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GO1525 HD-LINX™II
Voltage Controlled Oscillator
GO1525 Data Sheet
21969 - 9 February 2007 1 of 9
FOR NEW DESIGNS USE GO1555
Key Features
• generates 1.485GHz or 1.485/1.001GHz signal for
HD-LINX™II ICs
• low current consumption
•50Ω output impedance
• operates from a single 2.5V supply
• 8 pin tape on reel
• Pb-free and RoHS Compliant
Applications
• VCO for the GS1560, GS1559 and GS9060
Deserializers, and the GS1532, GS1531 and
GS9062 Serializers
Description
The GO1525 is a self contained, miniature Voltage
Controlled Oscillator (VCO). It produces a clean
1.485GHz reference clock signal for the GS1560 and
GS9060 deserializers, and for the GS1532 and
GS9062 serializers. The control voltage range is from
1.0 volts to 1.5 volts and is derived from the on-chip
PLLs. The GO1525 frequency can be pulled
approximately 32MHz for every one volt of control.
The output level is typically -9.0dBm with low spurious
and noise content. It is designed to drive 50Ω strip lines.
The VCO requires a single 2.5V supply and draws a
maximum of 15mA of current. It is packaged in a
miniature 8-pin proprietary surface mount package and
operates over the normal commercial temperature
range of 0°C to +70°C.
This component and all homogeneous subcomponents
are RoHS compliant.
GO1555 for new designs
The GO1555 should be used for new designs given that
it is smaller, consumes less power and gives better jitter
performance.
GO1525 Functional Block Diagram
OSCILLATOR CIRCUIT
STRIPLINESTRIPLINE
VCTR VCC
OUT
GND
GO1525 Data Sheet
21969 - 9 February 2007 2 of 9
FOR NEW DESIGNS USE GO1555
Contents
Key Features.................................................................................................................1
Applications...................................................................................................................1
Description ....................................................................................................................1
1. Pin Out ......................................................................................................................3
1.1 Pin Assignment ...............................................................................................3
1.2 Pin Descriptions ..............................................................................................3
2. Electrical Characteristics...........................................................................................4
3. Soldering Recommendations ....................................................................................5
3.1 Reflow Conditions ...........................................................................................6
3.2 Soldering Flux .................................................................................................6
3.3 Rework or Repair ............................................................................................6
3.4 Endurance To Warp ........................................................................................6
4. Handling Recommendations .....................................................................................7
4.1 Cleaning ..........................................................................................................7
4.2 Storage ...........................................................................................................7
4.3 Transport .........................................................................................................7
4.4 ESD Warning ..................................................................................................7
5. Package & Ordering Information...............................................................................8
5.1 Package Dimensions ......................................................................................8
5.2 Packaging Data ...............................................................................................8
5.3 Ordering Information .......................................................................................8
6. Revision History ........................................................................................................9
GO1525 Data Sheet
21969 - 9 February 2007 3 of 9
FOR NEW DESIGNS USE GO1555
1. Pin Out
1.1 Pin Assignment
1.2 Pin Descriptions
GO1525
NC GND O/P
GNDGND
GND VCC
VCTR
321
48
576
NOTE: Pin numbers are arbitrary
There are no pin markings on the device itself
TOP VIEW
Table 1-1: Pin Descriptions
Pin Number Name Type Description
2, 4, 6, 8 GND Power Most negative power supply connections.
5V
CTR Input Control voltage for the VCO.
7V
CC Power Most positive power supply connection.
