmit LO
4h AN FLP Burst Transmit HI
1h 5Ah 1000Base-T Link-Up Time Control
2h
0h Common Control
1h Strap Status
2h Operation Mode Strap Override
3h Operation Mode Strap Status
4h GMII Control Signal Pad Skew
8h GMII Clock Pad Skew
10h Wake-On-LAN Control
11h Wake-On-LAN Magic Packet, MAC-DA-0
12h Wake-On-LAN Magic Packet, MAC-DA-1
13h Wake-On-LAN Magic Packet, MAC-DA-2
14h Wake-On-LAN Customized Packet, Type 0, Expected CRC 0
15h Wake-On-LAN Customized Pack et, Type 0, Expected CRC 1
16h Wake-On-LAN Customized Packet, Type 1, Expected CRC 0
17h Wake-On-LAN Customized Packet, Type 1, Expected CRC 1
18h Wake-On-LAN Customized Packet, Type 2, Expected CRC 0
19h Wake-On-LAN Customized Pack et, T y pe 2, Expected CRC 1
1Ah Wake-On-LAN Customized Packet, Type 3, Expected CRC 0
1Bh Wake-On-LAN Customized Packet, Type 3, Expected CRC 1
1Ch Wake-On-LAN Customized Packet, Type 0, Mas k 0
1Dh Wake-On-LAN Customized Packet, Type 0, Mas k 1
1Eh Wake-On-LAN Customized Packet, Type 0, Mas k 2
1Fh Wake-On-LAN Customized Packet, Type 0, Mask 3
20h Wake-On-LAN Customized Packet, Type 1, Mask 0
21h Wake-On-LAN Customized Packet, Type 1, Mask 1
22h Wake-On-LAN Customized Packet, Type 1, Mask 2
23h Wake-On-LAN Customized Packet, Type 1, Mask 3
24h Wake-On-LAN Customized Packet, Type 2, Mask 0
25h Wake-On-LAN Customized Packet, Type 2, Mask 1
26h Wake-On-LAN Customized Packet, Type 2, Mask 2
27h Wake-On-LAN Customized Packet, Type 2, Mask 3
28h Wake-On-LAN Customized Packet, Type 3, Mask 0
29h Wake-On-LAN Customized Packet, Type 3, Mask 1
2Ah Wake-On-LAN Customized Packet, Type 3, Mas k 2
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Table 14. MMD Registers Supported by KSZ9031MNX (Continued)
Device Address (Hex) Register Address (Hex) Description
2h 2Bh Wake-On-LAN Customized Packet, Type 3, Mask 3
3h 0h PCS EEE Control
1h PCS EEE Status
7h 3Ch EEE Advertisement
3Dh EEE Link Partner Advertisement
1Ch 4h Analog Control 4
23h EDPD Control
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Standard Registers
Standard registers provide direct read/write access to a 32-register address space, as defined in Clause 22 of the IEEE
802.3 Specification. Within this address space, the first 16 registers (Registers 0h to Fh) are defined according to the
IEEE specification, while the remaining 16 registers (Registers 10h to 1Fh) are defined specific to the PHY vendor.
IEEE Defined Registers Descriptions
Address Name Description Mode
(5)
Default
Register 0h Basic Cont rol
0.15 Reset 1 = Software PHY reset
0 = Normal operation
This bit is self-cleared after a ‘1’ is written to it. RW/SC 0
0.14 Loopback 1 = Loopback mode
0 = Normal operation RW 0
0.13 Speed Select
(LSB)
[0.6, 0.13]
[1,1] = Reserved
[1,0] = 1000Mbps
[0,1] = 100Mbps
[0,0] = 10Mbps
This bit is ignored if auto-negotiation is enabled
(Reg. 0.12 = 1).
RW 0
0.12 Auto-
Negotiation
Enable
1 = Enable auto-negotiation process
0 = Disable auto-negotiation process
If enabled, auto-negotiation result overrides
settings in Reg. 0.13, 0.8 and 0.6.
If disabled, Auto MDI-X is also automatically
disabled. Use Register 1Ch to set MDI/MDI-X.
RW 1
0.11 Power-Down
1 = Power-down mode
0 = Normal operation
When this bit is set to ‘1’, the link-down status
might not get updated in the PHY register.
Software should note link is down and should
not rely on the PHY register link status.
After this bit is changed from ‘1’ to ‘0’, an
internal global reset is automatically generated.
Wait a minimum of 1ms before read/write
access to the PHY registers.
RW 0
0.10 Isolate 1 = Electrical isolation of PHY from GMII/MII
0 = Normal operation RW 0
0.9 Restart Auto-
Negotiation
1 = Restart auto-negotiation pr oce ss
0 = Normal operation
This bit is self-cleared after a ‘1’ is written to it. RW/SC 0
Note:
5. RW = Read/Write.
RO = Read only.
SC = Self-cleared.
LH = Latch high.
LL = Latch low.
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IEEE Defined Registers Descriptions (Continued)
Address Name Description Mode
(5)
Default
0.8 Duplex Mode 1 = Full-duplex
0 = Half-duplex RW 1
0.7 Collision Test 1 = Enable COL test
0 = Disable COL test RW 0
0.6 Speed Select
(MSB)
[0.6, 0.13]
[1,1] = Reserved
[1,0] = 1000Mbps
[0,1] = 100Mbps
[0,0] = 10Mbps
This bit is ignored if auto-negotiation is enabled
(Reg. 0.12 = 1).
RW Set by MODE[3:0] strapping pins.
See the Strapping Options section
for details.
0.5:0 Reserved Reserved RO 00_0000
Register 1h Basic Status
1.15 100Base-T4 1 = T4 capable
0 = Not T4 capable RO 0
1.14 100Base-TX
Full-Duplex 1 = Capable of 100Mbps full-duplex
0 = Not capable of 100Mbps full-duplex RO 1
1.13 100Base-TX
Half-Duplex 1 = Capable of 100Mbps half-duplex
0 = Not capable of 100Mbps half-duplex RO 1
1.12 10Base-T
Full-Duplex 1 = Capable of 10Mbps full-duplex
0 = Not capable of 10Mbps full-duplex RO 1
1.11 10Base-T
Half-Duplex 1 = Capable of 10Mbps half-duplex
0 = Not capable of 10Mbps half-duplex RO 1
1.10:9 Reserved Reserved RO 00
1.8 Extended
Status 1 = Extended status info in Reg. 15h.
0 = No extended status info in Reg. 15h. RO 1
1.7 Reserved Reserved RO 0
1.6 No Preamble 1 = Preamble suppression
0 = Normal preamble RO 1
1.5 Auto-
Negotiation
Complete
1 = Auto-neg oti atio n pro ce ss compl ete d
0 = Auto-negotiation process not com pleted RO 0
1.4 Remote Fault 1 = Remote fault
0 = No remote fault RO/LH 0
1.3 Auto-
Negotiation
Ability
1 = Can perfor m auto-negotiation
0 = Cannot perform auto-negotiation RO 1
1.2 Link Status 1 = Link is up
0 = Link is down RO/LL 0
1.1 Jabber Detect 1 = Jabber detected
0 = Jabber not detected (default is low) RO/LH 0
1.0 Extended
Capability 1 = Supports extended capability registers RO 1
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IEEE Defined Registers Descriptions (Continued)
Address Name Description Mode
(5)
Default
Register 2h PHY Identifier 1
2.15:0 PHY ID
Number
Assigned to the 3rd through 18th bits of the
organizationally unique identifier (OUI).
KENDIN Communication’s OUI is 0010A1h. RO 0022h
Register 3h PHY Identifier 2
3.15:10 PHY ID
Number
Assigned to the 19th through 24th bits of the
organizationally unique identifier (OUI).
