Product Folder Order Now Support & Community Tools & Software Technical Documents LM35 SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 LM35 Precision Centigrade Temperature Sensors 1 Features 3 Description * * * * * * * * * * * The LM35 series are precision integrated-circuit temperature devices with an output voltage linearlyproportional to the Centigrade temperature. The LM35 device has an advantage over linear temperature sensors calibrated in Kelvin, as the user is not required to subtract a large constant voltage from the output to obtain convenient Centigrade scaling. The LM35 device does not require any external calibration or trimming to provide typical accuracies of 1/4C at room temperature and 3/4C over a full -55C to 150C temperature range. Lower cost is assured by trimming and calibration at the wafer level. The low-output impedance, linear output, and precise inherent calibration of the LM35 device makes interfacing to readout or control circuitry especially easy. The device is used with single power supplies, or with plus and minus supplies. As the LM35 device draws only 60 A from the supply, it has very low self-heating of less than 0.1C in still air. The LM35 device is rated to operate over a -55C to 150C temperature range, while the LM35C device is rated for a -40C to 110C range (-10 with improved accuracy). The LM35-series devices are available packaged in hermetic TO transistor packages, while the LM35C, LM35CA, and LM35D devices are available in the plastic TO-92 transistor package. The LM35D device is available in an 8-lead surface-mount small-outline package and a plastic TO-220 package. 1 Calibrated Directly in Celsius (Centigrade) Linear + 10-mV/C Scale Factor 0.5C Ensured Accuracy (at 25C) Rated for Full -55C to 150C Range Suitable for Remote Applications Low-Cost Due to Wafer-Level Trimming Operates From 4 V to 30 V Less Than 60-A Current Drain Low Self-Heating, 0.08C in Still Air Non-Linearity Only 1/4C Typical Low-Impedance Output, 0.1 for 1-mA Load 2 Applications * * * * Power Supplies Battery Management HVAC Appliances Device Information(1) PART NUMBER LM35 PACKAGE BODY SIZE (NOM) TO-CAN (3) 4.699 mm x 4.699 mm TO-92 (3) 4.30 mm x 4.30 mm SOIC (8) 4.90 mm x 3.91 mm TO-220 (3) 14.986 mm x 10.16 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Basic Centigrade Temperature Sensor (2C to 150C) Full-Range Centigrade Temperature Sensor +VS +VS (4 V to 20 V) LM35 LM35 VOUT OUTPUT 0 mV + 10.0 mV/C R1 tVS Choose R1 = -VS / 50 A VOUT = 1500 mV at 150C VOUT = 250 mV at 25C VOUT = -550 mV at -55C 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM35 SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 Absolute Maximum Ratings ...................................... 4 ESD Ratings.............................................................. 4 Recommended Operating Conditions....................... 4 Thermal Information .................................................. 4 Electrical Characteristics: LM35A, LM35CA Limits... 5 Electrical Characteristics: LM35A, LM35CA ............. 6 Electrical Characteristics: LM35, LM35C, LM35D Limits.......................................................................... 8 6.8 Electrical Characteristics: LM35, LM35C, LM35D ... 9 6.9 Typical Characteristics ............................................ 11 7 Detailed Description ............................................ 13 7.1 Overview ................................................................. 13 7.2 Functional Block Diagram ....................................... 13 7.3 Feature Description................................................. 13 7.4 Device Functional Modes........................................ 13 8 Application and Implementation ........................ 14 8.1 Application Information............................................ 14 8.2 Typical Application .................................................. 15 8.3 System Examples ................................................... 16 9 Power Supply Recommendations...................... 19 10 Layout................................................................... 19 10.1 Layout Guidelines ................................................. 19 10.2 Layout Example .................................................... 20 11 Device and Documentation Support ................. 21 11.1 11.2 11.3 11.4 11.5 Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 21 21 21 21 21 12 Mechanical, Packaging, and Orderable Information ........................................................... 21 4 Revision History Changes from Revision G (August 2016) to Revision H Page * Changed NDV Package (TO-CAN) pinout from bottom view back to top view; added textnote to pinout............................. 