GO1525 HD-LINXTMII Voltage Controlled Oscillator GO1525 Data Sheet Key Features * generates 1.485GHz or 1.485/1.001GHz signal for HD-LINXTMII ICs * low current consumption * 50 output impedance * operates from a single 2.5V supply * 8 pin tape on reel * Pb-free and RoHS Compliant The output level is typically -9.0dBm with low spurious and noise content. It is designed to drive 50 strip lines. VCO for the GS1560, GS1559 and GS9060 Deserializers, and the GS1532, GS1531 and GS9062 Serializers This component and all homogeneous subcomponents are RoHS compliant. Description GO1555 for new designs The GO1525 is a self contained, miniature Voltage Controlled Oscillator (VCO). It produces a clean 1.485GHz reference clock signal for the GS1560 and GS9060 deserializers, and for the GS1532 and The GO1555 should be used for new designs given that it is smaller, consumes less power and gives better jitter performance. VCTR VCC STRIPLINE STRIPLINE OUT OSCILLATOR CIRCUIT GND GO1525 Functional Block Diagram 21969 - 9 February 2007 1 of 9 www.gennum.com FOR NEW DESIGNS USE GO1555 The VCO requires a single 2.5V supply and draws a maximum of 15mA of current. It is packaged in a miniature 8-pin proprietary surface mount package and operates over the normal commercial temperature range of 0C to +70C. Applications * GS9062 serializers. The control voltage range is from 1.0 volts to 1.5 volts and is derived from the on-chip PLLs. The GO1525 frequency can be pulled approximately 32MHz for every one volt of control. GO1525 Data Sheet Contents Key Features .................................................................................................................1 Applications...................................................................................................................1 Description ....................................................................................................................1 1. Pin Out ......................................................................................................................3 1.1 Pin Assignment ...............................................................................................3 1.2 Pin Descriptions ..............................................................................................3 2. Electrical Characteristics ...........................................................................................4 3.1 Reflow Conditions ...........................................................................................6 3.2 Soldering Flux .................................................................................................6 3.3 Rework or Repair ............................................................................................6 3.4 Endurance To Warp ........................................................................................6 4. Handling Recommendations .....................................................................................7 4.1 Cleaning ..........................................................................................................7 4.2 Storage ...........................................................................................................7 4.3 Transport .........................................................................................................7 4.4 ESD Warning ..................................................................................................7 5. Package & Ordering Information ...............................................................................8 5.1 Package Dimensions ......................................................................................8 5.2 Packaging Data ...............................................................................................8 5.3 Ordering Information .......................................................................................8 6. Revision History ........................................................................................................9 21969 - 9 February 2007 2 of 9 FOR NEW DESIGNS USE GO1555 3. Soldering Recommendations ....................................................................................5 GO1525 Data Sheet 1. Pin Out 1.1 Pin Assignment GND NC GND O/P 3 2 1 GO1525 4 8 GND TOP VIEW 6 7 VCTR GND VCC FOR NEW DESIGNS USE GO1555 5 NOTE: Pin numbers are arbitrary There are no pin markings on the device itself 1.2 Pin Descriptions Table 1-1: Pin Descriptions Pin Number Name Type Description 2, 4, 6, 8 GND Power Most negative power supply connections. 5 VCTR Input Control voltage for the VCO. 7 VCC Power Most positive power supply connection. 1 O/P Output VCO signal output. 3 NC - No connection. Note: Pin numbering different from GO1515 21969 - 9 February 2007 3 of 9 GO1525 Data Sheet 2. Electrical Characteristics Table 2-1: Electrical Characteristics VCC = 2.5V 0.25V, Temperature = 0C to 70C, unless otherwise shown Symbol Conditions Min Typ Max Units Supply Voltage VCC - 2.25 2.5 2.75 V Supply Voltage Supply Current S - - - 15 mA Supply Current Control Voltage Range VCTR - 1.0 - 1.5 V Control Voltage Sensitivity df/dV - 25 32 39 MHz/V Operating Frequency Range VCO VCTR = 1.0V 1483.5 - - MHz VCTR = 1.5V - - 1485.0 MHz Output Signal Level VOUT - -12 -9 -6 dBm Output Signal Level Pushing Figure - VCC = 2.5V 0.25V, ref: VCC = 2.5V - 1.5 - MHz Pushing Figure Pulling Figure - VSWR = 2.0 for all phase, ref: 50 - 1.0 - MHz Pulling Figure Temperature Stability TCOEF 0C to 70C, ref. = 25C - - 3 MHz Temperature Stability Spurious Response - - - - -10 dBc Spurious Response Output Impedance ZO - - 50 - Output Impedance 21969 - 9 February 2007 Notes Control Voltage Range Control Voltage Sensitivity Operating Frequency Range 4 of 9 FOR NEW DESIGNS USE GO1555 Parameter GO1525 Data Sheet 3. Soldering Recommendations The device is manufactured with Matte-Sn terminations and is compatible with both standard eutectic and Pb-free solder reflow profiles. The recommended standard eutectic reflow profile is shown in Figure 3-1. The maximum recommended Pb-free reflow profile is shown in Figure 3-2. 