KENDIN Communication’s OUI is 0010A1h. RO 0001_01
3.9:4 Model Number Six-bit manufacturer’s model number RO 10_0010
3.3:0 Revision
Number Four-bit manufacturer’s revision number RO Indicates silicon revision
Register 4h Auto-Negotiation Advertisement
4.15 Next Page 1 = Next page c apable
0 = No next page capability RW 0
4.14 Reserved Reserved RO 0
4.13 Remote Fault 1 = Remote fault supported
0 = No remote fault RW 0
4.12 Reserved Reserved RO 0
4.11:10 Pause
[4.11, 4.10]
[0,0] = No pause
[1,0] = Asymmetric pause (link partner)
[0,1] = Symmetric pause
[1,1] = Sym m etric and asymmetric pause
(local devic e)
RW 00
4.9 100Base-T4 1 = T4 capable
0 = No T4 capability RO 0
4.8 100Base-TX
Full-Duplex 1 = 100Mbps full-duplex capable
0 = No 100Mbps full-duplex capability RW 1
4.7 100Base-TX
Half-Duplex 1 = 100Mbps half-duplex capable
0 = No 100Mbps half-duplex capability RW 1
4.6 10Base-T
Full-Duplex 1 = 10Mbps full-duplex capable
0 = No 10Mbps full-duplex capability RW 1
4.5 10Base-T
Half-Duplex 1 = 10Mbps half-duplex capable
0 = No 10Mbps half-duplex capability RW 1
4.4:0 Selector Field [00001] = IEEE 802.3 RW 0_0001
Register 5h Auto-Negotiation Link Partner Ability
5.15 Next Page 1 = Next page c apable
0 = No next page capability RO 0
5.14 Acknowledge 1 = Link code word received from partner
0 = Link code word not yet received RO 0
5.13 Remote Fault 1 = Remote fault detected
0 = No remote fault RO 0
5.12 Reserved Reserved RO 0
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IEEE Defined Registers Descriptions (Continued)
Address Name Description Mode
(5)
Default
5.11:10 Pause
[5.11, 5.10]
[0,0] = No pause
[1,0] = Asymmetric Pause (link partner)
[0,1] = Symmetric pause
[1,1] = Symmetric and asymmetric pause
(local devic e)
RW 00
5.9 100Base-T4 1 = T4 capable
0 = No T4 capability RO 0
5.8 100Base-TX
Full-Duplex 1 = 100Mbps full-duplex capable
0 = No 100Mbps full-duplex capability RO 0
5.7 100Base-TX
Half-Duplex 1 = 100Mbps half-duplex capable
0 = No 100Mbps half-duplex capability RO 0
5.6 10Base-T
Full-Duplex 1 = 10Mbps full-duplex capable
0 = No 10Mbps full-duplex capability RO 0
5.5 10Base-T
Half-Duplex 1 = 10Mbps half-duplex capable
0 = No 10Mbps half-duplex capability RO 0
5.4:0 Selector Field [00001] = IEEE 802.3 RO 0_0000
Register 6h Auto-Negotiation Expansion
6.15:5 Reserved Reserved RO 0000_0000_000
6.4 Parallel
Detection Faul t 1 = Fault detected by parallel detection
0 = No fault detected by parallel detection RO/LH 0
6.3 Link Partner
Next Page
Able
1 = Link partner has next page capability
0 = Link partner does not have next page
capability RO 0
6.2 Next Page
Able
1 = Local device has next page capability
0 = Local device does not have next page
capability RO 1
6.1 Page Received 1 = New page rec eived
0 = New page not received RO/LH 0
6.0
Link Partner
Auto-
Negotiation
Able
1 = Link partner has auto-neg otiat ion cap abi lity
0 = Link partner does not have auto-negotiation
capability RO 0
Register 7h Auto-Negotiation Next Page
7.15 Next Page 1 = Additional next pages will follow
0 = Last page RW 0
7.14 Reserved Reserved RO 0
7.13 Mess age Page 1 = Message page
0 = Unformatted page RW 1
7.12 Acknowledge2 1 = Will comply with message
0 = Cannot c omply with message RW 0
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IEEE Defined Registers Descriptions (Continued)
Address Name Description Mode
(5)
Default
7.11 Toggle 1 = Previous value of the transmitted li nk code
word equaled logic one
0 = Logic zero RO 0
7.10:0 Message Field 11-bit wi de field to encode 2048 messages RW 000_0000_0001
Register 8h Auto-Negotiation Link Partner Next Page Ability
8.15 Next Page 1 = Additional next pages will follow
0 = Last page RO 0
8.14 Acknowledge 1 = Successful receipt of link word
0 = No successful receipt of link word RO 0
8.13 Mess age Page 1 = Message page
0 = Unformatted page RO 0
8.12 Acknowledge2 1 = Able to act on the information
0 = Not able to act on the information RO 0
8.11 Toggle
1 = Previous value of transmitted link code word
equal to logic zero
0 = Previous value of transmitted link code word
equal to logic one
RO 0
8.10:0 Message Field RO 000_0000_0000
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IEEE Defined Registers Descriptions (Continued)
Register 9h1000Base-T Control
Address Name Description Mode
(5)
Default
9.15:13 Test Mode Bits
Transmitter test mode operations
[9.15:13] Mode
[000] Normal operation
[001] Test mode 1 –Transmit waveform
test
[010] Test mode 2 –Transmit jitter test
in master mode
[011] Test mode 3 –Transmit jitter test
in slave mode
[100] Test mode 4 –Transmitter
distortion test
[101] Reserv ed, operations not
identified
[110] Reserv ed, operations not
identified
[111] Reserv ed, operations not
identified
To enable 1000Base-T Test Mode:
1) Set Register 0h = 0x0140 to disable auto-
negotiati on and sel ect 1000Mbps speed.
2) Set Register 9h, bits [15:13] = 001, 010, 011, or
100 to select one of the 1000Base-T Test Modes.
After the above settings, the test waveform for the
selected tes t mode is transmitted onto each of the 4
differential pairs. No link partner is needed.
RW 000
9.12
Master-Slave
Manual
Configuration
Enable
1 = Enable master-slave manual configuration value
0 = Disable master-slave manual configuration value RW 0
9.11
Master-Slave
Manual
Configuration
Value
1 = Configure PHY as master durin g maste r- slave
negotiation
0 = Configure PHY as slave during master- slave
negotiation
This bit is ignored if master-slave manual onfiguration
is disabled (Reg. 9.12 = 0).
RW 0
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IEEE Defined Registers Descriptions (Continued)
Address Name Description Mode
(5)
Default
9.10 Port Type
1 = Indicate the preference to operate as multiport
device (master)
0 = Indicate the preference to operate as single-port
device (slave)
This bit is valid only if master-slave manual
configuration is disabled (Reg. 9.12 = 0).
RW 0
9.9 1000Base-T
Full-Duplex
1 = Advertis e PHY is 1000Base-T full-duplex capable
0 = Advertis e PHY is not 1000Base-T full-duplex
capable RW 1
9.8 1000Base-T
Half-Duplex
1 = Advertis e PHY is 1000Base-T half-duplex
capable
0 = Advertis e PHY is not 1000Base-T half-duplex
capable
RW
Set by MODE[3:0] strapping
pins.
See the Strapping Options
section for details.
9.7:0 Reserved Write as 0, ignore on read RO
Register Ah 1000Base-T Status
A.15 Master-Slave
Configuration
Fault
1 = Master-slave configuration fault detected
0 = No master-slave configuration fault det ecte d RO/LH/SC 0
A.14 Master-Slave
Configuration
Resolution
1 = Local PHY configuration resolved to master
0 = Local PHY configuration resolved to slave RO 0
A.13 Local Receiver
Status 1 = Local receiver OK (loc_rcvr_status = 1)
0 = Local receiver not OK (loc_rcvr_status = 0) RO 0
A.12 Remote
Receiver
Status
1 = Remote receiver OK (rem_rcvr_status = 1)
0 = Remote receiver not OK (rem_rcvr_status = 0) RO 0
A.11
Link Partner
1000Base-T
Full-Duplex
Capability
1 = Link partner is capable of 1000Ba se-T full-duplex
0 = Link partner is not capable of 1000Base-T
full-duplex RO 0
A.10
Link Partner
1000Base-T
Half-Duplex
Capability
1 = Link par tn er is capa ble of 1000Base-T half-duplex
0 = Link Partner is not capable of 1000Base-T
half-duplex RO 0
A.9:8 Reserved Reserved RO 00
A.7:0 Idle Error
Count
Cumulative count of errors detected when receiver is
receiving idles and PMA_TXMODE.indicate =
SEND_N.
The counter is incremented every sym bol period that
rxerror_status = ERROR.
RO/SC 0000_0000
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IEEE Defined Registers Descriptions (Continued)
Address Name Description Mode
(5)
Default
Registe r Dh MMD Access Control
D.15:14 MMD
Operation
Mode
For the selected MMD device address (Bits [4:0] of
this register) , the se tw o bits select one of the
following register or data operations and the usage
for MMD Access Register/Data (Reg. Eh).
00 = Register
01 = Data, no post increment
10 = Data, post increment on reads and writes
11 = Data, post increment on w rites only
RW 00
D.13:5 Reserved Reserved RW 00_0000_000
D.4:0 MMD
Device
Address These five bits set the MMD device address. RW 0_0000
Register Eh MMD Access Register/Data
E.15:0 MMD
Register/Data
For the selected MMD device address (Reg. Dh, Bits
[4:0]),
When Reg. Dh, Bits [15:14] = 00, this register
contains the read/write register address for the
MMD device address.
Otherwi s e, this register contains the read/write
data value for the MMD devic e address and its
selected register address.
See also Reg. Dh, Bits [15:14], for descriptions of
post increment reads and writes of this register for
data operation.
