1. Product profile
1.1 General description
The BGA7024 MMIC is a one-stage amplifier, available in a low-cost surface-mount
package. It delivers 24 dBm output power at 1 dB gain compression and superior
performance up to 2700 MHz.
1.2 Features and benefits
400 MHz to 2700 MHz frequency operating range
16 dB small signal gain at 2 GHz
24 dBm output powe r at 1 dB ga in com pr es sion
Integrated active biasing
External matching allows broad application optimization of the electrical perfo rmance
5 V single supply operat ion
All pins ESD protected
1.3 Applications
1.4 Quick reference data
[1] Operation outside this range is possible but not guaranteed.
[2] PL = 11 dBm per tone; spacing = 1 MHz.
BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
Rev. 3 — 11 June 2014 Product data sheet
627
Broadband CPE/MoCA Industrial applications
WLAN/ISM/RFID E-metering
Wireless infrastructure (base station,
repeater, point-to-point backhaul systems)
Satellite Master Antenna TV (SMATV)
Table 1. Quick reference data
Input and output impedances matched to 50
. Typical values at VCC =5V; T
case =25
C;
unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICC supply current 95 110 125 mA
f frequency [1] 400 - 2700 MHz
Gppower gain f = 2140 MHz 13.5 15 16.5 dB
PL(1dB) output power at 1 dB gain compression f = 2140 MHz 24.0 25.5 - dBm
IP3Ooutput third-order intercept point f = 2140 MHz [2] 35.0 38.5 - dBm
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 2 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
2. Pinning information
[1] This pin is DC-coupled and requires an external DC-blocking capacitor.
[2] The center metal base of the SOT89 also functions as heatsink for the power amplifier.
3. Ordering information
4. Functional diagram
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1V
CC(RF) [1]
2GND [2]
3RF_IN [1]

V\P
Table 3. Ordering information
Type number Package
Name Description Version
BGA7024 - plastic surface-mounted package; exposed die pad for good
heat transfer; 3 leads SOT89
Fig 1. Functional diagram
BANDGAP
BIAS
ENABLE V/I
CONVERTER
VCC(RF)
GND
1
2
3
RF_IN
014aab020
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 3 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
5. Limiting values
6. Thermal characteristics
[1] Case is ground solder pad.
[2] Thermal resistance measured using infrared measurement technique, device mounted on application board
and placed in still air.
7. Static characteristics
8. Dynamic characteristics
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC(RF) RF supply voltage - 5.7 V
Pi(RF) RF input power - 25 dBm
Tcase case temperature 40 +85 C
Tjjunction temperature - 150 C
VESD electrostatic discharge voltage Human Body Model (HBM);
according to JEDEC standard 22-A114E -2000V
Charged Device Model (CDM);
according to JEDEC standard 22-C101B -500V
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-c) thermal resistance from junction to case [1][2] 25 K/W
Table 6. Characteristics
Input and output impedances matched to 50
. Typical values at VCC =5V; T
case =25
C; unless
otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage - 5.0 - V
ICC supply current 95 110 125 mA
Table 7. Dynamic characteristics
Input and output impedances matched to 50
. Typical values at VCC =5V; T
case =25
C; see
Section 12 “Application information; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
f frequency [1] 400 - 2700 MHz
Gppower gain f = 940 MHz - 22 - dB
f = 1960 MHz - 16 - dB
f = 2140 MHz 13.5 15 16.5 dB
f = 2445 MHz - 14 - dB
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 4 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
[1] Operation outside this range is possible but not guaranteed.
[2] PL = 11 dBm per tone; spacing = 1 MHz.
[3] Defined at Pi(RF) = 40 dBm; small signal conditions.