3 * Added pin numbers to the TO-CAN (TO46) pinout ................................................................................................................ 3 Changes from Revision F (January 2016) to Revision G Page * Equation 1, changed From: 10 mV/F To: 10mv/C ............................................................................................................ 13 * Power Supply Recommendations, changed From: "4-V to 5.5-V power supply" To: "4-V to 30-V power supply: .............. 19 Changes from Revision E (January 2015) to Revision F * Changed NDV Package (TO-CAN) pinout from Top View to Bottom View ........................................................................... 3 Changes from Revision D (October 2013) to Revision E * Page Page Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 Changes from Revision C (July 2013) to Revision D Page * Changed W to .................................................................................................................................................................... 1 * Changed W to in Abs Max tablenote. ................................................................................................................................ 4 2 Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 LM35 www.ti.com SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 5 Pin Configuration and Functions NDV Package 3-Pin TO-CAN (Top View) LP Package 3-Pin TO-92 (Bottom View) (1) +VS (3) GND +VS VOUT GND (2) VOUT 1 2 3 Case is connected to negative pin (GND) Refer the second NDV0003H page for reference NEB Package 3-Pin TO-220 (Top View) D Package 8-PIN SOIC (Top View) VOUT N.C. 1 2 8 7 +VS N.C. N.C. 3 6 N.C. GND 4 5 N.C. LM 35DT 1 2 3 N.C. = No connection +VS GND VOUT Tab is connected to the negative pin (GND). NOTE: The LM35DT pinout is different than the discontinued LM35DP Pin Functions PIN NAME VOUT N.C. GND N.C. +VS TO46 TO92 TO220 SO8 2 2 3 1 -- -- -- 2 -- -- -- 3 3 3 2 4 -- -- -- 5 -- -- -- 6 -- -- -- 7 1 1 1 8 TYPE DESCRIPTION O Temperature Sensor Analog Output -- No Connection GROUND -- POWER Device ground pin, connect to power supply negative terminal No Connection Positive power supply pin Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 3 LM35 SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Supply voltage -0.2 35 V Output voltage -1 6 V Output current 10 mA Maximum Junction Temperature, TJmax 150 C Storage Temperature, Tstg (1) (2) TO-CAN, TO-92 Package -60 150 TO-220, SOIC Package -65 150 C If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. 6.2 ESD Ratings V(ESD) (1) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) VALUE UNIT 2500 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) Specified operating temperature: TMIN to TMAX MIN MAX LM35, LM35A -55 150 LM35C, LM35CA -40 110 0 100 4 30 LM35D Supply Voltage (+VS) UNIT C V 6.4 Thermal Information LM35 THERMAL METRIC (1) (2) NDV LP 3 PINS RJA Junction-to-ambient thermal resistance RJC(top) Junction-to-case (top) thermal resistance (1) (2) 4 D NEB 8 PINS 3 PINS 400 180 220 90 24 -- -- -- UNIT C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. For additional thermal resistance information, see Typical Application. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 LM35 www.ti.com SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 6.5 Electrical Characteristics: LM35A, LM35CA Limits Unless otherwise noted, these specifications apply: -55C TJ 150C for the LM35 and LM35A; -40C TJ 110C for the LM35C and LM35CA; and 0C TJ 100C for the LM35D. VS = 5 Vdc and ILOAD = 50 A, in the circuit of Full-Range Centigrade Temperature Sensor. These specifications also apply from 2C to TMAX in the circuit of Figure 14. LM35A PARAMETER Accuracy (3) TEST CONDITIONS LM35CA TYP TESTED LIMIT (1) DESIGN LIMIT (2) TYP TESTED LIMIT (1) TA = 25C 0.2 0.5 TA = -10C 0.3 0.2 0.5 TA = TMAX 0.4 1 0.4 TA = TMIN 0.4 1 0.4 1.5 0.15 0.3 0.3 1 TMIN TA TMAX, -40C TJ 125C Sensor gain (average slope) TMIN TA TMAX 10 9.9 10 9.9 -40C TJ 125C 10 10.1 10 10.1 TA = 25C 0.4 1 0.4 TMIN TA TMAX, -40C TJ 125C 0.5 Load regulation (5) 0 IL 1 mA Line regulation (5) TA = 25C 0.01 4 V VS 30 V, -40C TJ 125C 0.02 VS = 5 V, 25C Quiescent current (6) 105 VS = 30 V, 25C 56.2 VS = 30 V, -40C TJ 125C Change of quiescent current (5) Temperature coefficient of quiescent current (1) (2) (3) (4) (5) (6) 3 0.05 0.1 67 68 114 68 0.5 2 0.5 2 -40C TJ 125C 0.39 0.5 0.39 0.5 1.5 2 1.5 2 0.08 A 116 4 V VS 30 V, -40C TJ 125C TJ = TMAX, for 1000 hours mV/V 67 91.5 0.2 mV/mA 0.1 0.2 1 mV/C 0.05 91 56.2 133 3 0.02 56 131 105.5 0.5 0.01 C 1 4 V VS 30 V, 25C Minimum temperature In circuit of Figure 14, IL = 0 for rate accuracy Long term stability 56 VS = 5 V, -40C TJ 125C 0.35 C 1 Nonlinearity (4) 0.18 UNIT DESIGN LIMIT (2) 1 0.08 A A/C C C Tested Limits are ensured and 100% tested in production. Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are not used to calculate outgoing quality levels. Accuracy is defined as the error between the output voltage and 10 mv/C times the case temperature of the device, at specified conditions of voltage, current, and temperature (expressed in C). Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated temperature range of the device. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Quiescent current is defined in the circuit of Figure 14. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 5 LM35 SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 www.ti.com 6.6 Electrical Characteristics: LM35A, LM35CA Unless otherwise noted, these specifications apply: -55C TJ 150C for the LM35 and LM35A; -40C TJ 110C for the LM35C and LM35CA; and 0C TJ 100C for the LM35D. VS = 5 Vdc and ILOAD = 50 A, in the circuit of Full-Range Centigrade Temperature Sensor. These specifications also apply from 2C to TMAX in the circuit of Figure 14. PARAMETER LM35A TEST CONDITIONS MIN TYP LM35CA MAX 0.2 TA = 25C Tested Limit (2) TYP TYP MAX UNIT 0.2 0.5 0.5 Design Limit (3) TA = -10C Tested Limit 0.3 0.3 0.4 0.4 (2) Design Limit (3) Accuracy (1) TA = TMAX 1 Tested Limit (2) Design Limit 1 1 (3) 0.4 TA = TMIN Tested Limit (2) 0.4 1 Design Limit (3) 1.5 0.18 TMIN TA TMAX, -40C TJ 125C Nonlinearity (4) 0.15 Tested Limit (2) Design Limit C (3) 0.35 10 TMIN TA TMAX Tested Limit (2) 0.3 10 9.9 Design Limit (3) Sensor gain (average slope) 9.9 10 -40C TJ 125C Tested Limit (2) 10 10.1 0.4 Load regulation 0 IL 1 mA Tested Limit (2) 0.4 1 0.5 TMIN TA TMAX, -40C TJ 125C TA = 25C Tested Limit (2) Design Limit (3) 3 (5) 6 0.05 0.02 4 V VS 30 V, -40C TJ 125C (4) Tested Limit (2) 3 0.01 0.05 Design Limit (3) Line regulation (5) (2) (3) mV/mA 0.5 0.01 (1) 1 Design Limit (3) (5) mV/C 10.1 Design Limit (3) TA = 25C C mV/V 0.02 Tested Limit (2) Design Limit (3) 0.1 0.1 Accuracy is defined as the error between the output voltage and 10 mv/C times the case temperature of the device, at specified conditions of voltage, current, and temperature (expressed in C). Tested Limits are ensured and 100% tested in production. Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are not used to calculate outgoing quality levels. Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated temperature range of the device. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 LM35 www.ti.com SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 Electrical Characteristics: LM35A, LM35CA (continued) Unless otherwise noted, these specifications apply: -55C TJ 150C for the LM35 and LM35A; -40C TJ 110C for the LM35C and LM35CA; and 0C TJ 100C for the LM35D. VS = 5 Vdc and ILOAD = 50 A, in the circuit of Full-Range Centigrade Temperature Sensor. These specifications also apply from 2C to TMAX in the circuit of Figure 14. PARAMETER LM35A TEST CONDITIONS MIN TYP LM35CA MAX 56 VS = 5 V, 25C Tested Limit (2) TYP TYP MAX UNIT 56 67 67 Design Limit (3) 105 VS = 5 V, -40C TJ 125C Quiescent current (6) Tested Limit 91 (2) Design Limit (3) 131 56.2 VS = 30 V, 25C Tested Limit (2) 114 56.2 68 A 68 Design Limit (3) 105.5 VS = 30 V, -40C TJ 125C 91.5 Tested Limit (2) Design Limit (3) 133 0.2 4 V VS 30 V, 25C Change of quiescent current (5) Design Limit 1 4 V VS 30 V, -40C TJ 125C Minimum temperature for rate accuracy In circuit of Figure 14, IL = 0 Long term stability TJ = TMAX, for 1000 hours A 0.5 Tested Limit (2) Design Limit (3) 2 0.39 -40C TJ 125C 1 (3) 0.5 Temperature coefficient of quiescent current (6) Tested Limit (2) 116 0.2 2 0.39 Tested Limit (2) A/C Design Limit (3) 0.5 1.5 0.5 1.5 Tested Limit (2) C Design Limit (3) 2 0.08 2 0.08 C Quiescent current is defined in the circuit of Figure 14. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 7 LM35 SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 www.ti.com 6.7 Electrical Characteristics: LM35, LM35C, LM35D Limits Unless otherwise noted, these specifications apply: -55C TJ 150C for the LM35 and LM35A; -40C TJ 110C for the LM35C and LM35CA; and 0C TJ 100C for the LM35D. VS = 5 Vdc and ILOAD = 50 A, in the circuit of Full-Range Centigrade Temperature Sensor. These specifications also apply from 2C to TMAX in the circuit of Figure 14. LM35 PARAMETER Accuracy, LM35, LM35C (3) Accuracy, LM35D (3) Nonlinearity (4) Sensor gain (average slope) Load regulation (5) 0 IL 1 mA Line regulation (5) TEST CONDITIONS TYP TESTED LIMIT (1) TA = 25C 0.4 1 TA = -10C 0.5 TA = TMAX 0.8 TA = TMIN 0.8 Temperature coefficient of quiescent current (1) (2) (3) (4) (5) (6) 8 0.4 1 DESIGN LIMIT (2) 0.5 1.5 0.8 1.5 0.8 2 0.6 0.9 2 TA = TMIN 0.9 2 0.2 