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MS5F6118
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8.Reliability test items
All guaranteed values are under the categories of reliability per non-assembled(only MOSFETs).
Each categories under the guaranteed reliability conform to EIAJ ED4701/100 method104
standards.
Test items required without fail
Humidification treatment (85±2°C,65±5%RH,168±24hr)
Heat treatment of soldering
Through Hole Package (Solder Dipping,260±5°C(265°Cmax.),10±1sec,2 times)
SMD Package(IR-ray Reflow ,255±5°C(260°Cmax.),10±1sec,2 times)
Test Test Testing methods and Conditions Reference Sampling Acceptance
No. Items Standard number number
1 Terminal Pull force
Strength TO-220,TO-220F : 10N EIAJ
(Tensile) TO-3P,TO-3PF,TO-247 : 25N ED4701/400 15
TO-3PL : 45N method 401
(Through Hole) T-Pack,K-Pack : 10N
Force maintaining duration :30±5sec
2 Terminal Load force
Strength TO-220,TO-220F : 5N EIAJ
(Bending) TO-3P,TO-3PF,TO-247 : 10N ED4701/400 15
TO-3PL : 15N method 401
(Through Hole) T-Pack,K-Pack : 5N
Number of times :2times(90deg./time)
3 Mounting Screwing torque value: (M3) EIAJ (0:1)
Strength
・
TO-3P,TO-3PF,TO-247 : 50±10N
・
(Through Hole)
・
4 Vibration frequency : 100Hz to 2kHz EIAJ
Sweeping time : 4min. method 403
48min. for each X,Y&Z directions.
5 Shock Peak amplitude: 15km/s
EIAJ
Duration time : 0.5ms ED4701/400 15
3times for each X,Y&Z directions. method 404
6 Solderability Solder temp. : 245±5°C
Immersion time : 5±0.5sec
About Through Hole Package type, ----- 15
each terminal shall be immersed in
the solder bath within 1 to 1.5mm from
the body.
7 Resistance to Solder temp. : 260±5°C EIAJ
Soldering Heat Immersion time : 10±1sec ED4701/300 15
(Through Hole) Number of times : 1times method 302
Resistance to Solder temp. : 255
5
CEIAJ 15
Soldering Heat Immersion time : 10±1sec ED4701/400
(SMD Type) Number of times : 2times method 301
IR-ray Reflowing
Mechanical test methods