RW 0000_0000_0000_0000
Register FhExtended Status
F.15 1000Base-X
Full-Duplex 1 = PHY can perform 1000Base-X ful l-duplex
0 = PHY cannot perform 1000 Base-X full-duplex RO 0
F.14 1000Base-X
Half-Duplex 1 = PHY can perform 1000Base-X half-duplex
0 = PHY cannot perf orm 100 0 B ase-X half-duplex RO 0
F.13 1000Base-T
Full-Duplex 1 = PHY can perform 1000Base-T full-duplex
0 = PHY cannot perf orm 100 0 Base-T full-duplex RO 1
F.12 1000Base-T
Half-Duplex 1 = PHY can perform 1000Base-T half-duplex
0 = PHY cannot perf orm 100 0 Base-T half-duplex RO 1
F.11:0 Reserved Ignore when read RO -
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Vendor-Specific Registers Descriptions
Address Name Description Mode
(6)
Default
Register 11h Remote Loopback
11.15:9 Reserved Reserved RW 0000_000
11.8 Remote
Loopback 1 = Enable remote loopback
0 = Disable remote loopback RW 0
11.7:1 Reserved Reserved RW 1111_010
11.0 Reserved Reserved RO 0
Register 12h LinkMD Cable Diagnostic
12.15 Cable
Diagnostic
Test Enable
Write value:
1 = Enable cable diagnostic test. After test has
completed, this bit is self-cleared.
0 = Disable cable diagnostic test.
Read value:
1 = Cable diagnostic test is in progress.
0 = Indicates cable diagnostic test (if enabled) has
completed and the status information is valid for
read.
RW/SC 0
12.14 Reserved This bit should always be set to ‘0’. RW 0
12.13:12 Cable
Diagnostic
Test Pair
These two bits select the differential pair for testing:
00 = Differential pair A (Pins 2, 3)
01 = Differential pair B (Pins 5, 6)
10 = Differential pair C (Pins 7, 8)
11 = Differential pair D (Pins 10, 11)
RW 00
12.11:10 Reserved These two bi ts should always be set to ‘00’. RW 00
12.9:8 Cable
Diagnostic
Status
These two bits repres ent the test res ult for the
se lected differential pair in Bits [13:12] of this register.
00 = Normal cable condition (no fault detected)
01 = Open cable fault detected
10 = Short cable fault detected
11 = Reserved
RO 00
12.7:0 Cable
Diagnostic
Fault Data
For the open or short cable fault detected in Bits [9:8]
of this register, this 8-bit value represents the
distance to the cable fault . RO 0000_0000
Note:
6. RW = Read/Write.
RO = Read only.
SC = Self-cleared.
LH = Latch high.
LL = Latch low.
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Vendor-Specific Registers Descriptions (Continued)
Address Name Description Mode
(6)
Default
Register 13h Digital PMA/PCS Status
13.15:3 Reserved Reserved RO/LH 0000_0000_0000_0
13.2 1000Base-T
Link Status
1000Base-T link stat us
1 = Link status is OK
0 = Link status is not OK RO 0
13.1 100Base-TX
Link Status
100Base-TX link status
1 = Link status is OK
0 = Link status is not OK RO 0
13.0 Reserved Reserved RO 0
Register 15h RXER Counter
15.15:0 RXER Counter Receiv e error coun ter for symbol error frames RO/RC 0000_0000_0000_0000
Register 1Bh Interrupt Control/Status
1B.15 Jabber
Interrupt
Enable
1 = Enable jabber interrupt
0 = Disable jabber interrupt RW 0
1B.14 Receive Error
Interrupt
Enable
1 = Enable receive error interrupt
0 = Disable receive error interrupt RW 0
1B.13 Page Received
Interrupt
Enable
1 = Enable page received interrupt
0 = Disable page received interrupt RW 0
1B.12 Parallel Detect
Fault Interr upt
Enable
1 = Enable parallel detect fault interrupt
0 = Disable parallel detect fault interrupt RW 0
1B.11
Link Partner
Acknowledge
Interrupt
Enable
1 = Enable link partner acknowledge interrupt
0 = Disable link partner acknowledge interrupt RW 0
1B.10 Link-Down
Interrupt
Enable
1 = Enable link-down interrupt
0 = Disable link-down interrupt RW 0
1B.9 Remote Fault
Interrupt
Enable
1 = Enable remote fault interrupt
0 = Disable remote fault interrupt RW 0
1B.8 Link-Up
Interrupt
Enable
1 = Enable link-up interrupt
0 = Disable link-up interrupt RW 0
1B.7 Jabber
Interrupt 1 = Jabber occurred
0 = Jabber did not occur RO/RC 0
1B.6 Receive Error
Interrupt 1 = Receive error occurred
0 = Receive error did not occur RO/RC 0
1B.5 Page Receive
Interrupt 1 = Page receive oc curred
0 = Page receiv e did not occ ur RO/RC 0
1B.4 Parallel Detect
Fault Interr upt 1 = Parallel detect fault occurred
0 = Parallel detect fault did not occur RO/RC 0
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Vendor-Specific Registers Descriptions (Continued)
Address Name Description Mode
(6)
Default
1B.3 Link Partner
Acknowledge
Interrupt
1 = Link partner acknowledge occ urr ed
0 = Link partner ac knowledge did not occur RO/RC 0
1B.2 Link-Down
Interrupt 1 = Link-down occurred
0 = Link-down did not occur RO/RC 0
1B.1 Remote Fault
Interrupt 1 = Remote fault occurred
0 = Remote fault did not occur RO/RC 0
1B.0 Link-Up
Interrupt 1 = Link-up occurred
0 = Link-up did not occur RO/RC 0
Register 1Ch Auto MDI/MDI-X
1C.15:8 Reserved Reserved RW 0000_0000
1C.7 MDI Set
When Swap-Off (Bit [6] of this register) is asserted
(1),
1 = PHY is set to operate as MDI mode
0 = PHY is set to operate as MDI-X mode
This bit has no function w hen Swap-Off is de-
asserted (0).
RW 0
1C.6 Swap-Off 1 = Disable Auto MDI/MDI-X function
0 = Enable Auto MDI/MDI-X function RW 0
1C.5:0 Reserved Reserved RW 00_0000
Register 1Fh PHY Control
1F.15 Reserved Reserved RW 0
1F.14 Interrupt Level 1 = Interrupt pin active high
0 = Interrupt pin active low RW 0
1F.13:12 Reserved Reserved RW 00
1F.11:10 Reserved Reserved RO/LH/RC 00
1F.9 Enable Jabber 1 = Enable jab ber cou nter
0 = Disable jabber counter RW 1
1F.8:7 Reserved Reserved RW 00
1F.6 Speed Status
1000Base-T 1 = Indicate chip fi nal sp eed st atus at
1000Base-T RO 0
1F.5 Speed Status
100Base-TX 1 = Indicate chip final speed status at
100Base-TX RO 0
1F.4 Speed Status
10Base-T 1 = Indicate chip final sp eed st atus at 10Base-T RO 0
1F.3 Duplex status Indicate chip duplex status
1 = Full-duplex
0 = Half-duplex RO 0
1F.2 1000Base-T
Master/Slave
Status
Indicate chip mas ter/slave status
1 = 1000Base-T master mode
0 = 1000Base-T slave mode RO 0
1F.1 Reserved Reserved RW 0
1F.0 Link Status
Check Fail 1 = Fail
0 = Not failing RO 0
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MMD Registers
MMD registers provide indirect read/write access to up to 32 MMD device addresses with each device supporting up to
65,536 16-bit r egist er s , as defined in Claus e 22 of the IEE E 802 .3 Sp ecif ic ati on. T he KSZ9031MNX , ho wev er, uses onl y a
small fraction of the available registers. See the Register Map section for a list of supported MMD device addresses and
their associated register addresses.
The following two standard registers serve as the portal registers to access the indirect MMD registers.
Standard Register Dh MMD Access Control
Standard Register Eh MMD Access Register/Data
Table 15. Portal Registers (Access to Indirect MMD Regi ster s)
Address Name Description
Mode(6)
Default
Registe r Dh MMD Access Control
D.15:14 MMD
Operation
Mode
For the selected MMD device address (Bits
[4:0] of this register), these two bits select one
of the following regis ter or data oper atio ns and
the usage for MMD Access Register/Data
(Reg. Eh).
00 = Register
01 = Data, no post increment
10 = Data, post increment on reads and writes
11 = Data, post increment on writes only
RW 00
D.13:5 Reserved Reserved RW 00_0000_000
D.4:0 MMD
Device
Address These f ive bits s et the MMD d evice address. RW 0_0000
Register Eh MMD Access Register/Data
E.15:0 MMD
Register/Data
For the selected MMD device address (Reg.
Dh, Bits [4:0]),
When Reg. Dh, Bits [15:14] = 00, this
register contains the read/write register
address for the MMD device address.
Otherwise, this register contains the
read/write data value for the MMD device
address and its selec ted register address.
See also Register Dh, Bits [15:14] descriptions
for post i ncre me nt re ads and w rites of this
register for data operation.
RW 0000_0000_0000_0000
Examples:
MMD Register Write
Write MMD Device Address 2h, Register 10h = 0001h to enable link-up detection to trigger PME for WOL.