0.5 0.3 TMIN TA TMAX, -40C TJ 125C 10 9.8 10 9.8 10 10.2 10 10.2 TA = 25C 0.4 2 0.4 TMIN TA TMAX, -40C TJ 125C 0.5 TA = 25C 0.01 4 V VS 30 V, -40C TJ 125C 0.02 56 VS = 5 V, -40C TJ 125C 105 VS = 30 V, 25C 56.2 0.5 5 0.1 0.2 80 82 105.5 0.2 138 82 91.5 4 V VS 30 V, -40C TJ 125C 0.5 3 0.5 3 -40C TJ 125C 0.39 0.7 0.39 0.7 1.5 2 1.5 2 TJ = TMAX, for 1000 hours 0.08 0.08 mV/C mV/mA mV/V A 141 0.2 0.2 C 80 4 V VS 30 V, 25C 2 C 0.1 91 56.2 161 5 0.02 56 158 C 2 0.5 0.01 UNIT 1.5 TMIN TA TMAX, -40C TJ 125C Minimum temperature In circuit of Figure 14, IL = 0 for rate accuracy Long term stability 1.5 TESTED LIMIT (1) TA = TMAX VS = 30 V, -40C TJ 125C Change of quiescent current (5) 1.5 TYP TA = 25C VS = 5 V, 25C Quiescent current (6) LM35C, LM35D DESIGN LIMIT (2) 2 A A/C C C Tested Limits are ensured and 100% tested in production. Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are not used to calculate outgoing quality levels. Accuracy is defined as the error between the output voltage and 10 mv/C times the case temperature of the device, at specified conditions of voltage, current, and temperature (expressed in C). Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated temperature range of the device. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Quiescent current is defined in the circuit of Figure 14. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 LM35 www.ti.com SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 6.8 Electrical Characteristics: LM35, LM35C, LM35D Unless otherwise noted, these specifications apply: -55C TJ 150C for the LM35 and LM35A; -40C TJ 110C for the LM35C and LM35CA; and 0C TJ 100C for the LM35D. VS = 5 Vdc and ILOAD = 50 A, in the circuit of Full-Range Centigrade Temperature Sensor. These specifications also apply from 2C to TMAX in the circuit of Figure 14. PARAMETER LM35 TEST CONDITIONS MIN TYP LM35C, LM35D MAX 0.4 TA = 25C Tested Limit (2) MIN TYP UNIT MAX 0.4 1 1 Design Limit (3) TA = -10C Tested Limit 0.5 0.5 0.8 0.8 (2) Design Limit (3) Accuracy, LM35, LM35C (1) TA = TMAX 1.5 Tested Limit (2) Design Limit 1.5 (3) 1.5 0.8 TA = TMIN C 0.8 Tested Limit (2) Design Limit (3) 1.5 2 0.6 TA = 25C Tested Limit (2) Design Limit 1.5 (3) 0.9 Accuracy, LM35D (1) TA = TMAX Tested Limit (2) C Design Limit (3) 2 0.9 TA = TMIN Tested Limit (2) Design Limit (3) 2 0.3 Nonlinearity (4) TMIN TA TMAX, -40C TJ 125C 0.2 Tested Limit (2) C Design Limit (3) 0.5 10 TMIN TA TMAX, -40C TJ 125C Sensor gain (average slope) Tested Limit (2) 0.5 10 9.8 Design Limit (3) 9.8 10 Tested Limit (2) 10.2 Design Limit (3) 10.2 0.4 TA = 25C (2) (3) (4) (5) 2 0.5 TMIN TA TMAX, -40C TJ 125C (1) Tested Limit (2) 0.4 2 Design Limit (3) Load regulation (5) 0 IL 1 mA mV/C 10 mV/mA 0.5 Tested Limit (2) Design Limit (3) 5 5 Accuracy is defined as the error between the output voltage and 10 mv/C times the case temperature of the device, at specified conditions of voltage, current, and temperature (expressed in C). Tested Limits are ensured and 100% tested in production. Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are not used to calculate outgoing quality levels. Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated temperature range of the device. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 9 LM35 SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 www.ti.com Electrical Characteristics: LM35, LM35C, LM35D (continued) Unless otherwise noted, these specifications apply: -55C TJ 150C for the LM35 and LM35A; -40C TJ 110C for the LM35C and LM35CA; and 0C TJ 100C for the LM35D. VS = 5 Vdc and ILOAD = 50 A, in the circuit of Full-Range Centigrade Temperature Sensor. These specifications also apply from 2C to TMAX in the circuit of Figure 14. PARAMETER LM35 TEST CONDITIONS MIN TYP LM35C, LM35D MAX 0.01 TA = 25C Tested Limit (2) MIN TYP 0.1 0.1 0.02 4 V VS 30 V, -40C TJ 125C 0.02 mV/V Tested Limit (2) Design Limit (3) 0.2 56 VS = 5 V, 25C UNIT 0.01 Design Limit (3) Line regulation (5) MAX Tested Limit (2) 0.2 56 80 80 Design Limit (3) 105 VS = 5 V, -40C TJ 125C Quiescent current (6) 91 Tested Limit (2) Design Limit (3) 158 56.2 VS = 30 V, 25C Tested Limit (2) Design Limit 82 Change of quiescent current (5) Design Limit (3) 91.5 161 A 0.5 Tested Limit (2) Design Limit (3) 3 0.39 -40C TJ 125C Minimum temperature for rate accuracy In circuit of Figure 14, IL = 0 Tested Limit (2) Long term stability TJ = TMAX, for 1000 hours 10 2 2 0.5 Temperature coefficient of quiescent current (6) 141 0.2 Tested Limit (2) Design Limit (3) 4 V VS 30 V, -40C TJ 125C 82 Tested Limit (2) 0.2 4 V VS 30 V, 25C A (3) 105.5 VS = 30 V, -40C TJ 125C 138 56.2 3 0.39 Tested Limit (2) A/C Design Limit (3) 0.7 1.5 0.7 1.5 C Design Limit (3) 2 0.08 2 0.08 C Quiescent current is defined in the circuit of Figure 14. