1. Product profile
1.1 General description
NPN/NPN Resistor-Equipped Transistors (RET).
1.2 Features
■Built-in bias resistors
■Simplifies circuit design
■Reduces component count
■Reduces pick and place costs
1.3 Applications
■Low current peripheral driver
■Control of IC inputs
■Replaces general-purpose transistors in digital applications
1.4 Quick reference data
PEMH24; PUMH24
NPN/NPN resistor-equipped transistors;
R1 = 100 kΩ, R2 = 100 kΩ
Rev. 04 — 18 May 2005 Product data sheet
Table 1: Product overview
Type number Package NPN/PNP
complement PNP/PNP
complement
Philips JEITA
PEMH24 SOT666 - PEMD24 PEMB24
PUMH24 SOT363 SC-88 PUMD24 PUMB24
Table 2: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCEO collector-emitter voltage open base - - 50 V
IOoutput current (DC) - - 20 mA
R1 bias resistor 1 (input) 70 100 130 kΩ
R2/R1 bias resistor ratio 0.8 1 1.2
9397 750 14456 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 18 May 2005 2 of 9
Philips Semiconductors PEMH24; PUMH24
NPN/NPN resistor-equipped transistors; R1 = 100 kΩ, R2 = 100 kΩ
2. Pinning information
3. Ordering information
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Table 3: Pinning
Pin Description Simplified outline Symbol
1 GND (emitter) TR1
2 input (base) TR1
3 output (collector) TR2
4 GND (emitter) TR2
5 input (base) TR2
6 output (collector) TR1
001aab555
6 45
1 32
65 4
123
R2
TR1 TR2
R1
R2 R1
sym063
Table 4: Ordering information
Type number Package
Name Description Version
PEMH24 - plastic surface mounted package; 6 leads SOT666
PUMH24 SC-88 plastic surface mounted package; 6 leads SOT363
Table 5: Marking codes
Type number Marking code[1]
PEMH24 6T
PUMH24 H8*
9397 750 14456 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 18 May 2005 3 of 9
Philips Semiconductors PEMH24; PUMH24
NPN/NPN resistor-equipped transistors; R1 = 100 kΩ, R2 = 100 kΩ
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
Table 6: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per transistor
VCBO collector-base voltage open emitter - 50 V
VCEO collector-emitter voltage open base - 50 V
VEBO emitter-base voltage open collector - 10 V
VIinput voltage
positive - +40 V
negative - −10 V
IOoutput current (DC) - 20 mA
ICM peak collector current - 100 mA
Ptot total power dissipation Tamb ≤25 °C
SOT363 [1] - 200 mW
SOT666 [1] [2] - 200 mW
Tstg storage temperature −65 +150 °C
Tjjunction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Per device
Ptot total power dissipation Tamb ≤25 °C
SOT363 [1] - 300 mW
SOT666 [1] [2] - 300 mW
9397 750 14456 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 18 May 2005 4 of 9
Philips Semiconductors PEMH24; PUMH24
NPN/NPN resistor-equipped transistors; R1 = 100 kΩ, R2 = 100 kΩ
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
7. Characteristics
Table 7: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
Rth(j-a) thermal resistance from
junction to ambient in free air
SOT363 [1] - - 625 K/W
SOT666 [1] [2] - - 625 K/W
Per device
Rth(j-a) thermal resistance from
junction to ambient in free air
SOT363 [1] - - 416 K/W
SOT666 [1] [2] - - 416 K/W
Table 8: Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
ICBO collector-base cut-off
current VCB =50V; I
E= 0 A - - 100 nA
ICEO collector-emitter
cut-off current VCE =30V; I
B=0A - - 1 µA
VCE =30V; I
B=0A;
Tj= 150 °C--50µA
IEBO emitter-base cut-off
current VEB =5V; I
C=0A --50µA
hFE DC current gain VCE =5V; I
C=5mA 80 - -
VCEsat collector-emitter
saturation voltage IC= 5 mA; IB= 0.25 mA - - 150 mV
VI(off) off-state input voltage VCE =5V; I
C= 100 µA - 1.1 0.5 V
VI(on) on-state input voltage VCE = 0.3 V; IC= 1 mA 3 1.5 - V
R1 bias resistor 1 (input) 70 100 130 kΩ
R2/R1 bias resistor ratio 0.8 1 1.2
Cccollector capacitance VCB =10V;I
