Data Sheet
Broadcom AV02-1562EN
July 23, 2018
Description
These solid state LED lamps use double heterojunction
(DH) AlGaAs/GaAs material technology. This LED material
has outstanding light output efficiency at very low drive
currents. The color is deep red at the dominant wavelength
of 637 nm. These lamps are ideally suited for use in
applications where high light output is required with
minimum power output.
Features
Minimum luminous intensity specified at 1 mA
High light output at low currents
Wide viewing angle
Outstanding material efficiency
Low power/low forward voltage
CMOS/MOS compatible
TTL compatible
Deep red color
Applications
Low power circuits
Battery powered equipment
Telecommunication indicators
HLMP-D150, HLMP-D155, HLMP-K150, and
HLMP-K155
T-1¾ (5 mm), T-1 (3 mm), Low Current, Double
Heterojunction AlGaAs Red LED Lamps
Broadcom AV02-1562EN
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HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps
Package Dimensions
Package Outline A Package Outline B
25.40 (1.00)
MINIMUM
1.27(0.050)
NOM.
0.89 (0.035)
0.64 (0.025)
5.08 (0.200)
4.57 (0.180)
9.19 (0.362)
8.43 (0.332)
0.65 (0.026) MAX.
CATHODE
0.55 (0.022)
0.40 (0.016) SQ. TYP.
2.54 (0.100)
NOM.
6.10 (0.240)
5.59 (0.220)
A.
6.1 (0.240)
5.6 (0.220)
23.0
(0.90)MIN.
0.46 (0.018)
SQUARE NOMINAL
2.54 (0.100)
NOM.
CATHODE
1.27 (0.050)
NOM.
0.89 (0.035)
0.64 (0.025)
9.19 (0.362)
8.43 (0.332)
13.25 (0.522)
12.45 (0.490)
1.32 (0.052)
1.02 (0.040)
5.08 (0.200)
4.57 (0.180)
B.
Package Outline C
NOTE:
1. All dimensions are in mm (in.).
2. An epoxy meniscus may extend about 1 mm (0.040 in.) down the leads.
3. For PCB hole recommendations, see the Precautions section.
Broadcom AV02-1562EN
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HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps
Selection Guide
Absolute Maximum Ratings at TA = 25°C
Package Description Device HLMP-
Luminous Intensity Iv (mcd) at 1 mA 2θ1/2a
Degree
a. θ1/2 is the off axis angle from lamp centerline where the luminous intensity is ½ the on-axis value.
Package
Outline Min. Typ. Max.
T-1¾ Red Tinted Diffused D150 1.3 3.0 — 65 A
D150-C00xx 1.3 3.0 — 65 A
T-1¾ Red Untinted Non-diffused D155 5.4 10.0 — 24 B
D155-F00xx 5.4 10.0 — 24 B
T-1 Red Tinted Diffused K150 1.3 2.0 — 60 C
K150-C00xx 1.3 2.0 — 60 C
K150-CD0xx 1.3 2.0 4.2 60 C
T-1 Red Untinted Non-diffused K155 2.1 3.0 — 45 C
K155-D00xx 2.1 3.0 — 45 C
Parameter Value
Peak Forward Currenta
a. Maximum IPEAK at f = 1 kHz, DF = 6.7%.
300 mA
Average Forward Currentb20 mA
DC Currentb
b. Derate linearly as shown in Figure 4.
30 mA
Power Dissipation 87 mW
Reverse Voltage (IR = 100 µA) 5V
Transient Forward Current (10 µs Pulse)c
c. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire
bonds. It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.
500 mA
LED Junction Temperature 110°C
Operating Temperature Range –20°C to +100°C
Storage Temperature Range –40°C to +100°C
Broadcom AV02-1562EN
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HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps
Electrical/Optical Characteristics at TA = 25°C
Part Numbering System
Parameter Symbol Min. Typ. Max. Unit Test Condition
Forward Voltage VF — 1.62.2 V I
F = 1 mA
Reverse Breakdown Voltage VR 5.015.0 — V I
R = 100 µA
Peak Wavelength p — 645 — nm Measurement at Peak
Dominant Wavelength d —637— nm
Note a
a. The dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the color of the device.
Spectral Line Halfwidth ½ — 20 — nm Wavelength width at spectral
distribution ½ power point.
Speed of Response S — 30 — ns Exponential Time Constant, e-t/TS
Capacitance C — 30 — pF VF = 0, f = 1 MHz
Thermal Resistance RθJ-PIN —260b
210c
290d
b. HLMP-D150.
c. HLMP-D155.
d. HLMP-K150/-K155.
— °C/W Junction to Cathode Lead
Luminous Efficacy V — 80 — Im/W Note e
e. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = lV/V, where IV is the luminous intensity in candelas and
V is luminous efficacy in lumens/watt.
HLMP -X1X2X3X4-X5X6X7X8X9
Code Description Option
X1Package type D T-1¾ (5 mm)
K T-1 (3 mm)
X2Color options 1 AlGaAs Red
X3 X4Lens type 50 Tinted, diffused
55 Untinted, non-diffused
X5Minimum intensity bin See Intensity Bin Limits
X6Maximum intensity bin 0 Open binning (no maximum limit)
X7Color bin selection 0 Full range
X8 X9Packaging option 00 Bulk packaging
02 Tape and reel
A1 Right angle housing, uneven leads
B2 Right angle housing, even leads
Broadcom AV02-1562EN
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HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps
Intensity Bin Limits
Maximum tolerance for each bin limit is ± 18%.