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 LM35 www.ti.com SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 6.9 Typical Characteristics 45 40 TIME CONSTANT (SEC) THERMAL RESISTANCE (C/W) 400 300 200 T0-46 100 35 30 25 20 T0-46 15 10 T0-92 5 T0-92 0 0 0 400 800 1200 1600 0 2000 AIR VELOCITY (FPM) 1200 1600 2000 C002 Figure 2. Thermal Time Constant 120 PERCENT OF FINAL VALUE (%) 120 PERCENT OF FINAL VALUE (%) 800 AIR VELOCITY (FPM) Figure 1. Thermal Resistance Junction To Air 100 80 60 40 20 0 20 100 80 T0-46 60 T0-92 40 20 0 20 0 2 4 6 8 TIME (MINUTES) 0 2 Figure 3. Thermal Response In Still Air 4 6 TIME (SEC) C003 8 C004 Figure 4. Thermal Response In Stirred Oil Bath 4.4 160 4.2 TYPICAL IOUT = 2.0 mA 4.0 140 QUIESCENT CURRENT ( A) SUPPLY VOLTAGE (V) 400 C001 3.8 3.6 3.4 TYPICAL IOUT = 1.0 mA 3.2 3.0 TYPICAL IOUT = 0 A or 50 A 2.8 120 100 80 60 40 20 2.6 2.4 0 75 25 25 75 125 TEMPERATURE (C) 175 75 Figure 5. Minimum Supply Voltage vs Temperature 25 25 75 TEMPERATURE (C) C005 125 175 C006 Figure 6. Quiescent Current vs Temperature (in Circuit of Figure 14) Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 11 LM35 SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 www.ti.com 200 2.0 180 1.5 TEMPERATURE ERROR (C) QUIESCENT CURRENT ( A) Typical Characteristics (continued) 160 140 120 100 80 0.5 0.5 2.0 25 75 125 LM35A 1.0 40 25 LM35A TYPICAL 0.0 1.5 175 TEMPERATURE (C) LM35 75 25 25 75 125 TEMPERATURE (C) C007 Figure 7. Quiescent Current vs Temperature (in Circuit of Full-Range Centigrade Temperature Sensor) 175 C008 Figure 8. Accuracy vs Temperature (Ensured) 1600 2.5 LM35D 2.0 1400 LM35C 1.5 1200 1.0 Noise (nV/--Hz) TEMPERATURE ERROR (C) 1.0 60 75 LM35 LM35CA 0.5 TYPICAL 0.0 0.5 LM35CA 1000 1.0 800 600 400 1.5 LM35C 200 2.0 0 2.5 75 25 25 75 125 10 175 TEMPERATURE (C) 100 1k 10k FREQUENCY (Hz) C009 100k C010 Figure 10. Noise Voltage Figure 9. Accuracy vs Temperature (Ensured) VIN (V) 6 4 2 0 0.6 VOUT (V) 0.4 0.2 0 -0.2 -20 -10 0 10 20 30 40 50 TIME ( SEC) 60 C011 Figure 11. Start-Up Response 12 Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 LM35 www.ti.com SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 7 Detailed Description 7.1 Overview The LM35-series devices are precision integrated-circuit temperature sensors, with an output voltage linearly proportional to the Centigrade temperature. The LM35 device has an advantage over linear temperature sensors calibrated in Kelvin, as the user is not required to subtract a large constant voltage from the output to obtain convenient Centigrade scaling. The LM35 device does not require any external calibration or trimming to provide typical accuracies of 1/4 C at room temperature and 3/4 C over a full -55C to 150C temperature range. Lower cost is assured by trimming and calibration at the wafer level. The low output impedance, linear output, and precise inherent calibration of the LM35 device makes interfacing to readout or control circuitry especially easy. The device is used with single power supplies, or with plus and minus supplies. As the LM35 device draws only 60 A from the supply, it has very low self-heating of less than 0.1C in still air. The LM35 device is rated to operate over a -55C to 150C temperature range, while the LM35C device is rated for a -40C to 110C range (-10 with improved accuracy). The temperature-sensing element is comprised of a delta-V BE architecture. The temperature-sensing element is then buffered by an amplifier and provided to the VOUT pin. The amplifier has a simple class A output stage with typical 0.5- output impedance as shown in the Functional Block Diagram. Therefore the LM35 can only source current and it's sinking capability is limited to 1 A. 7.2 Functional Block Diagram A1 1.38 VPTAT +VS nR1 Q1 Q2 10E + A2 E VOUT = 10 mV/C V0 .125 R2 nR1 8.8 mV/C i R2 7.3 Feature Description 7.3.1 LM35 Transfer Function The accuracy specifications of the LM35 are given with respect to a simple linear transfer function: VOUT = 10 mv/C x T where * * VOUT is the LM35 output voltage T is the temperature in C (1) 7.4 Device Functional Modes The only functional mode of the LM35 is that it has an analog output directly proportional to temperature. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 13 LM35 SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The features of the LM35 make it suitable for many general temperature sensing applications. Multiple package options expand on it's flexibility. 