Semiconductor Components Industries, LLC, 2002
June, 2002 – Rev. 6 1Publication Order Number:
MC74AC10/D
MC74AC10, MC74ACT10
Triple 3-Input NAND Gate
•Outputs Source/Sink 24 mA
•′ACT10 Has TTL Compatible Inputs
1314 12 11 10 9 8
21 34567
GND
VCC
Figure 1. Pinout: 14–Lead Packages Conductors
(Top View)
MAXIMUM RATINGS*
Rating Symbol Value Unit
DC Supply Voltage (Referenced to GND) VCC –0.5 to
+7.0 V
DC Input Voltage (Referenced to GND) Vin –0.5 to
VCC +0.5 V
DC Output Voltage (Referenced to GND) Vout –0.5 to
VCC +0.5 V
DC Input Current, per Pin Iin ±20 mA
DC Output Sink/Source Current, per Pin Iout ±50 mA
DC VCC or GND Current per Output Pin ICC ±50 mA
Storage Temperature Tstg –65 to
+150 °C
*Maximum Ratings are those values beyond which damage to the device may
occur. Functional operation should be restricted to the Recommended
Operating Conditions.
TSSOP–14
DT SUFFIX
CASE 948G
1
14
EIAJ–14
M SUFFIX
CASE 965
1
14
SO–14
D SUFFIX
CASE 751A
1
14
1
14
PDIP–14
N SUFFIX
CASE 646
Device Package Shipping
ORDERING INFORMATION
MC74AC10DT TSSOP–14 96 Units/Rail
MC74AC10DTR2 TSSOP–14 2500 Tape & Reel
MC74ACT10DT TSSOP–14 96 Units/Rail
MC74ACT10DTR2 TSSOP–14 2500 Tape & Reel
MC74AC10N PDIP–14 25 Units/Rail
MC74AC10D SOIC–14 55 Units/Rail
MC74ACT10N PDIP–14 25 Units/Rail
MC74AC10DR2 SOIC–14 2500 Tape & Reel
MC74ACT10D SOIC–14 55 Units/Rail
MC74ACT10DR2 SOIC–14 2500 Tape & Reel
MC74AC10M EIAJ–14 50 Units/Rail
MC74ACT10M EIAJ–14 50 Units/Rail
MC74ACT10MEL EIAJ–14 2000 Tape & Reel
See general marking information in the device marking
section on page 5 of this data sheet.
DEVICE MARKING INFORMATION
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MC74AC10, MC74ACT10
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2
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
V
Supply Voltage
′AC 2.0 5.0 6.0
V
VCC Supply Voltage ′ACT 4.5 5.0 5.5 V
Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) 0 – VCC V
VCC @ 3.0 V – 150 –
tr, tfInput Rise and Fall Time (Note 1)
′
AC Devices exce
p
t Schmitt In
p
uts
VCC @ 4.5 V – 40 – ns/V
r,f
′AC
Devices
except
Schmitt
Inputs
VCC @ 5.5 V – 25 –
t t
Input Rise and Fall Time
(
Note 2
)
VCC @ 4.5 V – 10 –
ns/V
tr, tf
In ut
Rise
and
Fall
Time
(Note
2)
′ACT Devices except Schmitt Inputs VCC @ 5.5 V – 8.0 – ns/V
TJJunction Temperature (PDIP) – – 140 °C
TAOperating Ambient Temperature Range –40 25 85 °C
IOH Output Current – High – – –24 mA
IOL Output Current – Low – – 24 mA
1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
DC CHARACTERISTICS
74AC 74AC
Symbol Parameter VCC
(V) TA = +25°CTA =
–40°C to
+85°CUnit Conditions
Typ Guaranteed Limits
VIH Minimum High Level 3.0 1.5 2.1 2.1 VOUT = 0.1 V
ugee
Input Voltage 4.5 2.25 3.15 3.15 Vor VCC – 0.1 V
5.5 2.75 3.85 3.85
VIL Maximum Low Level 3.0 1.5 0.9 0.9 VOUT = 0.1 V
auoee
