GaAlAs-IR-Lumineszenzdiode (880 nm) GaAlAs Infrared Emitter (880 nm) Lead (Pb) Free Product - RoHS Compliant SFH 486 Wesentliche Merkmale Features * GaAlAs-LED mit sehr hohem Wirkungsgrad * Hohe Zuverlassigkeit * gute spektrale Anpassung an Si-Fotoempfanger * Gegurtet lieferbar (im Ammo-Pack) * Gruppiert lieferbar * * * * * Anwendungen Applications * IR-Fernsteuerung von Fernseh- und Rundfunkgeraten, Videorecordern, Lichtdimmern * Geratefernsteuerungen fur Gleich- und Wechsellichtbetrieb * Rauchmelder (UL-Freigabe) * Sensorik * Diskrete Lichtschranken * IR remote control of hi-fi and TV-sets, video tape recorders, dimmers * Remote control for steady and varying intensity * Smoke detectors (UL-approval) * Sensor technology * Discrete interrupters Typ Type Bestellnummer Ordering Code SFH 486 Q62703Q1094 2007-04-03 1 Very highly efficient GaAlAs-LED High reliability Spectral match with silicon photodetectors Available on tape and reel (in Ammopack) Available in bins SFH 486 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 5 V Durchlassstrom Forward current IF 100 mA Stostrom, tp = 10 s, D = 0 Surge current IFSM 2.5 A Verlustleistung Power dissipation Ptot 200 mW Warmewiderstand Thermal resistance RthJA 375 K/W Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA peak 880 nm Spektrale Bandbreite bei 50% von rel Spectral bandwidth at 50% of rel IF = 100 mA 80 nm Abstrahlwinkel Half angle 11 Grad deg. Aktive Chipflache Active chip area A 0.09 mm2 Abmessungen der aktiven Chipflache Dimension of the active chip area LxB LxW 0.3 x 0.3 mm 5.1 ... 5.7 mm 0.6/0.5 s Kennwerte (TA = 25 C) Characteristics Abstand Chipoberflache bis Gehausevorderseite H Distance chip front to case surface Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 2007-04-03 tr , tf 2 SFH 486 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Kapazitat Capacitance VR = 0 V, f = 1 MHz Co 15 pF VF 1.5 (< 1.8) 3.0 (< 3.8) V Sperrstrom Reverse current VR = 5 V IR 0.01 ( 1) A Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms e 25 mW Temperaturkoeffizient von Ie bzw. e, IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA TCI - 0.5 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV -2 mV/K Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TC 0.25 nm/K Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s 2007-04-03 3 SFH 486 Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.001 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.001 sr Bezeichnung Parameter Symbol Werte Values Einheit Unit Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie typ 40 70 mW/sr Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Ie typ 600 mW/sr 2007-04-03 4 SFH 486 Relative Spectral Emission Irel = f () OHR00878 10 2 e % Max. Permissible Forward Current IF = f (TA) 80 10 1 100 60 10 0 75 40 10 -1 50 20 10 -2 25 10 -3 800 850 900 950 nm 1000 Forward Current IF = f (VF), single pulse, tp = 20 s 10 0 10 1 10 2 10 3 mA 10 4 F Permissible Pulse Handling Capability IF = f (), TA = 25 C, duty cycle D = parameter OHR00886 10 4 OHR00881 10 1 mA A OHR00880 125 F mA e (100mA) 0 750 F Ie = f (IF) Ie 100 mA Single pulse, tp = 20 s OHR00877 100 rel Radiant Intensity 0 0 20 40 60 80 C 100 T Forward Current vs. Lead Length Between the Package Bottom and the PC-Board IF = f (I), TA = 25 C OHR00949 120 mA F D = 0.005 0.01 0.02 0.05 10 0 F 100 10 3 0.1 0.2 80 10 -1 60 0.5 10 2 10 DC 40 -2 D= 10 -3 0 1 2 3 4 5 6 V VF tp T tp T 10 1 -5 -4 -3 -2 10 10 10 10 10 -1 10 0 8 20 F 10 1 s 10 2 tp Radiation Characteristics rel = f() 40 30 20 10 0 OHR01733 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 2007-04-03 0.8 0.6 0.4 0 20 40 60 80 5 100 120 0 0 5 10 15 20 25 mm 30 SFH 486 Mazeichnung Package Outlines Area not flat Anode 5.9 5.5 o5.1 o4.8 2.54 mm spacing 0.8 0.4 0.6 0.4 9.0 8.2 7.8 7.5 1.8 1.2 29.5 27.5 0.6 0.4 5.7 5.1 Chip position GEX06626 Mae in mm (inch) / Dimensions in mm (inch). Wellenloten (TTW) Recommended Solder Pad TTW Soldering 4.8 (0.189) Empfohlenes Lotpaddesign) 4 (0.157) OHLPY985 Mae in mm (inch) / Dimensions in mm (inch). 2007-04-03 6 SFH 486 Lotbedingungen Soldering Conditions Wellenloten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-04-03 7