8.1.1 Capacitive Drive Capability Like most micropower circuits, the LM35 device has a limited ability to drive heavy capacitive loads. Alone, the LM35 device is able to drive 50 pF without special precautions. If heavier loads are anticipated, isolating or decoupling the load with a resistor is easy (see Figure 12). The tolerance of capacitance can be improved with a series R-C damper from output to ground (see Figure 13). When the LM35 device is applied with a 200- load resistor as shown in Figure 16, Figure 17, or Figure 19, the device is relatively immune to wiring capacitance because the capacitance forms a bypass from ground to input and not on the output. However, as with any linear circuit connected to wires in a hostile environment, performance is affected adversely by intense electromagnetic sources (such as relays, radio transmitters, motors with arcing brushes, and SCR transients), because the wiring acts as a receiving antenna and the internal junctions act as rectifiers. For best results in such cases, a bypass capacitor from VIN to ground and a series R-C damper, such as 75 in series with 0.2 or 1 F from output to ground, are often useful. Examples are shown in Figure 13, Figure 24, and Figure 25. HEAVY CAPACITIVE LOAD, WIRING, ETC. + 2k LM35 TO A HIGH-IMPEDANCE LOAD OUT v Figure 12. LM35 with Decoupling from Capacitive Load HEAVY CAPACITIVE LOAD, WIRING, ETC. + LM35 0.01 PF BYPASS OPTONAL v OUT TO A HIGH-IMPEDANCE LOAD 75 1 PF Figure 13. LM35 with R-C Damper 14 Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 LM35 www.ti.com SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 8.2 Typical Application 8.2.1 Basic Centigrade Temperature Sensor +VS (4 V to 20 V) OUTPUT 0 mV + 10.0 mV/C LM35 Figure 14. Basic Centigrade Temperature Sensor (2 C to 150 C) 8.2.1.1 Design Requirements Table 1. Design Parameters PARAMETER VALUE Accuracy at 25C 0.5C Accuracy from -55 C to 150C 1C Temperature Slope 10 mV/C 8.2.1.2 Detailed Design Procedure Because the LM35 device is a simple temperature sensor that provides an analog output, design requirements related to layout are more important than electrical requirements. For a detailed description, refer to the Layout. 8.2.1.3 Application Curve TEMPERATURE ERROR (C) 2.0 LM35 1.5 1.0 0.5 LM35A TYPICAL 0.0 0.5 LM35A 1.0 1.5 LM35 2.0 75 25 25 75 TEMPERATURE (C) 125 175 C008 Figure 15. Accuracy vs Temperature (Ensured) Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 15 LM35 SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 www.ti.com 8.3 System Examples 5V 5V + + 6.8 k 5% 200 1% OUT LM35 HEAT VOUT = 10 mV/C (TAMBIENT = 1 C) FINS FROM + 2 C TO + 40 C VOUT = 10 mV/C (TAMBIENT = 1 C) FROM + 2 C TO + 40 C v + HEAT FINS LM35 OUT 200 1% v TWISTED PAIR 200 1% v TWISTED PAIR Figure 16. Two-Wire Remote Temperature Sensor (Grounded Sensor) 6.8 k 5% OR 10K RHEOSTAT FOR GAIN ADJUST 200 1% Figure 17. Two-Wire Remote Temperature Sensor (Output Referred to Ground) +VS 5V + 0.01 PF BYPASS OPTIONAL LM35 LM35 TWISTED PAIR 2k 1% + OUT 200 1% VOUT 2k 1% v 1N914 18 k 10% Figure 18. Temperature Sensor, Single Supply (-55 to +150C) 16 VOUT = 10 mV/C (TAMBIENT = 10 C) FROM t 5 C TO + 40 C 200 1% Figure 19. Two-Wire Remote Temperature Sensor (Output Referred to Ground) Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 LM35 www.ti.com SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 System Examples (continued) + 5 V TO + 30 V +VS (6 V to 20 V) 4.7 k LM35 2N2907 IN + OUT OUT LM35 402 1% v 62.5 0.5% OFFSET ADJUST 45.5 kO 1% LM317 ADJ 10 kO 1% 50 VOUT = +1 mV/F 26.4 kO 1% 18 kO LM385-1.2 1 MO 1% Figure 20. 4-To-20 mA Current Source (0C to 100C) 5V Figure 21. Fahrenheit Thermometer 9V 1k LM35 LM35 100 A, 60 mV FULLSCALE LM3852.5 Figure 22. Centigrade Thermometer (Analog Meter) 25.5 k Figure 23. Fahrenheit Thermometer, Expanded Scale Thermometer (50F to 80F, for Example Shown) Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 17 LM35 SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 www.ti.com System Examples (continued) 5V 5V + + 3.9 k OUT LM35 IN REF ADC08031 1.28 V GND SERIAL DATA OUTPUT LM35 16 k OUT ADC0804 GND 100k 75 75 + + LM385 + ENABLE 10 k 1 PF INTR 1k CLOCK FB PARALLEL DATA OUTPUT 8 IN VREF 0.64 V CS RD WR GND + 2k 1 PF GND Figure 24. Temperature to Digital Converter (Serial Output) (128C Full Scale) Figure 25. Temperature to Digital Converter (Parallel TRI-STATE Outputs for Standard Data Bus to P Interface) (128C Full Scale) 6V F 20 k 67 68 69 70 71 72 73 6.8 k 74 75 76 77 78 79 80 81 82 83 84 85 1k 86 7V + 20 PF fOUT 20 LEDs 18 10 10 18 4N28 + 8 100 k LM3914 1 2 3 4 5 LM3914 6 7V + HEAT FINS 7 8 9 1.2 k* 1 2 3 4 5 7 LM35 6 7 8 9 NC 7V 6 GND 0.01 PF OUT VC 200* + 1 PF 3 1 VA LM35 5 LM131 1.5 k* 100 k VB 499* 499* 1.5 k* 1 k* RC 1k RB 1k 47 1 PF 2 4 12 k 0.01 PF FULL SCALE ADJ 5k LOW TEMPCO RA 1k *=1% or 2% film resistor Trim RB for VB = 3.075 V Trim RC for VC = 1.955 V Trim RA for VA = 0.075 V + 100 mV/C xTambient Example, VA = 2.275 V at 22C Figure 26. Bar-Graph Temperature Display (Dot Mode) 18 Figure 27. LM35 With Voltage-To-Frequency Converter and Isolated Output (2C to 150C; 20 to 1500 Hz) Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 LM35 www.ti.com SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 9 Power Supply Recommendations The LM35 device has a very wide 4-V to 30-V power supply voltage range, which makes it ideal for many applications. In noisy environments, TI recommends adding a 0.1 F from V+ to GND to bypass the power supply voltage. Larger capacitances maybe required and are dependent on the power-supply noise. 