1 O/P Output VCO signal output.
3 NC – No connection.
Note: Pin numbering different from GO1515
GO1525 Data Sheet
21969 - 9 February 2007 4 of 9
FOR NEW DESIGNS USE GO1555
2. Electrical Characteristics
Table 2-1: Electrical Characteristics
VCC = 2.5V ±0.25V, Temperature = 0°C to 70°C, unless otherwise shown
Parameter Symbol Conditions Min Typ Max Units Notes
Supply Voltage VCC – 2.25 2.5 2.75 V Supply Voltage
Supply Current ΙS– – – 15 mA Supply Current
Control Voltage Range VCTR – 1.0 – 1.5 V Control Voltage Range
Control Voltage Sensitivity df/dV – 25 32 39 MHz/V Control Voltage
Sensitivity
Operating Frequency
Range
ƒVCO VCTR = 1.0V 1483.5 – – MHz Operating Frequency
Range
VCTR = 1.5V – – 1485.0 MHz
Output Signal Level VOUT – -12 -9 -6 dBm Output Signal Level
Pushing Figure – VCC = 2.5V ± 0.25V, ref:
VCC = 2.5V
– 1.5 – MHz Pushing Figure
Pulling Figure – VSWR = 2.0 for all
phase, ref: 50Ω
– 1.0 – MHz Pulling Figure
Temperature Stability TCOEF 0°C to 70°C, ref. = 25°C – – ±3 MHz Temperature Stability
Spurious Response – – – – -10 dBc Spurious Response
Output Impedance ZO––50–ΩOutput Impedance
GO1525 Data Sheet
21969 - 9 February 2007 5 of 9
FOR NEW DESIGNS USE GO1555
3. Soldering Recommendations
The device is manufactured with Matte-Sn terminations and is compatible with both
standard eutectic and Pb-free solder reflow profiles. The recommended standard
eutectic reflow profile is shown in Figure 3-1. The maximum recommended Pb-free
reflow profile is shown in Figure 3-2.
Figure 3-1: Standard Eutectic Solder Reflow Profile
Figure 3-2: Maximum Pb-free Solder Reflow Profile
25˚C
1
00˚C
1
50˚C
1
83˚C
2
30˚C
2
20˚C
Tim
e
T
emperature
6 min. max
120 sec. max
60-150 sec.
10-20 sec.
3˚C/sec max
6˚C/sec max
25˚C
1
50˚C
2
00˚C
2
17˚C
2
60˚C
2
50˚C
Tim
e
Temperature
8 min. max
60-180 sec. max
60-150 sec.
20-40 sec.
3˚C/sec max
6˚C/sec max
GO1525 Data Sheet
21969 - 9 February 2007 6 of 9
FOR NEW DESIGNS USE GO1555
3.1 Reflow Conditions
The device will meet the data sheet specifications after completing the reflow
process according to the profile shown in Figure 3-1 or Figure 3-2. Recommended
soldering conditions are as follows:
3.2 Soldering Flux
Do not use cleaning type flux. Washing the devices after using cleaning type flux
may damage inner parts and affect performance.
3.3 Rework or Repair
Rework or repair must only be done once. Do not reflow the device more than
twice; once for initial soldering and once for remounting after rework.
Do not vibrate the VCO during reflow soldering.
3.4 Endurance To Warp
When the device is soldered on a printed circuit board (dimension: 100mm x
100mm; thickness: 1.6mm) and the PCB is warped as shown in Figure 3-2, the
device will not be cracked or damaged.
Figure 3-3: PCB Warp
Preheating 150±10°C, 60 to 120 sec.
Soldering Peak 260°C
Over 200°C within 30 sec.
VCO
PCB MAX 2mm
GO1525 Data Sheet
21969 - 9 February 2007 7 of 9
FOR NEW DESIGNS USE GO1555
4. Handling Recommendations
4.1 Cleaning
There are two options for cleaning the devices.
Option 1:
1. Clean but do not use solvent cleaners.
2. Thoroughly dry assemblies afterwards.
Option 2:
1. Mount device after board is cleaned.
4.2 Storage
Store the devices out of direct sunlight, at a stable temperature and humidity. Avoid
extreme temperatures, high humidity and wide temperature fluctuations.
Condensation on the devices may result in reduced quality and lowered
solderability.
Avoid dust, sea breezes and corrosive gases (Cl2, NH3, SO2, NOX, etc.).