1. Write Register Dh with 0002h // Set up register address for MMD Device Address 2h.
2. Write Register Eh with 0010h // Select Register 10h of MMD Device Address 2h.
3. Write Register Dh with 4002h // Select r e gister data for MMD Device Address 2h, Register 10h.
4. Write Register Eh with 0001h // Write value 0001h to MMD Device Address 2h, Register 10h.
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MMD Register Read
Read MMD Device Address 2h, Register 11h 13h for the magic packet’s MAC address
1. Write Register Dh with 0002h // Set up register address for MMD Device Address 2h.
2. Write Register Eh with 0011h // Select Register 11h of MMD Device Address 2h.
3. Write Register Dh with 8002h // Select register data for MMD Device Address 2h, Register 11h.
4. Read Register Eh // Read data in MMD Device Address 2h, Register 11h.
5. Read Register Eh // Read data in MMD Device Address 2h, Register 12h.
6. Read Register Eh // Read data in MMD Device Address 2h, Register 13h.
MMD Registers Descriptions
Address Name Description Mode
(7)
Default
MMD Address 0h, Register 3hAN FLP Burst Transmit LO
0.3.15:0 AN FLP Burst
Transmit LO
This register and the fol low ing r egis ter set the
Auto-Negotiation FLP burst transmit timing. The
same timing must be s et for both registers.
0x4000 = Select 8ms interval timing (default)
0x1A80 = Select 16ms interval timing
All other values are reserved.
RW 0x4000
MMD Address 0h, Register 4h AN FLP Burst Transmit HI
0.4.15:0 AN FLP Burst
Transmit HI
This register and the previous regis ter set the
Auto-Negotiation FLP burst transmit timing. The
same timing must be s et for both registers.
0x0003 = Select 8ms interval timing (default)
0x0006 = Select 16ms interval timing
All other values are reserved.
RW 0x0003
MMD Address 1h, Register 5Ah 1000Base-T Link-Up Time Control
1.5A.15:9 Reserved Reserved RO 0000_000
1.5A.8:4 Reserved Reserved RW 1_0000
1.5A.3:1 1000Base-T
Link-Up Time
When the link partner is anot h er KSZ903 1
device, the 1000B as e-T link-up time can be
long. These three bits provide an optional
setting to reduce the 1000Base-T link-up time.
100 = Default power-up setting
011 = Optional setting to reduce link-up time
when the link partner is a KSZ9031
device.
All other setting s are reser v ed and shou ld not
be used.
The optional setting is safe to use with any link
partner.
Note: Read/Write access to this register bit is
available only when Reg. 0h is set to 0x2100 to
disable auto-negotiation and force 100Base-TX mode.
RW 100
1.5A.0 Reserved Reserved RW 0
Note:
7. RW = Read/Write.
RO = Read only.
WO = Write only.
LH = Latch high.
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MMD Registers – Descriptions (Continued)
Address Name Description Mode
(7)
Default
MMD Address 2h, Register 0h Common Control
2.0.15:5 Reserved Reserved RW 0000_0000_000
2.0.4 LED Mode
Override
Override strap-in for LED _MODE
1 = Single-LED mode
0 = Tri-color dual-LED mode
This bit is write-only and always reads back a
value of ‘0’. The updated value is reflected in Bit
[3] of this register.
WO 0
2.0.3 LED Mode LED_MODE Status
1 = Single-LED mode
0 = Tri-color dual-LED mode RO
Set by LED_MODE strapping pin.
See the Strapping Options section
for details.
Can be updated by Bit [4] of this
register after reset.
2.0.2 Reserved Reserved RW 0
2.0.1 CLK125_EN
Status
Override strap-in for CLK125_EN
1 = CLK125_EN strap-in is enabled
0 = CLK125_EN strap-in is disable d RW Set by CLK125_EN strapping pin.
See the Strapping Options section
for details.
2.0.0 Reserved Reserved RW 0
MMD Address 2h, Register 1h Strap Status
2.1.15:8 Reserved Reserved RO 0000_0000
2.1.7 LED_MODE
Strap-In Status
Strap to
1 = Single-LED mode
0 = Tri-color dual-LED mode RO Set by LED_MODE strapping pin.
See the Strapping Options section
for details.
2.1.6 Reserved Reserved RO 0
2.1.5 CLK125_EN
Strap-In Status
Strap to
1 = CLK125_EN strap-in is enabled
0 = CLK125_EN strap-in is disable d RO Set by CLK125_EN strapping pin.
See the Strapping Options section
for details.
2.1.4:3 Reserved Reserved RO 00
2.1.2:0 PHYAD[2:0]
Strap-In Value Strap-in value for PHY address
Bits [4:3] of PHY address are always set to ‘00’. RO Set by PHYAD[2:0] strapping pin.
See the Strapping Options section
for details.
MMD Address 2h, Register 2h Operation Mode Strap Override
2.2.15:11 Reserved Reserved RW 0000_0
2.2.10 PME_N2
Output Enable
For INT_N/PME_N2 (Pin 53),
1 = Enable PME output
0 = Disable PME output
This bit works in conjunction with MMD Address
2h, Reg. 10h, Bits [15:14] to define the output
for Pin 53.
RW 0
2.2.9 Reserved Reserved RW 0
`
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MMD Registers – Descriptions (Continued)
Address Name Description Mode
(7)
Default
2.2.8 PME_N1
Output Enable
For LED1/PME_N1 (Pin 19),
1 = Enable PME output
0 = Disable PME output
This bit works in conjunction with MMD Address
2h, Reg. 10h, Bits [15:14] to define the output
for Pin 19.
RW 0
2.2.7 Chip Power-
Down Override 1 = Override strap-in for chip power-down mode RW Set by MODE[3:0] strapping pin.
See the Strapping Options section
for details.
2.2.6:5 Reserved Reserved RW 00
2.2.4 NAND Tree
Override 1 = Override strap-in for NAND Tree mode RW Set by MODE[3:0] strapping pi n.
See the Strapping Options section
for details.
2.2.3:2 Reserved Reserved RW 00
2.2.1 GMII/MII
override 1 = Override strap-in fo r GMII/MII mode RW Set by MODE[3:0] strapping pin.
See the Strapping Options section
for details.
2.2.0 Reserved Reserved RW 0
MMD Address 2h, Register 3h Operation Mode Strap Status
2.3.15:8 Reserved Reserved RO 0000_0000
2.3.7 Chip Power-
Down Strap-In
Status 1 = Strap to chip power-down mode RO Set by MODE[3:0] strapping pin.
See the Strapping Options section
for details.
2.3.6:5 Reserved Reserved RO 00
2.3.4 NAND Tree
Strap-In Status 1 = Strap to NAND Tree mode RO Set by MODE[3:0] strapping pin.
See the Strapping Options section
for details.
2.3.3:2 Reserved Reserved RO 00
2.3.1 GMII/MII
Strap-In Status 1 = Strap to GMII/MII mode RO Set by MODE[3:0] strapping pin.
See the Strapping Options section
for details.
2.3.0 Reserved Reserved RO 0
MMD Address 2h, Register 4h GMII Control Signal Pad Skew
2.4.15:8 Reserved Reserved RW 0000_0000
2.4.7:4 RX_DV Pad
Skew GMII R X_DV output pad skew control
(0.06ns/step) RW 0111
2.4.3:0 TX_EN Pad
Skew GMII TX_EN input pad skew control
(0.06ns/step) RW 0111
MMD Address 2h, Register 8h GMII Clock Pad Skew
2.8.15:10 Reserved Reserved RW 0000_00
2.8.9:5 GTX_CLK
Pad Skew GMII GTX_CLK input pad skew control
(0.06ns/step) RW 01_111
2.8.4:0 RX_CLK
Pad Skew GMII RX_CLK output pad skew control
(0.06ns/step) RW 0_1111
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MMD Registers – Descriptions (Continued)
Address Name Description Mode
(7)
Default
MMD Address 2h, Register 10h Wake-On-LAN Control
2.10.15:14 PME Output
Select
These two bits work in conjunction with MMD
Address 2h, Reg. 2h, Bits [8] and [10] for
PME_N1 and PME_N2 enable, to define the
output for Pins 19 and 53, respectively .