Input Voltage 4.5 2.25 1.35 1.35 Vor VCC – 0.1 V
5.5 2.75 1.65 1.65
VOH Minimum High Level 3.0 2.99 2.9 2.9 IOUT = –50 µA
ugee
Output Voltage 4.5 4.49 4.4 4.4 V
5.5 5.49 5.4 5.4
*VIN = VIL or VIH
3.0 – 2.56 2.46
V
–12 mA
4.5 – 3.86 3.76
V
IOH –24 mA
5.5 – 4.86 4.76 –24 mA
VOL Maximum Low Level 3.0 0.002 0.1 0.1 IOUT = 50 µA
auoee
Output Voltage 4.5 0.001 0.1 0.1 V
5.5 0.001 0.1 0.1
*VIN = VIL or VIH
3.0 – 0.36 0.44
V
12 mA
4.5 – 0.36 0.44
V
IOL 24 mA
5.5 – 0.36 0.44 24 mA
IIN Maximum Input
55
–
±01
±10
µA
VI=V
CC GND
au u
Leakage Current 5.5 – ±0.1 ±1.0 µ
A
V
I =
V
CC,
GND
IOLD †Minimum Dynamic
Ot tC t
5.5 – – 75 mA VOLD = 1.65 V Max
IOHD Output Current 5.5 – – –75 mA VOHD = 3.85 V Min
ICC Maximum Quiescent
55
–
40
40
µA
VIN =V
CC or GND
a u Qu esce
Supply Current 5.5 – 4.0 40 µ
A
V
IN =
V
CC or
GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
MC74AC10, MC74ACT10
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3
AC CHARACTERISTICS (For Figures and Waveforms – See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
74AC 74AC
Symbol Parameter VCC*
(V) TA = +25°C
CL = 50 pF
TA = –40°C
to +85°C
CL = 50 pF Unit Fig.
No.
Min Typ Max Min Max
tPLH
Pro
p
agation Delay
3.3 1.5 6.0 9.5 1.0 10.5
ns
3–5
tPLH
P
ropagat
i
on
D
e
l
ay 5.0 1.5 4.5 7.0 1.0 8.0 ns 3–5
tPHL
Pro
p
agation Delay
3.3 1.5 5.5 8.5 1.0 10.0
ns
3–5
tPHL
P
ropagat
i
on
D
e
l
ay 5.0 1.5 4.0 6.0 1.0 6.5 ns 3–5
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
74ACT 74ACT
Symbol Parameter VCC
(V) TA = +25°CTA =
–40°C to
+85°CUnit Conditions
Typ Guaranteed Limits
VIH Minimum High Level 4.5 1.5 2.0 2.0
V
VOUT = 0.1 V
ugee
Input Voltage 5.5 1.5 2.0 2.0
V
or VCC – 0.1 V
VIL Maximum Low Level 4.5 1.5 0.8 0.8
V
VOUT = 0.1 V
auoee
Input Voltage 5.5 1.5 0.8 0.8
V
or VCC – 0.1 V
VOH Minimum High Level 4.5 4.49 4.4 4.4
V
IOUT = –50 µA
ugee
Output Voltage 5.5 5.49 5.4 5.4
V
*VIN = VIL or VIH
4.5 – 3.86 3.76 V
IOH
–24 mA
5.5 – 4.86 4.76
I
OH –24 mA
VOL Maximum Low Level 4.5 0.001 0.1 0.1
V
IOUT = 50 µA
auoee
Output Voltage 5.5 0.001 0.1 0.1
V
*VIN = VIL or VIH
4.5 – 0.36 0.44 V
IOL
24 mA
5.5 – 0.36 0.44
I
OL 24 mA
IIN Maximum Input
55
–
±01
±10
µA
VI=V
CC GND
au u
Leakage Current 5.5 – ±0.1 ±1.0 µ
A
V
I =
V
CC,
GND
∆ICCT Additional Max. ICC/Input 5.5 0.6 – 1.5 mA VI = VCC – 2.1 V
IOLD †Minimum Dynamic
Ot tC t
5.5 – – 75 mA VOLD = 1.65 V Max
IOHD Output Current 5.5 – – –75 mA VOHD = 3.85 V Min
ICC Maximum Quiescent
55
–
40
40
µA
VIN =V
CC or GND
a u Qu esce
Supply Current 5.5 – 4.0 40 µ
A
V
IN =
V
CC or
GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
MC74AC10, MC74ACT10
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4
AC CHARACTERISTICS (For Figures and Waveforms – See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
74ACT 74ACT
Symbol Parameter VCC*
(V) TA = +25°C
CL = 50 pF
TA = –40°C
to +85°C
CL = 50 pF Unit Fig.
