SN74LS08NP3 - Texas Instruments High-Performance Analog

SN5408, SN54LS08, SN54S08

SN7408, SN74LS08, SN74S08

QUADRUPLE 2-INPUT POSITIVE-AND GATES

SDLS033 – DECEMBER 1983 – REVISED MARCH 1988

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

SN5408, SN54LS08, SN54S08

SN7408, SN74LS08, SN74S08

QUADRUPLE 2-INPUT POSITIVE-AND GATES

SDLS033 – DECEMBER 1983 – REVISED MARCH 1988

2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN5408, SN54LS08, SN54S08

SN7408, SN74LS08, SN74S08

QUADRUPLE 2-INPUT POSITIVE-AND GATES

SDLS033 – DECEMBER 1983 – REVISED MARCH 1988

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN5408, SN54LS08, SN54S08

SN7408, SN74LS08, SN74S08

QUADRUPLE 2-INPUT POSITIVE-AND GATES

SDLS033 – DECEMBER 1983 – REVISED MARCH 1988

4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN5408, SN54LS08, SN54S08

SN7408, SN74LS08, SN74S08

QUADRUPLE 2-INPUT POSITIVE-AND GATES

SDLS033 – DECEMBER 1983 – REVISED MARCH 1988

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

JM38510/08003BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

08003BCA

JM38510/08003BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

08003BDA

JM38510/08003BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

08003BDA

JM38510/31004B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/

31004B2A

JM38510/31004B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/

31004B2A

JM38510/31004BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004BCA

JM38510/31004BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004BCA

JM38510/31004BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004BDA

JM38510/31004BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004BDA

JM38510/31004SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004SCA

JM38510/31004SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004SCA

JM38510/31004SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004SDA

JM38510/31004SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004SDA

M38510/08003BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

08003BCA

M38510/08003BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

08003BCA

M38510/08003BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

08003BDA

M38510/08003BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

08003BDA

PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

M38510/31004B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/

31004B2A

M38510/31004B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/

31004B2A

M38510/31004BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004BCA

M38510/31004BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004BCA

M38510/31004BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004BDA

M38510/31004BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004BDA

M38510/31004SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004SCA

M38510/31004SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004SCA

M38510/31004SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004SDA

M38510/31004SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

31004SDA

SN54LS08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS08J

SN54S08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S08J

SN7408N OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70

SN7408N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70

SN74LS08D ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08D ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

SN74LS08DBR ACTIVE SSOP DB 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DBR ACTIVE SSOP DB 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DE4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DE4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DR ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DR ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DRG4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08DRG4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS08

SN74LS08J OBSOLETE CDIP J 14 TBD Call TI Call TI 0 to 70

SN74LS08N ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS08N

PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

Addendum-Page 4

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

SN74LS08N ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS08N

SN74LS08N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70

SN74LS08NE4 ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS08N

SN74LS08NE4 ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS08N

SN74LS08NSR ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS08

SN74LS08NSR ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS08

SN74LS08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS08

SN74LS08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS08

SN74LS08NSRG4 ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS08

SN74LS08NSRG4 ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS08

SN74S08D ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S08

SN74S08D ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S08

SN74S08DE4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S08

SN74S08DE4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S08

SN74S08DG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S08

SN74S08DG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S08

SN74S08J OBSOLETE CDIP J 14 TBD Call TI Call TI 0 to 70

SN74S08N ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S08N

PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

Addendum-Page 5

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

SN74S08N ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S08N

SN74S08N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70

SN74S08NE4 ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S08N

SN74S08NE4 ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S08N

SNJ54LS08FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS

08FK

SNJ54LS08FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS

08FK

SNJ54LS08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS08J

SNJ54LS08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS08W

SNJ54S08FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S

08FK

SNJ54S08FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S

08FK

SNJ54S08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S08J

SNJ54S08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S08W

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

Addendum-Page 6

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54LS08, SN54LS08-SP, SN54S08, SN74LS08, SN74S08 :

•Catalog: SN74LS08, SN54LS08, SN74S08

•Military: SN54LS08, SN54S08

•Space: SN54LS08-SP

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Military - QML certified for Military and Defense Applications

•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

SN74LS08DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1

SN74LS08DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74LS08DBR SSOP DB 14 2000 367.0 367.0 38.0

SN74LS08DR SOIC D 14 2500 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

4040065 /E 12/01

28 PINS SHOWN

Gage Plane

8,20

7,40

0,55

0,95

0,25

12,90

12,30

10,50

8,50

Seating Plane

9,907,90

10,50

9,90

0,38

5,60

5,00

0,22

2016

6,50

0,05 MIN

5,905,90

DIM

A MAX

A MIN

PINS **

2,00 MAX

6,90

7,50

0,65 M

0,15

0°–ā8°

0,10

0,09

0,25

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

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