Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 10
1Publication Order Number:
MBRS1100T3/D
MBRS1100T3G,
SBRS81100T3G,
MBRS190T3G,
SBRS8190T3G
Preferred Devices
Schottky Power Rectifier
Surface Mount Power Package
Schottky Power Rectifiers employ the use of the Schottky Barrier
principle in a large area metal-to-silicon power diode. State-of-the-art
geometry features epitaxial construction with oxide passivation and
metal overlay contact. Ideally suited for low voltage, high frequency
rectification, or as free wheeling and polarity protection diodes, in
surface mount applications where compact size and weight are critical
to the system. These state-of-the-art devices have the following
features:
Features
Small Compact Surface Mountable Package with J-Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
High Blocking Voltage − 100 Volts
175C Operating Junction Temperature
Guardring for Stress Protection
AEC−Q101 Qualified and PPAP Capable
SBRS8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*
Mechanical Characteristics
Case: Epoxy, Molded
Weight: 95 mg (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
Shipped in 12 mm Tape and Reel, 2,500 units per reel
Cathode Polarity Band
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
SMB
CASE 403A
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERE
90, 100 VOLTS
Preferred devices are recommended choices for future use
and best overall value.
MARKING DIAGRAM
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B1 = Device Code
x = C for MBRS1100T3
9 for MBRS190T3
A = Assembly Location
Y = Year
WW = Work Week
G=Pb−Free Package
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
AYWW
B1xG
G
(Note: Microdot may be in either location)
MBRS1100T3G, SBRS81100T3G, MBRS190T3G, SBRS8190T3G
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
MBRS190T3
MBRS1100T3
VRRM
VRWM
VR90
100
V
Average Rectified Forward Current
TL = 163C
TL = 148C
IF(AV) 1.0
2.0
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM 50
A
Operating Junction Temperature (Note 1) TJ−65 to +175 C
Voltage Rate of Change dv/dt 10 V/ns
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance − Junction−to−Lead (TL = 25C) RqJL 22 C/W
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage (Note 2) (iF = 1.0 A, TJ = 25C) VF0.75 V
Maximum Instantaneous Reverse Current (Note 2)
(Rated dc Voltage, TJ = 25C)
(Rated dc Voltage, TJ = 100C)
IR0.5
5.0
mA
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.
ORDERING INFORMATION
Device Marking Package Shipping†
MBRS1100T3G B1C SMB
(Pb−Free)
2,500 Tape & Reel
SBRS81100T3G B1C SMB
(Pb−Free)
2,500 Tape & Reel
MBRS190T3G B19 SMB
(Pb−Free)
2,500 Tape & Reel
SBRS8190T3G B19 SMB
(Pb−Free)
2,500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MBRS1100T3G, SBRS81100T3G, MBRS190T3G, SBRS8190T3G
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3
TYPICAL ELECTRICAL CHARACTERISTICS
Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current*
Figure 3. Power Dissipation Figure 4. Current Derating, Case, Per Leg
20
10
5
2
1
0.5
0.2
0.1
0.05
0.02 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3
vF, INSTANTANEOUS VOLTAGE (VOLTS)
100C
25C
i , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
1 K
400
200
100
40
20
10
4
2
1
0.4
0.2
0.1
0.04
0.01
0.02
0 102030405060708090100
TJ = 150C
125C
100C
VR, REVERSE VOLTAGE (VOLTS)
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
00 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
TJ = 100C
SQUARE
WAVE
DC
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
P , AVERAGE POWER DISSIPATION (WATTS)
F(AV)
2.0
1.5
1.0
0.5
0145 150 155 160 165 170 175 180
SQUARE
WAVE
DC
TC, CASE TEMPERATURE (C)
I , AVERAGE FORWARD CURRENT (AMPS)
F(AV)
TJ = 150C
IR, REVERSE CURRENT ( A)
*The curves shown are typical for the highest voltage device in the voltage
grouping. Typical reverse current for lower voltage selections can be estimated
from these curves if VR is sufficient below rated VR.
25C
Figure 5. Typical Capacitance
280
260
240
220
200
180
160
140
120
100
80
60
40
20
00.1 0.2 0.5 1 2 5 10 20 50 100
VR, REVERSE VOLTAGE (VOLTS)
C, CAPACITANCE (pF)
NOTE: TYPICAL CAPACITANCE
NOTE: AT 0 V = 270 pF
MBRS1100T3G, SBRS81100T3G, MBRS190T3G, SBRS8190T3G
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4
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE H
E
bD
c
L1
L
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
2.261
0.089
2.743
0.108
2.159
0.085 ǒmm
inchesǓ
SCALE 8:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.90 2.20 2.28 0.075
INCHES
A1 0.05 0.10 0.19 0.002
b1.96 2.03 2.20 0.077
c0.15 0.23 0.31 0.006
D3.30 3.56 3.95 0.130
E4.06 4.32 4.60 0.160
L0.76 1.02 1.60 0.030
0.087 0.090
0.004 0.007
0.080 0.087
0.009 0.012
0.140 0.156
0.170 0.181
0.040 0.063
NOM MAX
5.21 5.44 5.60 0.205 0.214 0.220
HE
0.51 REF 0.020 REF
D
L1
HE
POLARITY INDICATOR
OPTIONAL AS NEEDED
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
MBRS1100T3/D
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