No.
Min Typ Max Min Max
tPLH Propagation Delay 5.0 1.0 – 9.0 1.0 10.0 ns 3–5
tPHL Propagation Delay 5.0 1.0 –9.0 1.0 9.5 ns 3–5
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol Parameter Value
Typ Unit Test Conditions
CIN Input Capacitance 4.5 pF VCC = 5.0 V
CPD Power Dissipation Capacitance 25 pF VCC = 5.0 V
MC74AC10, MC74ACT10
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5
MARKING DIAGRAMS
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
PDIP–14 SO–14 TSSOP–14
MC74AC10N
AWLYYWW AC10
AWLYWW AC
10
ALYW
ACT
10
ALYW
ACT10
AWLYWW
MC74ACT10N
AWLYYWW
74AC10
ALYW
EIAJ–14
74ACT10
ALYW
MC74AC10, MC74ACT10
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6
PACKAGE DIMENSIONS
PDIP–14
N SUFFIX
14 PIN PLASTIC DIP PACKAGE
CASE 646–06
ISSUE M
17
14 8
B
ADIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.715 0.770 18.16 18.80
B0.240 0.260 6.10 6.60
C0.145 0.185 3.69 4.69
D0.015 0.021 0.38 0.53
F0.040 0.070 1.02 1.78
G0.100 BSC 2.54 BSC
H0.052 0.095 1.32 2.41
J0.008 0.015 0.20 0.38
K0.115 0.135 2.92 3.43
L
M--- 10 --- 10
N0.015 0.039 0.38 1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
F
HG DK
C
SEATING
PLANE
N
–T–
14 PL
M
0.13 (0.005)
L
M
J0.290 0.310 7.37 7.87
SO–14
D SUFFIX
14 PIN PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
G
P7 PL
14 8
71 M
0.25 (0.010) B M
S
B
M
0.25 (0.010) A S
T
–T–
F
RX 45
SEATING
PLANE D14 PL K
C
J
M
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A8.55 8.75 0.337 0.344
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.228 0.244
R0.25 0.50 0.010 0.019
MC74AC10, MC74ACT10
http://onsemi.com
7
PACKAGE DIMENSIONS
TSSOP–14
DT SUFFIX
14 PIN PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C--- 1.20 --- 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
L–U–
SEATING
PLANE
0.10 (0.004)
–T–
ÇÇÇ
ÇÇÇ
SECTION N–N
DETAIL E
JJ1
K
K1
ÉÉ
ÉÉ
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
14X REFK
N
N
EIAJ–14
M SUFFIX
14 PIN PLASTIC EIAJ PACKAGE
CASE 965–01
ISSUE O
HE
A1
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
--- 1.42 --- 0.056
A1
HE
Q1
LE
10 0
10
LEQ1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005) M0.10 (0.004)
D
Z
E
1
14 8
7
eA
b
VIEW P
c
L
DETAIL P
M
A
b
c
D
E
e
0.50
M
Z
MC74AC10, MC74ACT10
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8
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changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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Phone: 81–3–5740–2700
Email: r14525@onsemi.com
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For additional information, please contact your local
Sales Representative.
MC74AC10/D
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