LED1/PME_N1 (Pin 19)
00 = PME_N1 output only
01 = LED1 output only
10 = LED1 and PME_N1 output
11 = Reserved
INT_N/PME_N2 (Pin 53)
00 = PME_N2 output only
01 = INT_N output only
10 = INT_N and PME_N2 output
11 = Reserved
RW 00
2.10.13:7 Reserved Reserved RW 00_0000_0
2.10.6 Magic Packet
Detect Enable 1 = Enable magic-packet detection
0 = Disable magic-packet detection RW 0
2.10.5 Custom-
Packet Type 3
Detect Enable
1 = Enable custom-packet, Type 3 detection
0 = Disable custom-packet, Type 3 detection RW 0
2.10.4 Custom-
Packet Type 2
Detect Enable
1 = Enable custom-packet, Type 2 detection
0 = Disable custom-packet, Type 2 detection RW 0
2.10.3 Custom-
Packet Type 1
Detect Enable
1 = Enable custom-packet, Type 1 detection
0 = Disable custom-packet, Type 1 detection RW 0
2.10.2 Custom-
Packet Type 0
Detect Enable
1 = Enable custom-packet, Type 0 detection
0 = Disable custom-packet, Type 0 detection RW 0
2.10.1 Link-Down
Detect Enable 1 = Enable link-down detection
0 = Disable link-down detection RW 0
2.10.0 Link-Up Detect
Enable 1 = Enable link-up detec tion
0 = Disable link-up detection RW 0
MMD Address 2h, Register 11h Wake-On-LAN Magic Packet, MAC-DA-0
2.11.15:0 Magic Packet
MAC-DA-0
This register stores the lower two bytes of the
destination MAC address for the magic packet.
Bit [15:8] = Byte 2 (MAC Address [15:8])
Bit [7:0] = Byte 1 (MAC Address [7:0])
The upper four bytes of the destination MAC
address are stored in the following two
registers.
RW 0000_0000_0000_0000
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MMD Registers – Descriptions (Continued)
Address Name Description Mode
(7)
Default
MMD Address 2h, Register 12h Wake-On-LAN Magic Packet, MAC-DA-1
2.12.15:0
Magic Packet
MAC-DA-1
This register stores the mi ddle two bytes of the
destination MAC address for the magic packet.
Bit [15:8] = Byte 4 (MAC Address [31:24])
Bit [7:0] = Byte 3 (MAC Address [23:16])
The lower two bytes and upper two bytes of the
destination MAC address are store d in the
previous and following registers, respectively.
RW 0000_0000_0000_0000
MMD Address 2h, Register 13h Wake-On-LAN Magic Packet, MAC-DA-2
2.13.15:0
Magic Packet
MAC-DA-2
This register stores the upp er two bytes of the
destination MAC address for the magic packet.
Bit [15:8] = Byte 6 (MAC Address [47:40])
Bit [7:0] = Byte 5 (MAC Address [39:32])
The lower four bytes of the destination MAC
address are stored in the previous two
registers.
RW 0000_0000_0000_0000
MMD Address 2h, Register 14h Wake-On-LAN Customized Packet, Type 0, Expected CRC 0
MMD Address 2h, Register 16h Wake-On-LAN Customized Packet, Type 1, Expected CRC 0
MMD Address 2h, Register 18h Wake-On-LAN Customized Packet, Type 2, Expected CRC 0
MMD Address 2h, Register 1Ah Wake-On-LAN Customized Packet, Type 3, Expected CRC 0
2.14.15:0
2.16.15:0
2.18.15:0
2.1A.15:0
Custom Packet
Type X CRC 0
This register stores the lower two bytes for the
expected CRC.
Bit [15:8] = Byte 2 (CRC [15:8])
Bit [7:0] = Byte 1 (CRC [7:0])
The upper two bytes for the expected CRC are
stored in the following register.
RW 0000_0000_0000_0000
MMD Address 2h, Register 15h Wake-On-LAN Customized Packet, Type 0, Expected CRC 1
MMD Address 2h, Register 17h Wake-On-LAN Customized Packet, Type 1, Expected CRC 1
MMD Address 2h, Register 19h Wake-On-LAN Customized Packet, Type 2, Expected CRC 1
MMD Address 2h, Register 1Bh Wake-On-LAN Customized Packet, Type 3, Expected CRC 1
2.15.15:0
2.17.15:0
2.19.15:0
2.1B.15:0
Custom Packet
Type X CRC 1
This register stores the upp er two bytes for the
expected CRC.
Bit [15:8] = Byte 4 (CRC [31:24])
Bit [7:0] = Byte 3 (CRC [23:16])
The lower two bytes for the expected CRC are
stored in the previous register.
RW 0000_0000_0000_0000
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MMD Registers – Descriptions (Continued)
Address Name Description Mode
(7)
Default
MMD Address 2h, Register 1Ch Wake-On-LAN Customized Packet, Type 0, Mask 0
MMD Address 2h, Register 20h Wake-On-LAN Customized Packet, Type 1, Mask 0
MMD Address 2h, Register 24h Wake-On-LAN Customized Packet, Type 2, Mask 0
MMD Address 2h, Register 28h Wake-On-LAN Customized Packet, Type 3, Mask 0
2.1C.15:0
2.20.15:0
2.24.15:0
2.28.15:0
Custom Packet
Type X Mask 0
This register selects the bytes in the first 16
bytes of the packet (bytes 1 thru 16) that will be
used for CRC calculation.
For each bit in this register,
1 = Byte is selected for CRC calculation
0 = Byte is not selected for CRC calc ulation
The register-bit to packet-byte mapping is as
follows:
Bit [15] : Byte 16
:
Bit [2] : Byte 2
Bit [0] : Byte 1
RW 0000_0000_0000_0000
MMD Address 2h, Register 1Dh Wake-On-LAN Customized Packet, Type 0, Mask 1
MMD Address 2h, Register 21h Wake-On-LAN Customized Packet, Type 1, Mask 1
MMD Address 2h, Register 25h Wake-On-LAN Customized Packet, Type 2, Mask 1
MMD Address 2h, Register 29h Wake-On-LAN Customized Packet, Type 3, Mask 1
2.1D.15:0
2.21.15:0
2.25.15:0
2.29.15:0
Custom Packet
Type X Mask 1
This register selects the bytes in the second 16
bytes of the packet (bytes 17 thru 32) that will
be used for CRC calculation.
For each bit in this register,
1 = Byte is selected for CRC calculation
0 = Byte is not selected for CRC calculation
The register-bit to packet-byte mapping is as
follows:
Bit [15] : Byte 32
:
Bit [2] : Byte 18
Bit [0] : Byte 17
RW 0000_0000_0000_0000
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Revision 2.2
MMD Registers – Descriptions (Continued)
Address Name Description Mode
(7)
Default
MMD Address 2h, Register 1Eh Wake-On-LAN Customized Packet, Type 0, Mask 2
MMD Address 2h, Register 22h Wake-On-LAN Customized Packet, Type 1, Mask 2
MMD Address 2h, Register 26h Wake-On-LAN Customized Packet, Type 2, Mask 2
MMD Address 2h, Register 2Ah Wake-On-LAN Customized Packet, Type 3, Mask 2
2.1E.15:0
2.22.15:0
2.26.15:0
2.2A.15:0
Custom Packet
Type X Mask 2
This register selects the bytes in the third 16
bytes of the packet (bytes 33 thru 48) that will
be used for CRC calculation.
For each bit in this register,
1 = Byte is selected for CRC calculation
0 = Byte is not s elected for C RC calculation
The register-bit to packet-byte mapping is as
follows:
Bit [15] : Byte 48
:
Bit [2] : Byte 34
Bit [0] : Byte 33
RW 0000_0000_0000_0000
MMD Address 2h, Register 1Fh Wake-On-LAN Customized Packet, Type 0, Mask 3
MMD Address 2h, Register 23h Wake-On-LAN Customized Packet, T ype 1, Mask 3
MMD Address 2h, Register 27h Wake-On-LAN Customized Packet, Type 2, Mask 3
MMD Address 2h, Register 2Bh Wake-On-LAN Customized Packet, Type 3, Mask 3
2.1F.15:0
2.23.15:0
2.27.15:0
2.2B.15:0
Custom Packet
Type X Mask 3
This register selects the bytes in the fourth 16
bytes of the packet (bytes 49 thru 64) that will
be used for CRC calculation.
For each bit in this register,
1 = Byte is selected for CRC calculation
0 = Byte is not selected for CRC calculation
The register-bit to packet-byte mapping is as
follows:
Bit [15] : Byte 64
:
Bit [2] : Byte 50
Bit [0] : Byte 49
RW 0000_0000_0000_0000
MMD Address 3h, Register 0h PCS EEE Control
3.0.15:12 Reserved Reserved RW 0000
3.0.11 1000Base-T
Force LPI
1 = Force 1000Base-T low-power idle
transmission
0 = Normal operation RW 0
3.0.10 100Base-TX
RX_CLK
Stoppable
During receive lower-power idle mode,
1 = RX_CLK stoppable for 100Base-TX
0 = RX_CLK not stoppable for 100Base-TX RW 0
3.0.9:0 Reserved Reserved RW 00_0000_0000
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Revision 2.2
MMD Registers – Descriptions (Continued)
Address Name Description Mode
(7)
Default
MMD Address 3h, Register 1h PCS EEE – Status
3.1.15:12 Reserved Reserved RO 0000
3.1.11 Transmit Low-
Power Idle
Received
1 = Transmit PCS has received low-power idle
0 = Low-power idle not received RO/LH 0
3.1.10 Receiv e Low-
Power Idle
Received
1 = Receive PCS has received low-power idle
0 = Low-power idle not received RO/LH 0
3.1.9 Transmit Low-
Power Idle
Indication
1 = Transmit PCS is c urrently receiving low-
power idle
0 = Transmit PCS is not currently recei ving low-
power idle
RO
3.1.8 Receive Low-
Power Idle
Indication
1 = Receive PCS is currently receiving low-
power idle
0 = Receive PCS is not currently recei ving low-
power idle
RO
3.1.7:0 Reserved Reserved RO 0000_0000
MMD Address 7h, Register 3Ch EEE Advertisement
7.3C.15:3 Reserved Reserved RW 0000_0000_0000_0
7.3C.2 1000Base-T
EEE
1 = 1000Mbps EEE capable
0 = No 1000Mbps EEE capability
This bit is set to ‘0’ as the default after power-up
or reset. Set this bit to ‘1 to enable 1000Mbps
EEE mode.
