INTEGRATED CIRCUITS DIVISION
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DS-PLA110-R08 1
PLA110
Single Pole, Normally Open
OptoMOS® Relay
Part # Description
PLA110 6-Lead DIP (50/Tube)
PLA110S 6-Lead Surface Mount (50/Tube)
PLA110STR 6-Lead Surface Mount (1000/Reel)
Parameters Ratings Units
Blocking Voltage 400 VP
Load Current 150 mArms / mADC
On-Resistance (max) 22
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, PocketSize)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
Certificate available on our website
• 3750Vrms Input to Output Isolation
• Low Drive Power Requirements
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• FCC Compatible
• VDE Compatible
• Small 6-Pin Package
• Flammability Rating UL 94 V-0
Switching Characteristics of
Normally Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
1
3
2
4
5
6
+ Control
- Control
NC
Load
Do Not Use
Load
AC/DC Configuration
1
3
2
4
5
6
+ Control
- Control
NC
+ Load
- Load
DC Only Configuration
PLA110 is a normally open (1-Form-A) solid
state relay that uses optically coupled MOSFET
technology to provide 3750Vrms of input to output
isolation. Its optically coupled outputs, which use the
patented OptoMOS architecture, are controlled by a
highly efficient infrared LED.
The PLA110 can be used to replace mechanical
relays, and offers the superior reliability associated
with semiconductor devices. Because it has no
moving parts, it offers faster, bounce-free switching
in a more compact surface mount or thru-hole
package.
INTEGRATED CIRCUITS DIVISION
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2R08
PLA110
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Parameter Min Max Units
Blocking Voltage - 400 VP
Reverse Input Voltage - 5 V
Input Control Current - 50 mA
Peak (10ms) - 1 A
Input Power Dissipation 1- 150 mW
Total Package Dissipation 2- 800 mW
Isolation Voltage, Input to Output 3750 - Vrms
Operational Temperature -40 +85 ºC
Storage Temperature -40 +125 ºC
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous, AC/DC Configuration - IL
- - 150 mArms / mADC
Continuous, DC Configuration - - - 250 mADC
Peak t=10ms ILPK - - ±400 mAP
On-Resistance
AC/DC Configuration IL=150mA RON
--22
DC Configuration IL=250mA - - 7
Off-State Leakage Current VL=400VPILEAK -- 1 A
Switching Speeds
Turn-On IF=5mA, VL=10V ton -- 1 ms
Turn-Off toff - - 0.5
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -25 - pF
Input Characteristics
Input Control Current to Activate IL=150mA IF-- 5 mA
Input Control Current to Deactivate - IF0.4 0.7 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Input to Output Capacitance VIO=0V, f=1MHz CIO -3 - pF
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PLA110
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R08
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC)
0.26 0.32 0.380.350.290.23
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC)
0.17 0.27 0.370.12 0.22 0.32
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=150mADC)
0.75 1.35 1.951.05 1.65 2.25
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Dropout
(N=50)
25
20
15
10
5
0
0.75 1.35 1.951.05 1.65 2.25
LED Current (mA)
Device Count (N)
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=150mADC)
35
30
25
20
15
10
5
0
16 18 2015 17 19
On-Resistance (:)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
35
30
25
20
15
10
5
0
450.5 468.5 486.5441.5 459.5 477.5
Blocking Voltage (VP)
Device Count (N)
Typical Turn-Off Time
vs. LED Forward Current
(IL=150mADC)
Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.12
0.10
0.08
0.06
0.04
0.02
0
50
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=10mA
I
F
=5mA
Typical Turn-On Time
vs. LED Forward Current
(IL=150mADC)
Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
50
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
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4R08
PLA110
Typical On-Resistance vs. Temperature
AC/DC Configuration
(IL=150mADC)
Temperature (ºC)
On-Resistance (:)
-40
25
20
15
10
5
0
-20 0 20 40 60 80 100
IF=5mA
IF=10mA
Typical Turn-On Time
vs. Temperature
(IL=100mADC)
Temperature (ºC)
Turn-On Time (ms)
-40
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 120100
IF=5mA
IF=10mA
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=100mADC)
Temperature (ºC)
Turn-Off Time (ms)
-40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100
Typical On-Resistance
vs. Temperature - DC Configuration
(IL=150mADC)
Temperature (ºC)
On-Resistance (:)
-40
10
9
8
7
6
5
0
-20 0 20 40 60 80 100
IF=5mA
IF=10mA
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical IF for Switch Dropout
vs. Temperature
(IL=100mADC)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical On Resistance
vs. Temperature
(IF=5mA; IL=100mA Instantaneous)
Temperature (ºC)
On-Resistance (:)
25
20
15
10
5
0
-40 -20 0 20 40 60 80 120100
Typical Load Current vs. Load Voltage
(IF=5mA)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-2.5 -2.0 -1.5 -1.0 -0.5 0 1.51.00.5 2.0 2.5
Maximum Load Current
vs. Temperature
(N=50)
Temperature (ºC)
Load Current (mA)
300
250
200
150
100
50
0
-40 -20 0 20 40 60 80 120100
I
F
=10mA
I
F
=5mA
DC Configuration
AC/DC Configuration
I
F
=10mA
I
F
=5mA
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
-40
480
475
470
465
460
455
450
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured across Pins 4&6
Temperature (ºC)
Leakage (PA)
-40
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-20 0 20 40 60 80 100
Energy Rating Curve
Time
Load Current (A)
10Ps
1.2
1.0
0.8
0.6
0.4
0.2
0
1ms100Ps 100ms 1s
10ms 10s 100s
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
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PLA110
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R08
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
PLA110 / PLA110S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
PLA110 250ºC 30 seconds 1
PLA110S 250ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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PLA110
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002) 4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
9.524 ± 0.508
(0.375 ± 0.020) 6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
PLA110
PLA110S
Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION
Specification: DS-PLA110-R08
©Copyright 2018, IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/27/2018
For additional information please visit our website at: www.ixysic.com
7
PLA110
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes
to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but
not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property
or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Dimensions
mm
(inches)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
A0 = 10.10
(0.398)
P1 = 12.00
(0.472)
K1 = 3.80
(0.15)
K0 = 4.90
(0.19)
User Direction of Feed
PLA110STR Tape & Reel