Mechanical Option Matrix
NOTE: All categories are established for classification of products. Products may not be available in all categories. Please
contact your local Broadcom representative for further clarification/information.
Color Bin
Intensity Range (mcd)
Min. Max.
Red C 1.5 2.4
D 2.4 3.8
E 3.8 6.1
F 6.1 9.7
G 9.7 15.5
H 15.5 24.8
I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
O 340.0 540.0
P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
Mechanical Option Code Definition
00 Bulk Packaging, minimum increment 500 pieces/bag
02 Tape and Reel, straight leads, minimum increment 1300 pieces (T-1¾), 800 pieces (T-1)
A1 T-1 Right Angle Housing, uneven leads, minimum increment 500 pieces/bag
B2 T-1¾ Right Angle Housing, even leads, minimum increment 500 pieces/bag
Broadcom AV02-1562EN
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HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps
Figure 1: Relative Intensity vs. Wavelength Figure 2: Forward Current vs. Forward Voltage
Figure 3: Relative Luminous Intensity vs. DC Forward Current Figure 4: Maximum Forward DC Current vs. Ambient
Temperature. Derating based on TJ MAX. = 110°C.
Figure 5: Relative Luminous Intensity vs. Angular
Displacement, HLMP-D150
Figure 6: Relative Luminous Intensity vs. Angular
Displacement, HLMP-K150
Broadcom AV02-1562EN
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HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps
Figure 7: Relative Luminous Intensity vs. Angular
Displacement, HLMP-D155
Figure 8: Relative Luminous Intensity vs. Angular
Displacement, HLMP-K155
Precautions
Lead Forming
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
For better control, use the proper tool to precisely form
and cut the leads to applicable length rather than doing
it manually.
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground that prevents mechanical stress
due to lead cutting from traveling into LED package.
Use this method for the hand soldering operation,
because the excess lead length also acts as small heat
sink.
Soldering and Handling
Take care during the PCB assembly and soldering
process to prevent damage to the LED component.
LED component may be effectively hand soldered to
PCB. However, do this under unavoidable
circumstances, such as rework. The closest manual
soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59 mm. Soldering
the LED using soldering iron tip closer than 1.59 mm
might damage the LED.
Apply ESD precautions on the soldering station and
personnel to prevent ESD damage to the LED
component that is ESD sensitive. Refer to Broadcom
application note AN 1142 for details. The soldering iron
used must have a grounded tip to ensure electrostatic
charge is properly grounded.
Recommended soldering condition.
Set and maintain wave soldering parameters according
to the recommended temperature and dwell time.
Perform daily checks on the soldering profile to ensure
that it always conforms to the recommended soldering
conditions.
1.59 mm
Wave Solderinga, b
a. The preceding conditions refer to measurement with a
thermocouple mounted at the bottom of the PCB.
b. Use only bottom pre-heaters to reduce thermal stress
experienced by LED.
Manual Solder Dipping
Pre-heat Temperature 105°C max. —
Pre-heat Time 60s max. —
Peak Temperature 250°C max. 260°C max.
Dwell Time 3s max. 5s max.
HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps
Broadcom AV02-1562EN
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NOTE:
1. PCBs with different size and design (component
density) will have a different heat mass (heat capacity).
This might cause a change in temperature experienced
by the board if the same wave soldering setting is used.
Therefore, re-calibrate the soldering profile again before
loading a new type of PCB.
2. Take extra precautions during wave soldering to ensure
that the maximum wave temperature does not exceed
250°C and the solder contact time does not exceed 3s.
Over-stressing the LED during the soldering process
might cause premature failure to the LED due to
delamination.
Loosely fit any alignment fixture that is being applied
during wave soldering and do not apply weight or force
on the LED. Use non-metal material because it will
absorb less heat during the wave soldering process.
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, allow the PCB to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
If PCB board contains both through-hole (TH) LED and
other surface-mount components, solder surface-mount
components on the top side of the PCB. If the surface
mount must be on the bottom side, solder these
components using reflow soldering prior to the insertion
of the TH LED.
The recommended PC board plated through holes
(PTH) size for LED component leads follows.
Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
Figure 9: Example of Wave Soldering Temperature Profile for TH LED
LED
Component
Lead Size Diagonal
Plated Through-
Hole Diameter
Lead size (typ.) 0.45 × 0.45 mm
(0.018 × 0.018 in.)
0.636 mm
(0.025 in.)
0.98 to 1.08 mm
(0.039 to 0.043 in.
)
Dambar shear-
off area (max.)
0.65 mm
(0.026 in.)
0.919 mm
(0.036 in.)
Lead size (typ.) 0.50 × 0.50 mm
(0.020 × 0.020 in.)
0.707 mm
(0.028 in.)
1.05 to 1.15 mm
(
0.041 to 0.045 in.)
Dambar shear-
off area (max.)
0.70 mm
(0.028 in.)
0.99 mm
(0.039 in.)
0 10 20 30 40 50 60 70 80 90 100
250
200
150
100
50
TIME (SECONDS)
PREHEAT
TURBULENT WAVE LAMINAR
HOT AIR KNIFE
TEMPERATURE (°C)
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin ux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5s – 3.0s (maximum = 3 seconds)
Note: Allow for board to be suciently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin ux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5s – 3.0s (maximum = 3 seconds)
Note: Allow for board to be suciently cooled to
room temperature before exerting mechanical force.
Broadcom AV02-1562EN
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HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps
Packaging Label
Avago Mother Label (Available on Packaging Box of Ammo Pack and Shipping Box)
Avago Baby Label (Only Available on Bulk Packaging)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Color Bin
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label
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