60-150 sec. Temperature 10-20 sec. 230C 220C 6C/sec max 150C 100C 25C Time 120 sec. max 6 min. max Figure 3-1: Standard Eutectic Solder Reflow Profile Temperature 60-150 sec. 20-40 sec. 260C 250C 3C/sec max 217C 6C/sec max 200C 150C 25C Time 60-180 sec. max 8 min. max Figure 3-2: Maximum Pb-free Solder Reflow Profile 21969 - 9 February 2007 5 of 9 FOR NEW DESIGNS USE GO1555 3C/sec max 183C GO1525 Data Sheet 3.1 Reflow Conditions The device will meet the data sheet specifications after completing the reflow process according to the profile shown in Figure 3-1 or Figure 3-2. Recommended soldering conditions are as follows: Preheating 15010C, 60 to 120 sec. Soldering Peak 260C Over 200C within 30 sec. Do not use cleaning type flux. Washing the devices after using cleaning type flux may damage inner parts and affect performance. 3.3 Rework or Repair Rework or repair must only be done once. Do not reflow the device more than twice; once for initial soldering and once for remounting after rework. Do not vibrate the VCO during reflow soldering. 3.4 Endurance To Warp When the device is soldered on a printed circuit board (dimension: 100mm x 100mm; thickness: 1.6mm) and the PCB is warped as shown in Figure 3-2, the device will not be cracked or damaged. VCO PCB MAX 2mm Figure 3-3: PCB Warp 21969 - 9 February 2007 6 of 9 FOR NEW DESIGNS USE GO1555 3.2 Soldering Flux GO1525 Data Sheet 4. Handling Recommendations 4.1 Cleaning There are two options for cleaning the devices. Option 1: 1. Clean but do not use solvent cleaners. 2. Thoroughly dry assemblies afterwards. Option 2: 4.2 Storage Store the devices out of direct sunlight, at a stable temperature and humidity. Avoid extreme temperatures, high humidity and wide temperature fluctuations. Condensation on the devices may result in reduced quality and lowered solderability. Avoid dust, sea breezes and corrosive gases (Cl2, NH3, SO2, NOX, etc.). Use within 6 months after delivery. If the devices are stored for more than one year, solderability may be degraded. 4.3 Transport Package the devices for transportation to avoid mechanical vibration or shock. 4.4 ESD Warning Avoid poor ground connections and electrostatic discharge or induction in production. 21969 - 9 February 2007 7 of 9 FOR NEW DESIGNS USE GO1555 1. Mount device after board is cleaned. GO1525 Data Sheet 5. Package & Ordering Information 5.1 Package Dimensions Recommended Footprint for PCB Layout 2.20 0.7 0.15 1.40 0.7 0.15 NC GO1525 TOP VIEW OUT 2.2 0.1 GND 4.2 0.1 1.10 5.8 0.2 2.00 VCTR GND 2.30 3.40 VCC 0.8 0.15 0.80.15 2.00.1 2.0 MAX 2.20 1.30.1 1.30.1 3.40 7.60.2 4.30 All dimensions in millimetres All dimensions in millimetres 5.2 Packaging Data Parameter Value Package Type 8L Proprietary Surface Mount Package Drawing Reference 21307 rev.0 Pb-free and RoHS Compliant Yes 5.3 Ordering Information Part Number Package Temperature Range Pb-Free RoHS Compliant GO1525-CTAE3 8-pin tape on reel 0C to 70C Yes Yes 21969 - 9 February 2007 8 of 9 FOR NEW DESIGNS USE GO1555 GND GND GO1525 Data Sheet 6. Revision History ECR PCN Date Changes/Modification 3 133240 - March 2004 Corrected package dimensions and added new footprint. 4 133445 - July 2004 Added `Pb-free' bullet. Added Pb-free solder reflow profile. 5 134964 - November 2004 Adding Pb-Free and Green Ordering Information. Converting to new document template. Adding packaging data information. Adding Solder Reflow Profile description. Updating product cleaning information. 6 136564 - April 2005 Changed `Green' references to RoHS Compliant. 7 137164 - June 2005 Rephrased RoHS compliance statement. 8 137624 - July 2005 Corrected packages list in Ordering Information on page 8. Corrected description of Pb-free profile in Soldering Recommendations on page 5 9 144096 42774 February 2007 Added watermark FOR NEW DESIGNS USE GO1555. CAUTION ELECTROSTATIC SENSITIVE DEVICES DO NOT OPEN PACKAGES OR HANDLE EXCEPT AT A STATIC-FREE WORKSTATION DOCUMENT IDENTIFICATION DATA SHEET The product is in production. Gennum reserves the right to make changes to the product at any time without notice to improve reliability, function or design, in order to provide the best product possible. GENNUM CORPORATION Mailing Address: P.O. Box 489, Stn. A, Burlington, Ontario, Canada L7R 3Y3 Shipping Address: 970 Fraser Drive, Burlington, Ontario, Canada L7L 5P5 Tel. +1 (905) 632-2996 Fax. +1 (905) 632-5946 GENNUM JAPAN CORPORATION Shinjuku Green Tower Building 27F, 6-14-1, Nishi Shinjuku, Shinjuku-ku, Tokyo, 160-0023 Japan Tel. +81 (03) 3349-5501, Fax. +81 (03) 3349-5505 GENNUM UK LIMITED 25 Long Garden Walk, Farnham, Surrey, England GU9 7HX Tel. +44 (0)1252 747 000 Fax +44 (0)1252 726 523 Gennum Corporation assumes no liability for any errors or omissions in this document, or for the use of the circuits or devices described herein. The sale of the circuit or device described herein does not imply any patent license, and Gennum makes no representation that the circuit or device is free from patent infringement. GENNUM and the G logo are registered trademarks of Gennum Corporation. (c) Copyright 2002 Gennum Corporation. All rights reserved. Printed in Canada. www.gennum.com 21969 - 9 February 2007 9 of 9 9 FOR NEW DESIGNS USE GO1555 Version