9. Scattering parameters
PL(1dB) output power at 1 dB gain compression f = 940 MHz - 24 - dBm
f = 1960 MHz - 25.5 - dBm
f = 2140 MHz 24.0 25.5 - dBm
f = 2445 MHz - 24.5 - dBm
IP3Ooutput third-order intercept point f = 940 MHz [2] - 37.5 - dBm
f = 1960 MHz [2] - 38.0 - dBm
f = 2140 MHz [2] 35.0 38.0 - dBm
f = 2445 MHz [2] - 37.5 - dBm
NF noise figure f = 940 MHz [3] -2.9- dB
f = 1960 MHz [3] -3.7- dB
f = 2140 MHz [3] -3.7- dB
f = 2445 MHz [3] -4.0- dB
RLin input return loss f = 940 MHz - 9- dB
f = 1960 MHz - 10 - dB
f = 2140 MHz - 10 - dB
f = 2445 MHz - 14 - dB
RLout output return loss f = 940 MHz - 29 - dB
f = 1960 MHz - 22 - dB
f = 2140 MHz - 29 - dB
f = 2445 MHz - 11 - dB
Table 7. Dynamic characteristics …continued
Input and output impedances matched to 50
. Typical values at VCC =5V; T
case =25
C; see
Section 12 “Application information; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Table 8. Scattering parameters at 5 V, MMIC only
f (MHz) S11 S21 S12 S22
Magnitude
(ratio) Angle
(degree) Magnitude
(ratio) Angle
(degree) Magnitude
(ratio) Angle
(degree) Magnitude
(ratio) Angle
(degree)
400 0.83 178.9 14.03 112.7 0.01 35.5 0.53 166.3
500 0.85 178.7 11.69 104.4 0.01 38.77 0.56 168.9
600 0.85 176.4 9.93 98.19 0.02 41.13 0.57 172.2
700 0.86 173.8 8.67 93.04 0.02 43.1 0.58 174.8
800 0.86 171.1 7.68 88.54 0.02 44.34 0.58 177.4
900 0.86 168.3 6.9 84.36 0.02 44.96 0.59 179.7
1000 0.86 165.4 6.29 80.24 0.02 45.07 0.60 176.7
1100 0.87 162.7 5.72 76.42 0.02 45 0.60 173.3
1200 0.88 159.9 5.23 72.83 0.02 44.54 0.60 170.9
1300 0.88 157.3 4.80 69.34 0.03 44.17 0.61 168.4
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 5 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
10. Reliability information
11. Moisture sensitivity
1400 0.89 154.8 4.43 66.17 0.03 43.58 0.61 166.4
1500 0.89 153 4.09 63.33 0.03 43.02 0.62 164.7
1600 0.89 151.3 3.80 60.8 0.03 42.67 0.63 163.1
1700 0.90 149.9 3.54 58.3 0.03 42.36 0.64 162.1
1800 0.90 148.7 3.30 56.13 0.03 41.89 0.65 161.2
1900 0.90 147.9 3.11 54.13 0.03 41.65 0.66 160.8
2000 0.91 147.5 2.93 52.63 0.03 41.7 0.66 160.5
2100 0.90 147 2.78 50.91 0.04 41.61 0.66 160.5
2200 0.90 146.9 2.65 49.5 0.04 41.59 0.67 160.9
2300 0.90 146.6 2.54 48.13 0.04 41.44 0.66 161.6
2400 0.90 146.5 2.46 46.88 0.04 41.61 0.66 161.7
2500 0.89 146.3 2.39 45.39 0.04 41.45 0.66 162.6
2600 0.88 146 2.34 43.93 0.05 41.13 0.65 162.8
2700 0.87 145.4 2.30 42.24 0.05 40.56 0.64 163.2
Table 8. Scattering parameters at 5 V, MMIC only …continued
f (MHz) S11 S21 S12 S22
Magnitude
(ratio) Angle
(degree) Magnitude
(ratio) Angle
(degree) Magnitude
(ratio) Angle
(degree) Magnitude
(ratio) Angle
(degree)
Table 9. Reliability
Life test Conditions Intrinsic failure rate
HTOL accord ing to JESD85; confidence level 60 %; Tj=55C;
activation energy = 0.7 eV; acceleration factor according to
Arrhenius equation
4
Table 10. Moisture sensitivity level
Test methodology Class
JESD-22-A113 1
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 6 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
12. Application information
12.1 920 MHz to 960 MHz
See Table 11 for a list of components.
PCB specification: Rogers RO4003C; height = 0.508 mm; r = 3.38; copper thickness = 35 m.
Fig 2. 5 V application schematic; 920 MHz to 960 MHz
L3
C9
C3 C4
C5
C7
C8 C6
R1
VCC
L1
L2
C2
C1
MSL1 MSL2 MSL3 MSL4 MSL6MSL5
RF_IN VCC(RF)
BGA7024
50 Ω50 Ω
014aab021
J1
J3
J2
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
Fig 3. Output pow er at 1 dB gain compression as a
function of frequency Fig 4. Power gain as a function of frequency
f (GHz)
0.92 0.960.950.93 0.94
24
26
22
28
30
PL(1dB)
(dBm)
20
(1)
(3)
(2)
014aab022
f (GHz)
0.92 0.960.950.93 0.94
22
24
20
26
28
Gp
(dB)
18
(1)
(3)
(2)
014aab023
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 7 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
Tcase = 25 C.