RW 0
7.3C.1 100Base-TX
EEE
1 = 100Mbps EEE capable
0 = No 100Mbps EEE capability
This bit is set to ‘0’ as the default after power-up
or reset. Set this bit to ‘1 to enable 100Mbps
EEE mode.
RW 0
7.3C.0 Reserved Reserved RW 0
MMD Address 7h, Register 3Dh EEE Link Partner Advertisement
7.3D.15:3 Reserved Reserved RO 0000_0000_0000_0
7.3D.2 1000Base-T
EEE 1 = 1000Mbps EEE capable
0 = No 1000Mbps EEE capability RO 0
7.3D.1 100Base-TX
EEE 1 = 100Mbps EEE capable
0 = No 100Mbps EEE capability RO 0
7.3D.0 Reserved Reserved RO 0
MMD Address 1Ch, Register 4h Analog Control 4
1C.4.15:11 Reserved Reserved RW 0000_0
1C.4.10 10Base-Te
Mode 1 = EEE 10Base-Te (1.75V TX amplitude)
0 = Standard 10Base-T (2.5V TX amplitude) RW 0
1C.4.9:0 Reserved Reserved RW 00_1111_1111
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Revision 2.2
MMD Registers – Descriptions (Continued)
Address Name Description Mode
(7)
Default
MMD Address 1Ch, Register 23h EDPD Cont rol
1C.23.15:1 Reserved Reserved RW 0000_0000_0000_000
1C.23.0 EDPD Mode
Enable
Energy-detect power-down mode
1 = Enable
0 = Disable RW 0
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Revision 2.2
Absolute Maximum Ratings(8)
Supply Voltage (VIN)
(DVDDL, AVDDL, AVDDL_PLL) ............. 0.5V to +1.8V
(AVDDH) ................................................. 0.5V to +5.0V
(DVDDH) ................................................. 0.5V to +5.0V
Input Voltage (all inputs) .............................. 0.5V to +5.0V
Output Volta ge (all out puts ) ......................... 0.5V to +5.0V
Lead Temperature (soldering, 10s) ............................ 260°C
Storage Temperature (Ts) ......................... 55°C to +150°C
Operating Ratings(9)
Suppl y Voltage
(DVDDL, AVDDL, AVDDL_PLL) ..... +1.140V to +1.260V
(AVDDH @ 3.3V) ............................ +3.135V to +3.465V
(AVDDH @ 2.5V, C-temp only) ....... +2.375V to +2.625V
(DVDDH @ 3.3V) ............................ +3.135V to +3.465V
(DVDDH @ 2.5V) ............................ +2.375V to +2.625V
(DVDDH @ 1.8V) ............................ +1.710V to +1.890V
Ambient Temperature
(TA Commercial: KSZ9031MNXC) ............. 0°C to +70°C
(TA Industrial: KSZ9031MNXI) ............... 40°C to +85°C
Maximum Junction Temperature (TJ, maximum) ....... 125°C
Thermal Resistance (θJA) .................................... 32.27°C/W
Thermal Resistance (θJC) ...................................... 6.76°C/W
Electrical Characteristics(10)
Symbol Parameter Condition Min. Typ. Max. Units
Supply Current Core / Digital I/Os
ICORE
1.2V Total of:
DVDDL (digital core) +
AVDDL (analog core) +
AVDDL_PLL (PLL)
1000Base-T link-up (no traffic) 211
mA
1000Base-T full-duplex @ 100% utilization 221
100Base-TX link-up (no traffic) 60.6
100Base-TX full-duplex @ 100% util ization 61.2
10Base-T link-up (no traffic) 7.0
10Base-T full-duplex @ 100% utilization 7.7
Software power-down mode (Reg. 0.11 = 1) 0.9
Chip power-down mode
(strap-in pins MODE[3:0] = 0111) 0.8
IDVDDH_1.8 1.8V for Digital I/Os
(GMII/MII operating @ 1.8V)
1000Base-T link-up (no traffic) 14.2
mA
1000Base-T full-duplex @ 100% utilization 29.3
100Base-TX link-up (no traffic) 7.3
100Base-TX full-duplex @ 100% util ization 10.0
10Base-T link-up (no traffic) 3.1
10Base-T full-duplex @ 100% utilizati on 6.0
Software power-down mode (Reg. 0.11 = 1) 3.7
Chip power-down mode
(strap-in pins MODE[3:0] = 0111) 0.2
Notes:
8. Exceeding the absolute maximum rating can damage the device. Stresses greater than the absolute maximum rating can cause permanent
damage to the device. Operation of the device at these or any other conditions above those specified i n the operating secti ons of this
specificat i on is not implied. Maximum conditions for extended periods may affect reliabi lit y.
9. The device is not guaranteed to functi on outside its operati ng rating.
10. TA = 25°C. Specification is for packaged product onl y.
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Electrical Characteristics(10) (Continued)
Symbol Parameter Condition Min. Typ. Max. Units
IDVDDH_2.5 2.5V for Digital I/Os
(GMII/MII operating @ 2.5V)
1000Base-T link-up (no traffic ) 19.3
mA
1000Base-T full-duplex @ 100% utilization 40.5
100Base-TX link-up (no traffic) 10.0
100Base-TX full-duplex @ 100% util ization 13.7
10Base-T link-up (no traffic) 4.3
10Base-T full-duplex @ 100% utilization 8.3
Software power-down mode (Reg. 0.11 = 1) 5.3
Chip power-down mode
(strap-in pins MODE[3:0] = 0111) 0.9
IDVDDH_3.3 3.3V for Digital I/Os
(GMII/MII operating @ 3.3V)
1000Base-T link-up (no traffic) 26.0
mA
1000Base-T full-duplex @ 100% utilization 53.8
100Base-TX link-up (no traffic) 13.3
100Base-TX full-duplex @ 100% util ization 18.0
10Base-T link-up (no traffic) 5.7
10Base-T full-duplex @ 100% utilizati on 11.1
Software power-down mode (Reg. 0.11 = 1) 7.1
Chip power-down mode
(strap-in pins MODE[3:0] = 0111) 2.1
Supply Current Transceiver
(equivalent to current draw through external transformer center taps for PHY transceivers with current-mode transmit
drivers)
IAVDDH_2.5
2.5V for Transceiver
(Recommended for commer cial
temperature range operation
only)
1000Base-T link-up (no traffic) 58.6
mA
1000Base-T full-duplex @ 100% utilization 57.6
100Base-TX link-up (no traffic) 24.8
100Base-TX full-duplex @ 100% utilization 24.8
10Base-T link-up (no traffic) 12.5
10Base-T full-duplex @ 100% utilizati on 25.8
Software power-down mode
(Reg. 0.11 = 1) 3.0
Chip power-down m ode
(strap-in pins MODE[3:0] = 0111) 0.02
IAVDDH_3.3 3.3V for Transceiver
1000Base-T link-up (no traffic) 66.6
mA
1000Base-T full-duplex @ 100% utilization 65.6
100Base-TX link-up (no traffic) 28.7
100Base-TX full-duplex @ 100% util ization 28.7
10Base-T link-up (no traffic) 17.0
10Base-T full-duplex @ 100% utilizati on 29.3
Software power-down mode
(Reg. 0.11 = 1) 4.1
Chip power-down mode
(strap-in pins MODE[3:0] = 0111) 0.02
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Revision 2.2
Electrical Characteristics(10) (Continued)
Symbol Parameter Condition Min. Typ. Max. Units
CMOS Inputs
VIH Input High Voltage DVDDH (digital I /Os) = 3.3V 2.0 V DVDDH (digital I/Os) = 2.5V 1.5
DVDDH (digital I/Os) = 1.8V 1.1
VIL Input Low Voltage DVDDH (d igital I/Os ) = 3. 3V 1.3 V DVDDH (d igital I/Os ) = 2. 5V 1.0
DVDDH (digital I/Os) = 1.8V 0.7
IIHL Input High Leakage Current DV DDH = 3.3V and VIH = 3.3V
All digital input pins -2.0 2.0 µA
IILL Input Low Leakage Current
DVDDH = 3.3V and VIL = 0.0V
All digital input pins, except MDC, MDIO,
RESET_N. -2.0 2.0 µA
DVDDH = 3.3V and VIL = 0.0V
MDC, MDIO, RESET_N pins with internal
pull-ups -120 -40 µA
CMOS Outputs
VOH Output High Voltage
DVDDH (digital I/Os) = 3.3V, IOH (min) = 10mA
