SN74LVC1G06
SCES295U –JUNE 2000–REVISED JUNE 2011
www.ti.com
DESCRIPTION/ORDERING INFORMATION
This single inverter buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
NanoFree™package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
The output of the SN74LVC1G06 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff.The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TAPACKAGE(1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3)
NanoFree™ – WCSP (DSBGA) Reel of 3000 SN74LVC1G06YZPR _ _ _CT_
0.23-mm Large Bump –YZP (Pb-free)
NanoFree™ – WCSP (DSBGA) _ _ _ _
Reel of 3000 SN74LVC1G06YZVR
0.23-mm Large Bump –YZV (Pb-free) CT
Reel of 3000 SN74LVC1G06DBVR
SOT (SOT-23) –DBV C06_
Reel of 250 SN74LVC1G06DBVT
–40°C to 85°CReel of 3000 SN74LVC1G06DCKR
SOT (SC-70) –DCK CT_
Reel of 250 SN74LVC1G06DCKT
SOT (SOT-553) –DRL Reel of 4000 SN74LVC1G06DRLR CT_
µQFN –DSF Reel of 5000 SN74LVC1G06DSFR CT
QFN –DRY Reel of 5000 SN74LVC1G06DRYR CT
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, •= Pb-free).
YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2
has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, •= Pb-free).
Table 3. FUNCTION TABLE
INPUT OUTPUT
A Y
H L
L Z
LOGIC DIAGRAM (POSITIVE LOGIC)
DBV, DCK, DSF, DRY, DRL, and YZP PACKAGE
YZV PACKAGE
2Copyright ©2000–2011, Texas Instruments Incorporated