(1) RLin
(2) RLout
(3) ISL
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
Fig 5. Input return loss, output return loss and
isolation as a function of frequency Fig 6. Output third-order intercept point as a function
of frequency
(1)
(2)
(3)
f (GHz)
0.92 0.960.950.93 0.94
014aab024
20
10
0
RLin, RLout, ISL
(dB)
30
(3)
(2)
f (GHz)
0.92 0.960.950.93 0.94
014aab025
36
38
34
40
42
IP3O
(dBm)
32
(1)
See Table 11 for a list of components.
Fig 7. 5 V application reference boar d; 920 MHz to 960 MHz
J3
J1
JIHGFEDCBA 12345678910
111213
RF in
J2
RF out
GND
VCC
GND
GND
GND
GND
MSL2
MSL4
MSL3 MSL5 MSL6MSL1
R1
C8
C7
C6
C2 C3 C4 C5
C1 C9
L3 L1 L2
014aab026
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 8 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
[1] MSL1 to MSL6 dimensions specified as width spacing length.
12.2 1930 MHz to 1990 MHz
Table 11. 5 V application list of comp onents; 920 MHz to 960 MHz
See Figure 2 and Figure 7 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating
thickness = 35
m.
Component Description Value Function Remarks
C1, C5 capacitor 68 pF DC blocking Mura ta GRM1885 C 1H 6 8 0JA01D
C2 capacitor 3.9 pF input match Murata GRM1885C1H3R9CZ01D
C3 capacitor 3.9 pF input match Murata GRM1885C1H3R9CZ01D
C4 capacitor 3.9 pF output match Murata GRM1885C1H3R9CZ01D
C6 capacitor 68 pF RF decouplin g Murata GRM1885C1H680JA01D
C7 capacitor 100 nF DC decoupling AVX 0603YC104KAT2A
C8 capacitor 10 F DC decoupling AVX 1206ZG106ZAT2A
C9 capacitor 68 nF IMD
suppression Murata GRM1888R71H683KA93D
J1, J2 RF connector SMA - Emerson Network Power
142-0701-841
J3 DC connecto r 6-pins - MOLEX
L1 inductor 4.7 nH output match Tyco Electronics 36501J4N7JTDG
L2 inductor 22 nH DC feed Tyco Electronics 36501J022JTDG
L3 inducto r 33 nH IMD
suppression Tyco Electronics 36501J033JTDG
MSL1[1] micro stripline 1.14 mm 0.8 mm 10.95 mm input match -
MSL2[1] micro stripline 1.14 mm 0.8 mm 5.65 mm input match -
MSL3[1] micro stripline 1.14 mm 0.8 mm 6.1 mm i nput match -
MSL4[1] micro stripline 1.14 mm 0.8 mm 1.6 mm output match -
MSL5[1] micro stripline 1.14 mm 0.8 mm 8.4 mm output match -
MSL6[1] micro stripline 1.14 mm 0.8 mm 10.95 mm output match -
R1 resistor 0 - Multicomp MC 0.063W 0603 0R
PCB - RO4003C - -
See Table 12 for a list of components.
PCB specification: Rogers RO4003C; height = 0.508 mm; r = 3.38; copper thickness = 35 m.
Fig 8. 5 V application schematic; 1930 MHz to 1990 MHz
C3
C4
C6
C7 C5
R1
V
CC
L1
C2
C1
MSL1 MSL2 MSL3 MSL4 MSL5 MSL6 MSL7
50 Ω50 Ω
RF_IN
J1
J3
J2
V
CC(RF)
BGA7024
014aab027
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 9 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
Fig 9. Output pow er at 1 dB gain compression as a
function of frequency Fig 10. Power gain as a function of frequency
014aab028
f (GHz)
1.93 1.991.971.95
24
26
22
28
30
PL(1dB)
(dBm)
20
(3)
(2)
(1)
014aab029
f (GHz)
1.93 1.991.971.95
14
16
12
18
20
Gp
(dB)
10
(2)
(1)
(3)
Tcase = 25 C.
