PLA110 Single Pole, Normally Open OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameters Blocking Voltage Load Current On-Resistance (max) Ratings 400 Units VP 150 22 mArms / mADC Description PLA110 is a normally open (1-Form-A) solid state relay that uses optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Features * * * * * * * * * 3750Vrms Input to Output Isolation Low Drive Power Requirements High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation FCC Compatible VDE Compatible Small 6-Pin Package Flammability Rating UL 94 V-0 The PLA110 can be used to replace mechanical relays, and offers the superior reliability associated with semiconductor devices. Because it has no moving parts, it offers faster, bounce-free switching in a more compact surface mount or thru-hole package. Approvals Applications * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, PocketSize) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment Patient/Equipment Isolation * Security * Aerospace * Industrial Controls * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Certified Component: Certificate available on our website Ordering Information Part # PLA110 PLA110S PLA110STR Description 6-Lead DIP (50/Tube) 6-Lead Surface Mount (50/Tube) 6-Lead Surface Mount (1000/Reel) Pin Configuration AC/DC Configuration + Control - Control NC 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control - Control NC 1 6 2 5 3 4 + Load - Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-PLA110-R08 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION PLA110 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / C 2 Derate linearly 6.67 mW / C Min 3750 -40 -40 Max 400 5 50 1 150 800 +85 +125 Units VP V mA A mW mW Vrms C C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25C Parameters Output Characteristics Load Current Continuous, AC/DC Configuration Continuous, DC Configuration Peak On-Resistance AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Min Typ Max Units - - 150 250 400 mArms / mADC mADC mAP - 22 7 1 ILEAK - IF=0mA, VL=50V, f=1MHz ton toff COUT - 25 1 0.5 - IL=150mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.2 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF t=10ms IL=150mA IL=250mA VL=400VP IF=5mA, VL=10V Symbol IL ILPK RON www.ixysic.com A ms pF R08 INTEGRATED CIRCUITS DIVISION PLA110 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) Typical Turn-On Time (N=50, IF=5mA, IL=100mADC) Device Count (N) 25 20 15 10 5 25 20 20 15 10 5 1.17 0.23 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=150mADC) 25 0.26 0.29 0.32 0.35 Turn-On Time (ms) Device Count (N) 10 5 0.12 0.17 0.22 0.27 0.32 Turn-Off Time (ms) 0.37 Typical On-Resistance Distribution (N=50, IF=5mA, IL=150mADC) 35 30 20 15 10 5 25 20 15 10 5 0 0 1.35 1.65 1.95 LED Current (mA) 5 0.38 25 15 1.05 10 Typical IF for Switch Dropout (N=50) 20 0.75 15 0 0 0 Device Count (N) 25 Device Count (N) Device Count (N) 30 Device Count (N) 35 Typical Turn-Off Time (N=50, IF=5mA, IL=100mADC) 0 0.75 2.25 1.05 1.35 1.65 1.95 LED Current (mA) 2.25 15 16 17 18 19 On-Resistance (:) 20 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 441.5 450.5 459.5 468.5 477.5 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=150mADC) 0.40 1.4 IF=50mA 1.2 IF=10mA IF=5mA 1.0 0.8 Turn-Off Time (ms) 1.6 0.30 0.25 0.20 0.15 0.10 -20 0 20 40 60 80 Temperature (C) 100 120 0.10 0.08 0.06 0.04 0.02 0.05 0 0 -40 Typical Turn-Off Time vs. LED Forward Current (IL=150mADC) 0.12 0.35 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 1.8 486.5 0 5 10 15 20 25 30 35 40 Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R08 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLA110 PERFORMANCE DATA* Typical On-Resistance vs. Temperature AC/DC Configuration (IL=150mADC) 0.6 IF=5mA IF=10mA 15 10 5 0.3 0.2 0.25 0.20 0.15 0.10 0.05 0 20 40 60 Temperature (C) 80 100 -40 20 40 60 80 Temperature (C) 100 0 -40 120 LED Current (mA) IF=10mA 6 5 2.0 1.5 1.0 0 20 40 60 Temperature (C) 80 100 Typical On Resistance vs. Temperature (IF=5mA; IL=100mA Instantaneous) 150 25 Load Current (mA) 20 15 10 5 -20 0 20 40 60 Temperature (C) 80 -40 -20 0 20 40 60 80 Temperature (C) 100 1.5 1.0 100 50 0 -50 250 150 Load Current (A) Leakage (PA) 1.0 0.025 0.020 0.015 0.010 0 20 40 60 Temperature (C) 80 100 0 -40 -20 0 20 40 60 80 Temperature (C) 100 120 0.8 0.6 0.4 0.2 0.005 -20 IF=10mA IF=5mA Energy Rating Curve 0.030 450 -40 IF=10mA IF=5mA AC/DC Configuration 0 -40 475 455 100 50 1.2 460 80 DC Configuration 100 0.035 465 20 40 60 Temperature (C) 200 480 470 0 300 Typical Leakage vs. Temperature Measured across Pins 4&6 Typical Blocking Voltage vs. Temperature -20 Maximum Load Current vs. Temperature (N=50) Typical Load Current vs. Load Voltage (IF=5mA) -150 -2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 2.5 Load Voltage (V) 120 100 2.0 -40 100 -100 0 80 0 -40 Load Current (mA) -20 20 40 60 Temperature (C) 0.5 0 -40 0 2.5 0.5 0 -20 Typical IF for Switch Dropout vs. Temperature (IL=100mADC) 3.0 2.5 8 7 0 Typical IF for Switch Operation vs. Temperature (IL=100mADC) 3.0 IF=5mA 9 -20 LED Current (mA) -20 Typical On-Resistance vs. Temperature - DC Configuration (IL=150mADC) 10 On-Resistance (:) IF=10mA 0 -40 On-Resistance (:) 0.4 0.1 0 Blocking Voltage (VP) 0.30 0.5 Turn-Off Time (ms) 20 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=100mADC) 0.35 IF=5mA Turn-On Time (ms) On-Resistance (:) 25 Typical Turn-On Time vs. Temperature (IL=100mADC) -20 0 20 40 60 Temperature (C) 80 100 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION PLA110 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PLA110 / PLA110S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles PLA110 PLA110S 250C 250C 30 seconds 30 seconds 1 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R08 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PLA110 Mechanical Dimensions PLA110 8.382 0.381 (0.330 0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54 0.127 (0.100 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) Pin 1 7.620 0.254 (0.300 0.010) 1.651 0.254 (0.065 0.010) 3.302 0.051 (0.130 0.002) 0.254 0.0127 (0.010 0.0005) 6.350 0.127 (0.250 0.005) 5.080 0.127 (0.200 0.005) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457 0.076 (0.018 0.003) PLA110S 8.382 0.381 (0.330 0.015) 9.524 0.508 (0.375 0.020) Pin 1 0.635 0.127 (0.025 0.005) PCB Land Pattern 2.54 0.127 (0.100 0.005) 2.54 (0.10) 6.350 0.127 (0.250 0.005) 0.457 0.076 (0.018 0.003) 1.651 0.254 (0.065 0.010) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) 4.445 0.254 (0.175 0.010) Dimensions mm (inches) 1.651 0.254 (0.065 0.010) 6 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION PLA110 PLA110STR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) P1 = 12.00 (0.472) User Direction of Feed Embossed Carrier Embossment A0 = 10.10 (0.398) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-PLA110-R08 (c)Copyright 2018, IXYS Integrated Circuits All rights reserved. Printed in USA. 6/27/2018