All digital output pins 2.7
V
DVDDH (digital I/Os) = 2.5V, IOH (min) = 10mA
All digital output pins 2.0
DVDDH (digital I/Os) = 1.8V, IOH (min) = 13mA
All digital output pins, except LED1, LED2 1.5
VOL Output Low Voltage
DVDDH (digital I/Os) = 3.3V, IOL (min) = 10mA
All digital output pins 0.3
V
DVDDH (digital I/Os) = 2 .5 V, IOL (min) = 10mA
All digital output pins 0.3
DVDDH (digital I/Os) = 1 .8 V, IOL (min) = 13mA
All digital output pins, except LED1, LED2 0.3
|Ioz| Output Tri-State Leakage 10 µA
LED Outputs
ILED Output Drive Current DVDDH (digital I/Os) = 3.3V or 2.5V, and VOL
at 0.3V
Each LED pin (LED1, LED2) 10 mA
Pull-Up Pins
pu Internal Pull-Up Resistanc e
(MDC, MDIO, RESET_N pins)
DVDDH (digital I/Os) = 3.3V 13 22 31
kΩ DVDDH (digital I/Os) = 2.5V 16 28 39
DVDDH (digital I/Os) = 1.8V 26 44 62
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Electrical Characteristics(10) (Continued)
Symbol Parameter Condition Min. Typ. Max. Units
100Base-TX Transmit
(Measured differentially after 1:1 transformer)
VO Peak Differential Output Voltage 100Ω termination across differential output 0.95 1.05 V
VIMB Output Voltage Imbalance 100Ω termination across differential output 2 %
tr, tf Rise/Fall Time 3 5 ns
Rise/Fall Time Imbalance 0 0.5 ns
Duty Cyc le Distortion ±0.25 ns
Overshoot 5 %
Output Jitter Peak-to-peak 0.7 ns
10Base-T Transmit
(Measured differentially after 1:1 transformer)
VP Peak Differential Output Voltage 100Ω termination ac ross differential output 2.2 2.8 V
Jitter Added Peak-to-peak 3.5 ns
Har monic Rejection Transmit all-one signal sequence 31 dB
10Base-T Receive
VSQ Squelch Threshold 5MHz square wave 300 400 mV
Transmitter Drive Setting
VSET Reference Voltage of ISET R(ISET) = 12.1kΩ 1.2 V
LDO Controlle r Drive Range
VLDO_O Output drive range for LDO_O
(Pin 58) to gate input of
P-channel MOSFET
AVDDH = 3.3V for MOSFET source voltage 0.85 2.8
V
AVDDH = 2.5V for MOSFET s ource voltage
(recommende d for co mmer cial temperature
range operatio n only ) 0.85 2.0
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Timing Diagrams
GMII Transmit Timing
Figure 13. GMII Transmit Timing Data Input to PHY
Table 16. GMII Transmit Timing Parameters
Timing Parameter Description Min. Typ. Max. Unit
1000Base-T
tCYC GTX_CLK period 7.5 8.0 8.5 ns
tSU TX_EN, TXD[7:0], TX_ER setup time to rising edge of GTX_CLK 2.0 ns
tHD TX_EN, TXD[7:0], TX_ER hold time from rising edge of GTX_CLK 0 ns
tHI GTX_CLK high pulse width 2.5 ns
tLO GTX_CLK low pulse width 2.5 ns
tR GTX_CLK rise time 1.0 ns
tF GTX_CLK fall time 1.0 ns
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GMII Receive Timing
Figure 14. GMII Receive Timing Data Input to MAC
Table 17. GMII Receive Timing Parameters
Timing Parameter Description Min. Typ. Max. Unit
1000Base-T
tCYC RX_CLK period 7.5 8.0 8.5 ns
tSU RX_DV, RXD[7:0], RX_ER setup time to rising edge of RX_CLK 2.5 ns
tHD RX_DV, RXD[7:0], RX_ER hol d time from rising edge of RX_CLK 0.5 ns
tHI RX_CLK high pulse width 2.5 ns
tLO RX_CLK low pulse width 2.5 ns
tR RX_CLK rise time 1.0 ns
tF RX_CLK fall time 1.0 ns
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MII Transmit Timing
Figure 15. MII Transmit Timing Data Input to PHY
Table 18. MII Transmit Timing Parameters
Timing Parameter Description Min. Typ. Max. Unit
10Base-T
tCYC TX_CLK period 400 ns
tSU TX_EN, TXD[3:0], TX_ER setup time to rising edge of TX_CLK 15 ns
tHD TX_EN, TXD[3:0], TX_ER hold time from rising edge of
TX_CLK 0 ns
tHI TX_CLK high pulse width 140 260 ns
tLO TX_CLK low pulse wi dth 140 260 ns
100Base-TX
tCYC TX_CLK period 40 ns
tSU TX_EN, TXD[3:0], TX_ER setup time to rising edge of TX_CLK 15 ns
tHD TX_EN, TXD[3:0], TX_ER hold time from rising edge of
TX_CLK 0 ns
tHI TX_CLK high pulse width 14 26 ns
tLO TX_CLK low pulse wi dth 14 26 ns
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MII Receive Timing
Figure 16. MII Receive Timing Data Input to MAC
Table 19. MII Receive Timing Parameters
Timing Parameter Description Min. Typ. Max. Unit
10Base-T
tCYC RX_CLK period 400 ns
tSU RX_DV, RXD[3:0], RX_ER setup time to rising edge of RX_CLK 10 ns
tHD RX_DV, RXD[3:0], RX_ER hol d time from rising edge of RX_CLK 10 ns
tHI RX_CLK high pulse width 140 260 ns
tLO RX_CLK low pulse width 140 260 ns
100Base-TX
tCYC RX_CLK period 40 ns
tSU RX_DV, RXD[3:0], RX_ER setup time to rising edge of RX_CLK 10 ns
tHD RX_DV, RXD[3:0], RX_ER hol d time from rising edge of RX_CLK 10 ns
tHI RX_CLK high pulse width 14 26 ns
tLO RX_CLK low pulse width 14 26 ns
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Auto-Negotiation Timing
Figure 17. Aut o-Negotiation Fast Link Pulse (FLP) Timing
Table 20. Auto-Negotiation Fast Link Pulse (FLP) Timing Parameters
Timing Parameter Description Min. Typ. Max. Units
tBTB FLP burst to FLP burst 8 16 24 ms
tFLPW FLP burst width 2 ms
tPW Clock/Data pulse width 100 ns
tCTD Clock pulse to data pulse 55.5 64 69.5 µs
tCTC Clock pulse to clock pulse 111 128 139 µs
Number of clock/data pulses per FLP burst 17 33
The KSZ9031MNX Fast Link Pulse (FLP) burst-to-burst transmit timing for Auto-Negotiation defaults t o 8ms. IEEE 802.3
Standard specifies this timing to be 16ms +/-8ms. Some PHY link partners need to receive the FLP with 16ms centered
timing; otherwise, there can be intermittent link failures and long link-up times.
After KSZ9031MNX power-up/reset, program the following register sequence to set the FLP timing to 16ms:
1. Write Register Dh = 0x0000 // Set up register address for MMD Device Address 0h
2. Write Register Eh = 0x0004 // Select Register 4h of MMD Device Address 0h
3. Write Register Dh = 0x4000 // Select register data for MMD Device Address 0h, Register 4h
4. Write Register Eh = 0x0006 // Write value 0x0006 to MMD Device Address 0h, Register 4h
5. Write Register Dh = 0x0000 // Set up register address for MMD Device Address 0h
6. Write Register Eh = 0x0003 // Select Register 3h of MMD Device Address 0h
7. Write Register Dh = 0x4000 // Select register data for MMD Device Address 0h, Register 3h
8. Write Register Eh = 0x1A80 // Write value 0x1A80 to MMD Device Address 0h, Register 3h
9. Write Register 0h, Bit [9] = 1 // Restart Auto-Negotiation
The above setting for 16ms FLP transmit timing is compatible with all PHY link partners.
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MDC/MDIO Timing
Figure 18. MDC/MDIO Timing
Table 21. MDC/MDIO Timing Parameters
Timing Parameter Description Min. Typ. Max. Unit
tP MDC period 120 400 ns
t1MD1 MDIO (PHY input) setup to rising edge of MDC 10 ns
tMD2 MDIO (PHY input) hold from rising edge of MDC 10 ns
tMD3 MDIO (PHY output) delay from rising edge of MDC 0 ns
The typical MDC clock frequency is 2.5MHz (400ns clock period).