(1) RLin
(2) RLout
(3) ISL
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
Fig 11. Input return loss, output return loss and
isolation as a function of frequency Fig 12. Output third-order intercept point as a function
of frequency
f (GHz)
1.93 1.991.971.95
014aab030
20
10
0
RLin, RLout, ISL
(dB)
30
(1)
(3)
(2)
014aab031
f (GHz)
1.93 1.991.971.95
36
38
34
40
42
IP3O
(dBm)
32
(3)
(2)
(1)
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 10 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
See Table 12 for a list of components.
Fig 13. 5 V application reference board; 1930 MHz to 1990 MHz
J3
J1
JIHGFEDCBA 12345678910
111213
RF in
J2
RF out
GND
VCC
GND
GND
GND
GND
MSL2
MSL4
MSL3 MSL5
MSL6 MSL7MSL1
R1
C7
C6
C5
C3C2 C4C1 L1
014aab032
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 11 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
[1] MSL1 to MSL7 dimensions specified as width spacing length.
12.3 2110 MHz to 2170 MHz
Table 12. 5 V application list of componen ts; 1930 MHz to 1990 MHz
See Figure 8 and Figure 13 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating
thickness = 35
m.
Component Description Value Function Remarks
C1, C4 capacitor 15 pF DC blocking Murata GRM1885C1H150JA01D
C2 capacitor 2.4 pF input match Murata GRM1885C1H2R4CZ01D
C3 capacitor 1.5 pF output match Murata GRM1885C1H1R5CZ01D
C5 capacitor 15 pF RF decoupling Murata GRM1885C1H150JA01D
C6 capacitor 100 nF DC decoupling AVX 0603YC104KAT2A
C7 capacitor 10 F DC decoupling AVX 1206ZG1 06ZAT2A
J1, J2 RF connector SMA - Emerson Network Power 142-0701-841
J3 DC connector 6-pins - MOLEX
L1 inductor 22 nH DC feed Tyco Electronics 36501J022JTDG
MSL1[1] micro stripline 1.14 mm 0.8 mm 10.95 mm input match -
MSL2[1] micro stripline 1.14 mm 0.8 mm 10.6 mm input match -
MSL3[1] micro stripline 1.14 mm 0.8 mm 1.0 mm input match -
MSL4[1] micro stripline 1.14 mm 0.8 mm 2.7 mm output match -
MSL5[1] micro stripline 1.14 mm 0.8 mm 3.2 mm output match -
MSL6[1] micro stripline 1.14 mm 0.8 mm 5.5 mm output match -
MSL7[1] micro stripline 1.14 mm 0.8 mm 10.95 mm output match -
R1 resistor 0 - Multicomp MC 0.063W 0603 0R
PCB - RO4003C - -
See Table 13 for a list of components.
PCB specification: Rogers RO4003C; height = 0.508 mm; r = 3.38; copper thickness = 35 m.
Fig 14. 5 V app l ication schematic; 2110 MHz to 2170 MHz
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 12 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
Fig 15. Output power at 1 dB ga in c om pression as a
function of frequency Fig 16. Power gain as a function of frequency
014aab034
f (GHz)
2.11 2.172.152.13
24
26
22
28
30
PL(1dB)
(dBm)
20
(3)
(2)
(1)
014aab035
f (GHz)
2.11 2.172.152.13
14
16
12
18
20
Gp
(dB)
10
(2)
(1)
(3)
Tcase = 25 C.
(1) RLin
(2) RLout
(3) ISL
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
Fig 17. Input return loss, output return loss and
isolation as a function of frequency Fig 18. Output third-order intercept point as a function
of frequency
f (GHz)
2.11 2.172.152.13
014aab036
20
10
0
RLin, RLout, ISL
(dB)
30
(3)
(1)
(2)
014aab037
f (GHz)
2.11 2.172.152.13
36
38
34
40
42
IP3O
(dBm)
32
(1)
(2)
(3)
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 13 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
See Table 13 for a list of components.
Fig 19. 5 V application reference board; 2110 MHz to 2170 MHz
J3
J1
JIHGFEDCBA 12345678910
111213
RF in
J2
RF out
GND
VCC
GND
GND
GND
GND
MSL2
MSL4
MSL3 MSL5
MSL6 MSL7MSL1
R1
C7
C6
C5
C3C2 C4C1 L1
014aab038
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 14 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
[1] MSL1 to MSL7 dimensions specified as width spacing length.