E=i
e=0A;
f = 1 MHz - - 2.5 pF
9397 750 14456 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 18 May 2005 5 of 9
Philips Semiconductors PEMH24; PUMH24
NPN/NPN resistor-equipped transistors; R1 = 100 kΩ, R2 = 100 kΩ
VCE =5V
(1) Tamb = 100 °C
(2) Tamb =25°C
(3) Tamb =−40 °C
IC/IB=20
(1) Tamb = 100 °C
(2) Tamb =25°C
(3) Tamb =−40 °C
Fig 1. DC current gain as a function of collector
current; typical values Fig 2. Collector-emitter saturation voltage as a
function of collector current; typical values
VCE = 0.3 V
(1) Tamb =−40 °C
(2) Tamb =25°C
(3) Tamb = 100 °C
VCE =5V
(1) Tamb =−40 °C
(2) Tamb =25°C
(3) Tamb = 100 °C
Fig 3. On-state input voltage as a function of collector
current; typical values Fig 4. Off-state input voltage as a function of collector
current; typical values
006aaa168
IC (mA)
10−1102
101
102
103
hFE
10
(1)
(3)
(2)
006aaa169
IC (mA)
10−1101
102
VCEsat
(mV)
10
(1)
(2)
(3)
IC (mA)
10−1101
006aaa170
1
10
VI(on)
(V)
10−1
(1)
(2)
(3)
006aaa171
IC (mA)
10−210110−1
1
10
VI(off)
(V)
10−1
(1)
(3)
(2)
9397 750 14456 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 18 May 2005 6 of 9
Philips Semiconductors PEMH24; PUMH24
NPN/NPN resistor-equipped transistors; R1 = 100 kΩ, R2 = 100 kΩ
8. Package outline
9. Packing information
[1] For further information and the availability of packing methods, see Section 15.
[2] T1: normal taping
[3] T2: reverse taping
Fig 5. Package outline SOT363 (SC-88) Fig 6. Package outline SOT666
04-11-08Dimensions in mm
0.25
0.10
0.3
0.2
pin 1
index
1.3
0.65
2.2
2.0 1.35
1.15
2.2
1.8 1.1
0.8
0.45
0.15
132
465
Dimensions in mm 04-11-08
1.7
1.5
1.7
1.5
1.3
1.1
1
0.18
0.08
0.27
0.17
0.5
pin 1 index
123
456
0.6
0.5
0.3
0.1
Table 9: Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 4000 8000 10000
PEMH24 SOT666 2 mm pitch, 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - -
PUMH24 SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165
9397 750 14456 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 18 May 2005 7 of 9
Philips Semiconductors PEMH24; PUMH24
NPN/NPN resistor-equipped transistors; R1 = 100 kΩ, R2 = 100 kΩ
10. Revision history
Table 10: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
PEMH24_PUMH24_4 20050518 Product data sheet - 9397 750 14456 PUMH24_3
Modifications: •Type PEMH24 added
•Table 1 “Product overview”: added
•Figure 1,2,3 and 4: electrical graphs added
•Table 9 “Packing methods”: added
•Section 14 “Trademarks”: added
PUMH24_3 20041015 Product data sheet - 9397 750 13628 PUMH24_2
PUMH24_2 20040414 Product specification - 9397 750 13087 PUMH24_1
PUMH24_1 20031016 Product specification - 9397 750 11895 -
Philips Semiconductors PEMH24; PUMH24
NPN/NPN resistor-equipped transistors; R1 = 100 kΩ, R2 = 100 kΩ
9397 750 14456 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 18 May 2005 8 of 9
11. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
13. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
14. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
15. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains datafrom the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights. Date of release: 18 May 2005
Document number: 9397 750 14456
Published in The Netherlands
Philips Semiconductors PEMH24; PUMH24
NPN/NPN resistor-equipped transistors; R1 = 100 kΩ, R2 = 100 kΩ
16. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Packing information. . . . . . . . . . . . . . . . . . . . . . 6
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
11 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . . 8
12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
14 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
15 Contact information . . . . . . . . . . . . . . . . . . . . . 8
