(Voltages referenced to GND.)
VCC .......................................................................-0.3V to +7.0V
V+ .........................................................................-0.3V to +7.0V
V- .........................................................................+0.3V to -7.0V
V+ to V- ..............................................................................+13V
Input Voltages
T1IN, T2IN, EN, FORCEON, FORCEOFF ...... -0.3V to +6.0V
R1IN, R2IN .....................................................................±70V
Output Voltages
T1OUT, T2OUT ..............................................................±70V
R1OUT, R2OUT, INVALID ....................... -0.3V to (VCC + 0.3V)
Short-Circuit Duration
T1OUT, T2OUT ......................................................Continuous
Continuous Power Dissipation (TA = +70°C)
TSSOP (derate 13.6mW/°C above +70°C) ..............1084mW
Operating Temperature Range .......................... -40°C to +85°C
Junction Temperature ...................................................... +150°C
Storage Temperature Range ........................... -65°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) ....................................... +260°C
TSSOP
Junction-to-Ambient Thermal Resistance (θJA) .......73.8°C/W
Junction-to-Case Thermal Resistance (θJC) ...............20°C/W
(Note 1)
(VCC = +3.0V to +5.5V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, TA = +25°C, unless other-
wise noted. For VCC = +3.0V to +3.6V, C1 = C2 = C3 = 0.1μF, C4 = 1μF. For VCC = +4.5V to +5.5V, C1 = 47nF, C2 = C3 = 330nF,
C4 = 1μF.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC 3.0 5.5 V
Supply Current AutoShutdown disabled (FORCEON =
FORCEOFF = VCC), no load 8 15 mA
Supply Current AutoShutdown IASD
FORCEON = GND, FORCEOFF = VCC,
R1IN and R2IN idle, T1IN and T2IN idle 1.0 10 µA
Supply Current Shutdown ISD FORCEOFF = GND 1.0 10 µA
LOGIC INPUTS
Input-Logic Low VT_IN,LO
T_IN, EN, FORCEON, FORCEOFF,
VCC = +3.3V to +3.6V, +5.0V to +5.5V 0.8 V
Input-Logic High VT_IN,HI
T_IN, FORCEON,
FORCEOFF, EN
VCC = +3.3V 2.0 V
VCC = +5.0V 2.4
Transmitter Input Hysteresis VTX,INHYS 0.5 V
Input Leakage Current IIN,LKG T_IN, EN, FORCEON, FORCEOFF ±0.01 ±1 µA
RECEIVER OUTPUTS
Output Leakage Current IRX,OUT,LKG EN = VCC ±0.05 ±10 µA
Output-Voltage Low VRX,OUT,LO IOUT = 1.6mA 0.4 V
Output-Voltage High VRX,OUT,HI IOUT = -1.0mA VCC -
0.6
VCC -
0.2 V
MAX13223E ±70V Fault-Protected, 3.0V to 5.5V,
2Tx/2Rx RS-232 Transceiver
www.maximintegrated.com Maxim Integrated
│
2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
Electrical Characteristics