12.4 2405 MHz to 2485 MHz
Table 13. 5 V application list of compon ents; 2110 MHz to 2170 MHz
See Figure 14 and Figure 19 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating
thickness = 35
m.
Component Description Value Function Remarks
C1, C4 capacitor 15 pF DC blocking Murata GRM1885C1H150JA01D
C2 capacitor 2.2 pF input match Murata GRM1885C1H2R2CZ01D
C3 capacitor 1.5 pF output match Murata GRM1885C1H1R5CZ01D
C5 capacitor 15 pF RF decoupling Murata GRM1885C1H150JA01D
C6 capacitor 100 nF DC decoupling AVX 0603YC104KAT2A
C7 capacitor 10 F DC decoupling AVX 1206ZG106ZAT2A
J1, J2 RF connector SMA - Emerson Network Power
142-0701-841
J3 DC connector 6-pins - MOLEX
L1 inductor 22 nH DC feed Tyco Electronics 36501J022JTDG
MSL1[1] micro stripline 1.14 mm 0.8 mm 10.95 mm input match -
MSL2[1] micro stripline 1.14 mm 0.8 mm 10.6 mm input match -
MSL3[1] micro stripline 1.14 mm 0.8 mm 1.0 mm input match -
MSL4[1] micro stripline 1.14 mm 0.8 mm 2.7 mm output match -
MSL5[1] micro stripline 1.14 mm 0.8 mm 3.2 mm output match -
MSL6[1] micro stripline 1.14 mm 0.8 mm 5.5 mm output match -
MSL7[1] micro stripline 1.14 mm 0.8 mm 10.95 mm output match -
R1 resistor 0 - Multicomp MC 0.063W 0603 0R
PCB - RO4003C - -
See Table 14 for a list of components.
PCB specification: Rogers RO4003C; height = 0.508 mm; r = 3.38; copper thickness = 35 m.
Fig 20. 5 V application schematic; 2405 MHz to 2485 MHz
C3
C4
C6
C7 C5
R1
VCC
L2
C2
C1
MSL1 MSL3 MSL5
L1
MSL6 MSL7 J2
J3
J1 50 Ω50 Ω
RF_IN VCC(RF)
BGA7024
014aab039
MSL4MSL2
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 15 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
Fig 21. Output power at 1 dB ga in c om pression as a
function of frequency Fig 22. Power gain as a function of frequency
(2)
(1)
(3)
f (GHz)
2.405 2.4852.4652.425 2.445
014aab040
24
26
22
28
30
PL(1dB)
(dBm)
20
(2)
(1)
(3)
f (GHz)
2.405 2.4852.4652.425 2.445
014aab041
14
16
12
18
20
Gp
(dB)
10
Tcase = 25 C.
(1) RLin
(2) RLout
(3) ISL
(1) Tcase = 40 C.
(2) Tcase = 25 C.
(3) Tcase = 85 C.
Fig 23. Input return loss, output return loss and
isolation as a function of frequency Fig 24. Output third-order intercept point as a function
of frequency
f (GHz)
2.405 2.4852.4652.425 2.445
014aab042
20
10
0
30
RLin, RLout, ISL
(dB)
(1)
(2)
(3)
(2)
(1)
(3)
f (GHz)
2.405 2.4852.4652.425 2.445
014aab043
36
38
34
40
42
IP3O
(dBm)
32
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 16 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
See Table 14 for a list of components.
Fig 25. 5 V application reference board; 2405 MHz to 2485 MHz
J3
J1
JIHGFEDCBA 12345678910
111213
RF in
J2
RF out
GND
VCC
GND
GND
GND
GND
MSL2
MSL4
MSL3 MSL5
MSL6 MSL7MSL1
R1
C7
C6
C5
C3C2 C4
L1 C1 L2
014aab044
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 17 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
[1] MSL1 to MSL7 dimensions specified as width spacing length.
Table 14. 5 V application list of componen ts; 2405 MHz to 2485 MHz
See Figure 20 and Figure 25 for component layout. PCB: Rogers RO4003C stack; height = 0.508 mm; copper plating
thickness = 35
m.