10 Layout 10.1 Layout Guidelines The LM35 is easily applied in the same way as other integrated-circuit temperature sensors. Glue or cement the device to a surface and the temperature should be within about 0.01C of the surface temperature. The 0.01C proximity presumes that the ambient air temperature is almost the same as the surface temperature. If the air temperature were much higher or lower than the surface temperature, the actual temperature of the LM35 die would be at an intermediate temperature between the surface temperature and the air temperature; this is especially true for the TO-92 plastic package. The copper leads in the TO-92 package are the principal thermal path to carry heat into the device, so its temperature might be closer to the air temperature than to the surface temperature. Ensure that the wiring leaving the LM35 device is held at the same temperature as the surface of interest to minimize the temperature problem. The easiest fix is to cover up these wires with a bead of epoxy. The epoxy bead will ensure that the leads and wires are all at the same temperature as the surface, and that the temperature of the LM35 die is not affected by the air temperature. The TO-46 metal package can also be soldered to a metal surface or pipe without damage. Of course, in that case the V- terminal of the circuit will be grounded to that metal. Alternatively, mount the LM35 inside a sealedend metal tube, and then dip into a bath or screw into a threaded hole in a tank. As with any IC, the LM35 device and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as a conformal coating and epoxy paints or dips are often used to insure that moisture cannot corrode the LM35 device or its connections. These devices are sometimes soldered to a small light-weight heat fin to decrease the thermal time constant and speed up the response in slowly-moving air. On the other hand, a small thermal mass may be added to the sensor, to give the steadiest reading despite small deviations in the air temperature. Table 2. Temperature Rise of LM35 Due To Self-heating (Thermal Resistance, RJA) TO, no heat sink TO (1), small heat fin TO-92, no heat sink TO-92 (2), small heat fin SOIC-8, no heat sink SOIC-8 (2), small heat fin TO-220, no heat sink Still air 400C/W 100C/W 180C/W 140C/W 220C/W 110C/W 90C/W Moving air 100C/W 40C/W 90C/W 70C/W 105C/W 90C/W 26C/W Still oil 100C/W 40C/W 90C/W 70C/W -- -- -- Stirred oil 50C/W 30C/W 45C/W 40C/W -- -- -- -- -- (Clamped to metal, Infinite heat sink) (1) (2) (24C/W) (55C/W) -- Wakefield type 201, or 1-in disc of 0.02-in sheet brass, soldered to case, or similar. TO-92 and SOIC-8 packages glued and leads soldered to 1-in square of 1/16-in printed circuit board with 2-oz foil or similar. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 19 LM35 SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 www.ti.com 10.2 Layout Example VIA to ground plane VIA to power plane VOUT +VS N.C. N.C. N.C. N.C. GND N.C. 0.01 F Figure 28. Layout Example 20 Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 LM35 www.ti.com SNIS159H - AUGUST 1999 - REVISED DECEMBER 2017 11 Device and Documentation Support 11.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM35 21 PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM35AH ACTIVE TO NDV 3 500 TBD Call TI Call TI -55 to 150 ( LM35AH, LM35AH) LM35AH/NOPB ACTIVE TO NDV 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 150 ( LM35AH, LM35AH) LM35CAH ACTIVE TO NDV 3 500 TBD Call TI Call TI -40 to 110 ( LM35CAH, LM35CAH ) LM35CAH/NOPB ACTIVE TO NDV 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 110 ( LM35CAH, LM35CAH ) LM35CAZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN N / A for Pkg Type LM35CAZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN N / A for Pkg Type -40 to 110 LM35 CAZ LM35CH ACTIVE TO NDV 3 500 TBD Call TI Call TI -40 to 110 ( LM35CH, LM35CH) LM35CH/NOPB ACTIVE TO NDV 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 110 ( LM35CH, LM35CH) LM35CZ/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN N / A for Pkg Type LM35CZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN N / A for Pkg Type -40 to 110 LM35DH ACTIVE TO NDV 3 1000 TBD Call TI Call TI 0 to 70 ( LM35DH, LM35DH) LM35DH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM 0 to 70 ( LM35DH, LM35DH) LM35DM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 100 LM35D M LM35DM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 100 LM35D M LM35DMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 100 LM35D M LM35DMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM 0 to 100 LM35D M LM35DT NRND TO-220 NEB 3 45 TBD Call TI Call TI 0 to 100 LM35DT LM35DT/NOPB ACTIVE TO-220 NEB 3 45 Green (RoHS & no Sb/Br) SN Level-1-NA-UNLIM 0 to 100 LM35DT Addendum-Page 1 LM35 CAZ LM35 CZ LM35 CZ Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM35DZ/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN N / A for Pkg Type LM35 DZ LM35DZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN N / A for Pkg Type LM35 DZ LM35DZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN N / A for Pkg Type 0 to 100 LM35H ACTIVE TO NDV 3 500 TBD Call TI Call TI -55 to 150 ( LM35H, LM35H) LM35H/NOPB ACTIVE TO NDV 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 150 ( LM35H, LM35H) LM35 DZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM35DMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM35DMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM35DMX SOIC D 8 2500 367.0 367.0 35.0 LM35DMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE NDV0003H TO-CAN - 2.67 mm max height SCALE 1.250 TO-46 4.95 4.55 0.76 MAX 2.67 MAX 0.64 MAX UNCONTROLLED LEAD DIA 3X 12.7 MIN 3X 0.483 0.407 5.32-5.56 2 1 3 45 ( 2.54) 1.16 0.92 1.22 0.72 4219876/A 01/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-46. www.ti.com EXAMPLE BOARD LAYOUT NDV0003H TO-CAN - 2.67 mm max height TO-46 (2.54) 0.07 MAX ALL AROUND ( 1.2) METAL 3 3X ( 0.7) VIA SOLDER MASK OPENING (1.27) 1 (R0.05) TYP 2X ( 1.2) METAL 2 0.07 MAX TYP 2X SOLDER MASK OPENING LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE:12X 4219876/A 01/2017 www.ti.com PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] A .004 [0.1] C PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .150 [3.81] .189-.197 [4.81-5.00] NOTE 3 4X (0 -15 ) 4 5 B 8X .012-.020 [0.31-0.51] .010 [0.25] C A B .150-.157 [3.81-3.98] NOTE 4 .069 MAX [1.75] .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 [0.11-0.25] 0 -8 .016-.050 [0.41-1.27] DETAIL A (.041) [1.04] TYPICAL 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X METAL SOLDER MASK OPENING EXPOSED METAL .0028 MAX [0.07] ALL AROUND SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL .0028 MIN [0.07] ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE NEB0003F TO-220 - 19.65 mm max height TRANSISTOR OUTLINE 0.250 0.178 10.16 +0.38 -0.13 +0.38 -0.13 9.86 4.70 4.45 1.32 1.22 3.05 2.54 85 -86 8.55 8.15 1.40 1.14 6.6 6.1 (6.3) 12.5 12.1 3.78-3.89 8.89 8.38 7 0 -6 7 29.34 28.07 4.06 3.30 26.29 25.53 PIN# 1 ID 11.56 8.52 3 1 3X 1.40 1.22 3X 0.94 0.69 2.79 2X 2.29 +0.18 0.38 -0.03 2.67 +0.25 -0.38 5.33 4.83 4215014/A 12/2017 NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-220. www.ti.com EXAMPLE BOARD LAYOUT NEB0003F TO-220 - 19.65 mm max height TRANSISTOR OUTLINE 0.07 MAX ALL AROUND 3X 2X (1.7) METAL (1.2) 2X SOLDER MASK OPENING (1.7) R (0.05) SOLDER MASK OPENING 2 1 (2.54) 3 0.07 MAX ALL AROUND (5.08) LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE:15X 4215014/A 12/2017 www.ti.com PACKAGE OUTLINE LP0003A TO-92 - 5.34 mm max height SCALE 1.200 SCALE 1.200 TO-92 5.21 4.44 EJECTOR PIN OPTIONAL 5.34 4.32 (1.5) TYP SEATING PLANE (2.54) NOTE 3 2X 4 MAX (0.51) TYP 6X 0.076 MAX SEATING PLANE 2X 2.6 0.2 3X 12.7 MIN 3X 3X 0.55 0.38 0.43 0.35 2X 1.27 0.13 FORMED LEAD OPTION STRAIGHT LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION 3X 2.67 2.03 4.19 3.17 3 2 1 3.43 MIN 4215214/B 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. www.ti.com EXAMPLE BOARD LAYOUT LP0003A TO-92 - 5.34 mm max height TO-92 0.05 MAX ALL AROUND TYP FULL R TYP METAL TYP (1.07) 3X ( 0.85) HOLE 2X METAL (1.5) 2X (1.5) 2 1 (R0.05) TYP 3 2X (1.07) (1.27) SOLDER MASK OPENING 2X SOLDER MASK OPENING (2.54) LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 0.05 MAX ALL AROUND TYP ( 1.4) 2X ( 1.4) METAL 3X ( 0.9) HOLE METAL (R0.05) TYP 2 1 (2.6) SOLDER MASK OPENING 3 2X SOLDER MASK OPENING (5.2) LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 4215214/B 04/2017 www.ti.com TAPE SPECIFICATIONS LP0003A TO-92 - 5.34 mm max height TO-92 13.7 11.7 32 23 (2.5) TYP 0.5 MIN 16.5 15.5 11.0 8.5 9.75 8.50 19.0 17.5 6.75 5.95 2.9 TYP 2.4 3.7-4.3 TYP 13.0 12.4 FOR FORMED LEAD OPTION PACKAGE 4215214/B 04/2017 www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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