Use within 6 months after delivery. If the devices are stored for more than one year,
solderability may be degraded.
4.3 Transport
Package the devices for transportation to avoid mechanical vibration or shock.
4.4 ESD Warning
Avoid poor ground connections and electrostatic discharge or induction in
production.
GO1525 Data Sheet
21969 - 9 February 2007 8 of 9
FOR NEW DESIGNS USE GO1555
5. Package & Ordering Information
5.1 Package Dimensions
5.2 Packaging Data
5.3 Ordering Information
GO1525
TOP VIEW
2.2
±0.1
4.2
±0.1
5.8
±0.2
2.0±0.1
7.6±0.2
All dimensions in millimetres
NC GND OUT
VCC
VCTR
GND
GND
2.0 MAX
0.8±0.15
1.3±0.1 1.3±0.1
1.10
2.20
3.40
4.30
All dimensions in millimetres
Recommended Footprint for PCB Layout
GND
0.7 ± 0.15 0.7 ± 0.15
0.8 ± 0.15
2.20
2.00 2.30 3.40
1.40
Parameter Value
Package Type 8L Proprietary Surface Mount
Package Drawing Reference 21307 rev.0
Pb-free and RoHS Compliant Yes
Part Number Package Temperature Range Pb-Free RoHS Compliant
GO1525-CTAE3 8-pin tape on reel 0°C to 70°C Yes Yes
CAUTION
ELECTROSTATIC SENSITIVE DEVICES
DO NOT OPEN PACKAGES OR HANDLE
EXCEPT AT A STATIC-FREE WORKSTATION
GENNUM CORPORATION
Mailing Address: P.O. Box 489, Stn. A, Burlington, Ontario, Canada L7R 3Y3
Shipping Address: 970 Fraser Drive, Burlington, Ontario, Canada L7L 5P5
Tel. +1 (905) 632-2996 Fax. +1 (905) 632-5946
GENNUM JAPAN CORPORATION
Shinjuku Green Tower Building 27F, 6-14-1, Nishi Shinjuku, Shinjuku-ku, Tokyo, 160-0023 Japan
Tel. +81 (03) 3349-5501, Fax. +81 (03) 3349-5505
GENNUM UK LIMITED
25 Long Garden Walk, Farnham, Surrey, England GU9 7HX
Tel. +44 (0)1252 747 000 Fax +44 (0)1252 726 523
Gennum Corporation assumes no liability for any errors or omissions in this document, or for the use of the
circuits or devices described herein. The sale of the circuit or device described herein does not imply any
patent license, and Gennum makes no representation that the circuit or device is free from patent infringement.
GENNUM and the G logo are registered trademarks of Gennum Corporation.
© Copyright 2002 Gennum Corporation. All rights reserved. Printed in Canada.
www.gennum.com
GO1525 Data Sheet
21969 - 9 February 2007
9
9 of 9
DOCUMENT IDENTIFICATION
DATA SHEET
The product is in production. Gennum reserves the right to make
changes to the product at any time without notice to improve reliability,
function or design, in order to provide the best product possible.
FOR NEW DESIGNS USE GO1555
6. Revision History
Version ECR PCN Date Changes/Modification
3 133240 – March 2004 Corrected package dimensions and added
new footprint.
4 133445 – July 2004 Added ‘Pb-free’ bullet. Added Pb-free
solder reflow profile.
5 134964 – November 2004 Adding Pb-Free and Green Ordering
Information. Converting to new document
template. Adding packaging data
information. Adding Solder Reflow Profile
description. Updating product cleaning
information.
6 136564 – April 2005 Changed ‘Green’ references to RoHS
Compliant.
7 137164 – June 2005 Rephrased RoHS compliance statement.
8 137624 – July 2005 Corrected packages list in Ordering
Information on page 8. Corrected
description of Pb-free profile in Soldering
Recommendations on page 5
9 144096 42774 February 2007 Added watermark FOR NEW DESIGNS
USE GO1555.