The KSZ90 31MNX c an operate with MDC clock frequencies generat ed from bit banging with G PIO pin in t he 10s/10 0s of
Hertz and h ave been t este d up to a MDC cl ock frequenc y of 8.33MH z (120 ns clo ck per iod). T est c ondition f or 8.33MH z is
for one KSZ9031MNX PHY on the MDIO line with a 1.0kΩ pull-up to the DVD DH s upply rail.
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Power-Up/Power-Down/Reset Timing
Figure 19. Power-Up/Power-Down/Reset Timing
Note 1:
The recommended power-up sequence is to have the transceiver (AVDDH) and digital I/O (DVDDH) voltages power up
before the 1.2V core (DVDDL, AVDDL, AVDDL_PLL) voltage. If the 1.2V core must power up first, the maximum lead time
for the 1.2V core voltage with respect to the transceiver and digital I/O voltages should be 200µs.
There is no power sequence requirement between transceiver (AVDDH) and digital I/O (DVDDH) power rails.
The power-up waveforms should be monotonic for all supply voltages to the KSZ9031MNX.
Note 2:
After the de-assertion of reset, wait a minimum of 100µs before starting programming on the MIIM (MDC/MDIO) interface.
Note 3:
The recommended power-down sequence is to have the 1.2V core voltage power-down before powering down the
transceiver and digital I/O voltages.
Before the nex t power -up cyc le, a ll supp ly voltag es to the KSZ 903 1MNX s h ou ld r e ach l es s tha n 0.4 V a nd there sho uld b e
a minimum wait time of 150ms from power-off to power-on.
Table 22. Power-Up/Power-Down/Reset Timing Parameters
Parameter Description Min. Max. Units
tvr Supply voltages rise time (must be monotonic) 200 µs
tsr Stable supply voltages to de-as s ertion of reset 10 ms
tcs Strap-in pin configuration setup time 5 ns
tch Strap-in pin configurat ion hol d time 5 ns
trc De-assertion of reset to strap-in pin output 6 ns
tpc Supply voltages cycle off-to-on time 150 ms
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Reset Circuit
The following are some reset circuit suggestions.
Figure 20 illustrates the reset circuit for powering up the KSZ9031MNX if reset is triggered by the power supply.
Figure 20. Reset Circuit for triggering by Power Supply
Figure 21 illus trates the reset c ircuit for applicat ions where reset is dr iven by anot her device (f or example, the CPU or an
FPGA). At power-on-reset, R, C, and D1 provide the monotonic rise time to reset the KSZ9031MNX device. The
RST_OUT_N from the CPU/FPGA provides the warm reset after power-up.
The KSZ9031MNX and CPU/FPGA references the same digital I/O voltage (DVDDH).
Figure 21. Reset Circuit for Interfacing with CPU/FPGA Res et Output
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Figure 22 illustrates the reset circuit with MIC826 Voltage Supervisor driving the KSZ9031RNX reset input.
KSZ9031RNX MIC826 Part
Number
RESET#
Reset
Threshold
DVDDH = 3.3V, 2.5V, or 1.8V
RESET_N
DVDDHDVDDH
MIC826TYMT / 3.075V
MIC826ZYMT / 2.315V
MIC826WYMT / 1.665V
Figure 22. Rest Circuit with MIC826 Voltage Supervisor
Reference Circuits – LED Strap-In Pins
The pull-up and pull-down reference circuits for the LED2/PHYAD1 and LED1/PHYAD0 strapping pins are shown in
Figure 23 for 3.3V and 2.5V DVDDH.
Figure 23. Reference Circ uits for LED Strapping Pins
For 1.8V DVDD H, LED indic ation support requir es voltage level sh ifters between LED[2:1] pins and LE D indicator dio des
to ensure the multiplexed PHYAD[1:0] strapping pins are latched in high/low correctly. If LED indicator diodes are not
implemented, the PHYAD[1:0] strapping pins just need 10kΩ pull-up to 1.8V DVDDH for a value of 1, and 1.0kΩ pull-down
to ground for a value of 0.
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Reference Clock – Connection and Selection
A crysta l or ex ternal c lock s ource, s uch as an os cillat or, is used t o pr ovide th e re ferenc e clock f or the K SZ9031M NX. T he
reference clock is 25MHz for all operating modes of the KSZ9031MNX.
The KSZ9031MNX uses the AVDDH supply, analog 3.3V (or analog 2.5V option for commercial temp only), for the
crystal/ clock pins (XI, XO). If the 25M Hz reference clock is provided externally, the XI input pin should have a minim um
clock voltage peak -to-peak ( Vp-p) swing of 2.5V ref erenc e to ground . If V p-p is less than 2.5V, series c apaciti ve couplin g
is recommended. With capacitive coupling, the Vp-p swing can be down to 1.5V. Maximum Vp-p swing is 3.3V +5%.
Figure 24 and Table 23 shows the reference clock connection to XI (Pin 61) and XO (Pin 60) of the KSZ9031MNX, and
the reference clock selection criteria.
Figure 24. 25MHz Crystal/Oscillator Reference Clock Connection
Table 23. Reference Crystal/Clock Selection Criteria
Characteristics Value Units
Frequency 25 MHz
Frequency to lera nce (maximum) ±50 ppm
Crystal series r esistance (typical) 40 Ω
Crystal load capacitance (typi c al) 22 pF
On-Chip LDO Controller – MOSFET Selection
If the optional LDO controller is used to generate 1.2V for the core voltage, the selected MOSFET should exceed the
following minimum requirements:
P-channel
500mA (continuous current)
3.3V or 2.5V (source input voltage)
1.2V (drain output vo ltag e)
VGS in the range of:
- (-1.2V to -1.5V) @ 500mA for 3.3V source voltage
- (-1.0V to -1.1V) @ 500mA for 2.5V source voltage
The VGS for the MOSFET needs to be operating in the constant current saturated region, and not towards the VGS(th),
the threshold voltage for the cut-off region of the MOSFET.
See end of Electrical Characteristics section for LDO controller output driving range to the gate input of the MOSFET.
Refer to application note ANLAN206 KSZ9031 Gigabit PHY Optimized Power Schem e for High Efficiency, Low-Power
Consumption and Dissipation as design reference.
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Magnetic – Connection and Selection
A 1:1 isolation transformer is required at the line interface. Use one with integrated common-mode chokes for designs
exceeding F CC requ irem ents. An optional aut o-transf orm er stage f ollowing the c hok es provides add itiona l comm on-mode
noise and signal att enu ati o n.
The KSZ9031MNX design incorporates voltage-mode transmit drivers and on-chip terminations.
With the voltage-mode implementation, the transmit drivers supply the common-mode voltages to the four differential
pairs. Therefore, the four transformer center tap pins on the KSZ9031MNX side should not be connected to any power
supply source on the board; rather, the center tap pins should be separated from one another and connected through
separate 0. 1µF comm on-mode capaci tors to ground . Separation is required bec ause the com mon-m ode voltage could b e
differ ent between the four d if f er ential pairs, depending on the connected speed mode.
Figure 25 shows the typical gigabit magnetic interface circuit for the KSZ9031MNX.
Figure 25. T ypical Gigabit Ma gne tic Interface Circuit
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Table 24 lists recommended magnetic characteristics.
Table 24. Magnetics Selection Criteria
Table 25 is a list of com patible single-port m agnetics with separated transformer center tap pins on the G-PHY chip side
that can be used with the KSZ9031MNX.
Table 25. Compatible Single-Port 10/100/10 00 Magn eti cs
Parameter Value Test Condition
Turns ratio 1 CT : 1 CT
Open-circuit induc tance (min.) 350µH 100mV, 100kHz, 8mA
Insertion loss (max.) 1.0dB 0MHz to 100MHz
HIPOT (min.) 1500Vrms
Manufacturer Part Number Auto-Transformer Temperature Range M a gnetic + RJ-45
Bel Fuse 0826-1G1T-23-F Yes 0°C to 70°C Yes
HALO TG1G-E001NZRL No 40°C to 85°C No
HALO TG1G-S001NZRL No 0°C to 70°C No
HALO TG1G-S002NZRL Yes 0°C to 70°C No
Pulse H5007NL Yes 0°C to 70°C No
Pulse H5062NL Yes 0°C to 70°C No
Pulse HX5008NL Yes 40°C to 85°C No
Pulse JK0654219NL Yes 0°C to 70°C Yes
Pulse JK0-0136NL No 0°C to 70°C Yes
TDK TLA-7T101LF No 0°C to 70°C No
Wurth/Midcom 000-7093-37R-LF1 Yes 0°C to 70°C No
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Package Information(11) and Recommended Landing Pattern
64-Pin (8mm × 8mm) QFN
Note:
11. Package i nformat i on is correct as of the publication date. For updates and most current inform ation, go t o www.micrel.com.
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MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
Micrel, Inc. is a leading gl obal manufacturer of IC s olutions for the worldwide hi gh performance linear and po wer, LAN, and tim ing & communications
markets. The Company’s products include advanced mixed
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