Component Description Value Function Remarks
C1, C4 capacitor 15 pF DC blocking Murata GRM1885C1H150JA01D
C2 capacitor 1.5 pF input match Murata GRM1885C1H1R5CZ01D
C3 capacitor 1.8 pF output match Murata GRM1885C1H1R8CZ01D
C5 capacitor 15 pF RF decoupling Murata GRM1885C1H150JA01D
C6 capacitor 100 nF DC decoupling AVX 0603YC1 04KAT2A
C7 capacitor 10 F DC decoupling AVX 1206ZG106ZAT2A
J1, J2 RF connector SMA - Emerson Network Power
142-0701-841
J3 DC connector 6-pins - MOLEX
L1 inductor 3.3 nH input match Tyco Electronics 36501J3N3JTDG
L2 inductor 22 nH DC feed Tyco Electronics 36501J022JTDG
MSL1[1] micro stripline 1.14 mm 0.8 mm 10.95 mm input match -
MSL2[1] micro stripline 1.14 mm 0.8 mm 9.8 mm input match -
MSL3[1] micro stripline 1.14 mm 0.8 mm 1.9 mm output match -
MSL4[1] micro stripline 1.14 mm 0.8 mm 2.5 mm output match -
MSL5[1] micro stripline 1.14 mm 0.8 mm 1.6 mm output match -
MSL6[1] micro stripline 1.14 mm 0.8 mm 7.3 mm output match -
MSL7[1] micro stripline 1.14 mm 0.8 mm 10.95 mm output match -
R1 resistor 0 - Multicomp MC 0.063W 0603 0R
PCB - RO4003C - -
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 18 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
12.5 PCB stack
(1) Pre-impregnated.
RO4003C dielectric constant r = 3.38.
Fig 26. PCB stack
through via
RF & analog ground
RF & analog routing
analog routing
RF & analog ground
35 μm (1 oz.) copper + 0.3 μm
gold plating
RO4003C, 0.51 mm (20 mil)
35 μm (1 oz.) copper
(1) 0.2 mm (8 mil)
FR4, 0.15 mm (6 mil)
35 μm (1 oz.) copper
35 μm (1 oz.) copper
014aab045
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 19 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
13. Package outline
Fig 27. Package outline SOT89
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BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 20 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
14. Abbreviations
15. Revision history
Table 15. Abbreviations
Acronym Description
CPE Customer-Prem is es Eq ui p me nt
ESD ElectroStatic Discharge
HTOL High Temperature Operating Life
IR InfraRed
ISM Industrial, Scientific and Medical
MMIC Monolithic Microwave Integrated Circuit
MoCA Multimedia over Coax Alliance
PCB Printed-Circuit Board
RFID Radio Frequency IDentification
TX Transmit
WLAN Wireless Local Area Network
Table 16. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BGA7024 v.3 20140611 Product data sheet - BGA7024 v.2
Modifications: Table 5 on page 3: Thermal simulation results have been replaced by IR measurements results.
BGA7024 v.2 20100830 Product data sheet - BGA7024 v.1
BGA7024 20100528 Product data sheet - -
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 21 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificatio n The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
16.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregat e and cumulative liabil ity towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors product s are not designed,
authorized or warranted to be suitable for use in life support, lif e-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
BGA7024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 11 June 2014 22 of 23
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for aut omotive use. It i s neither qua lified nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specificatio ns, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product cl aims resulting from custome r design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specificat ions.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
© NXP Semiconductors N.V. 2014. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 June 2014
Document identifier: BGA7024
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Static characteristics. . . . . . . . . . . . . . . . . . . . . 3
8 Dynamic characteristics . . . . . . . . . . . . . . . . . . 3
9 Scattering parameters. . . . . . . . . . . . . . . . . . . . 4
10 Reliability information. . . . . . . . . . . . . . . . . . . . 5
11 Moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . 5
12 Application information. . . . . . . . . . . . . . . . . . . 6
12.1 920 MHz to 960 MHz . . . . . . . . . . . . . . . . . . . . 6
12.2 1930 MHz to 1990 MHz . . . . . . . . . . . . . . . . . . 8
12.3 2110 MHz to 2170 MHz . . . . . . . . . . . . . . . . . 11
12.4 2405 MHz to 2485 MHz . . . . . . . . . . . . . . . . . 14
12.5 PCB stack. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19
14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 20
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 21
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21
16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
17 Contact information. . . . . . . . . . . . . . . . . . . . . 22
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Mouser Electronics
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